CN201930901U

CN201930901U - Die used for flat bracket adhesive dispensing

Info

Publication number: CN201930901U
Application number: CN2010207007615U
Authority: CN
Inventors: 蔡永义; 王聪; 麦镇强; 洪琴; 王跃飞; 吴乾; 李国平
Original assignee: Guangzhou Hongli Tronic Co Ltd
Current assignee: Hongli Zhihui Group Co Ltd
Priority date: 2010-12-28
Filing date: 2010-12-28
Publication date: 2011-08-17
Anticipated expiration: 2020-12-28

Abstract

The utility model discloses a die used for flat bracket adhesive dispensing, which comprises an upper die and a lower die, wherein a bearing space is arranged on the lower die; the upper die is provided with more than one cavity, and the upper surface of the upper die is provided with an adhesive injecting channel communicated with the cavity; and the cavity is in a round table shape. An LED molded by the die disclosed by the utility model has uniform light colors and high light efficiency.

Description

A kind of flat bracket point glue mould

Technical field

The utility model relates to LED point glue mould, particularly flat bracket LED point glue mould.

Background technology

The LED device is by encapsulated moulding, and the LED encapsulation is meant the encapsulation of luminescence chip, and it is more different to compare being packaged with of other non-optical devices.The encapsulation of LED not only requirement can be protected chip, gold thread and circuit, but also can printing opacity, the light that chip sent is effectively extracted, so the encapsulation of LED has special requirement to encapsulating material and packaging technology.

At present the packaging technology of LED mainly has a glue, mould model, and adopt the mode of some glue to prepare LED and be difficult to control glue amount, and because of the flowability of glue itself, be difficult to guarantee that the glue of encapsulation is uniform, especially for phosphor gel, if inhomogeneous, non-uniform light then; During mould model, glue injects between mould lower surface and support, in case mould and support to contact compactness bad, residual fraction glue on support then, thereby cause the waste of former material, in addition, mould is generally spherical in shape, therefore, also spherical in shape after the glue moulding, but that luminescence chip is generally is square, like this, what chip sent light excites range difference apart from big, thereby easily causes photochromic inhomogeneous.

Summary of the invention

The purpose of this utility model provides a kind of flat bracket point glue mould, adopts formed in mould LED of the present utility model, and is photochromic even, the light efficiency height.

For achieving the above object, a kind of flat bracket point glue mould comprises counterdie and patrix; Counterdie is provided with bearing space; Patrix is provided with more than one die cavity, and the upper surface of patrix is provided with the some glue passage that is communicated with die cavity; Described die cavity is truncated cone-shaped.

When stating mould in the use, earlier substrate is arranged in the bearing space, matched moulds then makes the tight contact substrate of lower surface of patrix, and is last, and glue is injected in the die cavity by a glue passage.Because when encapsulation, the lower surface of patrix closely contacts with substrate, therefore, glue can not form overlap from flowing out between patrix and the substrate, so just can not cause the waste of material; Because die cavity is truncated cone-shaped, the glue after the moulding also is truncated cone-shaped, and like this, the bright dipping channel distance of chip reduces, error each other also reduces, and is therefore photochromic even, and reflection and the refraction approach of the light that chip sends in colloid reduces, absorbed light is also few, therefore, and the light extraction efficiency height.

As improvement, the side of bearing space is provided with the groove to lower recess.Like this, the edge of bearing space arc chord angle can not occur, makes that substrate can smooth being placed in the bearing space.

As improvement, the lower surface of patrix is provided with boss.Like this, not only when matched moulds, upper die and lower die are closely contacted, and can avoid mold clamping force excessive and substrate is damaged by pressure.

As improvement, counterdie is provided with guide pillar, and patrix is provided with pilot hole, and described guide pillar upper end extend in the pilot hole.Described guide pillar has guide effect to the motion of patrix, prevents upper die and lower die off-design position and influence the quality of product in motion process.

As improvement, be positioned at bearing space on the counterdie and be provided with lead.Described lead has guide effect to settling substrate, to improve the quality of product.

As improvement, the two relative side of counterdie has inside depressed part.Depressed part is set on counterdie is convenient to die sinking.

