CN203134852U - White light LED packaging structure including substrate platform - Google Patents
White light LED packaging structure including substrate platform Download PDFInfo
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- CN203134852U CN203134852U CN 201220596771 CN201220596771U CN203134852U CN 203134852 U CN203134852 U CN 203134852U CN 201220596771 CN201220596771 CN 201220596771 CN 201220596771 U CN201220596771 U CN 201220596771U CN 203134852 U CN203134852 U CN 203134852U
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Abstract
The utility model discloses a white light LED packaging structure including a substrate platform. The white light LED packaging structure comprises a chip pedestal, a substrate platform, an LED chip and a fluorescent glue layer, wherein the substrate platform is fixed on the chip pedestal; the size of the overlooking projection of the substrate platform is larger than that of the LED chip; the LED chip is disposed on the substrate platform; the fluorescent glue layer is positioned above the substrate platform and wraps an upper portion and side portions of the LED chip; and an outer contour of the fluorescent glue layer is in a convex arc shape. The preparation method of the white LED packaging structure including the substrate platform comprises crystal solidification, wire welding, glue dispensing and solidification of the fluorescent glue layer. The prepared LED packaging structure has good light extraction efficiency and light color uniformity, and the use amount of fluorescent powder can be saved for over 60 percents while the same optical performance is guaranteed.
Description
Technical field
The invention belongs to LED encapsulation technology field, be specifically related to a kind of White-light LED package structure and preparation method thereof.
Background technology
In the design of white light LEDs, most crucial steps is exactly dot fluorescent powder (fluorescent glue), and dot fluorescent powder is the key that white light forms.Dot fluorescent powder is finished by full-automatic or automanual point gum machine or direct embedding, and the device of carrying fluorescent material can be led support or pcb board.In order to improve photochromic performance, fluorescent material often mixes other colloids (formation fluorescent glue), and by through a series of processing step, makes fluorescent material be coated in chip surface.But, at present, in the preparation of white light LEDs, mainly have following defective.
The first, common bracket LED chip encapsulation is that excessive fluorescent glue is not added control ground embedding in reflector, as shown in Figure 1, and to reach the effect of sending white light.The main shortcoming of this technology is to expend a large amount of fluorescent material, and causes the skewness of fluorescent material around chip, has a strong impact on the uniformity of white light LEDs colour temperature, causes the brightness of white light LEDs and hot spot all can not produce a desired effect.Another kind of technology adopts tiling then by semiconductor technologies (Fig. 3) such as air brushing, photoetching, thin film techniques, and fluorescent material evenly is coated in wafer surface, i.e. complete conformal process.But be difficult to accomplish on the packaging technology for the stent-type white light LEDs.Produce sale in batches for factory, the conformal paint-on technique needs excessive realization cost fully.Also having a kind of technology is that the coating of fluorescent material is controlled slightly, only applies fluorescent material around chip, but owing to there is not ideal technology, often obtains inhomogeneous phosphor powder layer, as (Fig. 2).
The second, dispensing technology is applied to the COB encapsulation at present mostly and waits on the well-to-do substrate of working area, and how to carry out a glue in diameter has only the narrow and small support reflector of 1.78mm left and right sides job area usually is a technical barrier.
The 3rd, have in the prior art and utilize chip surface tension force that fluorescent material is coated in the technology of chip upper surface, its control contrast conventional art to the fluorescent glue amount makes progress, but still can't apply fluorescent material in side blue light-emitting zone; For realizing the side excited white light, must get back to again on the traditional method of a large amount of fluorescent material of direct embedding, perhaps be prepared the technology of this complexity of mould of filling fluorescent glue.In a word, the technology that prior art is difficult to find simple and feasible obtains the even coated structure of fluorescent material in all kinds of encapsulation such as COB encapsulation, support encapsulation, common LED substrate package, and is difficult to be implemented in and accurately puts glue on the support.
Summary of the invention
Based on this, the present invention is directed in the prior art that the fluorescent material waste is big, fluorescent material technical problem such as skewness around chip, a kind of new White-light LED package structure is provided.
The technical scheme that realizes this purpose is as follows.
A kind of White-light LED package structure, comprise chip base, substrate platen, led chip and fluorescence glue-line, substrate platen is fixed on the chip base, the projection size of bowing of substrate platen is greater than led chip downward projection size, led chip is fixed on the substrate platen, the fluorescence glue-line is positioned at the top of substrate platen and with the top of led chip and sidepiece parcel, the outline of fluorescence glue-line is the cambered surface of epirelief.
