CN113441362A - Gluing mold and bonding method - Google Patents

Gluing mold and bonding method Download PDF

Info

Publication number
CN113441362A
CN113441362A CN202010231756.2A CN202010231756A CN113441362A CN 113441362 A CN113441362 A CN 113441362A CN 202010231756 A CN202010231756 A CN 202010231756A CN 113441362 A CN113441362 A CN 113441362A
Authority
CN
China
Prior art keywords
glue injection
gluing
glue
cavities
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010231756.2A
Other languages
Chinese (zh)
Other versions
CN113441362B (en
Inventor
李洪光
邹勇
王卫春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CN202010231756.2A priority Critical patent/CN113441362B/en
Publication of CN113441362A publication Critical patent/CN113441362A/en
Application granted granted Critical
Publication of CN113441362B publication Critical patent/CN113441362B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)

Abstract

The invention discloses a gluing mold and a bonding method, wherein the gluing mold comprises a mold body, a plurality of glue injection cavities are formed in the mold body, each glue injection cavity penetrates through the surfaces of two sides of the thickness of the mold body, and any two glue injection cavities are arranged at intervals. According to the gluing mold, the plurality of glue injection cavities are arranged, so that the injection amount of the adhesive can be effectively controlled, the distribution of the adhesive can meet the requirement, the plurality of glue injection cavities are arranged to be distributed at intervals, the curing efficiency of the adhesive can be improved, the curing strength of the central position of the adhesive is improved, the glue blocks are enabled to overflow from spaces during bonding, the bonding area is improved, the false bonding phenomenon of air holes is improved, and the bonding strength is improved.

