CN108372089A - A kind of method of LED module and its positive surface encapsulating - Google Patents
A kind of method of LED module and its positive surface encapsulating Download PDFInfo
- Publication number
- CN108372089A CN108372089A CN201810141277.4A CN201810141277A CN108372089A CN 108372089 A CN108372089 A CN 108372089A CN 201810141277 A CN201810141277 A CN 201810141277A CN 108372089 A CN108372089 A CN 108372089A
- Authority
- CN
- China
- Prior art keywords
- led module
- mold component
- encapsulating
- glue
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention belongs to encapsulating technical fields, and in particular to a kind of LED module and its positive surface glue-pouring method.This method includes：LED module, glue and encapsulating die are provided；Wherein, the encapsulating die includes the first mold component and the second mold component arranged up and down, cavity is provided at the top of second mold component, and the bottom surface of the cavity and the first mold component bottom are horizontal plane；The LED module is fixed in the top chamber of second mold component, and the light emitting diode on the LED module surface is oppositely arranged with first mold component, the glue is poured into the cavity, the LED module is submerged；First mold component bottom and second mold component are coincide each other up and down；After glue solidification, demoulding processing is carried out to the LED module after encapsulating.The present invention keeps the encapsulating layer surface after LED module encapsulating smooth, plays better protective effect to light emitting diode, and need not polish after encapsulating.
Description
Technical field
The present invention relates to encapsulating fields, more specifically, it is related to the side of a kind of LED module and its positive surface encapsulating
Method.
Background technology
LED module be light emitting diode (Light Emitting Diode, LED) by it is certain it is regularly arranged together
It is encapsulated again, in addition some water-proof treatment technologies are formed by product.LED module is that wider production is applied in LED product
Product, there is also prodigious difference in terms of configuration aspects and electronics, it is simple be exactly with a wiring board equipped with LED with outside
As soon as shell is just at LED module, complicated also has some controllers, constant-current source and relevant heat dissipation processing device, makes in this way
LED life and luminous intensity are more preferable.
Since the light emitting diode in existing LED module is more fragile, there is relevant LED module to need to it on the market
On light emitting diode carry out encapsulating protection.General process for filling colloid be all to LED module surface encapsulating from top to bottom, due to
The tension of liquid surface is not likely to form a horizontal plane above LED module, and the thickness of glue-line cannot be disposable
Control the thickness of needs；Therefore, after encapsulating, it is also necessary to polish glue-line, be worn into horizontal glue-line and go forward side by side one
The thickness of step control glue-line.This manual polishing method, can not accomplish substantially flat, and technique is cumbersome, of high cost.
Invention content
In view of the deficiencies of the prior art, the present invention intends to provide a kind of LED module and its positive surface to fill
The method of glue.
To achieve the above object, the present invention provides following technical solutions：A kind of side of LED module forward direction surface encapsulating
Method, the method includes：
LED module, glue and encapsulating die are provided；Wherein, the encapsulating die includes the first mold arranged up and down
Part and the second mold component are provided with cavity, and the bottom surface of the cavity and the first mold at the top of second mold component
Feature bottom is horizontal plane；
The LED module is fixed in the top chamber of second mold component, and makes the LED modules table
The light emitting diode in face is oppositely arranged with first mold component, and the glue is poured into the cavity, by the LED
Module submerges；
First mold component bottom and second mold component are coincide each other up and down；
After glue solidification, demoulding processing is carried out to the LED module after encapsulating.
In some embodiments, the side of first mold component is provided with for controlling first mold component
Several support plates of the distance between second mold component.
In some embodiments, the support plate is equipped with several support columns.
In some embodiments, the side of second mold component is provided with for detecting second mold component
Whether the horizontal bead of horizontality is in.
In some embodiments, the bottom of first mold component is provided with to make the light emitting diode demould
Film layer.
In some embodiments, the film layer is that stripping film, isolation film, seperation film, adhesive block film, fractal film, plastics are thin
Any one in film, masking hole film, silicon oil membrane, antiadhesion barrier；And/or
The glue is any one condensed in glue, thermosetting glue and ultra-violet curing glue.
In some embodiments, further include that vacuum defoaming treatment is carried out to the glue after glue being poured into chamber.
In some embodiments, it is described when first mold component coincide each other up and down with second mold component
LED surface is 0.2-1.6mm at a distance from first mold bottom surface.
The invention also discloses a kind of LED module, the preparation process of the LED module includes that above-mentioned LED module is positive
The method of surface encapsulating.
LED module provided by the invention, because its preparation process includes distinctive LED module forward direction of the invention surface encapsulating
Method, therefore the present invention LED module surface contain one layer of smooth encapsulating layer, light emitting diode can be played more
Good protective effect, and the encapsulating layer need not polish, and at low cost, significant effect is better than the prior art.
Description of the drawings
Fig. 1 is the structural schematic diagram for the encapsulating die that present pre-ferred embodiments provide；
Fig. 2 is the method flow schematic diagram for the LED module forward direction surface encapsulating that present pre-ferred embodiments provide.