Preferably, the lower limb of described fluorescence glue-line is concordant with the top edge of substrate platen.
Among embodiment, the downward projection of described substrate platen is square therein.
Among embodiment, described chip base is led support therein.
Another object of the present invention provides the preparation method of above-mentioned White-light LED package structure.
Concrete technical scheme is as follows:
A kind of preparation method of White-light LED package structure may further comprise the steps:
(1) solid brilliant: as substrate platen to be fixed on the chip base with crystal-bonding adhesive, to put into the high temperature baking box then, crystal-bonding adhesive is solidified; Take out the chip base that substrate platen is fixedly arranged, use the crystal-bonding adhesive secured in parallel in the centre of substrate platen led chip again, insert the high temperature baking box again, crystal-bonding adhesive is solidified, be fixed the chip base of led chip and substrate platen;
(2) bonding wire: by the gold thread ball bonding, led chip is finished be electrically connected, obtain the led chip pedestal;
(3) some glue: the led chip pedestal of step (2) gained is placed on the point gum machine workbench, in fluorescent material, add silica gel and obtain fluorescent glue; Start point gum machine, fluorescent glue is put on the led chip, fluorescent glue is according to self flowability, after covering the led chip upper surface, because fluorescent glue is viscous fluid, be subjected to the substrate platen boundary limitation, and under surface tension and attraction of gravitation effect, stablize when static, form the fluorescence glue-line, the fluorescence glue-line is with top and the sidepiece parcel of led chip, and the outline of fluorescence glue-line is the arc hemisphere of epirelief;
(4) fluorescence curable adhesive layer: will put the led chip pedestal that glue finishes and insert the high temperature baking box, and embedding silica gel, solidify, obtain described White-light LED package structure again.
Among embodiment, described chip base is led support therein; The downward projection of described substrate platen is square.
The addition of silica gel can be adjusted according to optical principle according to needed bright dipping quality in the fluorescent glue, so silica gel amount and on-fixed that fluorescent material adds can be adjusted---thereby the viscosity of fluorescent glue can not be determined value.Be spilled over to the covering substrate platen in order to make fluorescent glue accelerate to flow from chip surface, need to introduce extra fluorescent glue viscosity control method.At this, the present invention has designed two sections bakings especially, the baking temperature can change the flowability of fluorescent glue, accelerate the even coating of fluorescent glue, that is: in the step (4), described high temperature oven for solidifying is: at 75 ℃～90 ℃ environment baking 40min～60min, then at 120 ℃～150 ℃ environment baking 115-130min.
Among the present invention, used fluorescent glue amount, those skilled in the art can cooperate the shape behind substrate platen and die size, the fluorescence glue-line coating molding to prepare.In the step 3, the consumption of described fluorescent glue is the long-pending 30-40% of the reflective reflector of led support.Substrate platen of the present invention then can be selected from 20 to 75mil according to die size.
The present invention reforms at the production stage of conventional stent formula LED dot fluorescent powder, by adding the platform of a carrying fluorescence glue-line, propose a kind of chip sides light-emitting zone and can cover the approximate conformal technique that fluorescent material, chip accurately evenly apply fluorescent material on every side.The systematicness arch of vault shape structural adhesive layer that this technology forms contrasts light extraction efficiency and the photochromic uniformity that existing surface-coated fluorescent material technology can further improve LED.The fluorescent material use amount reduces more than 60% under equal optical property.
Accurately the control fluorescent glue becomes the parameter of ideal type shape to pass through design of Simulation or duplicate test, and those skilled in the art can obtain the best of breed of materials specification and job parameter, and best of breed differs according to the market chip type and fine setting is respectively arranged.Get final product according to this specification during production, need not to increase expensive device.
Existing led chip surface coating technique only proposes to reduce the fluorescent material consumption mostly, and when not proving the correlated colour temperature CCT approximately equal of product, whether light energy output or luminous efficiency be constant.The present invention is a kind of under the colour temperature of regulation, reaches the same light flux and the LED fluorescent powder coating technique of fluorescent material use amount minimizing more than 60%.The saving of fluorescent material can intuitively reflect on technology composition and shaped article, and the present invention carried out the experiment of formed product subsequent detection, and the photochromic performance of moulding sample is tested, and proves that the new technology sample reaches equal bright dipping quality.