Description

Gluing mold and bonding method
Technical Field
The invention relates to the technical field of bonding, in particular to a gluing mold and a bonding method.
Background
With the rapid development of industrial technology, bonding is used as a new process and a new technology, so that the connection of multiple materials becomes possible, the method has the advantages of simple process equipment, convenience in operation, low cost, wide application range, good sealing and corrosion resistance, high fatigue resistance and the like, simultaneously, the damage of a base material caused by drilling is avoided, the stress distribution is uniform, the integrated functions of corrosion resistance, shock absorption, insulation, tolerance compensation and the like can be realized, and the traditional connection modes such as welding, riveting, bolt connection and the like are replaced more and more. For example, in the production and manufacturing process of rail vehicles, bonding is an indispensable connection method, for example, the mounting process of hangers, glass and the like involves bonding operation, however, the bonding quality cannot be effectively guaranteed, and the quality of the whole vehicle is influenced to a certain extent.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a gluing mold which can improve the bonding quality.
The invention also provides a bonding method adopting the bonding die.
According to an embodiment of the first aspect of the invention, the gluing die comprises: the mould comprises a mould body, wherein the mould body is provided with a plurality of glue injection cavities, each glue injection cavity penetrates through the surfaces of two sides of the thickness of the mould body, and any two glue injection cavities are arranged at intervals.
According to the gluing mold disclosed by the embodiment of the first aspect of the invention, the plurality of glue injection cavities are arranged, so that the injection amount of the adhesive can be effectively controlled, the distribution of the adhesive can be ensured to meet the requirement, the glue injection cavities are arranged to be distributed at intervals, the curing efficiency of the adhesive can be improved, the curing strength of the central position of the adhesive can be improved, the glue blocks are enabled to overflow from spaces during bonding, the bonding area is improved, the false bonding phenomenon of air holes is improved, and the bonding strength is improved.
In some embodiments, the spacing between every two adjacent glue injection cavities is equal.
In some embodiments, a plurality of the glue injection cavities are distributed at intervals along the length direction of the mould body in sequence.
In some embodiments, the edges on both sides of the length of the mold body are respectively a first edge and a second edge, a first glue injection cavity is arranged in the plurality of glue injection cavities close to the first edge, a second glue injection cavity is arranged in the plurality of glue injection cavities close to the second edge, the distance between the first glue injection cavity and the first edge is larger than the distance between any two adjacent glue injection cavities, and the distance between the second glue injection cavity and the second edge is larger than the distance between any two adjacent glue injection cavities.
In some embodiments, the glue die further comprises: the positioning structure is arranged on one side of the thickness of the die body and avoids the glue injection cavity, and the positioning structure is used for limiting the relative position of the to-be-glued piece and the die body.
In some embodiments, a plurality of the glue injection cavities are distributed at intervals in sequence along the length direction of the mold body, and the positioning structure includes: the first locating blocks are two and located on two sides of the plurality of glue injection cavities in the length direction of the die body.
In some embodiments, a plurality of the glue injection cavities are distributed at intervals in sequence along the length direction of the mold body, and the positioning structure includes: the number of the second positioning blocks is at least two, and the second positioning blocks are respectively arranged on two sides of at least one glue injection cavity in the width direction of the die body.
In some embodiments, at least a portion of the mold body is a uniform-thickness flat plate and is configured to provide a plurality of the glue injection cavities so that the depths of the plurality of the glue injection cavities are equal in the thickness direction of the mold body.
In some embodiments, the glue die further comprises: and the pad piece is arranged in at least one glue injection cavity and is not in contact with the side wall of the glue injection cavity where the pad piece is positioned, and the height of the pad piece is smaller than the depth of the glue injection cavity where the pad piece is positioned in the thickness direction of the die body.
According to the bonding method of the embodiment of the second aspect of the present invention, the bonding method of bonding a work to a base material using the paste application mold according to the embodiment of the first aspect of the present invention includes the steps of: disposing the die body on the workpiece; arranging the cushion piece in at least one glue injection cavity and adhering the cushion piece to the workpiece; injecting an adhesive into at least one glue injection cavity, and enabling the adhesive injected into the glue injection cavity with the cushion piece to cover the cushion piece; taking the die body off the workpiece, wherein the workpiece is adhered with a glue block formed by the adhesive in the corresponding glue injection cavity; and enabling one side of the workpiece, which is provided with the rubber block, to face the base material, and enabling the workpiece to be close to the base material until the pad is contacted with the base material, wherein the part of the rubber block, which is higher than the pad, overflows around the rubber block.
According to the bonding method of the second aspect of the invention, by adopting the gluing mold of the first aspect of the invention to bond the workpiece on the substrate, the bonding can be simply and effectively realized, the injection amount of the adhesive can be effectively controlled, the curing efficiency of the adhesive is improved, the curing strength of the central position of the adhesive is improved, and the glue blocks are enabled to overflow from the space during bonding, so that the bonding area is improved, the false bonding phenomenon of air holes is improved, and the bonding strength is further improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a front view of a gluing die according to one embodiment of the invention;
FIG. 2 is a top plan view of the glue die shown in FIG. 1 mated to a work piece;
FIG. 3 is a schematic view of the work piece shown in FIG. 2 after it has been disengaged from the glue die;
FIG. 4 is a rear view of the glue die shown in FIG. 1;
FIG. 5 is a cross-sectional view of section A-A shown in FIG. 4;
FIG. 6 is a partial cross-sectional view of the glue die shown in FIG. 1;
FIG. 7 is a state diagram during bonding of a workpiece to a substrate according to one embodiment of the present invention;
FIG. 8 is another state diagram during bonding of the workpiece to the substrate shown in FIG. 7;
FIG. 9 is a diagram of a workpiece after bonding to a substrate has been completed according to one embodiment of the invention;
FIG. 10 is a front view of the workpiece shown in FIG. 9;
FIG. 11 is a schematic view of the clamping of the workpiece and vise shown in FIG. 10;
FIG. 12 is a schematic view of the mating of the work piece shown in FIG. 11 with the glue die;
FIG. 13 is a top plan view of the workpiece shown in FIG. 12 in cooperation with a glue die;
FIG. 14 is a partial front view of the workpiece shown in FIG. 9 secured with clamps while it is adhered to a substrate;
FIG. 15 is a partial left side view of the workpiece shown in FIG. 14 secured with clamps while it is bonded to a substrate.
Reference numerals:
a gluing mold 1;
a mold body 11; a thickness-side surface 11 a; the thickness other side surface 11 b;
a first edge 11 c; a second edge 11 d;
a glue injection cavity 12; a first glue injection cavity 12 a; a second glue injection cavity 12 b;
