CN111036515A - Glue filling method of heart rate module - Google Patents
Glue filling method of heart rate module Download PDFInfo
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- CN111036515A CN111036515A CN201911300245.5A CN201911300245A CN111036515A CN 111036515 A CN111036515 A CN 111036515A CN 201911300245 A CN201911300245 A CN 201911300245A CN 111036515 A CN111036515 A CN 111036515A
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- heart rate
- rate module
- glue
- mounting groove
- pouring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
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- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- External Artificial Organs (AREA)
Abstract
The invention discloses a glue filling method of a heart rate module, and relates to the technical field of heart rate module processing. The glue filling method of the heart rate module comprises the following steps: providing a heart rate module, wherein the heart rate module comprises a substrate, a heart rate module shell and a component, the heart rate module shell is fixed on the substrate, a mounting groove for accommodating the component is formed in the heart rate module shell, and a bottom shielding area is formed in the mounting groove; placing the heart rate module on a working platform of a dispenser, and pouring a pouring sealant into the mounting groove until the pouring sealant fills the bottom shielding area; standing the heart rate module subjected to primary glue pouring until bubbles in the glue layer are eliminated; pouring glue into the mounting groove after defoaming treatment again until the pouring glue completely covers the component; and curing the heart rate module which completes secondary glue filling. The invention aims to protect components in the heart rate module in a glue pouring and packaging mode.
Description
Technical Field
The invention relates to the technical field of heart rate module processing, in particular to a glue filling method of a heart rate module.
Background
The heart rate module is a device for measuring the heart rate of a human body. The rhythm of the heart module includes the base plate usually and fixes a plurality of rhythm of the heart module shells on the base plate, has seted up a plurality of mounting grooves on each rhythm of the heart module shell, corresponds in the mounting groove and is equipped with multiple components and parts such as LED banks spare, power management module, simulation front end module and photosensitive diode. For avoiding components and parts to drop or harm, when the preparation rhythm of the heart module, generally can be after installing components and parts, installation safety cover on components and parts to components and parts in the protection rhythm of the heart module. The installation safety cover has undoubtedly increased the manufacturing cost and the processing step of rhythm of the heart module.
Disclosure of Invention
The invention mainly aims to provide a glue filling method of a heart rate module, and aims to protect components in the heart rate module in a glue filling and packaging mode.
In order to achieve the purpose, the invention provides a glue filling method of a heart rate module, which comprises the following steps:
providing a heart rate module, wherein the heart rate module comprises a substrate, a heart rate module shell and a component, the heart rate module shell and the component are fixed on the substrate, a mounting groove for accommodating the component is formed in the heart rate module shell, a bottom shielding area is formed in the mounting groove, the bottom shielding area comprises a first shielding area and/or a second shielding area, at least part of the component and the bottom of the mounting groove are separated to form the first shielding area, and the side wall of the mounting groove and the bottom of the mounting groove form the second shielding area;
placing the heart rate module on a working platform of a dispenser, and pouring a pouring sealant into the mounting groove until the pouring sealant fills the bottom shielding area;
standing the heart rate module subjected to primary glue pouring until bubbles in the glue layer are eliminated;
pouring glue into the mounting groove after defoaming treatment again until the pouring glue completely covers the component;
and curing the heart rate module after the completion of secondary glue filling.
Optionally, the mounting groove has a long sidewall extending along a length direction of the mounting groove, and the long sidewall and a side surface of the component are spaced to form a gap;
will on heart rate module arranged in the work platform of point gum machine, pour into the casting glue in to the mounting groove until the casting glue is filled the step in bottom sheltered from the district includes:
arranging the heart rate module on a working platform of a dispenser, setting a first dispensing path from one end of the intermediate path to the other end of the intermediate path, and controlling a nozzle of the dispenser to move on the first dispensing path and dispense until pouring sealant flows to completely fill the bottom shielding area.
Optionally, the first dispensing path is from one end of a center line of the inter-road to the other end.
Optionally, the number of the first dispensing paths is two, and the two first dispensing paths are respectively arranged on two sides of the component.
Optionally, the directions of the two first dispensing paths are opposite.
Optionally, the mounting groove has a first side wall and a second side wall which are oppositely arranged;
and pouring glue again in the mounting groove after defoaming treatment until the pouring glue completely covers the component, wherein the step comprises the following steps of: and setting a second dispensing path from the first side wall of the mounting groove to the second side wall, and controlling a nozzle of the dispenser to move on the second dispensing path and dispense until the potting adhesive completely covers the component.