Description of drawings

Fig. 1 is the exploded view of flat bracket point glue with mould.

Fig. 2 is the stereogram of counterdie.

Fig. 3 is the front view of counterdie.

Fig. 4 is the vertical view of counterdie.

Fig. 5 is the stereogram of patrix.

Fig. 6 is the front view of patrix.

Fig. 7 is the vertical view of patrix.

Fig. 8 is the upward view of patrix.

Fig. 9 is for utilizing flat bracket point glue with formed in mould product figure.

Figure 10 is the structure chart of a LED in the shaped article.

Figure 11 is the enlarged drawing of A among Fig. 2.

The specific embodiment

Below in conjunction with the drawings and specific embodiments the utility model is further elaborated.

Flat bracket point glue mould as shown in Figure 1 comprises counterdie 1 and patrix 2.Fixing between counterdie 1 and the patrix 2 by soket head cap screw 3.

Extremely shown in Figure 4 as Fig. 2, counterdie 1 is provided with bearing space 11, as shown in figure 11, the dual-side of bearing space 11 is provided with the groove 12 to lower recess, on counterdie, be positioned at bearing space 11 and be provided with lead 13, when being at shaped article, hole alignment guide post 13 with substrate, and lead 13 is inserted in the hole of substrate, therefore, the installation site of substrate is accurate, and owing to have groove 12, therefore, the edge of bearing space 11 arc chord angle can not occur, makes that substrate can smooth being placed in the bearing space 11; As shown in Figure 4, the two relative side of counterdie 1 has inside depressed part 15, so that die sinking.

To shown in Figure 8, patrix 2 is provided with more than one die cavity 21 as Fig. 5, and the upper surface of patrix 2 is provided with the some glue passage 22 that is communicated with die cavity; Described die cavity is truncated cone-shaped.The lower surface of patrix 2 is provided with boss 23, like this, not only when matched moulds upper die and lower die is closely contacted, and can avoid mold clamping force excessive and substrate is damaged by pressure.

As depicted in figs. 1 and 2, counterdie 1 is provided with guide pillar 4, and patrix 2 is provided with pilot hole 5, and described guide pillar upper end extend in the pilot hole, when patrix 2 motions, the motion of patrix is had guide effect, to improve the quality of product.

Utilize the process of mould molding product of the present utility model to be: earlier substrate to be arranged in the bearing space 11, matched moulds then makes the tight contact substrate of lower surface of patrix 2, and is last, glue is injected in the die cavity 21 by a glue passage 22, after insulation, cooling, die sinking, then, product is taken out from counterdie, the product of moulding as shown in Figure 9, and is last, and product is cut into as shown in figure 10 LED.Because when encapsulation, the lower surface of patrix 2 closely contacts with substrate, therefore, glue can not form overlap from flowing out between patrix 2 and the substrate, so just can not cause the waste of material; Because die cavity 21 is truncated cone-shaped, as described in Figure 10, the colloid after the moulding also is truncated cone-shaped, like this, the distance that excites of chip light emitting differs little, and is therefore photochromic even, and, send reflection and the refraction of light in colloid few, like this, absorbed light is also few, the light extraction efficiency height.

Claims

1. a flat bracket point glue mould comprises counterdie and patrix; It is characterized in that: counterdie is provided with bearing space; Patrix is provided with more than one die cavity, and the upper surface of patrix is provided with the some glue passage that is communicated with die cavity; Described die cavity is truncated cone-shaped.

2. flat bracket point glue mould according to claim 1, it is characterized in that: the side of bearing space is provided with the groove to lower recess.

3. flat bracket point glue mould according to claim 1, it is characterized in that: the lower surface of patrix is provided with boss.

4. flat bracket point glue mould according to claim 1, it is characterized in that: counterdie is provided with guide pillar, and patrix is provided with pilot hole, and described guide pillar upper end extend in the pilot hole.

5. flat bracket point glue mould according to claim 1 is characterized in that: be positioned at bearing space on the counterdie and be provided with lead.

6. flat bracket point glue mould according to claim 1, it is characterized in that: the two relative side of counterdie has inside depressed part.