CN110956902A - LED display module lamp seam glue pouring process - Google Patents
LED display module lamp seam glue pouring process Download PDFInfo
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- CN110956902A CN110956902A CN201911214160.5A CN201911214160A CN110956902A CN 110956902 A CN110956902 A CN 110956902A CN 201911214160 A CN201911214160 A CN 201911214160A CN 110956902 A CN110956902 A CN 110956902A
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Abstract
The invention discloses a glue pouring process for a light gap of an LED display module, and belongs to the technical field of LED display screens. The glue pouring process comprises the following steps: the LED display module to be encapsulated is reversely buckled on the adhesive film with the lamp surface facing downwards, and the adhesive film is attached to the reversed lamp surface of the LED display module to be encapsulated; forming a through hole on the adhesive film; bonding a surrounding barrier on four sides of the adhesive film, and folding the surrounding barrier to enable the surrounding barrier, the inverted LED display module to be subjected to adhesive filling and the adhesive film to form an adhesive containing groove; injecting glue into the glue containing groove; connecting the through hole into an air pipe and vacuumizing until glue pouring is completed to form a semi-finished product of the LED display module which is poured with glue; and standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified. The whole process only needs to adopt the existing simple equipment, the flowability of the glue in the lamp seam is good, and meanwhile, the glue-filled LED display module finished product with thicker glue filling thickness and more uniform glue filling in the lamp seam can be obtained with lower cost and higher efficiency, so that the LED display module has the capabilities of collision prevention, moisture prevention and water prevention.
Description
Technical Field
The invention relates to the technical field of LED display screens, in particular to a glue pouring process for a light gap of an LED display module.
Background
At present, LED lamp beads in an LED display module have the condition that the lamp is dead due to short circuit caused by entering moisture easily due to packaging factors. To solve this problem, it is generally necessary to inject glue into the light slits of the LED display module by a glue-pouring method or process. Along with the development that the dot interval of lamp pearl among the LED display module is littleer and littleer, the width of the light seam between the lamp pearl is littleer and littleer, among current encapsulating method or encapsulating technology, the mobility of glue in the light seam is relatively poor, on the one hand for the efficiency of encapsulating is lower, and on the other hand, the glue of filling is less in the light seam, hardly plays fine protective effect to the lamp pearl.
Disclosure of Invention
The invention aims to provide a glue pouring process for a light gap of an LED display module, which solves the technical problems that in the existing glue pouring method or the existing glue pouring process, the flowability of glue in the light gap is poor, on one hand, the glue pouring efficiency is low, and on the other hand, the light gap is filled with less glue, so that the good protection effect on a lamp bead is difficult to achieve.
The technical purpose of the invention is realized by the following technical scheme: a glue pouring process for a light gap of an LED display module comprises the following steps:
the LED display module to be glued is reversely buckled on a glue film with the lamp surface facing downwards, and the glue film is attached to the reversed lamp surface of the LED display module to be glued;
forming a through hole on the adhesive film;
bonding enclosing barriers on four sides of the adhesive film, and folding the enclosing barriers to enable the enclosing barriers, the inverted LED display module to be subjected to adhesive filling and the adhesive film to form an adhesive containing groove;
injecting glue into the glue containing and holding groove;
connecting the through hole on the adhesive film into an air pipe and vacuumizing until the glue filling is completed to form a semi-finished product of the LED display module filled with the glue;
and standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified.
Preferably, the LED display module to be subjected to glue pouring is reversely buckled on the glue film, and the distance between each edge of the glue film and the corresponding edge of the LED display module to be subjected to glue pouring is 5-10 mm.
Preferably, the diameter of the through hole on the adhesive film is 0.05-0.1mm, and/or the through hole is marked by a colored pen.
As a further optimization, the adhesive film is a hot melt adhesive film.
Preferably, the adhesive film is an EVA hot melt adhesive film, a PE hot melt adhesive film, a PP hot melt adhesive film, a PA hot melt adhesive film, a PES hot melt adhesive film, a PO hot melt adhesive film or a TPU hot melt adhesive film.
As further optimization, the LED display module lamp face that will treat the encapsulating is down the back-off on the glued membrane, will the glued membrane laminating is in on the lamp face of LED display module, include:
spreading a silica gel mold or a release film on a platform of the hot press;
flatly paving a hot melt adhesive film on the silica gel mold or the release film;
inversely buckling the LED display module to be glue-filled on the hot melt adhesive film with the surface facing downwards;
the hot press heats and pressurizes the inverted LED display module to be encapsulated;
and after the hot pressing is finished, taking down the silicone mold or the release film after the inverted LED display module to be filled with the adhesive is cooled.