a positioning structure 13; a first positioning block 131; a second positioning block 132;
a pad 14;
a workpiece 2; an adhesive 3; a rubber block 31; glue overflow 32;
the gap 41; the gap 42; a base material 5; a bench clamp 6; and a clamp 7.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.
With the rapid development of industrial technology, bonding is used as a new process and a new technology, so that the connection of multiple materials becomes possible, the method has the advantages of simple process equipment, convenience in operation, low cost, wide application range, good sealing and corrosion resistance, high fatigue resistance and the like, simultaneously, the damage of a base material caused by drilling is avoided, the stress distribution is uniform, the integrated functions of corrosion resistance, shock absorption, insulation, tolerance compensation and the like can be realized, and the traditional connection modes such as welding, riveting, bolt connection and the like are replaced more and more. For example, in the production and manufacturing process of rail vehicles, bonding is an indispensable connection method, for example, the installation process of hangers, glass and the like involves bonding operation, and the quality of bonding directly affects the quality of the whole vehicle.
However, the inventor creatively finds that in the general bonding operation, the common industry practice is to make a rope-shaped adhesive tape out of the adhesive and apply the rope-shaped adhesive tape on a workpiece or a base material, when the area of the workpiece is large, a plurality of rope-shaped adhesive tapes are needed to be made back and forth, but the manual extrusion pressure of the adhesive is difficult to control, the thickness of the manually extruded adhesive tape is not uniform, and the lengths of the manually extruded adhesive tapes are different, so that the distribution of the adhesive on the workpiece is not uniform, the adhesive amount of the adhesive cannot be controlled, the bonding reliability cannot be ensured, the bonding strength of each part of the workpiece is also different, the stress is not uniform, and the risk of damage or falling off is easy to occur.
In addition, when large-area bonding is carried out, the adhesive is expected to be paved on the whole surface of a workpiece, but the multiple rope-shaped adhesive tapes are difficult to be paved, gaps exist between the adhesive tapes inevitably, gaps also exist at the extruded and broken positions of the adhesive tapes, and after a base material is bonded with the workpiece, a large number of air holes possibly exist at the gaps, false bonding phenomena occur, so that the contact area between the adhesive and the base material is insufficient, the problem of insufficient mechanical locking acting force occurs, when external force is applied, the workpiece is easy to fall off, and the bonding quality is not stable enough. In order to solve at least one of the above technical problems, the present invention provides a glue spreading mold 1 and a glue spreading method using the glue spreading mold 1.
Next, a gluing mold 1 according to an embodiment of the first aspect of the present invention is described with reference to the accompanying drawings.
As shown in fig. 1, the gluing mold 1 according to the embodiment of the invention may include a mold body 11, the mold body 11 having a plurality of glue injection cavities 12, each glue injection cavity 12 penetrating through both thickness side surfaces of the mold body 11, that is, in conjunction with fig. 2 and 3, each glue injection cavity 12 penetrating through from a thickness side surface 11a of the mold body 11 to a thickness side surface 11b of the mold body 11, so that the adhesive 3 can be injected into the glue injection cavity 12 from one side of the thickness of the die body 11 and flow from the glue injection cavity 12 to the other side of the thickness of the die body 11 to contact the part to be glued (e.g. the workpiece 2) on the other side of the thickness of the die body 11, so that the adhesive 3 may be separated from the die body 11 and adhered to the surface of the member to be coated (e.g., the work 2) after the die body 11 is removed from the member to be coated (e.g., the work 2).
Of course, the present invention is not limited thereto, and in other embodiments of the present invention, the member to be glued may also be the base material 5, and for simplicity of description, only the member to be glued is taken as the workpiece 2 for illustration, and after reading the technical solutions of the present application, it is obvious that the member to be glued is taken as an example of the base material 5.
As shown in fig. 1 and 3, after the mold body 11 is removed from the workpiece 2, a plurality of glue blocks 31 corresponding to the glue injection cavities 12 one by one are adhered to the workpiece 2, that is, each glue block 31 is formed by the adhesive 3 in the corresponding glue injection cavity 12, because any two glue injection cavities 12 are arranged at intervals, any two glue blocks 31 adhered to the workpiece 2 are also arranged at intervals, that is, a gap 41 is formed between any two glue blocks 31, and further, the gap 41 can be used for circulating air flow and/or glue overflow, so when the air flow circulates in the gap 41, moisture is facilitated to solidify the adhesive 3, the solidification time of the adhesive 3 is shortened, the solidification efficiency of the adhesive 3 is improved, and the solidification strength of the center position of the adhesive 3 is improved.
Moreover, when the workpiece 2 is bonded to the base material 5 through the plurality of rubber blocks 31, when the distance between the workpiece 2 and the base material 5 is smaller than the height of the rubber blocks 31, the rubber blocks 31 can overflow to the gap 41, so that the bonding area is increased, the air hole false bonding phenomenon is improved, and the bonding strength is improved. Of course, it can be understood that the rubber blocks 31 not only overflow to the gaps 41 between two adjacent rubber blocks 31, but also overflow to the periphery of the rubber blocks 31, and the air holes are extruded in the overflow process, so as to improve the false adhesion phenomenon.
Therefore, according to the gluing mold 1 provided by the embodiment of the invention, the injection amount of the adhesive 3 can be effectively controlled by arranging the plurality of glue injection cavities 12, the distribution of the adhesive 3 can be ensured to meet the bonding requirement, the plurality of glue injection cavities 12 are arranged to be distributed at intervals, the curing efficiency of the adhesive 3 can be improved, the curing strength of the central position of the adhesive 3 is improved, and the glue blocks 31 are enabled to overflow in space during bonding, so that the bonding area is improved, the phenomenon of false bonding of air holes is improved, and the bonding strength is improved.
In addition, it should be noted that, in the process of performing the bonding operation by using the gluing mold 1, the adhesive 3 is not required to be injected into each glue injection cavity 12, the adhesive 3 may be selectively injected into at least one glue injection cavity 12 according to needs, and the amount of the adhesive 3 injected into the glue injection cavity 12 is also not limited, for example, the glue injection cavity 12 may be filled completely, so as to control the injection amount of the adhesive 3, and of course, the glue injection may also be selected not to be filled according to actual situations, which is not described herein again.
In some embodiments of the present invention, the spacing between each two adjacent glue cavities 12 is equal, for example, in the example shown in fig. 1, the spacing between each two adjacent glue cavities 12 is L. From this, can guarantee that two adjacent gluey gaps 41 between the piece 31 equal to can guarantee that gluey piece 31 distributes evenly, bonding strength is good, makes gluey piece 31 take place excessive space substantially the same when bonding moreover, thereby makes every gluey piece 31 excessive area substantially the same, and then can improve the distribution homogeneity of adhesive 3 more effectively, and then improves bonding strength.