Optionally, the second dispensing path is from one end of a center line of the mounting groove to the other end.
Optionally, the step of curing the heart rate module that completes the re-potting comprises:
and after UV irradiation is carried out on the heart rate module which completes secondary glue filling, the heart rate module is placed in baking equipment, the temperature is raised to 110-130 ℃ for baking and curing, and then the heart rate module is cooled.
Optionally, the heating time is 8-12 min, the baking time is 10-15 min, and the cooling time is 18-22 min.
Optionally, the viscosity of the pouring sealant is 3000-5000 mPas, and the temperature of a working platform of the dispenser is set to be 45-65 ℃.
In the technical scheme of the invention, the components are protected by adopting a glue pouring packaging mode, so that the operation is simpler and more convenient, and the processing cost is lower. Meanwhile, when pouring the glue, the glue pouring step is completed in two steps, and the glue pouring amount during the first glue pouring is controlled, so that the pouring glue in the mounting groove can fill a bottom shielding area formed in the mounting groove after flowing and uniformly distributing, and bubbles of the pouring glue in the bottom shielding area are avoided; through stewing between two steps of encapsulating to the easy bubble that produces during the encapsulating has fully been discharged, thereby has formed the encapsulating face after making the encapsulating and has not had sunken, bubble, has satisfied the requirements such as optical property of plane degree and rhythm of the heart module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other related drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of an embodiment of a method for filling a heart rate module according to the present invention;
FIG. 2 is a cross-sectional view of an embodiment of a heart rate module according to the present invention;
FIG. 3 is a top view of the heart rate module of FIG. 2;
fig. 4 is a schematic diagram of a dispensing path of a first glue filling of the heart rate module glue filling method according to the present invention;
fig. 5 is a schematic diagram of a dispensing path of the second glue filling of the heart rate module glue filling method according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
32 | PD |
| 2 | |
33 | AFE |
| 21 | First |
34 | LED |
| 22 | First |
35 | |
| 23 | Second small groove | 4 | Road between roads |
| 24 | Second |
5 | |
| 210 | |
6 | |
| 31 | LED |
7 | Heart rate module shell |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
For avoiding components and parts to drop or harm, when the preparation rhythm of the heart module, generally can be after installing components and parts, installation safety cover on components and parts to components and parts in the protection rhythm of the heart module. The installation safety cover has undoubtedly increased the manufacturing cost and the processing step of rhythm of the heart module.
In view of this, the invention provides a potting method of a heart rate module, which is used for potting a sealant for the heart rate module, and protects components by adopting a potting method, so that the operation is simpler and more convenient, and the processing cost is lower. Fig. 1 is a diagram illustrating an embodiment of a method for filling a heart rate module according to the present invention.
Referring to fig. 1, the glue filling method of the heart rate module includes the following steps:
step S10, providing a heart rate module, where the heart rate module includes a substrate 1, a heart rate module housing 7 fixed on the substrate 1, and a component, where the heart rate module housing 7 is provided with a mounting groove 2 for accommodating the component, a bottom shielding region is formed in the mounting groove 2, the bottom shielding region includes a first shielding region and/or a second shielding region 210, at least part of the component and the bottom of the mounting groove 2 form the first shielding region at an interval, and the side wall of the mounting groove 2 and the bottom of the mounting groove 2 form the second shielding region 210.
Fig. 2 and 3 provide a particular embodiment of a heart rate module, and in this embodiment, the heart rate module includes base plate 1, fixes heart rate module shell 7 and components and parts on base plate 1, has seted up a plurality of mounting grooves 2 on the heart rate module shell 7, for example first little groove 21, first big groove 22, second little groove 23 and second big groove 24. The LED red lamp component 31 is arranged in the first small groove 21, the LED green lamp component 34 is arranged in the second small groove 23, and the side walls of the first small groove 21 and the second small groove 23 protrude towards the inside of the groove, so that a second shielding area 210 is formed between the side walls and the bottom of the groove; the first macro groove 22 is stacked with a device PD32 (photodiode) and AFE33 (analog front end) mounted therein, and the second macro groove 24 is stacked with a device PD32 and PMIC35 (power management module) mounted therein, thereby forming a first shielding region between the PD32 and the groove bottom. When the glue is poured, the bottom shielding area is not easy to be filled with the pouring glue.
