CN208854893U - A kind of encapsulating die for LED module - Google Patents
A kind of encapsulating die for LED module Download PDFInfo
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- CN208854893U CN208854893U CN201821624094.XU CN201821624094U CN208854893U CN 208854893 U CN208854893 U CN 208854893U CN 201821624094 U CN201821624094 U CN 201821624094U CN 208854893 U CN208854893 U CN 208854893U
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- led module
- mold
- film
- glue
- encapsulating die
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Abstract
A kind of encapsulating die for LED module, it is related to encapsulating technical field.It includes: the first mold and the second mold laid up and down, the encapsulating die further include: be carried on second mold and be converted into groove-like, for contain primer and facilitate LED module demould film layer；Be set on first mold far from the LED module side, for first mold apply pressure so that the primer contained in the film layer is uniformly adhered the briquetting in the LED module；And it is set to several elastic components between first mold and the LED module, for being evenly dispersed into the gravity of first mold and the briquetting in the LED module.The gravity of the first mold can be evenly dispersed in LED template when encapsulating die molds by adopting the above technical scheme, with filling effect, good, LED module damages advantage small, that glue surface is thin and smooth.
Description
Technical field
The utility model relates to encapsulating technical fields, and in particular to a kind of encapsulating die for LED module.
Background technique
A certain number of light emitting diodes are exactly arranged regularly and are encapsulated again together by LED module, in addition some
The product of water-proofing treatment composition.LED module is using wider product in LED product, in terms of configuration aspects and electronics
It is simply exactly the wiring board and shell with one equipped with LED just at a LED module in the presence of very big difference, it is complicated
Just there are also some controllers, constant-current source and relevant heat dissipation processing devices, make LED life and luminous intensity more preferable in this way.
Since the light emitting diode in existing LED module is more fragile, LED module on the market is needed to hair thereon
Optical diode carries out encapsulating processing to achieve the purpose that protect light emitting diode.Existing encapsulating die includes: the first mold,
Two molds and the locating piece being arranged between the first mold and LED module, since locating piece is arranged in the first mold and LED mould
Group, in the first mold and the second mold clamping, since the pcb board hardness in LED module is not high, along with the branch of positioning component
Support, easily leads to pcb board bending deformation in encapsulating and therefore has much room for improvement.
Utility model content
The purpose of this hair utility model is in view of the drawbacks of the prior art and insufficient, is provided in a kind of for LED module
Encapsulating die, the gravity of the first mold can be evenly dispersed in LED template when encapsulating die molds, have and fill effect
Fruit is good, LED module damages advantage small, that glue surface is thin and smooth.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of encapsulating die for LED module, comprising:
The first mold and the second mold laid up and down, the encapsulating die further include: be carried on second mold and be converted into recessed
Channel-shaped, for contain primer and facilitate LED module demould film layer；It is set on first mold far from the LED mould
Group side, for first mold apply pressure so that the primer contained in the film layer is uniformly adhered described
Briquetting in LED module；And be set to it is between first mold and the LED module, for by first mold
Several elastic components being evenly dispersed into the gravity of the briquetting in the LED module.
The elastic component is tower spring or tower-shaped bullet block.
The floor space for the groove that the film layer is converted into is greater than the area of glue surface in the LED module.
The film layer is adsorbed on the loading end of second mold by water layer or oil reservoir.
The film layer be stripping film, isolation film, seperation film, adhesive block film, fractal film, plastic film, masking hole film, silicon oil membrane,
Any one in antiadhesion barrier.
The LED module is the semi-finished product that upper glue surface is coated with face glue.
Second mold is acrylic board, and glue used in primer and face glue is condensation glue, thermosetting glue and purple
Any one in outer solidification glue.
After adopting the above technical scheme, the invention has the following beneficial effects: by the way that bullet is arranged between the first mold and LED module
Property part, when so that the encapsulating die molding during encapsulating, enables to the gravity of the first mold to be uniformly dispersed in LED mould
In group, the problem of not only avoiding LED module surface unbalance stress and the pcb board in LED module is caused to be bent, LED ensure that
The uniformity of mould group surface pressure, moreover, can guarantee the uniformity of the upper glue surface gluing water attachment of LED module, in turn
It ensure that the uniformity that glue surface glue is distributed in LED module, put on the quality of LED module encapsulating；Meanwhile on the first mold
Briquetting is set, so that LED module pressure suffered during encapsulating is increased, so that under LED module is continuous in primer
Pressure, so that the glue surface of LED module is relatively thin, so that the LED module after encapsulating has good excellent of good heat dissipation effect, translucent effect
Gesture, with filling effect, good, LED module damages advantage small, that glue surface is thin and smooth.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the overall structure diagram of embodiment.