In sum, the present invention has following advantage:
1, this White-light LED package structure adopts the mode of some glue to process, need not adopt the mode of filling that whole reflector is filled up, the fluorescence glue-line is dots structure, saved the consumption of fluorescent glue greatly, and after substrate platen is set, the fluorescence glue-line is all wrapped up top and the sidepiece of led chip, and the light that the led chip sidepiece is sent is also excited by the fluorescence glue-line, has improved the utilance of light;
2 glutinous fluid fluorescent glues rely on substrate platen to form arch of vault structures and have guaranteed the easy of technology, need not to increase any mould, because the substrate platen specification can be according to different chip type adjustment, this technology is fully applicable to the chip of 7 to 50mil specifications.
3, the invention solves the technical barrier of accurate glue of narrow and small area point glue job area on the support, saved fluorescent material and realized that chip evenly applies the technology of fluorescent material on every side, has also guaranteed the identical color quality of LED product.
Description of drawings
Fig. 1 is the structural representation of stent-type White-light LED package structure of the prior art;
Fig. 2 is the inhomogeneous coated structure schematic diagram of prior art;
Fig. 3 is conformal schematic diagram of a high price;
Fig. 4 is the finished product structural representation of White-light LED package structure of the present invention;
Fig. 5 is the flow chart of technology of the present invention;
Description of reference numerals:
10, support, 20, led chip, 30, the fluorescence glue-line, 40, substrate platen, 41, top edge, 50, reflector.
Embodiment
The feature of material of the present invention is as follows:
High-power K1 white light LEDs is similar to conformal fluorescent material point glue
Material: the substrate platen in four directions is processed into the specification of 45x45mil with the substrate platen in four directions, its long and wide led chip that all is slightly larger than.The silicon chip substrate platform that thermal conductivity is good), silica gel, fluorescent material, 30x30milLED chip, K1 support; Equipment: the point gum machine that precision is enough, high temperature baking box.
The preparation method of the described stent-type White-light LED package structure of present embodiment as shown in Figure 5, mainly comprises comprising the steps:
(1), solid brilliant: substrate platen is fixed in the centre at the bottom of the reflector cup of K1 support with the LED crystal-bonding adhesive.The led support of intrinsic substrate platen is inserted the high temperature baking box, toast 1.5h down at 150 ℃, finish crystal-bonding adhesive and solidify; After taking out led support, use the crystal-bonding adhesive secured in parallel substrate platen centre (be lower limb and substrate platen surface join do not exceed the border of platform) led chip; The led support of intrinsic chip is inserted the high temperature baking box again, toast the curing that 1.5h finishes chip down at 150 ℃; Be fixed the support of led chip and substrate platen;
(2), bonding wire: common gold thread ball bonding, led chip is finished is electrically connected, obtain led support;
(3) some glue:
(3.1) add proper silica gel in fluorescent material, the amount of interpolation is so that the fluorescent glue that obtains has certain flowability to be limited gets final product.Mobile in the specifically adjustment again of baking link.The volume of fluorescent glue is about 40% of K1 support reflector volume;
(3.2) debugging point gum machine: during production in enormous quantities, some glue frequency is between 0.8s～1.2s;
(3.3) led support with step (2) gained places on the point gum machine workbench, starts point gum machine, finishes a glue; Arch of vault fluorescence glue-line is according to self flowability, after covering the led chip upper surface, because glue-line is viscous fluid, be subjected to the platform border restriction down, and under surface tension and attraction of gravitation effect, stablize when static the fluorescence glue-line with top and the sidepiece parcel of led chip, the arc that the outline of fluorescence glue-line is epirelief forms circular shape naturally, namely rely on surface tension to cover blue light-emitting zone, led chip side, realize only around led chip, evenly applying a kind of arch of vault shape fluorescence glue-line that reaches approximate conformal effect of fluorescent glue;
(4) temperature control promotes fluorescent glue to flow and hot curing: will put the led support that glue finishes and insert the high temperature baking box, at first at 75 ℃～90 ℃ environment baking 50min, then at 120 ℃～150 ℃ environment baking 120min; Under this specific baking process, the mobile generation of fluorescent glue further changes, and under the restriction on substrate platen border, the fluorescence glue-line finally reaches designed even arch of vault hemisphere.Last embedding pure silicon glue, curing again obtain described stent-type white light LEDs.
