CN111054596B - Gluing mold and UV glue coating method for electronic component - Google Patents
Gluing mold and UV glue coating method for electronic component Download PDFInfo
- Publication number
- CN111054596B CN111054596B CN201911164130.8A CN201911164130A CN111054596B CN 111054596 B CN111054596 B CN 111054596B CN 201911164130 A CN201911164130 A CN 201911164130A CN 111054596 B CN111054596 B CN 111054596B
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- Prior art keywords
- glue
- substrate
- gluing
- circuit board
- groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a gluing mold and a UV glue coating method for an electronic component, and relates to the field of UV glue, wherein the gluing mold comprises a substrate, and the substrate is made of a material which is not easy to adhere to the UV glue; the substrate is divided into a transparent area and an opaque area, and the transparent area is provided with a groove for glue filling. When the gluing mold is used for gluing electronic components on a circuit board, glue is poured into the grooves firstly, then the circuit board and the substrate are jointed, and the electronic components and the corresponding grooves are jointed; and irradiating UV light from the substrate side, wherein the UV light penetrates through the transparent region and irradiates on the UV glue in the groove to cure the UV glue, and the substrate and the circuit board are peeled off after curing to finish UV glue coating. Because the substrate can be provided with a plurality of grooves, the gluing operation of a plurality of electronic components on the circuit board is completed at one time, and the gluing efficiency is improved; the invention has the advantages of simple structure, low cost and easy realization.
Description
Technical Field
The invention relates to the technical field of UV glue, in particular to a gluing mold and a UV glue coating method for an electronic component.
Background
At present, in order to protect electronic components on a circuit board, a layer of UV glue is generally coated on the surface of the electronic components. Traditional UV glues the mode of coating, uses the syringe needle to carry out UV to electronic components's surface one by one and glues the coating mostly, leads to rubber coating efficiency relatively slower.
Disclosure of Invention
Aiming at the defects, the technical problems to be solved by the invention are as follows: the gluing mold and the electronic component UV glue coating method are provided, the electronic component UV glue coating efficiency is improved, and the gluing mold and the electronic component UV glue coating method have the advantages of being simple in structure and low in cost.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a gluing mold comprises a substrate, wherein the substrate is made of a material which is not easy to adhere to a UV glue; the substrate is divided into a transparent area and an opaque area, and the transparent area is provided with a groove for glue filling.
Preferably, the substrate is made of silica gel, polytetrafluoroethylene or polypropylene.
Preferably, the surface of one side of the substrate is a plane, and the surface of the transparent region on the other side of the substrate is recessed inward to form the groove.
Preferably, the substrate is provided with a plurality of grooves, and all the grooves are arranged according to the arrangement and distribution mode of the electronic components on the circuit board to be glued.
Preferably, the shape and depth of each groove are matched with the electronic component to be glued.
A method for coating UV glue on an electronic component comprises the following steps:
step one, pouring glue into the groove of the glue coating mold;
step two, the circuit board to be glued is jointed with the gluing mold, so that each electronic component is jointed with the corresponding groove;
irradiating UV light from the side of the gluing mold to act on UV glue in each groove, and forming a cured glue layer on the surface of the electronic component by the UV glue;
and step four, stripping the gluing mold and the circuit board to finish UV glue coating.
Preferably, in the first step, a UV paste is applied to the surface of the substrate so that the UV paste flows into the grooves.
After the technical scheme is adopted, the invention has the beneficial effects that:
according to the gluing mold and the method for coating the UV glue on the electronic component, the gluing mold comprises a substrate, and the substrate is made of a material which is not easy to adhere to the UV glue; the substrate is divided into a transparent area and an opaque area, and the transparent area is provided with a groove for glue filling. When the gluing mold is used for gluing electronic components on a circuit board, glue is poured into the grooves on the substrate, then the circuit board and the substrate are jointed, and the electronic components and the corresponding grooves are jointed; and irradiating UV light from the substrate side, wherein the UV light penetrates through the transparent region and irradiates the UV glue in the groove, so that the UV glue is cured on the surface of the electronic component, and the substrate and the circuit board are peeled off after curing to finish UV glue coating. Because the substrate can be provided with a plurality of grooves, the gluing operation of a plurality of electronic components on the circuit board is completed at one time, and the gluing efficiency is improved; the invention has the advantages of simple structure, low cost and easy realization.