Preferably, when the reversed LED display module to be encapsulated is heated and pressurized by the hot press, the pressure is 0.1-1Mpa, and/or the temperature is 70-120 ℃, and/or the pressure maintaining time is 0.5-5 min.
The technical purpose of the invention can also be realized by the following technical scheme: a glue pouring process for a light gap of an LED display module comprises the following steps:
the LED display module to be glued is reversely buckled on a glue film with the lamp surface facing downwards, and the glue film is attached to the reversed lamp surface of the LED display module to be glued;
forming a through hole on the adhesive film;
the reverse buckled LED display module with the adhesive film is downwards buckled into a glue pouring jig, and the outer side of the periphery of the reverse buckled LED display module with the adhesive film and the inner side of the periphery of the glue pouring jig form a glue containing and accommodating groove;
injecting glue into the glue containing and holding groove;
connecting the through hole on the adhesive film into an air pipe and vacuumizing until the glue filling is completed to form a semi-finished product of the LED display module filled with the glue;
and standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified.
As a further optimization, the adhesive film is a hot-melt adhesive film, and the adhesive film is attached to the inverted LED display module to be glue-filled on the lamp surface through hot pressing.
As a further optimization, before the injecting the glue into the glue containing and holding tank, the method further comprises: and release films are arranged around the reversed LED display module to be glue-filled, which is attached with the glue film.
In conclusion, the invention has the following beneficial effects: according to the LED display module light seam glue filling process, the light surface of the LED display module is protected through the glue film, the through hole poked on the glue film is convenient to vacuumize to form pressure difference, the whole process only needs to adopt existing simple equipment, the mobility of glue in the light seam is good, meanwhile, the finished LED display module with the glue filled in the light seam with thicker glue filling thickness and more uniform glue filling can be obtained at lower cost and higher efficiency, and the front side of the LED display module has the capabilities of collision prevention, moisture prevention and water prevention.
Drawings
FIG. 1 is a schematic flow chart of a glue pouring process for a light gap of an LED display module according to a first embodiment;
FIG. 2 is a schematic process diagram of a glue pouring process for a light gap of an LED display module according to the first embodiment;
FIG. 3 is a schematic flow chart of a glue pouring process for the light gap of the LED display module according to the second embodiment;
FIG. 4 is a schematic view of a process of glue pouring for the light gap of the LED display module according to the second embodiment;
fig. 5 is a schematic flow chart of a light gap glue filling process of the LED display module according to the third embodiment.
In the figure: 10. the LED display module is to be encapsulated; 20. adhesive film/hot melt adhesive film; 21. a through hole; 30. fencing; 40. a glue containing groove; 50. glue; 100. silicone mold or release film.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example one
Referring to fig. 1 and fig. 2, in the present embodiment, a light gap glue filling process for an LED display module includes the following steps:
step S10, the LED display module 10 to be glue-filled is reversely buckled on the glue film 20 with the lamp surface facing downwards, and the glue film 20 is attached to the reversely buckled lamp surface of the LED display module 10 to be glue-filled.
Specifically, an adhesive film 20 which has certain viscosity and can be subsequently removed and an LED display module 10 to be subjected to glue pouring are prepared, the adhesive film 20 is tiled, then the LED display module 10 to be subjected to glue pouring is inversely buckled on the tiled adhesive film 20 with the lamp surface facing downwards, and then the adhesive film 20 is attached to the inversely buckled lamp surface of the LED display module 10 to be subjected to glue pouring, so that the adhesive bonding of the adhesive film 20 can be directly utilized, and other means such as hot pressing can also be assisted. For optimization, after the to-be-glue-filled LED display module 10 is reversely buckled on the glue film 20, the distance between each edge of the glue film 20 and the corresponding edge of the to-be-glue-filled LED display module 10 is 5-10mm (millimeters).
In step S20, a through hole 21 is formed in the adhesive film 20.