And S20, placing the heart rate module on a working platform of a dispenser, and pouring a pouring sealant into the mounting groove 2 until the pouring sealant fills the bottom shielding area.
The conventional glue pouring method comprises the steps of pouring glue at one time, and then baking and curing at high temperature, wherein the problems of poor flatness and air bubbles in the glue are easily caused after the pouring glue is cured. However, the flatness and the optical property requirement of rhythm of the heart module to the inoxidizing coating are higher, and the mode of disposable direct encapsulating is not suitable for the encapsulating encapsulation of rhythm of the heart module. Therefore, in the embodiment, the glue pouring step is completed in two steps, when glue is poured in the first step, only a part of the pouring glue is poured, and the pouring glue has fluidity and naturally flows in the mounting groove 2, so that the pouring glue is uniformly distributed at all positions of the mounting groove 2, and bubbles generated by the pouring glue in a bottom layer shielding area are avoided. Wherein, the pouring amount of the pouring sealant is based on the fact that the bottom shielding area is fully filled.
The type and properties of the pouring sealant can affect the flowing condition and distribution state of the pouring sealant, and the pouring sealant with the viscosity of 3000-5000 mPas is preferred in the embodiment, on the basis, the temperature of the working platform of the dispenser is controlled to be 45-65 ℃, so that the viscosity of the pouring sealant is reduced and the pouring sealant is easy to flow. In addition, compared with the method that the pouring sealant is heated by increasing the temperature of the nozzle, the pouring sealant is heated by controlling the temperature of the working platform, and the obtained pouring sealant is better in uniformity. In addition, in consideration of the requirement of the heart rate module on the optical performance of the material, the pouring sealant is transparent and colorless, and the refractive index of the pouring sealant before curing is 1.48-1.49, for example, the pouring sealant can be colorless and transparent epoxy resin. Preferably, the type of the selected potting adhesive in this embodiment is Panacol UC1619, the viscosity of the potting adhesive is 3000mPas, the storage temperature is 0-10 ℃, and the refractive index of the potting adhesive before curing is 1.486.
In addition, can select suitable solenoid valve with the accurate control volume of encapsulating, avoid appearing the overflow phenomenon that the volume of gluing is less or the volume of gluing is more produces, the preferred solenoid valve that accords with following parameter standard of this embodiment solenoid valve: can be sprayed in a narrow space of 175 μm; the small fillet size is less than 250 mu m; the diameter of the spray point is less than 200 μm; as small as 1 nanoliter range; the jet size is less than 50 μm. Based on the above, in practical application, a Nordson Asymtek S2-900 dispenser and a DJ-9500 type electromagnetic valve can be selected.
As a preferred embodiment of the present invention, step S20 may be operated as follows:
step S21, placing the heart rate module on a working platform of a dispenser, setting a first dispensing path 5 from one end of the middle channel 4 to the other end, and controlling a nozzle of the dispenser to move on the first dispensing path 5 and dispense glue until pouring glue flows to completely fill the bottom shielding area.
Referring to fig. 3 and 4, the mounting groove 2 has long sidewalls extending along the length direction of the mounting groove 2, and the long sidewalls form a channel 4 at a distance from the side surface of the component, and taking the first large groove 22 as an example, the left sidewall of the first large groove 22 is a long sidewall, and a channel 4 located on the left side of the AFE33 is formed between the left sidewall and the left side surface of the AFE 33. In this embodiment, after the heart rate module is disposed on the working platform of the dispenser, the first dispensing path 5 of the nozzle of the dispenser is set in advance, and the first dispensing path 5 may be from the upper end to the lower end of the middle channel 4, or as shown in fig. 4, the first dispensing path 5 is set from the lower end to the upper end of the middle channel 4. Then, the nozzle of the dispenser is controlled to move on the first dispensing path 5 for dispensing, a glue line can be formed between the side wall of the mounting groove 2 and the AFE33 along the first dispensing path 5, and then the pouring sealant naturally flows from the glue line to the two sides of the glue line, so that bubbles in the pouring sealant can be prevented, the pouring sealant can be uniformly distributed, and meanwhile, the pouring sealant can smoothly flow into a first shielding area formed between the PD32 and the bottom of the groove because the first dispensing path 5 is distributed on one side of the PD 32. And because the glue line extends along the length direction of the mounting groove 2, when the pouring sealant is dispersed from the glue line to two sides, the pouring sealant flows along the width direction, and the flowing distance is smaller, so that the speed of the pouring sealant uniformly distributed in the mounting groove 2 is improved.
