CN208290302U - A kind of mold of LED module reflecting surface encapsulating - Google Patents
A kind of mold of LED module reflecting surface encapsulating Download PDFInfo
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- CN208290302U CN208290302U CN201820245677.5U CN201820245677U CN208290302U CN 208290302 U CN208290302 U CN 208290302U CN 201820245677 U CN201820245677 U CN 201820245677U CN 208290302 U CN208290302 U CN 208290302U
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- led module
- reflecting surface
- film
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Abstract
The utility model belongs to encapsulating technical field, and in particular to a kind of mold of LED module reflecting surface encapsulating.The mold includes the first mold component and the second mold component arranged up and down, cavity is provided at the top of second mold component, and the bottom surface of the cavity is horizontal plane；First mold component includes: mounting base；And it is rotatably arranged in the mounting base, the rotation mold fixed for LED module；After the rotation mold rotation to level; the LED module is just matched with the chamber at the top of the first mold component; using the above design; so that one layer of smooth encapsulating layer is contained on LED module surface; better protective effect can be played to light emitting diode; and the encapsulating layer does not need to polish, and at low cost, significant effect is better than the prior art.
Description
Technical field
The utility model relates to encapsulating fields, more specifically, it is related to a kind of mould of LED module reflecting surface encapsulating
Tool.
Background technique
LED module be light emitting diode (Light Emitting Diode, LED) by it is certain it is regularly arranged together again
It is encapsulated, in addition some water-proof treatment technologies are formed by product.LED module is that wider product is applied in LED product,
There is also very big difference in terms of configuration aspects and electronics, be simply exactly the wiring board that LED is housed with one and shell just
As soon as at LED module, complicated also some controllers, constant-current source and relevant heat dissipation processing device make the LED longevity in this way
Life and luminous intensity are more preferable.
Since the light emitting diode in existing LED module is more fragile, there is relevant LED module to need to thereon on the market
Light emitting diode carry out encapsulating protection.General process for filling colloid is all to LED module surface encapsulating from top to bottom, due to liquid
The tension on surface is not likely to form a horizontal plane above LED module, and the thickness of glue-line cannot be controlled disposably
The thickness needed；Therefore, after encapsulating, it is also necessary to polish glue-line, be worn into horizontal glue-line and further controlled
The thickness of glue-line.This manual polishing method, can not accomplish substantially flat, and technique is cumbersome, at high cost.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of fillings of LED module reflecting surface
The mold of glue.
To achieve the above object, the utility model provides following technical solution: a kind of LED module reflecting surface encapsulating
Mold, which is characterized in that the mold includes:
First mold component and the second mold component arranged up and down are provided with chamber at the top of second mold component
Body, and the bottom surface of the cavity is horizontal plane；
First mold component includes:
Mounting base；And
It is rotatably arranged in the mounting base, the rotation mold fixed for LED module；
After the rotation mold rotation to level, the LED module just matches with the chamber at the top of the first mold component
It closes.
In some embodiments, the side of the LED module is provided with for detecting whether the LED module is in horizontal
The horizontal bead of state.
In some embodiments, it is provided with several first threaded holes in the LED module, is set on first mold component
Several mounting holes corresponding with each first screw thread hole site are equipped with, the LED module passes through the installation by bolt
Hole and first threaded hole cooperate to be fastenedly connected first mold component.
In some embodiments, the cavity inner wall of second mold component is provided with to keep the light emitting diode de-
The film layer of mould.
In some embodiments, the film layer be stripping film, isolation film, seperation film, adhesive block film, fractal film, plastic film,
Masking hole film, silicon oil membrane, any one in antiadhesion barrier；And/or
The glue is any one condensed in glue, thermosetting glue and ultra-violet curing glue.
In some embodiments, the bottom of second mold component is made of transparent material.
In some embodiments, it is described when first mold component and second mold component coincide each other up and down
LED surface is 0.2-1.6mm at a distance from the cavity bottom surface.
Mold provided by the utility model, so that one layer of smooth encapsulating layer is contained on LED module surface, it can be to luminous
Diode plays better protective effect, and the encapsulating layer does not need to polish, at low cost, and significant effect is better than existing skill
Art.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the encapsulating die unfolded state that the utility model preferred embodiment provides.
Fig. 2 is the structural schematic diagram for the encapsulating die closed state that the utility model preferred embodiment provides.
Specific embodiment
As shown in Figure 1, Figure 2, the utility model embodiment provides a kind of mold of LED module reflecting surface encapsulating,
It is characterized in that, the mold includes:
First mold component 10 arranged up and down and the second mold component 20, the top setting of second mold component 20
There is cavity 21, and the bottom surface of the cavity 21 is horizontal plane；
First mold component 10 includes:
Mounting base 11；And
It is rotatably arranged in the mounting base 11, the rotation mold 12 fixed for LED module 30；
After the rotation mold 12 turns to level, the LED module 30 just chamber with the top of the first mold component 10
Body 21 matches.