In some embodiments of the present invention, as shown in fig. 1, the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, that is, the mold body 11 has an elongated structure (e.g., rectangular, oblong, etc.), and the plurality of glue injection cavities 12 are spaced apart along the length extension direction of the mold body 11 (e.g., the direction F1 shown in fig. 1). Therefore, the die body 11 is simple in structure, convenient to process and suitable for gluing the strip-shaped workpiece 2.
Of course, the present invention is not limited thereto, and the shape of the mold body 11 and the distribution of the glue injection cavities 12 can be adjusted according to actual conditions, such as the specific shape of the workpiece 2, so as to meet different actual requirements, such as the glue application requirements of workpieces 2 of different shapes. For example, when the surface of the workpiece 2 to be glued is circular, the mold body 11 may also be circular, and the plurality of glue injection cavities 12 may be uniformly distributed in the form of radial dots, and for example, when the surface of the workpiece 2 to be glued is a square with a large size, the mold body 11 may also be square, and the plurality of glue injection cavities 12 may be uniformly distributed in multiple rows and multiple columns, and so on.
In some embodiments of the present invention, as shown in fig. 1, when the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, two side edges of the length of the mold body 11 are the first edge 11c and the second edge 11d, respectively, that is, the first edge 11c and the second edge 11d are disposed opposite to each other along the length direction F1 of the mold, a first glue injection cavity 12a is located in the plurality of glue injection cavities 12 near the first edge 11c, and a second glue injection cavity 12b is located in the plurality of glue injection cavities 12 near the second edge 11 d.
As shown in fig. 1, a distance L1 between the first glue injection cavity 12a and the first edge 11c is greater than a distance between any two adjacent glue injection cavities 12 (e.g., distance L shown in fig. 1), and a distance L2 between the second glue injection cavity 12b and the second edge 11d is greater than a distance between any two adjacent glue injection cavities 12 (e.g., distance L shown in fig. 1). From this, the position that lies in on the mould body 11 between first notes gluey chamber 12a and first edge 11c to and the position that lies in on the mould body 11 between second notes gluey chamber 12b and second edge 11d can regard as the gripping handle of both sides, makes things convenient for the staff to take mould body 11, the operation of being convenient for.
It should be noted that the specific shape of the glue injection cavity 12 is not limited, and may be, for example, a circle, an ellipse, a polygon (such as a rectangle, a hexagon, etc.), and the shape of the first edge 11c and the second edge 11d is also not limited, and may be, for example, a straight edge or a curved edge, where "a distance L1 between the first glue injection cavity 12a and the first edge 11 c" refers to a maximum distance between the first glue injection cavity 12a and the first edge 11c in the length direction F1 of the mold body 11, and "a distance L2 between the second glue injection cavity 12b and the second edge 11 d" refers to a maximum distance between the second glue injection cavity 12b and the second edge 11d in the length direction F1 of the mold body 11.
In some embodiments of the present invention, as shown in fig. 2 and 4, the glue application mold 1 may further include: the positioning structure 13, the positioning structure 13 are disposed on one side of the thickness of the mold body 11, that is, one side of the mold body 11 facing the workpiece 2 (the side where the surface 11b on the other side of the thickness of the mold body 11 is located as shown in fig. 2), and the positioning structure 13 is disposed away from the glue injection cavity 12, that is, the positioning structure 13 does not block the glue injection cavity 12, so that the adhesive 3 injected into the glue injection cavity 12 can pass through the workpiece 2 and contact with the workpiece 2, but does not contact with the positioning structure 13.
As shown in fig. 2 and 4, the positioning structure 13 is used for limiting the relative position of the member to be glued (e.g. the workpiece 2 or the substrate 5) and the mold body 11, for example, when the member to be glued is the workpiece 2, the positioning structure 13 may be used for at least limiting: the workpiece 2 moves relative to the die body 11 in a plane perpendicular to the thickness direction F3 of the die body 11. From this, can improve stability, reliability and the validity that the rubber coating process goes on, avoid because work piece 2 takes place the dislocation skew with mould body 11, lead to rubber coating error scheduling problem, and saved and adopted and be used for restricting above-mentioned relative motion anchor clamps to simplify going on of injecting glue process, and reduced the input cost of rubber coating process, improved the efficiency of going on of rubber coating process.
In some embodiments of the present invention, as shown in fig. 2 and 4, when the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, the positioning structure 13 may include two first positioning blocks 131, and the two first positioning blocks 131 are located on two sides of the plurality of glue injection cavities 12 in the length direction F1 of the mold body 11, for example, in the example shown in fig. 4, when two of the plurality of glue injection cavities 12 close to two ends of the length of the mold body 11 are the first glue injection cavity 12a and the second glue injection cavity 12b, the side of the first glue injection cavity 12a far from the second glue injection cavity 12b, and the side of the second glue injection cavity 12b far from the second glue injection cavity 12b are respectively provided with the first positioning blocks 131. Therefore, the first positioning block 131 can simply and effectively limit the workpiece 2 to move along the length direction F1 of the die body 11 relative to the die body 11, and the first positioning block 131 does not affect the arrangement of the plurality of glue injection cavities 12, for example, the equal distance between every two adjacent glue injection cavities 12 can be ensured.
In some embodiments of the present invention, as shown in fig. 2 and 4, when the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, the positioning structure 13 may include at least two second positioning blocks 132, and at least one glue injection cavity 12 is provided with the second positioning blocks 132 on both sides of the width direction F2 of the mold body 11. Therefore, the second positioning block 132 can simply and effectively limit the movement of the workpiece 2 relative to the mold body 11 along the width direction F2 of the mold body 11, and the second positioning block 132 does not affect the arrangement of the plurality of glue injection cavities 12, for example, the distance between every two adjacent glue injection cavities 12 can be ensured to be equal.
It should be noted that the number and size of the second positioning blocks 132 are not limited, for example, in the example shown in fig. 4, each second positioning block 132 may be disposed corresponding to at least two glue injection cavities 12, so as to reduce the number of the second positioning blocks 132, reduce the processing difficulty, and reduce the assembly difficulty of the mold body 11 and the workpiece 2. In addition, in the width direction F2 of the mold body 11, the same side of the plurality of glue injection cavities 12 may have a plurality of second positioning blocks 132, and the plurality of second positioning blocks 132 are distributed at intervals along the length direction F1 of the mold body 11, so that the positioning reliability may be improved.
In some embodiments of the present invention, as shown in fig. 5, at least a portion of the mold body 11 is a flat plate with an equal thickness, and is configured to provide a plurality of glue injection cavities 12, so that the depth of the plurality of glue injection cavities 12 in the thickness direction F3 of the mold body 11 may be equal, for example, in the example shown in fig. 5, the depth of each glue injection cavity 12 is H, so that when each glue injection cavity 12 is filled with the adhesive 3, it is ensured that the glue injection amount of each glue injection cavity 12 is equal, so that the glue is uniformly applied, and the structure of the mold body 11 may be simplified, so as to facilitate the processing. Of course, the die body 11 of the embodiment of the present invention may also be a flat plate with the same thickness as the whole, so as to facilitate the processing.