Because the shape and the depth of each groove are matched with the electronic component to be glued, accurate gluing is ensured.
Drawings
FIG. 1 is a schematic view of the construction of a gluing die according to the invention;
FIG. 2 is a process flow diagram of a method for UV glue coating of electronic components according to the present invention;
in the figure: 1-substrate, 10-transparent region, 11-opaque region, 2-groove, 3-circuit board, 4-electronic component, 5-curing glue layer, 6-UV glue and 7-UV light.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
as shown in fig. 1, a glue spreading mold comprises a substrate 1, wherein the substrate 1 is made of a material which is not easy to adhere to a UV glue; the substrate 1 is divided into a transparent area 10 and an opaque area 11, and the transparent area 10 is provided with a groove 2 for filling glue. When the gluing mold is used for coating UV glue, the grooves 2 with required quantity can be arranged on the substrate 1, the gluing action on the surfaces of a plurality of electronic components can be completed at one time, and the gluing efficiency is improved.
The substrate 1 of the gluing mold is made of a material which is not easy to adhere to the UV glue, so that the UV glue is easy to peel off after being cured, and the efficiency is improved. The arrangement of the transparent area 10 on the substrate 1 ensures that the UV glue irradiates the UV glue in the groove 2, and the arrangement of the non-transparent area 11 blocks the irradiation of the UV light and prevents the UV glue which does not need to be glued from not curing.
The substrate 1 of the present invention may be made of silicone, teflon or polypropylene, in this case, silicone is used, the transparent region 10 is made of transparent silicone, and the opaque region 11 is made of black silicone.
As shown in fig. 1, one surface of the substrate 1 is a flat surface, and the other surface of the transparent region 10 of the substrate 1 is recessed inward to form the grooves 2. When the glue coating mold is used for coating glue, UV light irradiates from the plane side of the substrate 1 and penetrates through the transparent area 10 to irradiate on the UV glue.
As shown in fig. 1, a substrate 1 is provided with a plurality of grooves 2, and all the grooves 2 are arranged according to the arrangement and distribution of electronic components on the circuit board to be glued. This structure base plate 1, better with the circuit board involutory, promote rubber coating efficiency and rubber coating effect.
The shape and the depth of each groove 2 are matched with the electronic component to be glued, so that the gluing effect on the surface of the electronic component is improved.
In conclusion, compared with the prior art, the gluing mold disclosed by the invention solves the problem of low gluing efficiency; the gluing mold disclosed by the invention has the advantages that the gluing efficiency is improved by gluing the electronic component by using the substrate provided with the groove, the stripping efficiency after curing is improved by using the substrate which is not adhered with the UV glue, and the gluing mold has a simple structure, is low in cost and is easy to realize.
Example two:
as shown in fig. 2, a method for coating UV glue on an electronic component includes the following steps:
step one, glue is poured into the grooves of the glue coating mold, in the embodiment, the surface of the substrate 1 is coated with the UV glue 6, so that the UV glue 6 flows into each groove, and the efficiency is further improved;
step two, the circuit board 3 to be coated is jointed with a coating mould, so that each electronic component 4 is jointed with a corresponding groove;
irradiating UV light 7 from the side of the gluing mold to act on the UV glue 6 in each groove, wherein the UV glue 6 forms a cured glue layer 5 on the surface of the electronic component 4;
and step four, stripping the gluing mold and the circuit board 3 to finish coating the UV glue 6.
According to the method for coating the UV glue on the electronic component, the gluing operation of all the electronic components 4 to be glued on the circuit board 3 can be completed at one time by using the gluing mold in the first embodiment, so that the gluing efficiency is improved, and the method is simple to operate as long as the electronic components 4 are matched with the corresponding grooves.
The above-described preferred embodiments of the present invention are not intended to limit the present invention, and any modifications, equivalent modifications of the glue application mold and method, which are within the spirit and principle of the present invention, should be included in the scope of the present invention.
Claims (6)
1. The gluing mold is characterized by comprising a substrate, wherein the substrate is made of a material which is not easy to adhere to UV glue; the substrate is divided into a transparent area and an opaque area, the transparent area is provided with a groove for glue filling, and the shape and the depth of the groove are matched with the electronic component to be glued; the transparent areas are distributed according to the electronic components to be glued on the circuit board.
2. Gluing die according to claim 1, characterised in that the substrate is made of silicone, teflon or polypropylene material.
3. The gluing die according to claim 2, wherein the surface of one side of the substrate is a plane, and the surface of the other side of the substrate of the transparent area is recessed inwards to form the grooves.
4. The gluing mold according to claim 3, wherein the substrate is provided with a plurality of grooves, and all the grooves are arranged according to the arrangement and distribution of the electronic components on the circuit board to be glued.
5. A method for coating UV glue on an electronic component is characterized by comprising the following steps:
step one, pouring glue into a groove of the gluing mold according to any one of claims 1 to 4;
step two, the circuit board to be glued is jointed with the gluing mold, so that each electronic component is jointed with the corresponding groove;
irradiating UV light from the side of the gluing mold to act on UV glue in each groove, and forming a cured glue layer on the surface of the electronic component by the UV glue;
and step four, stripping the gluing mold and the circuit board to finish UV glue coating.
6. A method for coating electronic components with UV glue as claimed in claim 5, wherein in the first step, the surface of the substrate is coated with UV glue, so that the UV glue flows into each groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164130.8A CN111054596B (en) | 2019-11-25 | 2019-11-25 | Gluing mold and UV glue coating method for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164130.8A CN111054596B (en) | 2019-11-25 | 2019-11-25 | Gluing mold and UV glue coating method for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111054596A CN111054596A (en) | 2020-04-24 |
| CN111054596B true CN111054596B (en) | 2022-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911164130.8A Active CN111054596B (en) | 2019-11-25 | 2019-11-25 | Gluing mold and UV glue coating method for electronic component |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113050391A (en) * | 2021-03-18 | 2021-06-29 | 歌尔股份有限公司 | Method for recycling components coated with UV glue |
| CN113477486B (en) * | 2021-07-14 | 2021-12-28 | 福建时代星云科技有限公司 | Gluing method with degumming function |
| CN117443671A (en) * | 2023-12-25 | 2024-01-26 | 硕泰(江苏)精密制造有限公司 | High-efficient rubber coating device of electronic components |
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| CN202242137U (en) * | 2011-10-08 | 2012-05-30 | 叶逸仁 | Simple line die manufacture structure |
| CN102623226A (en) * | 2012-04-06 | 2012-08-01 | 薛志勇 | Method for manufacturing membrane panel |
| CN102645717A (en) * | 2011-02-17 | 2012-08-22 | 一诠精密工业股份有限公司 | Method for fixing optical lens by ultraviolet (UV) adhesive |
| WO2018018468A1 (en) * | 2016-07-27 | 2018-02-01 | 华为技术有限公司 | Method for bonding shell and display screen, shell assembly and mobile terminal |
| CN108235578A (en) * | 2018-01-02 | 2018-06-29 | 京东方科技集团股份有限公司 | PCB silk-screens production method, PCB screen printing patterns and pcb board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2005265A (en) * | 2009-10-07 | 2011-04-11 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
| KR102353349B1 (en) * | 2015-03-31 | 2022-01-19 | 삼성디스플레이 주식회사 | Manufacturing method of metal mask and mask for deposition using thereof |
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- 2019-11-25 CN CN201911164130.8A patent/CN111054596B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102645717A (en) * | 2011-02-17 | 2012-08-22 | 一诠精密工业股份有限公司 | Method for fixing optical lens by ultraviolet (UV) adhesive |
| CN202242137U (en) * | 2011-10-08 | 2012-05-30 | 叶逸仁 | Simple line die manufacture structure |
| CN102623226A (en) * | 2012-04-06 | 2012-08-01 | 薛志勇 | Method for manufacturing membrane panel |
| WO2018018468A1 (en) * | 2016-07-27 | 2018-02-01 | 华为技术有限公司 | Method for bonding shell and display screen, shell assembly and mobile terminal |
| CN108235578A (en) * | 2018-01-02 | 2018-06-29 | 京东方科技集团股份有限公司 | PCB silk-screens production method, PCB screen printing patterns and pcb board |
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| CN111054596A (en) | 2020-04-24 |
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