Specifically, when in use, using the form of rotation, in the course of rotation, by the inclination pressure of LED module 30 slowly
Enter into glue, in this process, avoids and lead to the problem of bubble between the light emitting diode in LED module 30, it can be with
Bubble is directly discharged.
Relative to the mold of pressure, when upper mold vertical depression, LED module 30 is contacted with glue up and down, but for
The LED module 30 of some large area, in this process, the bubble of 30 central part of LED module are difficult to two sides in glue
Discharge will result in bubble accumulation in this way, seriously affect product quality.Using the program, this problem is just completely avoided.
In some embodiments, the side of the LED module 30 is provided with for detecting whether the LED module 30 is in
The horizontal bead (not marked in figure) of horizontality.
In some embodiments, several first threaded holes 31, first mold component are provided in the LED module 30
Several mounting holes 13 corresponding with each first threaded hole, 31 position are provided on 10, the LED module 30 passes through bolt
14, which pass through the mounting hole 13, cooperates with first threaded hole 31 to be fastenedly connected first mold component 10.
In some embodiments, 21 inner wall of cavity of second mold component 20 is provided with to make the light-emitting diodes
The film layer 40 of pipe demoulding.
In some embodiments, the film layer 40 is that stripping film, isolation film, seperation film, adhesive block film, fractal film, plastics are thin
Film, masking hole film, silicon oil membrane, any one in antiadhesion barrier.
In some embodiments, the bottom of second mold component 20 is made of transparent material.
In some embodiments, when first mold component 10 coincide each other with about 20 second mold component,
The LED surface is 0.2-1.6mm at a distance from 21 bottom surface of cavity.
In conclusion mold provided by the utility model, so that one layer of smooth encapsulating is contained on 30 surface of LED module
Layer, can play better protective effect, and the encapsulating layer does not need to polish, at low cost, significant effect to light emitting diode
Better than the prior art.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (7)
1. a kind of mold of LED module reflecting surface encapsulating, which is characterized in that the mold includes:
First mold component and the second mold component arranged up and down are provided with cavity at the top of second mold component, and
The bottom surface of the cavity is horizontal plane；
First mold component includes:
Mounting base；And
It is rotatably arranged in the mounting base, the rotation mold fixed for LED module；
After the rotation mold rotation to level, the LED module is just matched with the chamber at the top of the first mold component.
2. the mold of LED module reflecting surface encapsulating according to claim 1, which is characterized in that the side of the LED module
Face is provided with the horizontal bead for whether being in horizontality for detecting the LED module.
3. the mold of LED module reflecting surface encapsulating according to claim 2, which is characterized in that set in the LED module
Several first threaded holes are equipped with, are provided on first mold component corresponding several with each first screw thread hole site
Mounting hole, the LED module pass through the mounting hole and first threaded hole by bolt and cooperate to be fastenedly connected described the
One mold component.
4. the mold of LED module reflecting surface encapsulating according to claim 3, which is characterized in that second mold
The film layer that the cavity inner wall of part is provided with to demould light emitting diode.
5. the mold of LED module reflecting surface encapsulating according to claim 4, which is characterized in that the film layer is removing
Film, isolation film, seperation film, adhesive block film, fractal film, plastic film, masking hole film, silicon oil membrane, any one in antiadhesion barrier；With/
Or,
Glue is any one condensed in glue, thermosetting glue and ultra-violet curing glue.
6. the mold of LED module reflecting surface encapsulating according to claim 5, which is characterized in that second mold
The bottom of part is made of transparent material.
7. the mold of LED module reflecting surface encapsulating according to claim 6, which is characterized in that first mold
When part and second mold component coincide each other up and down, the LED surface is at a distance from the cavity bottom surface
0.2-1.6mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820245677.5U CN208290302U (en) | 2018-02-11 | 2018-02-11 | A kind of mold of LED module reflecting surface encapsulating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820245677.5U CN208290302U (en) | 2018-02-11 | 2018-02-11 | A kind of mold of LED module reflecting surface encapsulating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208290302U true CN208290302U (en) | 2018-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820245677.5U Active CN208290302U (en) | 2018-02-11 | 2018-02-11 | A kind of mold of LED module reflecting surface encapsulating |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110956902A (en) * | 2019-12-02 | 2020-04-03 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring process |
-
2018
- 2018-02-11 CN CN201820245677.5U patent/CN208290302U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110956902A (en) * | 2019-12-02 | 2020-04-03 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring process |
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