Specific implementation mode
As shown in Figure 1, Figure 2, an embodiment of the present invention provides a kind of methods of LED module forward direction surface encapsulating, wherein
3 structure of encapsulating die being related to is as depicted in figs. 1 and 2, which includes the following steps：
S01：LED module 1, glue 2 and encapsulating die 3 are provided；Wherein, the encapsulating die 3 includes the arranged up and down
The top of one mold component 31 and the second mold component 32, second mold component 32 is provided with cavity 33, and the cavity
33 bottom surface and 31 bottom of the first mold component are horizontal plane；
S02：The LED module 1 is fixed in the top chamber of second mold component 32, and makes the LED
The light emitting diode on 1 surface of module is oppositely arranged with first mold component 31, and the glue 2 is poured into the cavity 33
It is interior, the LED module 1 is submerged；
S03：First mold component, 31 bottom is coincide each other with about 32 second mold component；
S04：After the solidification of the glue 2, demoulding processing is carried out to the LED module 1 after encapsulating.
The method of 1 positive surface encapsulating of LED module provided by the invention, in the light emitting diode to 1 surface of LED module
When carrying out encapsulating, 1 surface of LED module is fixed on upward in 32 top chamber of the second mold component, it is solid by modes such as screws
It is scheduled in chamber, avoids its during encapsulating from moving left and right or move up and down, influence encapsulating quality.It needs to illustrate
It is that the chamber depth at the top of the second mold component 32 is more than the thickness of LED modules 1, after the completion of fixation, glue 2 is poured into the
In the chamber at the top of two molds component 32, the light emitting diode on 1 surface of LED module is submerged, while 2 surface of glue is to luminous
The height of Diode facets is more than the bondline thickness of product actual needs.
After the completion of encapsulating, the first mold component 31 is moved downward and is coincide each other with the second mold component 32 so that first
The lower surface of mold component 31 is contacted with 2 surface of glue, is in a horizontal plane by the pressing of 2 surface of glue, finally waits glues 2 solidifying
It is demoulded after Gu, completes entire encapsulating process.
Since the lower surface of the first mold component 31 is a plane, compared with prior art, LED of the invention
The method of the positive surface encapsulating of module 1 keeps the encapsulating layer surface after 1 encapsulating of LED module smooth, is played to light emitting diode
Better protective effect can not only achieve the effect that resistance to impact, and being capable of waterproof；And need not polish after encapsulating, it should
Method is simple and practicable, at low cost, and significant effect is better than the prior art.
It should be noted that this encapsulating mode finally also needs to be removed leftover pieces, but without to front into
Row polishing.
Further, in above-mentioned steps S01, the side of the first mold component 31 of the encapsulating die 3, which is provided with, to be used for
Control several support plates 34 of the distance between the first mold component 31 and the second mold component 32.The LED module of different model
1, since the thickness of its encapsulating layer is different, the installation site of support plate 34 is also different.
Further, in above-mentioned steps S01, the side of second mold component 32 be provided with for detect this second
Whether mold component 32 is in the horizontal bead of horizontality (figure does not mark).After LED module 1 fixes completion, it can pass through
Horizontal bead is adjusted it, and the second mold component 32 is made to be in horizontality, adjusts, directly sets horizontal bead for convenience
It sets on 32 side of the second mold component.
In some embodiments, the support plate 34 is equipped with several support columns 35.
Specifically, several support columns 35 are arranged in support plate 34 so that the first mold component 31 and the second mold component
There are gaps 36 between 32 contact surface so that extra glue 2 can be flowed out according to gap 36.It should be noted that second
The chamber area at 32 top of mold component is slightly larger than the area of LED module 1, the area and LED of 31 bottom surface of the first mold component
The shape and area equation of module 1, and being oppositely arranged, this design so that the first mold component 31 during pushing,
Extra glue 2 either in transverse direction, or it is longitudinal all have the gap 36 and can flow out, avoid that glue 2 can not flow out asks
Topic.
In some embodiments, the bottom of first mold component 31 is provided with to keep the light emitting diode de-
The film layer of mould.
It should also be noted that, for the ease of demoulding, it can be in the oil reservoir on 31 bottom surface of the first mold component.
In some embodiments, the film layer is that stripping film, isolation film, seperation film, adhesive block film, fractal film, plastics are thin
Any one in film, masking hole film, silicon oil membrane, antiadhesion barrier；And/or
The glue 2 is any one condensed in glue 2, thermosetting glue 2 and ultra-violet curing glue 2.
In some embodiments, further include being carried out at vacuum defoaming to the glue 2 after glue 2 being poured into chamber
Reason.
In some embodiments, when first mold component coincide each other with about 32 second mold component, institute
It is 0.2-1.6mm at a distance from first mold bottom surface to state LED surface.