As shown in fig. 1, in some embodiments of the present invention, the glue-applying mold 1 may further include a pad 14, the pad 14 is disposed in at least one glue-injecting cavity 12, and the pad 14 is not in contact with the sidewall of the glue-injecting cavity 12 where the pad 14 is located, and with reference to fig. 6, in the thickness direction F3 of the mold body 11, the height H of the pad 14 is smaller than the depth H of the glue-injecting cavity 12 where the pad is located. Referring to fig. 7 and 8, in the process of clamping and pressing the workpiece 2 and the substrate 5 when bonding the workpiece 2 to the substrate 5, for example, when pushing the workpiece 2 toward the substrate 5 from the top to the bottom direction shown in fig. 7 until the pad 14 contacts the substrate 5 (for example, the state shown in fig. 8), the clamping is in place, and in this process, a portion of the rubber block 31 higher than the pad 14 in the thickness direction F3 of the die body 11 (e.g., the portion in the shaded area B shown in fig. 7) overflows around under pressure, and a portion of the rubber block overflows into the gap 41, so that the glue overflow 32 is obtained.
Therefore, the pad 14 with the height smaller than the depth of the glue injection cavity 12 can be used for realizing glue overflow 32, so that the bonding area can be increased, the phenomenon of false bonding of air holes can be improved, and the bonding strength can be improved. Moreover, the amount of the overflow glue 32 in the gap 41 can be adjusted by designing the relationship between the difference between the depth of the glue injection cavity 12 and the height of the cushion member 14 and the volume of the gap 41 and other parameters, so that the overflow glue 32 of two adjacent glue blocks 31 in the gap 41 is not contacted, and a certain gap 42 (as shown in fig. 8) still remains, thereby facilitating the circulation of air flow in the gap 42, facilitating the moisture to cure the adhesive 3, shortening the curing time of the adhesive 3, improving the curing efficiency of the adhesive 3, and improving the curing strength of the center position of the adhesive 3.
For example, in one embodiment of the present invention, as shown in fig. 6, the depth H of the glue injection cavity 12 is 0.5mm-1mm higher than the height H (i.e., H-H) of the pad 14, and in conjunction with fig. 8, after the glue overflow 32 is obtained in the gap 41, a gap 42 (shown as W in fig. 8) of 1mm-3mm is remained in the gap 412) Thereby being beneficial to the circulation of air current in the gap 42 and being beneficial to moisture to solidify the adhesive 3, shortening the solidification time of the adhesive 3, improving the solidification efficiency of the adhesive 3 and improving the solidification strength of the central position of the adhesive 3.
It should be noted that the structural shape of the pad 14 is not limited, and for example, the pad 14 may be a solid cylinder, a prism (as shown in fig. 6), or the like, or the pad 14 may also be a hollow cylinder, a prism (as shown in fig. 7), or the like, and when the hollow hole penetrates through the pad 14 in the thickness direction of the mold body 11, the glue filling amount of the glue injection cavity 12 may be increased to some extent, so as to improve the reliability of the bonding. In addition, it should be noted that, during the design, an excessive space is reserved around the workpiece 2 as much as possible, so as to prevent the adhesive 3 from overflowing to the outside of the workpiece 2 and even being adhered to other components.
In a specific example of the present invention, as shown in fig. 1 to 3, the mold body 11 is a rectangular uniform-thickness flat plate, the mold body 11 has a plurality of glue injection cavities 12 with the same shape and size, the plurality of glue injection cavities 12 are uniformly spaced apart along a length direction F1 of the mold body 11, each glue injection cavity 12 is a rounded rectangle to facilitate demolding of the glue block 31, and a spacing L between two adjacent glue injection cavities 12 is about 6 mm. Therefore, by adopting the die body 11, a corresponding number of round-corner rectangular rubber blocks 31 can be obtained on the workpiece 2, and the gap 41 between two adjacent rubber blocks 31 is about 6 mm. The at least two glue cavities 12 are provided with padding elements 14, so that after demoulding, the at least two glue blocks 31 have padding elements 14 therein.
Suppose that: a is the length of the glue injection cavity 12; b is the width of the glue injection cavity 12; s is the bottom area of the glue injection cavity 12, and s is ab; h is the height of the glue injection cavity 12; h is the height of the pad 14; h' is the overflow of glue 32Height of layer, H' ═ H-H; c is the perimeter of the glue injection cavity 12, and c is 2(a + b); the gap 41 between two adjacent rubber blocks 31 is W1. Then: the volume of the overflow glue 32 is: sh' is given as V, and the single-side width of the overflow glue 32 is: w3V/c/h; the width of the gap 42 in the gap 41 after the glue overflow 32 is: w2=W1-2W3. Example (c): 30mm for a, 20mm for b, 4mm for H, 3mm for H, W1When the thickness is 6 mm: v600 mm3;W3=2mm;W2=2mm。
Next, a bonding method according to an embodiment of the second aspect of the present invention is described with reference to the drawings.
According to the bonding method of the embodiment of the present invention, the work 2 is bonded to the base material 5 using the paste die 1 of the embodiment of the first aspect of the present invention (as shown in fig. 9). It should be noted that the application of the bonding method of the embodiment of the present invention is not limited, for example, in a specific example of the present invention, in conjunction with fig. 9-10, the workpiece 2 may be a rail vehicle side roof suspension.
The bonding method may include the steps of: arranging a mould body 11 on a workpiece 2, arranging a pad 14 in at least one glue injection cavity 12, bonding the pad 14 to the workpiece 2, injecting a glue 3 into at least one glue injection cavity 12, enabling the glue 3 injected into the glue injection cavity 12 provided with the pad 14 to cover the pad 14, taking the mould body 11 off the workpiece 2, adhering glue blocks 31 formed by the glue 3 in the corresponding glue injection cavity 12 on the workpiece 2, namely injecting the glue 3 into a plurality of glue injection cavities 12, obtaining a plurality of glue blocks 31 on the workpiece 2, arranging a gap 41 between any two glue blocks 31, enabling the side provided with the glue blocks 31 of the workpiece 2 to face a substrate 5, enabling the workpiece 2 to be close to the substrate 5 until the pad 14 is contacted with the substrate 5, and enabling the part of the glue blocks 31 higher than the pad 14 to overflow to the periphery of the glue blocks 31.
From this, can realize simply and effectively bonding, and can be to the injection volume effective control of adhesive 3, can guarantee in addition that 3 distributions of adhesive meet the requirements, and through setting up a plurality of glue injection chamber 12 to spaced apart distribution to can improve the solidification efficiency of adhesive 3, improve the solidification intensity that 3 central points of adhesive put, make gluey piece 31 have the space to take place the overflow when bonding in addition, thereby improve the bonding area, and improve the pseudo-bonding phenomenon of gas pocket, and then improve bonding intensity.
Of course, the present invention is not limited to this, and in the embodiment of the present invention, the above bonding method may be further refined as follows.
Firstly, polishing the workpiece 2 and the base material 5, removing oxide layers on the surfaces of the base material 5 and the workpiece 2, making the surfaces rough, and enhancing the adhesion with the adhesive 3. And then the workpiece 2 and the substrate 5 can be cleaned, and impurities such as grinding residual dust, iron powder and the like can be removed cleanly.