Description of symbols: 1, the first mold；2, the second mold；3, film layer；4, briquetting；5, elastic component；6, light-emitting diodes
Pipe；7, LED module；8, primer；9, groove；10, face glue.
Specific embodiment
In the following detailed description, many details are proposed, in order to the comprehensive understanding to the utility model；But
It is, it will be apparent to those skilled in the art that the utility model can not need one in these details
Implement in the case where a little details；Below the description of embodiment is used for the purpose of providing by showing the example of the utility model
The utility model is more fully understood.
Below in conjunction with attached drawing, the technical solution of the utility model embodiment is described.
The present embodiment is related to a kind of encapsulating die for LED module, comprising: the first mold 1, the second mold 2, film layer 3,
Briquetting 4 and elastic component 5.
First mold 1 and the second mold 2 in laying up and down, and the second mold 2 is in lower section, and the first mold 1 is above.Film layer 3
It is carried on the second mold 2 after being converted into 9 shape of groove, film layer 3 is for containing primer 8 and facilitating LED module 7 and the second mould after encapsulating
2 separation of tool.Briquetting 4 is set on the first mold 1 far from 7 side of LED module, and briquetting 4 is used to apply pressure to the first mold 1,
To make the primer 8 contained in film layer 3 be uniformly adhered in LED module 7, reach gluing purpose.Elastic component 5 is set to first
Between mold 1 and LED module 7, elastic component 5 is tower spring or tower-shaped bullet block, and elastic component 5 is used for the first mold 1 and pressure
The gravity of block 4 is evenly dispersed into LED module 7, showing for bending deformation occurs so as to avoid the pcb board in LED module 7
As reducing damage when 7 encapsulating of LED module, ensure that the encapsulating effect of LED module 7.
In the present embodiment, the first mold 1 and the second mold 2 are rectangular-shape, the area of the stitching surface of the first mold 1
Less than the area of the loading end of the second mold 2,4 plastic plate of briquetting, elastic component 5 is tower spring, to facilitate elastic component 5
It places.The four edges of film layer 3 are to separate 90 degree of second mold, 2 curving, so that it is converted into 9 shape of groove with accommodating chamber, side
Just primer 8 is contained.First mold 1 and the second mold 2 are transparent acrylic board.The area for the accommodating chamber that film layer 3 is converted into is big
In the area of the first mold 1, so that the second mold 2 be facilitated to press LED module 7.In order to guarantee film layer 3 in the second mold
The stationarity placed on 2 coats water layer on the loading end of the second mold 2, and film layer 3 is fixed on by the adsorption capacity of water
On two molds 2, to facilitate the use of film layer 3 and pouring into for primer 8, film layer 3 is glass film layers 3.
In other embodiments, the first mold 1 can be cylindrical with the second mold 2, the shapes such as straight pentagonal prism shape.Film layer
3 can be able to be isolation film, seperation film, adhesive block film, fractal film, plastics by cutting or 9 shape of spicing forming type groove, film layer 3
Film, masking hole film, silicon oil membrane, antiadhesion barrier etc..Briquetting 4 is steel plate, solid wood block etc..Elastic component 5 be straight tube spring, tower bullet block,
Column bullet block etc..Glue used in primer 8 and face glue 10 is condensation glue, thermosetting glue, ultra-violet curing glue etc..
When in order to promote stitching operation, LED module 7 is set upper glue surface by the mobility of the primer 8 in 3 groove 9 of film layer
It is coated with the semi-finished product LED module 7 of face glue 10, in encapsulating, the LED module 7 after spray-coating surface glue 10, can when being glued
The bond properties between LED module 7 and primer 8 is promoted, to ensure that the globality between LED module 7 and primer 8, in turn
It ensure that the effect of 7 encapsulating of LED module.
The design principle of the present embodiment is approximately as stating: by the way that elastic component is arranged between the first mold 1 and LED module 7
5, when so that the encapsulating die molding during encapsulating, the gravity of the first mold 1 is enabled to be uniformly dispersed in LED module
On 7, the problem of not only avoiding 7 surface unbalance stress of LED module and the pcb board in LED module 7 is caused to be bent, LED ensure that
The uniformity of 7 surface pressure of mould group, moreover, can guarantee the uniformity of the upper glue surface gluing water attachment of LED module 7, into
And ensure that the uniformity that 10 liquid of glue surface glue is distributed in LED module 7, put on the quality of 7 encapsulating of LED module；Meanwhile first
Briquetting 4 is set on mold 1, so that the pressure suffered during encapsulating of LED module 7 is increased, so that LED module 7 is in primer 8
In constantly push so that the glue surface of LED module 7 is relatively thin, so that the LED module 7 after encapsulating has good heat dissipation effect, thoroughly
The good advantage of light effect, with filling effect, good, LED module 7 damages advantage small, that glue surface is thin and smooth.