The invention also discloses a kind of LED module 1, the preparation process of the LED module 1 includes above-mentioned LED modules 1
The method of positive surface encapsulating.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned reality
Example is applied, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for this technology
For the those of ordinary skill in field, several improvements and modifications without departing from the principles of the present invention, these are improved and profit
Decorations also should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of method of LED module forward direction surface encapsulating, which is characterized in that the method includes：
LED module, glue and encapsulating die are provided；Wherein, the encapsulating die include the first mold component for arranging up and down and
Second mold component is provided with cavity, and the bottom surface of the cavity and the first mold component at the top of second mold component
Bottom is horizontal plane；
The LED module is fixed in the top chamber of second mold component, and makes the hair on the LED module surface
Optical diode is oppositely arranged with first mold component, and the glue is poured into the cavity, and the LED module is soaked
Not yet；
First mold component bottom and second mold component are coincide each other up and down；
After glue solidification, demoulding processing is carried out to the LED module after encapsulating.
2. the method for LED module forward direction according to claim 1 surface encapsulating, which is characterized in that first mold
The side of part is provided with several supports for controlling the distance between first mold component and second mold component
Plate.
3. the method for LED module forward direction according to claim 2 surface encapsulating, which is characterized in that set in the support plate
There are several support columns.
4. the method for LED module forward direction according to claim 1 surface encapsulating, which is characterized in that second mold
The side of part is provided with the horizontal bead that horizontality whether is in for detecting second mold component.
5. according to the method for claim 1-4 any one of them LED module forward directions surface encapsulating, which is characterized in that described
The bottom of one mold component is provided with to make the film layer of the light emitting diode demoulding.
6. the method for LED module forward direction according to claim 5 surface encapsulating, which is characterized in that the film layer is stripping
Any one in film, isolation film, seperation film, adhesive block film, fractal film, plastic film, masking hole film, silicon oil membrane, antiadhesion barrier；With/
Or
The glue is any one condensed in glue, thermosetting glue and ultra-violet curing glue.
7. according to the method for claim 1-3 any one of them LED module forward directions surface encapsulating, which is characterized in that by glue
Further include that vacuum defoaming treatment is carried out to the glue after pouring into chamber.
8. according to the method for claim 1-3 any one of them LED module forward directions surface encapsulating, which is characterized in that described
When one mold component coincide each other up and down with second mold component, the LED surface and first mold
The distance of bottom surface is 0.2-1.6mm.
9. a kind of LED module, which is characterized in that the preparation process of the LED module includes claim 1-8 any one of them
The method of LED module forward direction surface encapsulating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810141277.4A CN108372089A (en) | 2018-02-11 | 2018-02-11 | A kind of method of LED module and its positive surface encapsulating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810141277.4A CN108372089A (en) | 2018-02-11 | 2018-02-11 | A kind of method of LED module and its positive surface encapsulating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108372089A true CN108372089A (en) | 2018-08-07 |
Family
ID=63017719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810141277.4A Pending CN108372089A (en) | 2018-02-11 | 2018-02-11 | A kind of method of LED module and its positive surface encapsulating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108372089A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312885A (en) * | 2020-04-06 | 2020-06-19 | 深圳市洲明科技股份有限公司 | LED display module glue filling process, glue pumping device and LED display module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202570547U (en) * | 2012-04-09 | 2012-12-05 | 湖州倍格曼新材料有限公司 | Automatic adhesive injection platform |
| CN202709064U (en) * | 2012-09-04 | 2013-01-30 | 慈溪恒煜电子有限公司 | Unglued LED (light-emitting diode) module external member of outdoor patch |
| CN103264001A (en) * | 2013-05-24 | 2013-08-28 | 无锡市崇安区科技创业服务中心 | LED (light-emitting diode) potting machine |
| CN102039262B (en) * | 2010-12-31 | 2014-04-02 | 上海众人网络安全技术有限公司 | Glue pouring electronic token and glue pouring process method |
| CN107335581A (en) * | 2017-06-29 | 2017-11-10 | 深圳市艾森视讯科技有限公司 | Led module and its surface glue-pouring method |
-
2018
- 2018-02-11 CN CN201810141277.4A patent/CN108372089A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102039262B (en) * | 2010-12-31 | 2014-04-02 | 上海众人网络安全技术有限公司 | Glue pouring electronic token and glue pouring process method |
| CN202570547U (en) * | 2012-04-09 | 2012-12-05 | 湖州倍格曼新材料有限公司 | Automatic adhesive injection platform |
| CN202709064U (en) * | 2012-09-04 | 2013-01-30 | 慈溪恒煜电子有限公司 | Unglued LED (light-emitting diode) module external member of outdoor patch |
| CN103264001A (en) * | 2013-05-24 | 2013-08-28 | 无锡市崇安区科技创业服务中心 | LED (light-emitting diode) potting machine |
| CN107335581A (en) * | 2017-06-29 | 2017-11-10 | 深圳市艾森视讯科技有限公司 | Led module and its surface glue-pouring method |
Non-Patent Citations (1)
| Title |
|---|
| 钱志屏: "《塑料制品设计与制造》", 31 May 1993, 同济大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312885A (en) * | 2020-04-06 | 2020-06-19 | 深圳市洲明科技股份有限公司 | LED display module glue filling process, glue pumping device and LED display module |
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| PB01 | Publication | ||
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Application publication date: 20180807 |