Furthermore, in order to uniformly distribute the potting adhesive in the mounting groove 2, the first dispensing path 5 is from one end of the center line of the middle channel 4 to the other end, that is, the first dispensing path 5 is arranged in the middle of the middle channel 4. For example, if the width of the lane 4 is 0.4mm, the first dispensing path 5 may be disposed along the length direction of the lane 4 at a distance of 0.2mm from the side wall of the mounting groove 2.
In addition, for some of the mounting grooves 2 in the heart rate module, for example, the first small groove 21 and the second small groove 23 shown in fig. 3, the components mounted in the mounting groove 2 are only LED lamp assemblies, and the bottom shielding area formed in the mounting groove 2 is small, so that the first dispensing path 5 may be from one end of the middle channel 4 to the other end when the first glue filling is performed, or may be set from one end of the middle line of the mounting groove 2 to the other end as shown in fig. 4.
For the condition that components and parts set up in the middle in mounting groove 2, when the first encapsulating, path 5 is glued to first point can set up two, say respectively set up one respectively in the left side between saying and the right side between saying, and path 5 is glued to two first points and is established respectively in the left and right sides of components and parts.
Further, in order to facilitate planning of the moving path of the nozzle, in this embodiment, the two first dispensing paths 5 are arranged in opposite directions, so that after the nozzle moves to the end point of one of the first dispensing paths 5 along the one of the first dispensing paths 5, the nozzle can reach the start point of the other first dispensing path 5 by moving horizontally, the moving stroke of the nozzle is shortened, the glue filling operation of the nozzle is performed continuously, and the glue filling efficiency is improved.
In practical application, can assemble a plurality of rhythm of the heart modules along the length direction of base plate 1 on same base plate 1 usually, under this condition, can let arbitrary two adjacent first some glue route 5 on the length direction of base plate 1 all be opposite direction's setting, so, every first some glue route 5 can be accomplished in proper order along the length direction of base plate 1 to the nozzle, and its movement stroke can be gone on consecutively.
In addition, the final encapsulating effect also can be influenced to the translation rate of point gum machine nozzle and the height of spouting gluey, and in this embodiment, the translation rate of point gum machine nozzle is preferred 10mm/s, and the height of point gum machine nozzle apart from rhythm of the heart module shell 7 is 0.5 mm.
And S30, standing the heart rate module completing the one-time glue filling until bubbles in the glue layer are eliminated.
After primary potting adhesive is finished, defoaming treatment needs to be carried out on an adhesive layer formed in the mounting groove 2, and particularly, a standing mode of 30-60 s can be adopted, so that the potting adhesive can naturally flow to be uniformly distributed, and bubbles in the adhesive layer can be automatically removed.
And step S40, pouring glue into the mounting groove 2 after defoaming treatment again until the pouring glue completely covers the component.
After defoaming treatment, glue can be poured into the mounting groove 2 again, so that all components in the mounting groove 2 are covered by the pouring glue.
Specifically, step S40 may include:
step S41, setting the second dispensing path 6 from the first sidewall to the second sidewall of the mounting groove 2, and controlling the nozzle of the dispenser to move on the second dispensing path 6 and dispense until the potting adhesive completely covers the component.
After the first potting, the bottom shielding area is filled with the potting adhesive, so that the second potting is performed only by potting the adhesive from one side wall of the mounting groove 2 to the other opposite side wall.
Furthermore, in order to uniformly distribute the pouring sealant in the mounting groove 2, the second dispensing path 6 is from one end of the center line of the mounting groove 2 to the other end, and the pouring sealant can uniformly flow from the center line to both sides due to the fluidity of the pouring sealant. It should be noted that the notch of the mounting groove 2 has two opposite sides, and a connecting line of respective midpoints of the two sides is a central line of the mounting groove 2.
In addition, after the step S40 and before the step S50, the heart rate module that completes the second potting may be left to stand to eliminate air bubbles that may be generated during the second potting, and the standing time may be 30-60S.
And step S50, curing the heart rate module after the glue pouring is finished again.
The filled heart rate module needs to be subjected to curing treatment, and the encapsulation protection on the heart rate module can be realized. In this embodiment, the curing is preferably performed by first UV irradiation and then high temperature baking. Specifically, step S50 may include:
step S51, after UV irradiation is carried out on the filled heart rate module, the heart rate module is placed in baking equipment, the temperature is raised to 110-130 ℃ for baking and curing, and then the temperature is lowered for cooling.