Above embodiments are only to illustrate the technical solution of the utility model, rather than carry out to the protection scope of utility model
Limitation, it is clear that described embodiment is only the utility model section Example, rather than whole embodiments；Based on these
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the utility model scope of the claimed.
Although the utility model is described in detail referring to above-described embodiment, those of ordinary skill in the art are still
Can it is according to circumstances mutual to the feature in various embodiments of the utility model that creative work not be made in the absence of conflict
Other adjustment are made in combination, additions and deletions, to obtain different, essence without departing from the other technologies side of the design of the utility model
Case, these technical solutions similarly belong to the utility model scope of the claimed.
Claims (7)
1. a kind of encapsulating die for LED module, comprising: the first mold (1) laid up and down and the second mold (2), it is special
Sign is, the encapsulating die further include:
Be carried on second mold (2) and be converted into groove-like, for contain primer (8) and facilitate LED module (7) demould
Film layer (3)；
Be set on first mold (1) far from the LED module (7) side, for first mold (1) apply
Pressure is so that the primer (8) contained in the film layer (3) is uniformly adhered the briquetting (4) on the LED module (7)；And
Be set to it is between first mold (1) and the LED module (7), for by first mold (1) and the pressure
The gravity of block (4) is evenly dispersed into several elastic components (5) on the LED module (7).
2. the encapsulating die according to claim 1 for LED module, which is characterized in that the elastic component (5) is tower
Spring or tower-shaped bullet block.
3. the encapsulating die according to claim 1 for LED module, which is characterized in that the film layer (3) was converted into
The floor space of groove (9) is greater than the area of glue surface on the LED module (7).
4. the encapsulating die according to claim 3 for LED module, which is characterized in that the film layer (3) passes through water layer
Or oil reservoir is adsorbed on the loading end of second mold (2).
5. the encapsulating die according to claim 4 for LED module, which is characterized in that the film layer (3) is removing
Film, isolation film, seperation film, adhesive block film, fractal film, plastic film, masking hole film, silicon oil membrane, any one in antiadhesion barrier.
6. the encapsulating die according to any one of claims 1-5 for LED module, which is characterized in that the LED mould
Group (7) is the semi-finished product that upper glue surface is coated with face glue (10).
7. the encapsulating die according to claim 6 for LED module, which is characterized in that second mold (2) is Asia
Glue used in gram force plate, primer (8) and face glue (10) is any in condensation glue, thermosetting glue and ultra-violet curing glue
It is a kind of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821624094.XU CN208854893U (en) | 2018-09-30 | 2018-09-30 | A kind of encapsulating die for LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821624094.XU CN208854893U (en) | 2018-09-30 | 2018-09-30 | A kind of encapsulating die for LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208854893U true CN208854893U (en) | 2019-05-14 |
Family
ID=66420289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821624094.XU Expired - Fee Related CN208854893U (en) | 2018-09-30 | 2018-09-30 | A kind of encapsulating die for LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208854893U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109177008A (en) * | 2018-09-30 | 2019-01-11 | 深圳市华夏光彩股份有限公司 | A kind of encapsulating die and its glue-pouring method for LED module |
| CN113927804A (en) * | 2021-09-18 | 2022-01-14 | 东莞阿尔泰显示技术有限公司 | Glue filling mold of LED display module |
-
2018
- 2018-09-30 CN CN201821624094.XU patent/CN208854893U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109177008A (en) * | 2018-09-30 | 2019-01-11 | 深圳市华夏光彩股份有限公司 | A kind of encapsulating die and its glue-pouring method for LED module |
| CN109177008B (en) * | 2018-09-30 | 2024-06-07 | 深圳市华夏光彩股份有限公司 | Glue filling method |
| CN113927804A (en) * | 2021-09-18 | 2022-01-14 | 东莞阿尔泰显示技术有限公司 | Glue filling mold of LED display module |
| CN113927804B (en) * | 2021-09-18 | 2023-11-07 | 东莞阿尔泰显示技术有限公司 | Glue filling die of LED display module |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190514 Termination date: 20210930 |
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| CF01 | Termination of patent right due to non-payment of annual fee |