GB0812350D0 - Packaging structure of a light emitting diode - Google Patents

Packaging structure of a light emitting diode

Info

Publication number
GB0812350D0
GB0812350D0 GB0812350A GB0812350A GB0812350D0 GB 0812350 D0 GB0812350 D0 GB 0812350D0 GB 0812350 A GB0812350 A GB 0812350A GB 0812350 A GB0812350 A GB 0812350A GB 0812350 D0 GB0812350 D0 GB 0812350D0
Authority
GB
United Kingdom
Prior art keywords
chip
mold
circuit board
emitting diode
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0812350A
Other versions
GB2452121A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB0812350D0 publication Critical patent/GB0812350D0/en
Publication of GB2452121A publication Critical patent/GB2452121A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A light emitting diode chip 1 is mounted on the surface of a circuit board 2 which has on the surface both a region for mounting the chip 21, and conductors 22 for connecting to the chip via lead wires 12. A hollow mold (fig 1; 3) is placed over the LED chip, and transparent material such as resin is injected into the mold under vacuum extraction to encapsulate the chip, after which the mold is removed. The transparent material solidifies to form a packaging layer 4. The mold can be semicircular in shape, or trapezoidal in cross-section, and can be faceted to form a microlens or pavilion cut shape. Because the LED chip is not recessed in the circuit board, emitted light is not obstructed by recess walls or other parts of the circuit board, allowing a light extraction angle of about 180{
GB0812350A 2007-08-21 2008-07-07 Packaging structure of a light emitting diode Withdrawn GB2452121A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96213912U TWM329857U (en) 2007-08-21 2007-08-21 LED package structure

Publications (2)

Publication Number Publication Date
GB0812350D0 true GB0812350D0 (en) 2008-08-13
GB2452121A GB2452121A (en) 2009-02-25

Family

ID=39718048

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0812350A Withdrawn GB2452121A (en) 2007-08-21 2008-07-07 Packaging structure of a light emitting diode

Country Status (4)

Country Link
DE (1) DE202008009435U1 (en)
FR (1) FR2920253B3 (en)
GB (1) GB2452121A (en)
TW (1) TWM329857U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108465613A (en) * 2018-04-27 2018-08-31 延锋伟世通汽车电子有限公司 Remove the circuit board coating system and method for bubble between circuit board and IC chip
CN108465613B (en) * 2018-04-27 2024-05-24 延锋伟世通汽车电子有限公司 Circuit board gluing system and method for removing bubbles between circuit board and IC chip

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101630491B1 (en) * 2009-11-05 2016-06-24 루미니트 엘엘씨 Method to provide microstructure for encapsulated high-brightness led chips
JP2013157408A (en) * 2012-01-27 2013-08-15 Nitto Denko Corp Light emitting diode device and manufacturing method thereof
CN114347395B (en) * 2022-03-17 2022-06-03 威海嘉瑞光电科技股份有限公司 Method for packaging semiconductor optical device and apparatus used therefor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3193194B2 (en) * 1993-07-09 2001-07-30 三菱電線工業株式会社 Method of molding lens coating layer on LED chip mounted on substrate and substrate structure for molding the same
JPH08111132A (en) * 1994-10-12 1996-04-30 Japan Aviation Electron Ind Ltd Illumination-type keytop
JP2829567B2 (en) * 1994-11-21 1998-11-25 スタンレー電気株式会社 Chip mounted LED
JP2000049386A (en) * 1998-07-30 2000-02-18 Stanley Electric Co Ltd Manufacturing surface-mounting components
KR200181152Y1 (en) * 1999-12-17 2000-05-15 윤순관 Led lamp having female lead on pcb
JP3876250B2 (en) * 2003-06-24 2007-01-31 スタンレー電気株式会社 Surface mount semiconductor electronic component and manufacturing method
TWI231609B (en) * 2003-09-01 2005-04-21 Solidlite Corp High heat-conductive PCB type surface mounted light emitting diode
KR100638611B1 (en) * 2004-08-12 2006-10-26 삼성전기주식회사 Light emitting diode having multiple lenses
TW200701507A (en) * 2005-06-24 2007-01-01 Epitech Technology Corp Light-emitting diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108465613A (en) * 2018-04-27 2018-08-31 延锋伟世通汽车电子有限公司 Remove the circuit board coating system and method for bubble between circuit board and IC chip
CN108465613B (en) * 2018-04-27 2024-05-24 延锋伟世通汽车电子有限公司 Circuit board gluing system and method for removing bubbles between circuit board and IC chip

Also Published As

Publication number Publication date
FR2920253A3 (en) 2009-02-27
DE202008009435U1 (en) 2008-09-11
FR2920253B3 (en) 2009-07-24
GB2452121A (en) 2009-02-25
TWM329857U (en) 2008-04-01

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20101209 AND 20101215

WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)