Wherein, when UV irradiation is carried out, the wavelength of the UV is set to 365nm, the irradiation time is 60s, the energy is 50 percent, and the temperature is 25.3 ℃; when high-temperature baking is carried out, a mode of slowly heating, then baking at constant temperature and slowly cooling to room temperature is adopted. So can make the curing process of casting glue go on steadily, promote the solidification effect, prevent that the potting compound face from appearing sunken behind the solidification, avoid the rhythm of the heart module to appear the problem that the potting compound face broke or the shrinkage deformation in subsequent electric welding course of working simultaneously.
In practical application, the temperature rising time can be controlled to be 8-12 min, the baking time can be controlled to be 10-15 min, and the temperature reduction time can be controlled to be 18-22 min, so that the temperature rising and reduction speed can be controlled. Moreover, this embodiment curing method toasts the time shorter, has not only improved the machining efficiency of rhythm of the heart module, has avoided toasting the harm to rhythm of the heart module shell 7 for a long time under the high temperature moreover.
Further, after step S50, the method may further include:
step S60, cover the cleaning layer on the encapsulating face of the heart rate module after the solidification treatment, adopt cutting equipment to load the base plate 1 who has a plurality of heart rate modules and cut the processing to obtain single heart rate module, the cleaning layer is formed by surfactant coating.
In the actual production, can assemble a plurality of rhythm of the heart modules on same strip base plate 1 usually, accomplish encapsulating, solidification back to each rhythm of the heart module, cut into single rhythm of the heart module again. This embodiment paints surfactant active in order to form a cleaning layer on encapsulating the face, then cuts the processing to base plate 1, so, the impurity that the cutting treatment process dropped can glue on the cleaning layer, and can not touch encapsulating the face, washs the rhythm of the heart module that obtains at last, can together get rid of impurity along with the active agent film, has avoided encapsulating the face because of adhesion impurity influences its plane degree.
The above is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall be included in the scope of the present invention.
Claims (10)
1. The utility model provides a glue filling method of heart rate module which characterized in that includes following step:
providing a heart rate module, wherein the heart rate module comprises a substrate, a heart rate module shell and a component, the heart rate module shell and the component are fixed on the substrate, a mounting groove for accommodating the component is formed in the heart rate module shell, a bottom shielding area is formed in the mounting groove, the bottom shielding area comprises a first shielding area and/or a second shielding area, at least part of the component and the bottom of the mounting groove are separated to form the first shielding area, and the side wall of the mounting groove and the bottom of the mounting groove form the second shielding area;
placing the heart rate module on a working platform of a dispenser, and pouring a pouring sealant into the mounting groove until the pouring sealant fills the bottom shielding area;
standing the heart rate module subjected to primary glue pouring until bubbles in the glue layer are eliminated;
pouring glue into the mounting groove after defoaming treatment again until the pouring glue completely covers the component;
and curing the heart rate module after the completion of secondary glue filling.
2. The glue filling method for the heart rate module as claimed in claim 1, wherein the mounting groove is provided with a long side wall extending along the length direction of the mounting groove, and the long side wall and the side surface of the component are spaced to form a gap;
will on heart rate module arranged in the work platform of point gum machine, pour into the casting glue in to the mounting groove until the casting glue is filled the step in bottom sheltered from the district includes:
arranging the heart rate module on a working platform of a dispenser, setting a first dispensing path from one end of the intermediate path to the other end of the intermediate path, and controlling a nozzle of the dispenser to move on the first dispensing path and dispense until pouring sealant flows to completely fill the bottom shielding area.
3. The method of claim 2, wherein the first dispensing path is from one end of a centerline of the middle channel to the other end.
4. The glue filling method for the heart rate module according to claim 2, wherein two first glue dispensing paths are provided, and the two first glue dispensing paths are respectively provided at two sides of the component.
5. The method as claimed in claim 4, wherein the two first dispensing paths are arranged in opposite directions.
6. The glue filling method for the heart rate module as claimed in claim 1, wherein the mounting groove has a first side wall and a second side wall which are oppositely arranged;
and pouring glue again in the mounting groove after defoaming treatment until the pouring glue completely covers the component, wherein the step comprises the following steps of: and setting a second dispensing path from the first side wall of the mounting groove to the second side wall, and controlling a nozzle of the dispenser to move on the second dispensing path and dispense until the potting adhesive completely covers the component.
7. The method as claimed in claim 6, wherein the second dispensing path is from one end of the center line of the mounting groove to the other end.
8. The method for potting a heart rate module of claim 1, wherein the step of curing the heart rate module after completion of the re-potting comprises:
and after UV irradiation is carried out on the heart rate module which completes secondary glue filling, the heart rate module is placed in baking equipment, the temperature is raised to 110-130 ℃ for baking and curing, and then the heart rate module is cooled.
9. The glue filling method for the heart rate module according to claim 8, wherein the temperature rise time is 8-12 min, the baking time is 10-15 min, and the temperature reduction time is 18-22 min.
10. The glue pouring method for the heart rate module as claimed in claim 1, wherein the viscosity of the pouring glue is 3000-5000 mPas, and the temperature of the working platform of the glue dispenser is set to be 45-65 ℃.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911300245.5A CN111036515A (en) | 2019-12-16 | 2019-12-16 | Glue filling method of heart rate module |
| PCT/CN2020/134743 WO2021121089A1 (en) | 2019-12-16 | 2020-12-09 | Potting method for heart rate module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911300245.5A CN111036515A (en) | 2019-12-16 | 2019-12-16 | Glue filling method of heart rate module |
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| CN111036515A true CN111036515A (en) | 2020-04-21 |
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| CN201911300245.5A Pending CN111036515A (en) | 2019-12-16 | 2019-12-16 | Glue filling method of heart rate module |
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| WO (1) | WO2021121089A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021121089A1 (en) * | 2019-12-16 | 2021-06-24 | 青岛歌尔智能传感器有限公司 | Potting method for heart rate module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872220A (en) * | 2014-04-02 | 2014-06-18 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED packaging method |
| CN105101720A (en) * | 2015-07-17 | 2015-11-25 | 北京航天万源科技公司 | Modular potting process for electronic product |
| CN108158569A (en) * | 2017-12-31 | 2018-06-15 | 维灵（杭州）信息技术有限公司 | A kind of heart rate detection patch |
| CN110200604A (en) * | 2019-04-26 | 2019-09-06 | 青岛歌尔智能传感器有限公司 | A kind of heart rate mould group and the electronic equipment for acquiring heart rate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7248923B2 (en) * | 2003-11-06 | 2007-07-24 | Cardiac Pacemakers, Inc. | Dual-use sensor for rate responsive pacing and heart sound monitoring |
| JP2006238169A (en) * | 2005-02-25 | 2006-09-07 | Seiko Instruments Inc | Heart rate measuring device |
| CN106102397A (en) * | 2016-08-01 | 2016-11-09 | 安徽贝莱电子科技有限公司 | A kind of dosing technology of electronic module |
| CN209107329U (en) * | 2017-12-31 | 2019-07-16 | 维灵（杭州）信息技术有限公司 | A kind of heart rate detection patch |
| CN109622323A (en) * | 2018-12-12 | 2019-04-16 | 深圳威迈斯电源有限公司 | The encapsulating production method of new-energy automobile wireless charging motor |
| CN111013942B (en) * | 2019-12-06 | 2021-08-06 | 青岛歌尔智能传感器有限公司 | Heart rate module glue filling method |
| CN111036515A (en) * | 2019-12-16 | 2020-04-21 | 青岛歌尔智能传感器有限公司 | Glue filling method of heart rate module |
-
2019
- 2019-12-16 CN CN201911300245.5A patent/CN111036515A/en active Pending
-
2020
- 2020-12-09 WO PCT/CN2020/134743 patent/WO2021121089A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872220A (en) * | 2014-04-02 | 2014-06-18 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED packaging method |
| CN105101720A (en) * | 2015-07-17 | 2015-11-25 | 北京航天万源科技公司 | Modular potting process for electronic product |
| CN108158569A (en) * | 2017-12-31 | 2018-06-15 | 维灵（杭州）信息技术有限公司 | A kind of heart rate detection patch |
| CN110200604A (en) * | 2019-04-26 | 2019-09-06 | 青岛歌尔智能传感器有限公司 | A kind of heart rate mould group and the electronic equipment for acquiring heart rate |
Non-Patent Citations (1)
| Title |
|---|
| 周德俭等: "《表面组装工艺技术》", 30 June 2009, 国防工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021121089A1 (en) * | 2019-12-16 | 2021-06-24 | 青岛歌尔智能传感器有限公司 | Potting method for heart rate module |
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| WO2021121089A1 (en) | 2021-06-24 |
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