The described stent-type White-light LED package structure of present embodiment, as shown in Figure 4, comprise support 10, led chip 20 and fluorescence glue-line 30 and substrate platen 40, the downward projection of described substrate platen is square, middle part at support 10 forms reflector 50, substrate platen 40 places in the reflector 50, the projection size of bowing of substrate platen 40 is greater than led chip downward projection size, led chip 20 is arranged on the substrate platen, pass through point gum machine, with fluorescent glue point on led chip, form the fluorescence glue-line, fluorescence glue-line 30 is positioned at the top of substrate platen 40 and with the top of led chip 20 and sidepiece parcel, the outline of fluorescence glue-line 30 is the arc of epirelief, and the top of described fluorescence glue-line 30 is lower than the upper surface of described support 10; The lower limb of described fluorescence glue-line 30 is concordant with the top edge 41 of substrate platen 40.
In this embodiment K1, finished product process structure parameter is as follows:
The height of fluorescence glue-line is about 2: 7 with substrate platen width ratio.
The four directions land thickness is between 0.21mm～0.26mm;
The four directions berm width is between 1.40mm～1.45mm;
The LED wafer thickness is between 0.15mm～0.20mm;
Fluorescent glue layer height (fluorescence glue-line cambered surface summit is perpendicular to the length between perpendiculars of cubic platform) is between 0.31mm～0.45mm.
According to the method described above, 4 stent-type White-light LED package structure samples that are prepared into are carried out optic test.
White light LEDs is similar to conformal fluorescent material gluing process packaged sample optical performance parameter
The approximate conformal fluorescent material gluing process finished product of high-power K1 white light LEDs carries out Photoelectric Detection, and following sample 2 chromaticity diagrams (Fig. 5) show that color temperature value is the sample of testing the positive white light 6000K that needs.(because application documents do not allow complex colors figure, so sampling chromaticity diagram coordinate, chromaticity diagram gets final product with reference to international CIE version).
Spectrogram characteristic point coordinate be the peak-peak wavelength of fluorescent material institute exciting light and spectrum coefficient (blue light is 1) thereof wherein, reach the LED sample 2 of standard 6000k, its luminous flux still remains on 105.55Lm
The above embodiment has only expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be noted that; for the person of ordinary skill of the art; without departing from the inventive concept of the premise; can also make some distortion and improvement, as chip type changes, change, chip and the platform of platform shape size are placed trickle change, fluorescent glue preparation and some glue job parameter quantitatively on adjustment etc. these all belong to protection scope of the present invention.
Claims (4)
1. White-light LED package structure, it is characterized in that, comprise chip base, substrate platen, led chip and fluorescence glue-line, substrate platen is fixed on the chip base, the projection size of bowing of substrate platen is greater than led chip downward projection size, led chip is fixed on the substrate platen, and the fluorescence glue-line is positioned at the top of substrate platen and with the top of led chip and sidepiece parcel, the outline of fluorescence glue-line is the cambered surface of epirelief.
2. according to the described White-light LED package structure of claim 1, it is characterized in that the lower limb of described fluorescence glue-line is concordant with the top edge of substrate platen.
3. according to the described White-light LED package structure of claim 1, it is characterized in that the downward projection of described substrate platen is square.
4. according to each described White-light LED package structure of claim 1-3, it is characterized in that described chip base is led support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220596771 CN203134852U (en) | 2012-11-13 | 2012-11-13 | White light LED packaging structure including substrate platform |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220596771 CN203134852U (en) | 2012-11-13 | 2012-11-13 | White light LED packaging structure including substrate platform |
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| CN203134852U true CN203134852U (en) | 2013-08-14 |
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| CN 201220596771 Expired - Lifetime CN203134852U (en) | 2012-11-13 | 2012-11-13 | White light LED packaging structure including substrate platform |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931320A (en) * | 2012-11-13 | 2013-02-13 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | White light light-emitting diode (LED) approximate shape-preserving packaging structure and preparation method thereof |
| CN110556054A (en) * | 2018-05-31 | 2019-12-10 | 青岛海信电器股份有限公司 | flexible Micro LED display device |
-
2012
- 2012-11-13 CN CN 201220596771 patent/CN203134852U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931320A (en) * | 2012-11-13 | 2013-02-13 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | White light light-emitting diode (LED) approximate shape-preserving packaging structure and preparation method thereof |
| CN110556054A (en) * | 2018-05-31 | 2019-12-10 | 青岛海信电器股份有限公司 | flexible Micro LED display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhang Qi Document name: Notice of conformity |
|
| DD01 | Delivery of document by public notice | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130814 |
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| CX01 | Expiry of patent term |