Secondly, as shown in fig. 11, the cleaned workpiece 2 is fixed by using the vise 6 or a jig, with reference to fig. 12 and 13, and then the die body 11 is sleeved on the workpiece 2, for example, the die body 11 and the workpiece 2 are relatively limited by using the positioning structure 13, so as to implement the installation of the die body 11 on the workpiece 2.
Thirdly, as shown in fig. 12, a pad 14 is disposed in at least one glue injection cavity 12, for example, the pad 14 may be disposed in two spaced apart glue injection cavities 12, the pad 14 is disposed at the center of the corresponding glue injection cavity 12, a small amount of flash drying glue is dropped into the glue injection cavity 12 with the pad 14, so as to bond the pad 14 to the bonding surface of the workpiece 2, and the pad 14 is dried for about 5 minutes, so as to bond the pad 14 to the workpiece 2.
Fourthly, the glue gun is adopted to extrude the adhesive 3, the adhesive 3 flows out from the glue gun nozzle, the adhesive is injected into the adhesive injection cavity 12 and fills the adhesive injection cavity 12, the scraper blade is adopted to scrape off the surface of the workpiece 2 far away from the mold body 11, and the redundant adhesive 3 is scraped off, so that the adhesive 3 is only filled in the adhesive injection cavity 12 and does not remain on the surface of the mold body 11, thereby ensuring that the adhesive 3 fully fills the adhesive injection cavity 12, after scraping, no air holes exist on the surface of the adhesive 3, and the amount of the adhesive 3 is effectively controlled.
And fifthly, holding the two ends of the length of the die body 11 by two hands, and slightly lifting the die body 11 vertically upwards to realize demoulding, namely taking down the die body 11, leaving the molding glue with the same shape and size as the glue injection cavity 12 on the die body 11 on the workpiece 2 after demoulding, namely glue blocks 31 formed by the adhesive 3 in the corresponding glue injection cavity 12 are adhered on the workpiece 2, and a gap 41 is formed between any two glue blocks 31. For facilitating the demolding, the material of the mold body 11 may be selected from a material having a low tension or a material having a surface treated to have a low tension, such as: the low tension is achieved by the polytetrafluoroethylene, polyethylene, polypropylene and other materials or metal material spraying polytetrafluoroethylene and other processes, so that the mold body 11 can be smoothly demoulded without auxiliary silicon, oil, grease, agent and the like, and the operation is convenient.
Sixthly, the side, provided with the rubber block 31, of the workpiece 2 faces the cleaned substrate 5, the workpiece 2 is made to approach the substrate 5, so that the rubber block 31 is in contact with the substrate 5, then the workpiece 2 and the substrate 5 are lightly clamped at a position opposite to or approximately opposite to the pad 14 by using a plurality of clamps 7 (such as C-shaped clamps), the relative position of the workpiece 2 and the substrate 5 in the direction perpendicular to the pressing direction is properly adjusted, so that the bonding position of the workpiece 2 meets the requirement, then the clamping is continued until the pad 14 is in contact with the substrate 5, in the process, under the action of clamping pressure, the part, higher than the pad 14, of the rubber block 31 overflows to the periphery of the rubber block 31 to form an overflow rubber 32, and in the process of pressing, the air holes in the rubber block 31 are filled, and the false bonding phenomenon is avoided.
In addition, the adhesive 3 can be cured for more than seven days in a temperature-controlled and wet environment to ensure that the inside of the adhesive 3 is changed from colloidal liquid to solid, so that the workpiece 2 and the base material 5 are mechanically locked and reliably connected after the adhesive 3 is cured. The time for removing the clamp 7 may be determined according to actual conditions, and for example, the clamp may be removed after the periphery of the rubber block 31 is cured, for example, about three days, or may be removed after the rubber block 31 is completely cured, which is not limited herein.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A gluing mold, characterized in that, includes:
the mould comprises a mould body, wherein the mould body is provided with a plurality of glue injection cavities, each glue injection cavity penetrates through the surfaces of two sides of the thickness of the mould body, and any two glue injection cavities are arranged at intervals.
2. The gluing die of claim 1, wherein the spacing between each two adjacent glue injection cavities is equal.
3. The gluing die of claim 1, wherein a plurality of the glue cavities are spaced apart in sequence along the length of the die body.
4. A gluing mold as claimed in claim 3, wherein the two side edges of the length of the mold body are respectively a first edge and a second edge, a first gluing cavity is provided in the plurality of gluing cavities close to the first edge, a second gluing cavity is provided in the plurality of gluing cavities close to the second edge, the distance between the first gluing cavity and the first edge is greater than the distance between any two adjacent gluing cavities, and the distance between the second gluing cavity and the second edge is greater than the distance between any two adjacent gluing cavities.
5. The gluing die of claim 1, further comprising:
the positioning structure is arranged on one side of the thickness of the die body and avoids the glue injection cavity, and the positioning structure is used for limiting the relative position of the to-be-glued piece and the die body.
6. The gluing die of claim 5, wherein a plurality of the gluing cavities are distributed at intervals along the length direction of the die body in sequence, and the positioning structure comprises:
the first locating blocks are two and located on two sides of the plurality of glue injection cavities in the length direction of the die body.
7. The gluing die of claim 5, wherein a plurality of the gluing cavities are distributed at intervals along the length direction of the die body in sequence, and the positioning structure comprises:
the number of the second positioning blocks is at least two, and the second positioning blocks are respectively arranged on two sides of at least one glue injection cavity in the width direction of the die body.
8. The gluing die according to claim 1, wherein at least part of the die body is a flat plate of uniform thickness and is provided with a plurality of the glue injection cavities so as to be equal in depth in the thickness direction of the die body.
9. Gluing die according to any one of claims 1 to 8, characterised in that it further comprises:
and the pad piece is arranged in at least one glue injection cavity and is not in contact with the side wall of the glue injection cavity where the pad piece is positioned, and the height of the pad piece is smaller than the depth of the glue injection cavity where the pad piece is positioned in the thickness direction of the die body.
10. A bonding method for bonding a work to a substrate using the paste application mold according to claim 9, comprising the steps of:
disposing the die body on the workpiece;
arranging the cushion piece in at least one glue injection cavity and adhering the cushion piece to the workpiece;
injecting an adhesive into at least one glue injection cavity, and enabling the adhesive injected into the glue injection cavity with the cushion piece to cover the cushion piece;
taking the die body off the workpiece, wherein the workpiece is adhered with a glue block formed by the adhesive in the corresponding glue injection cavity;
and enabling one side of the workpiece, which is provided with the rubber block, to face the base material, and enabling the workpiece to be close to the base material until the pad is contacted with the base material, wherein the part of the rubber block, which is higher than the pad, overflows around the rubber block.
CN202010231756.2A 2020-03-27 2020-03-27 Gluing mold and bonding method Active CN113441362B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010231756.2A CN113441362B (en) 2020-03-27 2020-03-27 Gluing mold and bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010231756.2A CN113441362B (en) 2020-03-27 2020-03-27 Gluing mold and bonding method