Specifically, the through holes 21 are formed in the adhesive film 20, preferably, 1 to 4 through holes 21 are poked at the center position of the adhesive film 20 or around the center position, for example, the through holes 21 may be poked at four points, i.e., the upper, lower, left and right points, on a circle formed by taking the center of the adhesive film 20 as a circle center and taking a half of the distance from the center of the adhesive film 20 to the side edge of the inverted LED display module 10 to be glue-poured as a radius, so that the subsequent glue 40 can more uniformly flow to each position of the lamp seam of the LED display module 10 to be glue-poured. As optimization, the aperture of the formed through hole 21 is 0.05-0.1mm (millimeter), and the through hole 21 can be marked by a colored pen.
Step S30, bonding the enclosure 30 on four sides of the adhesive film 20, and folding the enclosure 30 to make the enclosure 30, the inverted LED display module 10 to be glue-filled, and the adhesive film 20 form a glue receiving slot 40.
Specifically, enclose fender 30 in the bonding of glued membrane 20's four sides, then will enclose fender 30 and roll up for the LED display module assembly 10 that waits to glue filling that encloses fender 30, back-off and glued membrane 20 form one and hold gluey groove 40, and the bonding encloses fender 30 and rolls up when enclosing fender 30, notices holistic leakproofness, and the appearance gluey groove 40 of avoiding forming can leak. The enclosure 30 is preferably aluminum foil tape. For optimization, after the enclosure 30 is folded, the distance between the enclosure 30 and the four sides of the inverted LED display module 10 to be glue-filled is 0.5-2 mm.
Step S40, glue 50 is injected into the glue receiving groove 40.
Specifically, a proper amount of glue 50 without bubbles is uniformly injected into the glue containing groove 40 formed by the enclosure 30, the inverted LED display module 10 to be glue filled and the glue film 20. Preferably, the glue 50 is an epoxy glue, a silica gel glue, a PU glue or a UV glue. The color of the glue 50 can be transparent or black, and the color of the glue 50 is preferably black, so that not only can higher contrast be obtained, but also the color difference between the LED display modules can be eliminated.
And step S50, connecting the through hole 21 on the adhesive film 20 into an air pipe and vacuumizing until the adhesive filling is completed to form a semi-finished product of the LED display module filled with the adhesive.
Specifically, a through hole 21 which is formed in the front adhesive film 20 and is marked is connected to an air pipe, and is connected to a vacuumizing device for vacuumizing, the glue 50 in the glue containing groove 40 is filled into a lamp gap of the inverted LED display module 10 to be glued under the action of the atmospheric pressure, and the surface of the lamp bead is protected by the adhesive film 20 and cannot be contacted with the glue.
And step S60, standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified.
Specifically, the LED display module semi-finished product filled with the glue is placed in an environment with the temperature lower than 60 ℃ or room temperature minus 60 ℃ for a period of time until the glue is cured.
And step S70, removing the barriers 30, the adhesive films 20 and the redundant glue 50 on the solidified LED display module semi-finished product filled with glue to obtain the LED display module finished product filled with glue in the lamp seams.
Specifically, after the glue is cured, the enclosure 30, the glue film 20 and the redundant glue 50 around the LED display module on the cured LED display module semi-finished product filled with the glue are removed, and the redundant glue 50 can be cut off by using a carving machine or a scribing machine, so that the LED display module finished product filled with the glue in the lamp seam can be obtained. As optimization, in order to eliminate mirror reflection after glue curing, a layer of matte paint, such as UV (ultraviolet) matte paint, can be uniformly sprayed on the surface of the LED display module finished product filled with the glue.
LED display module lamp seam encapsulating technology in this embodiment, lamp face through glued membrane protection LED display module, and the through-hole that stabs on the glued membrane be convenient for the evacuation and form pressure differential, make whole technology only need adopt current simple equipment, glue mobility in the lamp seam is better, can be with lower cost and higher efficiency simultaneously, obtain encapsulating thickness thicker and encapsulating more even lamp seam and irritate the LED display module finished product of gluing, make LED display module openly possess the anticollision, dampproofing and waterproof ability.
Example two
The difference between this embodiment and the first embodiment is: the adhesive film in this embodiment is a hot-melt adhesive film, and is attached to the lamp surface of the LED display module to be glue-filled in a hot-pressing manner.
In step S10 in the first embodiment, the lamp surface of the LED display module to be glue-filled is turned over on the glue film, and the glue film is attached to the lamp surface of the LED display module to be glue-filled. As shown in fig. 3 and 4, the present embodiment includes:
step S11, a silicone mold or release film 100 is laid flat on the platform of the hot press.
Specifically, a silicone mold or a release film 100 is laid on a hot pressing platform of the hot press, and the silicone mold or the release film 100 is used for preventing the hot melt adhesive film 20 from being stuck on the hot pressing platform of the hot press during hot pressing.
Step S12, a sheet of hot melt adhesive film 20 is laid on the silicone mold or release film 100.
Specifically, a sheet of hot melt adhesive film 20 is laid on a silicone mold or release film 100 that has been laid on a hot press platform of a hot press. Preferably, the thickness of the hot melt adhesive film 20 is 0.1 to 0.6 mm. Preferably, the hot-melt adhesive film 20 is an EVA hot-melt adhesive film, a PE hot-melt adhesive film, a PP hot-melt adhesive film, a PA hot-melt adhesive film, a PEs hot-melt adhesive film, a PO hot-melt adhesive film, or a TPU hot-melt adhesive film.
Step S13, the LED display module 10 to be glue-filled is turned upside down on the hot melt adhesive film 20.
Specifically, the LED display module 10 to be encapsulated is turned upside down on the hot melt adhesive film 20.
And step S14, heating and pressurizing the inverted LED display module 10 to be encapsulated by the hot press.
Specifically, the hot press heats and pressurizes the inverted LED display module 10 to be glued, so that the hot-melt adhesive film 20 is attached to the inverted LED display module 10 to be glued, and after hot pressing, the hot-melt adhesive film 20 partially enters the lamp gap, so that the glue surface after subsequent glue filling is finished is lower than the lamp surface of the LED display module. As optimization, when the hot press heats and presses the inverted LED display module 10 to be encapsulated, the pressure is 0.1-1MPa, the temperature is 70-120 ℃, and the pressure maintaining time is 0.5-5min (minutes).
Step S15, after the hot pressing is finished, the silicone mold or the release film 100 is taken down after the inverted LED display module 10 to be filled with the adhesive is cooled.
Specifically, after the hot pressing is finished, waiting for a certain time, and after the inverted LED display module 10 to be filled with the adhesive is cooled, the silicone mold or the release film 100 is taken down.
The remaining steps of the LED display module light seam glue filling process in this embodiment are the same as steps S20-S70 in the first embodiment, and details are referred to in the first embodiment and are not described herein.
EXAMPLE III
The difference between this embodiment and the first embodiment is that the composition of the sol tank is different, and as shown in fig. 5, the light gap potting process of the LED display module in this embodiment includes the following steps:
and S100, inversely buckling the LED display module to be subjected to glue pouring with the lamp surface facing downwards on a glue film, and attaching the glue film to the inversely buckled lamp surface of the LED display module to be subjected to glue pouring.
And step S200, forming a through hole on the adhesive film.
And step S300, downwards buckling the adhesive film of the inverted LED display module to be subjected to adhesive pouring, which is attached with the adhesive film, into an adhesive pouring jig, wherein the outer sides of the periphery of the inverted LED display module to be subjected to adhesive pouring, which is attached with the adhesive film, and the inner sides of the periphery of the adhesive pouring jig form adhesive accommodating grooves.
Specifically, a glue filling jig is prepared, the inverted buckle of the glue film is attached to the LED display module to be glue filled, the glue film is downwards buckled into the glue filling jig, and the outer side of the periphery of the inverted buckle of the glue film to be glue filled and the inner side of the periphery of the glue filling jig form a glue accommodating groove.
Step S400, injecting glue into the glue containing groove.
And S500, connecting the through hole on the adhesive film into an air pipe and vacuumizing until the glue filling is completed to form a semi-finished product of the LED display module filled with the glue.
And S600, standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified.
And S700, taking the cured LED display module semi-finished product filled with glue out of the glue filling jig, and removing the glue film and the redundant glue on the cured LED display module semi-finished product filled with glue to obtain the LED display module finished product filled with glue in the lamp seam.
Preferably, the adhesive film in this embodiment is a hot-melt adhesive film, the adhesive film is attached to the inverted lamp surface of the LED display module to be glue-filled by hot pressing, and the detailed steps can be referred to in the second embodiment. As a further optimization, before the injecting the glue into the glue containing groove, the method further comprises: the LED display module assembly that treats the encapsulating of back-off that the laminating has the glued membrane sets up all around from the type membrane, avoids glue to bond around LED display module assembly through from the type membrane.
The above specific embodiments are merely illustrative of the present invention, and are not restrictive, and those skilled in the art can modify the above embodiments without inventive contribution as required after reading the present specification, but only protected by the patent laws within the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a LED display module lamp seam encapsulating technology which characterized in that: the method comprises the following steps:
the LED display module to be glued is reversely buckled on a glue film with the lamp surface facing downwards, and the glue film is attached to the reversed lamp surface of the LED display module to be glued;
forming a through hole on the adhesive film;
bonding enclosing barriers on four sides of the adhesive film, and folding the enclosing barriers to enable the enclosing barriers, the inverted LED display module to be subjected to adhesive filling and the adhesive film to form an adhesive containing groove;
injecting glue into the glue containing and holding groove;
connecting the through hole on the adhesive film into an air pipe and vacuumizing until the glue filling is completed to form a semi-finished product of the LED display module filled with the glue;
and standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified.
2. The LED display module lamp seam glue pouring process according to claim 1, characterized in that: and after the LED display module to be subjected to glue pouring is reversely buckled on the glue film, the distance between each edge of the glue film and the corresponding edge of the LED display module to be subjected to glue pouring is 5-10 mm.
3. The LED display module lamp seam glue pouring process according to claim 1, characterized in that: the aperture of the through hole on the adhesive film is 0.05-0.1mm, and/or the through hole is marked by a colored pen.
4. The LED display module lamp seam glue pouring process according to claim 1, characterized in that: the adhesive film is a hot melt adhesive film.
5. The LED display module lamp seam glue pouring process according to claim 4, characterized in that: the adhesive film is an EVA hot melt adhesive film, a PE hot melt adhesive film, a PP hot melt adhesive film, a PA hot melt adhesive film, a PES hot melt adhesive film, a PO hot melt adhesive film or a TPU hot melt adhesive film.
6. The LED display module lamp seam glue pouring process according to claim 4, characterized in that: the LED display module lamp face that will treat the encapsulating is down the back-off on the glued membrane, will the glued membrane laminating is in on the lamp face of LED display module, include:
spreading a silica gel mold or a release film on a platform of the hot press;
flatly paving a hot melt adhesive film on the silica gel mold or the release film;
inversely buckling the LED display module to be glue-filled on the hot melt adhesive film with the surface facing downwards;
the hot press heats and pressurizes the inverted LED display module to be encapsulated;
and after the hot pressing is finished, taking down the silicone mold or the release film after the inverted LED display module to be filled with the adhesive is cooled.
7. The LED display module lamp seam glue pouring process according to claim 6, characterized in that: and when the hot press heats and pressurizes the inverted LED display module to be encapsulated, the pressure is 0.1-1Mpa, and/or the temperature is 70-120 ℃, and/or the pressure maintaining time is 0.5-5 min.
8. The utility model provides a LED display module lamp seam encapsulating technology which characterized in that: the method comprises the following steps:
the LED display module to be glued is reversely buckled on a glue film with the lamp surface facing downwards, and the glue film is attached to the reversed lamp surface of the LED display module to be glued;
forming a through hole on the adhesive film;
the reverse buckled LED display module with the adhesive film is downwards buckled into a glue pouring jig, and the outer side of the periphery of the reverse buckled LED display module with the adhesive film and the inner side of the periphery of the glue pouring jig form a glue containing and accommodating groove;
injecting glue into the glue containing and holding groove;
connecting the through hole on the adhesive film into an air pipe and vacuumizing until the glue filling is completed to form a semi-finished product of the LED display module filled with the glue;
and standing the LED display module semi-finished product filled with the glue until the LED display module semi-finished product is solidified.
9. The LED display module lamp seam glue pouring process according to claim 8, characterized in that: the adhesive film is a hot-melt adhesive film, and the adhesive film is attached to the inverted LED display module to be subjected to adhesive filling through hot pressing.
10. The LED display module lamp seam glue pouring process according to claim 8, characterized in that: before the step of injecting glue into the glue containing and holding groove, the method further comprises the following steps: and release films are arranged around the reversed LED display module to be glue-filled, which is attached with the glue film.
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| CN111312885A (en) * | 2020-04-06 | 2020-06-19 | 深圳市洲明科技股份有限公司 | LED display module glue filling process, glue pumping device and LED display module |
| CN111589669A (en) * | 2020-06-18 | 2020-08-28 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring method and system |
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