Publications (2)

Publication Number Publication Date
CN113441362A true CN113441362A (en) 2021-09-28
CN113441362B CN113441362B (en) 2022-10-18

Family

ID=77808250

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010231756.2A Active CN113441362B (en) 2020-03-27 2020-03-27 Gluing mold and bonding method

Country Status (1)

Country Link
CN (1) CN113441362B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117054199A (en) * 2023-10-11 2023-11-14 沈阳市中飞机械厂有限公司 Radome mechanical test tool

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1750246A (en) * 2004-09-15 2006-03-22 精工爱普生株式会社 Method for mounting semiconductor device, semiconductor device and its mounting structure
TW200812705A (en) * 2006-09-13 2008-03-16 Lingsen Precision Ind Ltd Method of thickness control for gluing
TWM363338U (en) * 2009-04-29 2009-08-21 Pin-Yu Liao Heat-melting glue film with gas exhausting structure
JP2009280493A (en) * 2009-07-13 2009-12-03 Ngk Insulators Ltd Method of manufacturing ceramic honeycomb structure
CN101670331A (en) * 2009-09-17 2010-03-17 深圳市瑞丰光电子有限公司 Liquid glue encapsulation device and encapsulation method using same
CN101823039A (en) * 2009-03-06 2010-09-08 鸿骐新技股份有限公司 Gluing device, use method and products thereof
CN201930901U (en) * 2010-12-28 2011-08-17 广州市鸿利光电股份有限公司 Die used for flat bracket adhesive dispensing
CN202006158U (en) * 2011-03-04 2011-10-12 常州市欧密格电子科技有限公司 Batch quantity spot gluer
CN103433171A (en) * 2013-08-30 2013-12-11 深圳创维-Rgb电子有限公司 Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source
CN103515080A (en) * 2012-06-20 2014-01-15 苏州工业园区赫光科技有限公司 Screen type glue fitting device
CN103551291A (en) * 2013-10-29 2014-02-05 深圳市联得自动化装备股份有限公司 Glue coating method and glue laminating machine
CN204249365U (en) * 2014-11-27 2015-04-08 荆门市幸科电子有限公司 LED lamp bead pastes gluing particular manufacturing craft
CN204703444U (en) * 2015-05-26 2015-10-14 陈燕 A kind of composite floor board
CN106000815A (en) * 2016-05-27 2016-10-12 青岛理工大学 Preparing method and system for damping layer in embedded type co-curing composite material
CN108638678A (en) * 2018-05-31 2018-10-12 苏州天立达胶粘制品有限公司 A kind of printing process of abnormal shape glue
CN208062141U (en) * 2018-05-08 2018-11-06 宁德时代新能源科技股份有限公司 Battery modules

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1750246A (en) * 2004-09-15 2006-03-22 精工爱普生株式会社 Method for mounting semiconductor device, semiconductor device and its mounting structure
TW200812705A (en) * 2006-09-13 2008-03-16 Lingsen Precision Ind Ltd Method of thickness control for gluing
CN101823039A (en) * 2009-03-06 2010-09-08 鸿骐新技股份有限公司 Gluing device, use method and products thereof
TWM363338U (en) * 2009-04-29 2009-08-21 Pin-Yu Liao Heat-melting glue film with gas exhausting structure
JP2009280493A (en) * 2009-07-13 2009-12-03 Ngk Insulators Ltd Method of manufacturing ceramic honeycomb structure
CN101670331A (en) * 2009-09-17 2010-03-17 深圳市瑞丰光电子有限公司 Liquid glue encapsulation device and encapsulation method using same
CN201930901U (en) * 2010-12-28 2011-08-17 广州市鸿利光电股份有限公司 Die used for flat bracket adhesive dispensing
CN202006158U (en) * 2011-03-04 2011-10-12 常州市欧密格电子科技有限公司 Batch quantity spot gluer
CN103515080A (en) * 2012-06-20 2014-01-15 苏州工业园区赫光科技有限公司 Screen type glue fitting device
CN103433171A (en) * 2013-08-30 2013-12-11 深圳创维-Rgb电子有限公司 Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source
CN103551291A (en) * 2013-10-29 2014-02-05 深圳市联得自动化装备股份有限公司 Glue coating method and glue laminating machine
CN204249365U (en) * 2014-11-27 2015-04-08 荆门市幸科电子有限公司 LED lamp bead pastes gluing particular manufacturing craft
CN204703444U (en) * 2015-05-26 2015-10-14 陈燕 A kind of composite floor board
CN106000815A (en) * 2016-05-27 2016-10-12 青岛理工大学 Preparing method and system for damping layer in embedded type co-curing composite material
CN208062141U (en) * 2018-05-08 2018-11-06 宁德时代新能源科技股份有限公司 Battery modules
CN108638678A (en) * 2018-05-31 2018-10-12 苏州天立达胶粘制品有限公司 A kind of printing process of abnormal shape glue

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117054199A (en) * 2023-10-11 2023-11-14 沈阳市中飞机械厂有限公司 Radome mechanical test tool
CN117054199B (en) * 2023-10-11 2023-12-22 沈阳市中飞机械厂有限公司 Radome mechanical test tool

Also Published As

Publication number Publication date
CN113441362B (en) 2022-10-18

Similar Documents

Publication Publication Date Title
KR102207471B1 (en) Method of forming an injection-bonded joint and structural assembly
EP3111506B1 (en) Process for producing an assembly of an energy storage module and a cooling element and assembly of an energy storage module and a cooling element
CN113441362B (en) Gluing mold and bonding method
CN107709848B (en) The manufacturing method of gasket
BRPI0610835B1 (en) electrode, chemical cell, battery or power cell and method for making an electrode
EP3243215B1 (en) Method for producing an electronics module, in particular a transmission control module
US6017429A (en) Cathode element and a method of its manufacture
CN111054596B (en) Gluing mold and UV glue coating method for electronic component
US6754971B1 (en) Centering device for flat components, especially glass panels
US10018211B2 (en) Bond standoffs for sliding positioning of components in an assembly
KR0151416B1 (en) Method of fabricating ink-jet printer head
WO2010136162A2 (en) Method for producing a solar module
KR20160008155A (en) Method for manufacturing carbon plate-integrated gasket
EP2684247B1 (en) Connecting layer, battery having said connecting layer, and motor vehicle having said battery
CN217569498U (en) Device for accurately gluing on substrate
WO2014016078A1 (en) Accumulator having galvanic cells
CN103802439B (en) Engagement member manufacture method and engagement member manufacturing installation
RU2368634C2 (en) Method and device for application of thermomelting glue onto pasted or adhered surfaces of fastening elements
KR101279448B1 (en) Processing method of thin glass
CN110815525B (en) Drying tool and method for gel injection molding large-size ceramic blank
CN210395027U (en) Robot is smeared with cement in restoration
CN210706125U (en) FRP board-base member bonding test piece making devices
CN210653354U (en) Automobile body structure and car cover with rubber coating groove
CN114798314B (en) Gluing jig and gluing method
CN107206970B (en) Wiper blade

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant