CN105608485A - Smart card and manufacturing method thereof - Google Patents

Smart card and manufacturing method thereof Download PDF

Info

Publication number
CN105608485A
CN105608485A CN201510947396.5A CN201510947396A CN105608485A CN 105608485 A CN105608485 A CN 105608485A CN 201510947396 A CN201510947396 A CN 201510947396A CN 105608485 A CN105608485 A CN 105608485A
Authority
CN
China
Prior art keywords
substrate
light
mold insert
interior mold
curing adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510947396.5A
Other languages
Chinese (zh)
Inventor
陆舟
于华章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feitian Technologies Co Ltd
Original Assignee
Feitian Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feitian Technologies Co Ltd filed Critical Feitian Technologies Co Ltd
Priority to CN201510947396.5A priority Critical patent/CN105608485A/en
Publication of CN105608485A publication Critical patent/CN105608485A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a smart card and a manufacturing method thereof. The method comprises the following steps that: a substrate provided with an insert filling area is provided; an insert is arranged in the insert filling area in a filling manner; a light curing adhesive is applied onto a surface where the insert filling area is located; light curing is performed on the substrate coated with the light curing adhesive, so that an intermediate material can be obtained; and a smart card can be obtained according to the intermediate material. According to the method of the invention, light curing is performed on the substrate coated with the light curing adhesive, so that curing time can be greatly shortened, and the production efficiency of the smart card can be improved.

Description

A kind of smart card and manufacture method thereof
Technical field
The present invention relates to field of intelligent cards, relate in particular to a kind of smart card and manufacture method thereof.
Background technology
Society is pursued and is started to become diversification smart card product, along with smart card production technology day by day, there is having the smart card of human-computer interaction function in maturation. In prior art, there is man-machine interaction in manufactureIn the process of the smart card of function, need can make for a long time the substrate of adhesive-applying to solidify, reduceThe production efficiency of smart card.
Summary of the invention
The invention provides a kind of smart card and manufacture method thereof, produce effect to solve smart card in prior artThe defect that rate is low.
The invention provides a kind of smart card, comprising: substrate and paste the printed layers on described substrate; InstituteState and in substrate, be filled with interior mold insert; In described substrate, be filled with light-curing adhesive.
Alternatively, described light-curing adhesive is filled between described substrate and described interior mold insert.
Alternatively, described light-curing adhesive is specially ultraviolet light bonding agent or visible-light curing bonding agent or redOuter light-curing adhesive.
Alternatively, have interior mold insert fill area on described substrate, described interior mold insert is filled in described interior mold insert and fills outFill in district.
Alternatively, described light-curing adhesive is filled in described interior mold insert fill area.
Alternatively, described interior mold insert fill area is specially trench structure or engraved structure;
In the time that described interior mold insert fill area is specially described trench structure, the raw material of described substrate are light-permeableMaterial;
In the time that described interior mold insert fill area is specially described engraved structure, the raw material of described substrate comprise can be saturatingLuminescent material and/or not transparent material.
Alternatively, the raw material of described substrate are transparent material.
Alternatively, between described printed layers and described substrate, also comprise overlay film.
Alternatively, described printed layers comprises: the first printing pattern layer, the first printing bed of material and the first printing are protectedSheath; Described first prints the bed of material between described substrate and described the first printing pattern layer, described firstPrinting pattern layer is between the described first printing bed of material and described the first printing protective layer.
Alternatively, between the described first printing bed of material and described substrate, also comprise overlay film.
Alternatively, described printed layers comprises: the second printing pattern layer and the second printing bed of material, described second printsBrush patterned layer is between the described second printing bed of material and described substrate; The described second printing bed of material is transparent.
Alternatively, between described the second printing pattern layer and described substrate, also comprise overlay film.
Alternatively, the raw material of described overlay film are transparent material.
Alternatively, the raw material of described overlay film are all transparent material or the district corresponding with described interior mold insertThe raw material in territory are transparent material.
Alternatively, described interior mold insert comprises mutual circuit module.
Alternatively, described interior mold insert also comprises nonreciprocal circuit module.
Alternatively, described mutual circuit module specifically comprises: key-press module and/or display module; Described non-friendshipCircuit module specifically comprises mutually: power module and control module.
The present invention also provides a kind of manufacture method of smart card, comprising:
Step s1: the substrate with interior mold insert fill area is provided;
Step s2: interior mold insert is filled in the described interior mold insert fill area of described substrate, at described interior mold insertOn the surface at fill area place, apply light-curing adhesive;
Step s3: the described substrate that applies described light-curing adhesive is carried out to photocuring, obtain middle material, rootObtain smart card according to described middle material.
Alternatively, described interior mold insert fill area is specially trench structure or engraved structure;
In the time that described interior mold insert fill area is specially described engraved structure, described in described interior mold insert fill area instituteSurface on also comprise before applying light-curing adhesive: overlay film on described substrate.
Alternatively, the raw material of described overlay film are transparent material.
Alternatively, described interior mold insert fill area is specially trench structure or engraved structure;
In the time that described interior mold insert fill area is specially described trench structure, the raw material of described substrate are light-permeableMaterial;
In the time that described interior mold insert fill area is specially described engraved structure, the raw material of described substrate comprise can be saturatingLuminescent material and/or not transparent material.
Alternatively, described step s2 is specially: described interior mold insert is filled in the interior mold insert fill area of substrateAfterwards, on the surface at described interior mold insert fill area place, apply described light-curing adhesive; Or describedAfter applying described light-curing adhesive on the surface at interior mold insert fill area place, described interior mold insert is filled intoIn the interior mold insert fill area of described substrate or by described interior mold insert, be filled into together with described light-curing adhesiveIn the described interior mold insert fill area of described substrate.
Alternatively, after described step s2, before described step s3, also comprise: at the described photocuring of coatingOn the described substrate of bonding agent, paste overlay film.
The raw material of the described overlay film pasting on the described substrate of the described light-curing adhesive of coating alternatively,For transparent material.
Alternatively, describedly carry out after photocuring also comprising to applying the described substrate of described light-curing adhesive:Remove the overlay film on described substrate.
Alternatively, described light-curing adhesive is specially ultraviolet light bonding agent or visible-light curing bonding agent or redOuter light-curing adhesive.
Alternatively, the raw material of described substrate are transparent material.
Alternatively, described step s3 is specially: use light source sticky to applying described photocuring in Preset TimeThe described substrate that connects agent irradiates, and the described light-curing adhesive on described substrate is solidified, and obtains middle material,Obtain smart card according to described middle material.
Alternatively, described Preset Time is no more than 120 seconds.
Alternatively, described light source is specially unidirectional light source or multidirectional light source.
Alternatively, described use light source in Preset Time to applying the described substrate of described light-curing adhesiveIrradiate and be specially: use described light source in Preset Time to apply described light-curing adhesive described inSubstrate carries out once or repeatedly irradiates.
Alternatively, use described light source in Preset Time to applying the described substrate of described light-curing adhesiveWhile repeatedly irradiation, the power of the described light source that each irradiation is used is identical or different.
Alternatively, described use light source in Preset Time to applying the described substrate of described light-curing adhesiveIrradiate and be specially: use described light source in Preset Time coating described light-curing adhesive described inOne-sided or many sides of substrate are irradiated.
Alternatively, described light-curing adhesive is ultraviolet light bonding agent; Described light source is ultraviolet lamp.
Alternatively, describedly obtain smart card according to described middle material, specifically comprise: on described substrate, paste sealBrush layer, obtains smart card.
Alternatively, described interior mold insert comprises mutual circuit module and nonreciprocal circuit module; Described mutual circuitModule specifically comprises: key-press module and/or display module; Described nonreciprocal circuit module specifically comprises: power supplyModule and control module.
Alternatively, described use light source in Preset Time to applying the described substrate of described light-curing adhesiveIrradiate, the described light-curing adhesive on described substrate is solidified, obtain middle material, according to described middle materialObtaining smart card specifically comprises:
Step a1: light source is adjusted into the first default power, use light source in the first Preset Time to coatingThe described substrate of described light-curing adhesive irradiates for the first time, makes the described photocuring on described substrate stickyConnecing agent first solidifies;
Step a2: light source is adjusted into the second default power, use light source in the second Preset Time to coatingThe described substrate of described light-curing adhesive irradiates for the second time, makes the described photocuring on described substrate stickyConnect agent and solidify for the second time, obtain middle material, obtain smart card according to middle material.
Alternatively, described step s3 is specially: use light source in Preset Time to being fixed on the painting on toolThe described substrate that applies described light-curing adhesive irradiates, and makes the described light-curing adhesive on described substrateSolidify, obtain middle material, obtain smart card according to middle material.
The invention provides a kind of smart card and manufacture method thereof, sticky to coating photocuring in described manufacture methodThe substrate that connects agent carries out photocuring processing, has shortened greatly the curing time, has improved the production of smart cardEfficiency.
Brief description of the drawings
The flow chart of the manufacture method of a kind of smart card that Fig. 1 provides for the embodiment of the present invention 1;
The flow chart of the manufacture method of a kind of smart card that Fig. 2 provides for the embodiment of the present invention 2;
The structure chart of a kind of substrate that Fig. 3 provides for the embodiment of the present invention 2;
The structure chart of the slotted substrate of a kind of tool that Fig. 4 provides for the embodiment of the present invention 2;
The structure chart of a kind of interior mold insert that Fig. 5 embodiment of the present invention 2 provides;
The profile of a kind of substrate that is filled with interior mold insert that Fig. 6 provides for the embodiment of the present invention 2;
The profile of a kind of substrate with overlay film that Fig. 7 provides for the embodiment of the present invention 2;
A kind of substrate that applies ultraviolet light bonding agent that Fig. 8 provides for the embodiment of the present invention 2 is by conveying type purpleThe schematic diagram of outer uv equipment;
The profile of the smart card that Fig. 9-Figure 12 provides for the embodiment of the present invention 2;
The flow chart of the manufacture method of a kind of smart card that Figure 13 provides for the embodiment of the present invention 3;
The structure chart of a kind of substrate with vacancy section providing that Figure 14 provides for the embodiment of the present invention 3;
The structure chart of a kind of interior mold insert that Figure 15 provides for the embodiment of the present invention 3;
The profile of a kind of substrate that is filled with interior mold insert that Figure 16 provides for the embodiment of the present invention 3;
The profile of a kind of substrate with overlay film that Figure 17 provides for the embodiment of the present invention 3;
The profile of removing the substrate after overlay film that Figure 18 and Figure 19 provide for the embodiment of the present invention 3;
The profile of the smart card that Figure 20-Figure 23 provides for the embodiment of the present invention 3.
Detailed description of the invention
Below in conjunction with accompanying drawing of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, completeGround is described, and obviously, described embodiment is only a part of embodiment of the present invention, instead of wholeEmbodiment. Based on the embodiment in the present invention, those skilled in the art are not making creative work prerequisiteLower obtained every other embodiment, belongs to the scope of protection of the invention.
Embodiment 1
The present embodiment provides a kind of smart card, comprising: substrate and paste the printed layers on substrate; Wherein,In substrate, be filled with in interior mold insert and substrate and be filled with light-curing adhesive.
In the present embodiment, in described substrate, be filled with light-curing adhesive and be specially: between substrate and interior mold insertBe filled with light-curing adhesive.
In the present embodiment, have interior mold insert fill area on substrate, interior mold insert is specifically filled in interior mold insert fill areaIn, in interior mold insert fill area, be also filled with light-curing adhesive. Interior mold insert fill area is specifically as follows grooved knotStructure or engraved structure. In the time that interior mold insert fill area is trench structure, the raw material of substrate are transparent material,Preferably, substrate is transparent. In the time that interior mold insert fill area is engraved structure, the raw material of substrate comprise canLight transmissive material and/or not transparent material, preferably, the raw material of substrate are transparent material, furtherGround, substrate can be transparent. In the present embodiment, transparent material is specially can be through bonding with photocuringThe material of the corresponding light source of agent. In the time that light-curing adhesive is ultraviolet light bonding agent, transparent material is energySee through the material of ultraviolet light; In the time that light-curing adhesive is visible-light curing bonding agent, transparent material is energySee through the material of visible ray; In the time that light-curing adhesive is infrared light curing adhesive, transparent material is energySee through the material of infrared light.
In the present embodiment, interior mold insert can comprise mutual circuit module, and mutual circuit module is for having man-machine friendshipThe circuit module of function mutually. Mutual circuit module, can comprise key-press module and/or display module etc. Interior edgePart can also comprise nonreciprocal circuit module. Nonreciprocal circuit module is the circuit without human-computer interaction functionModule. Nonreciprocal circuit module can comprise power module and control module etc. The mutual circuit mould of interior mold insertThe height of piece and nonreciprocal circuit module can be identical or different.
In the present embodiment, provide a kind of printed layers, printed layers specifically comprises: the first printed layers and/or secondPrinted layers. The first printed layers comprises: the first printing pattern layer, the first printing bed of material and the first printing protective layer;The first printing bed of material is between substrate and the first printing pattern layer, and the first printing pattern layer is positioned at the first printingBetween the bed of material and the first printing protective layer.
In the present embodiment, the second printed layers comprises: the second printing pattern layer and the second printing bed of material, second printsBrush patterned layer is between the second printing bed of material and substrate; The second printing bed of material is transparent.
In the present embodiment, between printed layers and substrate, can also comprise: overlay film. Correspondingly, when printed layers bagWhile drawing together the first printed layers, film-coating tool body is positioned between substrate and the first printing bed of material; When printed layers comprises secondWhen printed layers, film-coating tool body is positioned between substrate and the second printing pattern layer.
In the present embodiment, the first printing pattern layer is the figure layer with printed patterns, and the first printing bed of material is for usingIn the bed of material of the printed patterns of undertaking the printing of, the first printing protective layer is the bed of material for the protection of the first printing pattern layer.Wherein, the first printing bed of material can be transparent can be also opaque, the first printing protective layer can beAll transparent or the part corresponding with the printed patterns of the first printing pattern layer be transparent.
In the present embodiment, the second printing pattern layer is the figure layer with printed patterns, and the second printing bed of material is for usingIn the bed of material of the printed patterns of undertaking the printing of. In the present embodiment, the second printing bed of material can be the also passable of all transparentTo be transparent with part corresponding to the printed patterns of the second printing pattern layer.
In the present embodiment, the raw material of printed layers are PVC (Polyvinylchloride, polyvinyl chloride), PC(Polycarbonate, Merlon), PETG (Poly (ethyleneTerephthalateco-1,4-cylclohexylenedimethyleneterephthalate), non-crystalline type copolyesters),PET (poly (ethyleneterephthalate), pet resin) or ABSPVC treeAt least one in fat. In the present embodiment, the light-permeable material of the sheet type that the suitable employing synthetic resin of overlay film is madeMaterial, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin. CanSelection of land, the raw material of overlay film can be all the former material in transparent material or the region corresponding with interior mold insertMaterial is transparent material. Preferably, overlay film is hyaline membrane. In this enforcement, in the time that overlay film is hyaline membrane, coverFilm can be all transparent or the region corresponding with interior mold insert be transparent.
The cure shrinkage of the smart card that the present embodiment provides is low, has excellent pliability and impact resistance,There is good weatherability and good electric property simultaneously.
Based on above-mentioned smart card, the present embodiment also provides a kind of manufacture method of smart card, as shown in Figure 1,Comprise:
Step 101: the substrate with interior mold insert fill area is provided;
Particularly, according to the structure of interior mold insert, adopt die-cut, vexed cut or milling at the bottom of etc. technique, what provideOn substrate, form the interior mold insert fill area that can fill interior mold insert. Wherein, interior mold insert fill area is specifically as followsTrench structure or engraved structure etc.
In the present embodiment, the plate-shaped material that the suitable employing synthetic resin of substrate is made, its raw material can be PVC,At least one in PC, PETG, PET or ABSPVC resin. When interior mold insert fill area is specially groovedWhen structure, the raw material of substrate are transparent material. In the time that interior mold insert fill area is specially engraved structure, baseThe raw material of plate can comprise transparent material and/or transparent material not.
Preferably, substrate is transparent. Substrate described in the present embodiment is transparent being specially: substrate is passableBe all transparent or part be transparent.
Step 102: interior mold insert is filled in the interior mold insert fill area of substrate, at interior mold insert fill area placeCoating light-curing adhesive on surface, and light-curing adhesive is smoothed;
This step can be specially: after interior mold insert being filled in the interior mold insert fill area of substrate, at interior edgeOn the surface at part fill area place, apply light-curing adhesive, and to light-curing adhesive smooth process orPerson is filled into substrate by interior mold insert apply light-curing adhesive on the surface at interior mold insert fill area place afterInterior mold insert fill area in, and light-curing adhesive is smoothed or by interior mold insert and light-curing adhesiveBe filled into together in the interior mold insert fill area of substrate, and the solid machine bonding agent of light is smoothed.
In the time that interior mold insert fill area is specially engraved structure, in step 102 at the table at interior mold insert fill area placeBefore applying light-curing adhesive on face, also comprise: on substrate, paste overlay film;
Particularly, apply light-curing adhesive on the surface at interior mold insert fill area place before, can adoptThe mode of stickup and/or lamination pastes overlay film on substrate.
It should be noted that, in the time that interior mold insert fill area is specially engraved structure, in step 102 at interior mold insertBefore applying light-curing adhesive on the surface at fill area place: can interior mold insert is filled into substrate inBefore mold insert fill area, on substrate, paste overlay film; Or can be at the interior edge that interior mold insert is filled into substrateAfter part fill area, on the surface at interior mold insert fill area place, apply light-curing adhesive before on substratePaste overlay film; Or in interior mold insert being filled into the interior mold insert fill area of substrate, on substrate, pasteOverlay film.
In the present embodiment, light-curing adhesive specifically comprises light trigger and photo-curing material, and wherein, light is solidFormed material can be epoxy resin, thermoplastic polyurethane or acrylate etc. Alternatively, light-curing adhesiveComprise: ultraviolet light bonding agent, visible-light curing bonding agent, infrared light curing adhesive etc. Preferably, lightCuring adhesive can be ultraviolet light bonding agent. Ultraviolet light bonding agent comprises acrylate and light trigger.
Step 103: paste overlay film on the substrate of coating light-curing adhesive;
Particularly, on the substrate of coating light-curing adhesive, need to adopt cylinder in pasting overlay film process, protectDemonstrate,proving overlay film used can progressively contact with the substrate that is filled with interior mold insert, can produce large while avoiding pasting overlay filmAmount bubble. In the present embodiment, the transparent material of the sheet type that the suitable employing synthetic resin of overlay film is made, it is formerMaterial can be at least one in PVC, PC, PETG, PET or ABSPVC resin. Alternatively, coverThe raw material of film can be all that the raw material in transparent material or the region corresponding with interior mold insert are can be saturatingLuminescent material. Preferably, overlay film is hyaline membrane. In this enforcement, in the time that overlay film is hyaline membrane, overlay film can beAll transparent or the region corresponding with interior mold insert be transparent.
Step 104: the light-curing adhesive on compacting substrate;
Particularly, the substrate that pastes overlay film is placed on and on laminating machine or on tool, carries out compaction treatment, compactingLight-curing adhesive on substrate.
Step 105: the substrate to coating light-curing adhesive carries out photocuring, obtains middle material, obtains according to middle materialTo smart card.
Particularly, use light source in Preset Time, the substrate of coating light-curing adhesive to be irradiated, makeLight-curing adhesive on substrate solidifies, and obtains middle material, obtains smart card according to middle material. Wherein, middle material toolBody comprises: substrate and interior mold insert, also have light-curing adhesive between substrate and interior mold insert. It should be noted that,Middle material can also comprise overlay film. It should be noted that, in the present embodiment, middle material does not comprise printed layers.
In the present embodiment, Preset Time can be no more than 120 seconds. Light source is specially and can makes photocuring bondingAgent is solid-state light source by liquid transition, has and comprises: ultraviolet source, visible light source and infrared light supply etc.In the time that light-curing adhesive is ultraviolet light bonding agent, light source is ultraviolet source; When light-curing adhesive is canWhile seeing light-curing adhesive, light source is visible light source; In the time that light-curing adhesive is infrared light curing adhesive,Light source is infrared light supply. In the present embodiment, preferably, light-curing adhesive is ultraviolet light bonding agent, correspondingLight source be ultraviolet source.
Alternatively, can use light source in Preset Time, the substrate of coating light-curing adhesive to be carried out onceOr repeatedly irradiate, the light-curing adhesive on substrate is solidified, obtain middle material, obtain intelligence according to middle materialCard. It should be noted that, when using light source in Preset Time, the substrate of coating light-curing adhesive to be carried outWhile repeatedly irradiation, each power that irradiates the light source using can be the same or different. Use light source to existIn Preset Time, the substrate of coating light-curing adhesive is repeatedly irradiated, can avoid solid to coating lightWhen the substrate of change bonding agent carries out photocuring, the light-curing adhesive Yin Wendu on substrate raise in too fast causingThe position of mold insert in the interior mold insert fill area of substrate is subjected to displacement and solidifies posterior photocuring adhesive surface notThe technical problem such as smooth, can improve the quality of smart card.
Use light source in Preset Time, the substrate of coating light-curing adhesive repeatedly to be irradiated, make substrateOn light-curing adhesive solidify, obtain middle material, obtain smart card according to middle material. Can specifically comprise:
Step a1: light source is adjusted into the first default power, use light source in the first Preset Time to coatingThe substrate of light-curing adhesive irradiates for the first time, and the light-curing adhesive first on substrate is solidified;
Step a2: light source is adjusted into the second default power, use light source in the second Preset Time to coatingThe substrate of light-curing adhesive irradiates for the second time, and the light-curing adhesive on substrate is solidified for the second time,Obtain middle material, obtain smart card according to middle material.
In the present embodiment, the first default power can be 10w/cm2-10000w/cm2, the second default power canThink 10w/cm2-10000w/cm2; The first default power and the second default power can identical also can be different.The first Preset Time and the second Preset Time sum are less than Preset Time.
Alternatively, can use light source in Preset Time substrate one-sided to coating light-curing adhesive orPerson is many, and side is irradiated, and the light-curing adhesive on substrate is solidified, and obtains middle material, obtains intelligence according to middle materialCan card. Like this, can increase irradiation area, make the light-curing adhesive on substrate can obtain enough energyLight be cured, simultaneously can also shorten the curing time.
In the present embodiment, it can be certainly that the substrate of coating light-curing adhesive is irradiated to used light sourceSo light source or artificial light sources, can be that unidirectional light source can be also multidirectional light source.
It should be noted that, this step can be specially: use light source in Preset Time to being fixed on toolOn the substrate of coating light-curing adhesive irradiate, in light-curing adhesive on substrate being solidified obtainMaterial, obtains smart card according to middle material. Alternatively, the raw material of tool are transparent material, preferably, controlTool is transparent.
After substrate being carried out to photocuring in step 105, can also comprise: remove the overlay film on substrate.
Particularly, can use membrane removal instrument to remove the overlay film on substrate, can also manually remove on substrateOverlay film. In the present embodiment, remove overlay film on substrate and can reduce the thickness of smart card.
In step 105, in basis, material obtains smart card, specifically comprises: on substrate, paste printed layers, obtainSmart card.
Particularly, adopt the method for stickup and/or lamination on substrate, to paste printed layers, obtain smart card.
Printed layers specifically comprises: the first printed layers and/or the second printed layers. In the present embodiment, the first printed layersSpecifically comprise: the first printing pattern layer, the first printing bed of material and the first printing protective layer; The first printing bed of materialBetween substrate and the first printing pattern layer, the first printing pattern layer is positioned at the first printing bed of material and first and printsBetween brush protective layer.
In the present embodiment, the second printed layers specifically comprises: the second printing pattern layer and the second printing bed of material, theTwo printing pattern layers are between the second printing bed of material and substrate; The second printing bed of material is transparent.
In the present embodiment, the first printing pattern layer is the figure layer with printed patterns, and the first printing bed of material is for usingIn the bed of material of the printed patterns of undertaking the printing of, the first printing protective layer is the bed of material for the protection of the first printing pattern layer.Wherein, the first printing bed of material can be transparent can be also opaque, the first printing protective layer can beAll transparent or the part corresponding with the printed patterns of the first printing pattern layer be transparent.
In the present embodiment, the second printing pattern layer is the figure layer with printed patterns, and the second printing bed of material is for usingIn the bed of material of the printed patterns of undertaking the printing of. In the present embodiment, the second printing bed of material can be the also passable of all transparentTo be transparent with part corresponding to the printed patterns of the second printing pattern layer.
In the present embodiment, the sheet that the suitable employing synthetic resin of printed layers pasting on the surface of substrate is madeShaped material, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.
In production technology of the present invention, can, in conjunction with multiple active and/or passive electronic building brick, comprise: intelligenceThe core of the card sheet, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc.
The manufacture method of the smart card that the present embodiment provides is carried out photocuring to the substrate of coating light-curing adhesiveProcess, shortened the curing time of substrate of coating light-curing adhesive, the life that has improved greatly smart cardProduce efficiency. And the curing receipts of the smart card that the manufacture method of the smart card providing according to the present embodiment producesShrinkage is low, has excellent pliability and impact resistance, has good weatherability and good electricity simultaneouslyGas performance.
Embodiment 2
The present embodiment provides a kind of manufacture method of smart card, as shown in Figure 2, comprising:
Step 201: provide tool slotted substrate;
Particularly, according to the structure of interior mold insert, adopt die-cut, vexed cut or milling at the bottom of etc. technique, what provideOn substrate, form the fluting that can fill interior mold insert.
In the present embodiment, the substrate J01 providing can be as shown in Figure 3, the slotted substrate J01 of tool providingCan be as shown in Figure 4.
In the present embodiment, the transparent material of the sheet type that the suitable employing synthetic resin of substrate J01 is made, its former materialMaterial can be at least one in PVC, PC, PETG, PET or ABSPVC resin. Preferably, substrateJ01 is transparent. The J01 of substrate described in the present embodiment is transparent being specially: substrate J01 can be wholeTransparent or part is transparent.
In the present embodiment, interior mold insert can comprise mutual circuit module, and mutual circuit module is for having man-machine friendshipThe circuit module of function mutually. Mutual circuit module, can comprise key-press module and/or display module etc. Interior edgePart can also comprise nonreciprocal circuit module. Nonreciprocal circuit module is the circuit without human-computer interaction functionModule. Nonreciprocal circuit module can comprise power module and control module etc. The mutual circuit mould of interior mold insertThe height of piece and nonreciprocal circuit module can be identical or different.
The structure chart of a kind of interior mold insert R01 is provided in the present embodiment, as shown in Figure 5, comprise key-press module,Display module, power module and control module.
Step 202: interior mold insert is filled in the fluting of substrate, applies photocuring on the surface at fluting placeBinding agent, and light-curing adhesive is smoothed.
Particularly, can be, but not limited to the concrete technique that adopts stickup and/or lamination, interior mold insert R01 is filledIn the fluting of substrate J01; By automatic coating equipment if automatic dispensing machine is by equal light-curing adhesive U01Be coated on the slotted surface of tool of substrate J01 even equidistant strip; Adopt the photocuring of cylinder to coatingBonding agent U01 smooths processing. In the present embodiment, also provide a kind of base that is filled with interior mold insert R01The profile of plate J01, as shown in Figure 6.
In the present embodiment, light-curing adhesive U01 specifically comprises light trigger and photo-curing material, wherein,Photo-curing material can be epoxy resin, thermoplastic polyurethane or acrylate etc. Preferably, photocuring is stickyConnecing agent can be ultraviolet light bonding agent. Ultraviolet light bonding agent comprises acrylate and light trigger.
Step 203: paste overlay film on the substrate of coating light-curing adhesive;
Particularly, coating light-curing adhesive substrate on paste overlay film, paste in overlay film process and needAdopt cylinder, ensure that overlay film M01 used can progressively contact with the substrate J01 that is filled with interior mold insert R01,Avoid producing a large amount of bubbles in the time pasting overlay film. In the present embodiment, paste the cuing open of substrate J01 of overlay film M01Face figure as shown in Figure 7.
In the present embodiment, the transparent material of the sheet type that the suitable employing synthetic resin of overlay film M01 is made, it is formerMaterial can be at least one in PVC, PC, PETG, PET or ABSPVC resin. Alternatively, coverThe raw material of film M01 can be all that the raw material in transparent material or the region corresponding with interior mold insert areTransparent material. Preferably, overlay film M01 is hyaline membrane. In this enforcement, in the time that overlay film M01 is hyaline membrane,Overlay film M01 can be all transparent or the region corresponding with interior mold insert R01 be transparent.
Step 204: the light-curing adhesive on compacting substrate;
Particularly, the substrate J01 that pastes overlay film M01 is placed on laminating machine or on tool and carry out compacting placeReason, the light-curing adhesive U01 on compacting substrate J01.
Step 205: the substrate to coating light-curing adhesive carries out photocuring, obtains middle material, obtains according to middle materialTo smart card.
Particularly, use light source in Preset Time, the substrate J01 of coating light-curing adhesive U01 to be carried outIrradiate, the light-curing adhesive U01 on substrate J01 is solidified, obtain middle material, obtain intelligence according to middle materialCard. Wherein, middle material specifically comprises: substrate and interior mold insert, also have photocuring sticky between substrate and interior mold insertConnect agent. It should be noted that, middle material can also comprise overlay film. It should be noted that, in the present embodiment, middle materialDo not comprise printed layers.
In the present embodiment, in the time that light-curing adhesive U01 is ultraviolet light bonding agent, can uses and there is ultravioletThe ultraviolet light polymerization equipment of light modulation carries out photocuring to the substrate of coating ultraviolet light bonding agent and obtains in Preset TimeTo middle material, and obtain smart card according to middle material.
Wherein, Preset Time can be no more than 120 seconds. Ultraviolet lamp can be mercury lamp, Halogen lamp LED or ultravioletPhotosemiconductor lamp etc. Mercury lamp comprises low pressure mercury lamp, medium pressure mercury lamp, high-pressure sodium lamp and ultrahigh pressure mercury lamp; UltravioletPhotosemiconductor lamp comprises ultraviolet leds, UV-light luminous Organic Light Emitting Diode and scattering UV-light luminous halfConductor laser etc.
Preferably, ultraviolet lamp is high-pressure sodium lamp. Alternatively, ultraviolet light polymerization equipment can be portable patternUltraviolet light polymerization equipment, desktop casing pattern ultraviolet light polymerization equipment, can hang pattern ultraviolet light polymerization equipmentWith conveying type ultraviolet light polymerization equipment etc. Preferably, ultraviolet light polymerization equipment is that conveying type ultraviolet light polymerization is establishedStandby. Correspondingly, step 205 specifically comprises:
First,, when opening after the power supply of conveying type ultraviolet light polymerization equipment, is set for default the time of photocuringTime, the power of adjusting the high-pressure sodium lamp L01 of conveying type ultraviolet light polymerization equipment in Fig. 8 is default power;Then, the substrate J01 of coating ultraviolet light bonding agent is positioned over to tool Z01 in Fig. 8 and above, will applies ultravioletThe substrate J01 of light bonding agent is fixed on tool Z01; Then, tool Z01 is positioned over to conveying type ultravioletA side of the conveyer belt S01 of uv equipment, along conveyer belt, S01 is sent to opposite side, the process transmittingIn by the high-pressure sodium lamp L01 of conveying type ultraviolet light polymerization equipment, by high-pressure sodium lamp, L01 irradiates, and makes substrateUltraviolet light bonding agent on J01 solidifies and obtains middle material, obtains smart card according to middle material.
In the present embodiment, the wavelength of high-pressure sodium lamp is preset wavelength, and alternatively, preset wavelength is290nm-410nm; Preferably, preset wavelength is 365nm. The power of adjusting high-pressure sodium lamp is default power,Alternatively, default power is 10w/cm2-10000w/cm2. The high-pressure mercury light of conveying type ultraviolet light polymerization equipmentSource has upper light source and/or lower light source, can irradiate to the upper surface of substrate and/or lower surface this biographySend formula ultraviolet light polymerization equipment can also there is side-irradiation light source, can irradiate the side of substrate,The light that makes ultraviolet light bonding agent on substrate can obtain enough energy is cured. In the present embodiment,In conveying type ultraviolet light polymerization equipment, can comprise multiple high-pressure sodium lamps, be used for increasing irradiation area. Ultraviolet lightBonding agent can be taken out the substrate after photocuring after solidifying from tool. In the present embodiment, will apply purpleAfter being positioned on tool, the substrate of outer smooth bonding agent again by conveyer belt transmission, can avoid substrate because of in biographySend relative sliding on the conveyer belt of formula ultraviolet light polymerization equipment and produce scuffing, off normal, get stuck etc.
It should be noted that, can also use ultraviolet light polymerization equipment sticky to coating ultraviolet light in Preset TimeThe substrate that connects agent carries out repeatedly photocuring, obtains middle material, obtains smart card according to middle material. For example, use purpleOuter uv equipment carries out during twice photocuring obtain the substrate of coating ultraviolet light bonding agent in Preset TimeMaterial, obtains smart card according to middle material, and step 205 specifically comprises:
Step b1: the time that photocuring is set is the first Preset Time, adjusts conveying type ultraviolet light polymerization equipmentThe power of high-pressure sodium lamp be the first default power;
Step b2: by being fixed on the substrate of the coating ultraviolet light bonding agent on tool, be positioned over conveying type ultravioletOne side of the conveyer belt of uv equipment, is sent to opposite side along conveyer belt, passes through to pass in the process transmittingSend the high-pressure sodium lamp of formula ultraviolet light polymerization equipment, by high voltage mercury lamp radiation, make the ultraviolet light bonding agent on substrateSolidify for the first time;
Step b3: after the ultraviolet light bonding agent on substrate has solidified for the first time, is set the time of photocuringBe the second Preset Time, the power of adjusting the high-pressure sodium lamp of conveying type ultraviolet light polymerization equipment is the second default meritRate;
Step b4: by being fixed on the substrate of the coating ultraviolet light bonding agent on tool, be positioned over conveying type ultravioletOne side of the conveyer belt of uv equipment, is sent to opposite side along conveyer belt, passes through to pass in the process transmittingSend the high-pressure sodium lamp of formula ultraviolet light polymerization equipment, by high voltage mercury lamp radiation, make the ultraviolet light bonding agent on substrateSolidify for the second time, obtain middle material, obtain smart card according to middle material.
In the present embodiment, the first default power can be 10w/cm2-10000w/cm2, the second default power canThink 10w/cm2-10000w/cm2; The first default power and the second default power can identical also can be different.The first Preset Time and the second Preset Time sum are less than Preset Time.
After the substrate of coating light-curing adhesive being carried out to photocuring in step 205, can also comprise: removeRemove the overlay film on substrate.
Particularly, can use membrane removal instrument to remove the overlay film M01 on substrate J01, can also manually removeOverlay film M01 on substrate on J01. The substrate J01 removing after overlay film M01 can be as shown in Figure 6.
In step 205, in basis, expect that obtaining smart card specifically comprises: on substrate, paste printed layers, obtain intelligenceCan card.
In the present embodiment, the sheet that the suitable employing synthetic resin of printed layers pasting on the surface of substrate is madeShaped material, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.
Printed layers is specially the first printed layers and/or the second printed layers. In the present embodiment, the first printed layers is concreteComprise: the first printing pattern layer T01, the first printing bed of material Y01 and the first printing protective layer P01; First printsBrush material layer Y01 between substrate J01 and the first printing pattern layer T01, the first printing pattern layer T01 positionBetween the first printing bed of material Y01 and the first printing protective layer P01.
In the present embodiment, the second printed layers specifically comprises: the second printing pattern layer T02 and the second printing bed of materialY02, the second printing pattern layer T02 is between the second printing bed of material and substrate J01; The second printing bed of materialY02 is transparent.
In the present embodiment, the first printing pattern layer T01 is the figure layer with printed patterns, the first printing bed of materialY01 is the bed of material for the printed patterns of undertaking the printing of, and the first printing protective layer P01 is for the protection of the first dimensional printed chartThe bed of material of case layer. Wherein, the first printing bed of material Y01 can be transparent can be also opaque, firstPrinting protective layer P01 can be all transparent or corresponding with the printed patterns of the first printing pattern layer T01Part be transparent.
In the present embodiment, the second printing pattern layer T02 is the figure layer with printed patterns, the second printing bed of materialY02 is the bed of material for the printed patterns of undertaking the printing of. In the present embodiment, the second printing bed of material Y02 can be wholeTransparent can be is also transparent with part corresponding to the printed patterns of the second printing pattern layer T02.
The profile of the smart card obtaining through above-mentioned technique is provided in the present embodiment, can be, but not limited to asShown in Fig. 9 or Figure 10 or Figure 11 or Figure 12.
It should be noted that, in the present embodiment, the upper surface of substrate can be covered with respectively on upper and lower surfaceComprise the first printed layers of the first printing pattern layer, the first printing bed of material and the first printing protective layer or comprise theThe second printed layers of two printing pattern layers and the second printing bed of material, or on the upper and lower surface of the upper surface of substrateAll be covered with the first printed layers that comprises the first printing pattern layer, the first printing bed of material and the first printing protective layer;Or on the upper and lower surface of the upper surface of substrate, be all covered with and comprise the second printing pattern layer and the second printing bed of materialThe second printed layers. Correspondingly, in the time also comprising overlay film on substrate, overlay film is positioned at the first printing bed of material and baseBetween plate or between the second printing pattern layer and substrate.
In the present embodiment, the sheet that the suitable employing synthetic resin of printed layers pasting on the surface of substrate is madeShaped material, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.
In production technology of the present invention, can, in conjunction with multiple active and/or passive electronic building brick, comprise: intelligenceThe core of the card sheet, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc.
The manufacture method of the smart card that the present embodiment provides is carried out photocuring to the substrate of coating light-curing adhesiveProcess, shortened the curing time of substrate of coating light-curing adhesive, the life that has improved greatly smart cardProduce efficiency. And, can specifically use ultraviolet light polymerization equipment bonding to coating ultraviolet light in Preset TimeThe substrate of agent carries out repeatedly photocuring, obtains middle material, obtains smart card according to middle material, wherein, uses ultravioletUv equipment carries out repeatedly photocuring to the substrate of coating ultraviolet light bonding agent and can avoid in Preset TimeIn the time that the substrate of coating light-curing adhesive is carried out to photocuring, the light-curing adhesive Yin Wendu liter on substrateHeight is too fast to be caused the position of interior mold insert in the fluting of substrate to be subjected to displacement and solidifies posterior photocuring bonding agent tableThe technical problems such as face out-of-flatness, can improve the quality of smart card.
Embodiment 3
The present embodiment provides a kind of manufacture method of smart card, as shown in figure 13, comprising:
Step 301: the substrate with vacancy section is provided;
Particularly, according to the structure of interior mold insert R02, adopt die-cut, vexed cut or milling at the bottom of etc. technique, carryingThe upper formation of substrate J02 of confession can be filled the vacancy section of interior mold insert.
Wherein, have the substrate J02 of vacancy section as shown in figure 14, interior mold insert R02 as shown in figure 15, wrapsDraw together key-press module, display module, power module and control module.
In the present embodiment, substrate J02 can be the plate-shaped material that adopts synthetic resin to make, and its raw material can beAt least one in PVC, PC, PETG, PET or ABSPVC resin. In the present embodiment, substrate J02Raw material can be light-permeable or not light-permeable or part be light-permeable. Preferably,Substrate J02 is transparent. The J02 of substrate described in the present embodiment is transparent being specially: substrate J02 can beAll transparent or part be transparent.
Step 302: interior mold insert is filled in the vacancy section of substrate, applies light on the surface at place, vacancy sectionCured binders, and light-curing adhesive is smoothed;
It should be noted that, before applying light-curing adhesive in step 302 on the surface at place, vacancy sectionAlso comprise: on substrate, paste overlay film.
Particularly, apply light-curing adhesive on the surface at place, vacancy section before, can adopt paste and/Or the mode of lamination pastes overlay film on substrate J02.
It should be noted that, can interior mold insert be filled in the vacancy section of substrate J02 to it in step 302Before on substrate J02, paste overlay film; Or after can be in the vacancy section that interior mold insert is filled into substrate J02,Apply light-curing adhesive on the surface at place, vacancy section before, on substrate J02, paste overlay film; Or inciting somebody to actionWhen interior mold insert is filled in the vacancy section of substrate J02, on substrate J02, paste overlay film.
Correspondingly, step 302 particularly, can be, but not limited to the concrete technique that adopts stickup and/or lamination,Interior mold insert R02 is filled in the vacancy section of substrate J02; By automatic coating equipment as automatic dispensing machine willLight-curing adhesive U01 is evenly equidistantly coated to the hollow out of the substrate J02 that is covered with overlay film M01 stripOn the surface in district; Adopt cylinder to smooth processing to the light-curing adhesive U01 of coating. In the present embodiment,Also provide the profile of a kind of substrate J02 that is filled with interior mold insert R02, as shown in figure 16.
In the present embodiment, light-curing adhesive U01 specifically comprises light trigger and photo-curing material, wherein,Photo-curing material can be epoxy resin, thermoplastic polyurethane or acrylate etc. Preferably, photocuring is stickyConnecing agent can be ultraviolet light bonding agent. Ultraviolet light bonding agent comprises acrylate and light trigger.
Step 303: paste overlay film on the substrate of coating light-curing adhesive;
Particularly, on the substrate of coating light-curing adhesive, need to adopt cylinder in pasting overlay film process, protectDemonstrate,proving overlay film M02 used can progressively contact with the substrate J02 that is filled with interior mold insert R02, avoids pasting and coversWhen film, can produce a large amount of bubbles. In this step, paste the profile of the substrate J02 after overlay film as shown in figure 17.
In the present embodiment, the light-permeable of the sheet type that the suitable employing synthetic resin of overlay film M01 and overlay film M02 is madeMaterial, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.Alternatively, the raw material of overlay film M01 and overlay film M02 can be all transparent material or with interior mold insert phaseThe raw material in corresponding region are transparent materials. Preferably, overlay film M01 and overlay film M02 are hyaline membrane.In this enforcement, in the time that overlay film M01 and overlay film M02 are hyaline membrane, overlay film M01 and overlay film M02 can beAll transparent or the region corresponding with interior mold insert R02 be transparent.
Step 304: the light-curing adhesive on compacting substrate;
Particularly, the substrate J02 that pastes overlay film is placed on laminating machine or on tool and carries out compaction treatment, pressLight-curing adhesive U01 on real substrate J02.
Step 305: the substrate to coating light-curing adhesive carries out photocuring, obtains middle material, obtains according to middle materialTo smart card.
In the present embodiment, the concrete operations of step 305 can be identical with the operation of step 205 in embodiment 2,In the present embodiment, repeat no more.
After the substrate of coating light-curing adhesive being carried out to photocuring in step 305, can also comprise: removeRemove the overlay film on substrate.
Particularly, can use membrane removal instrument to remove overlay film M01 and/or the overlay film M02 on substrate J02, alsoCan manually remove overlay film M01 and/or overlay film M02 on substrate J02. Remove the substrate after overlay film M02J02 can be as Figure 16; The substrate J02 removing after overlay film M01 and M02 can be as Figure 18; Remove overlay filmSubstrate J02 after M01 can be as shown in figure 19.
In step 305, in basis, expect that obtaining smart card specifically comprises: on substrate, paste printed layers, obtain intelligenceCan card.
In the present embodiment, the sheet that the suitable employing synthetic resin of printed layers pasting on the surface of substrate is madeShaped material, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.
Printed layers is specially the first printed layers and/or the second printed layers. In the present embodiment, the first printed layers is concreteComprise: the first printing pattern layer T01, the first printing bed of material Y01 and the first printing protective layer P01; First printsBrush material layer Y01 between substrate J01 and the first printing pattern layer T01, the first printing pattern layer T01 positionBetween the first printing bed of material Y01 and the first printing protective layer P01.
In the present embodiment, the second printed layers specifically comprises: the second printing pattern layer T02 and the second printing bed of materialY02, the second printing pattern layer T02 is between the second printing bed of material and substrate J01; The second printing bed of materialY02 is transparent.
In the present embodiment, the first printing pattern layer T01 is the figure layer with printed patterns, the first printing bed of materialY01 is the bed of material for the printed patterns of undertaking the printing of, and the first printing protective layer P01 is for the protection of the first dimensional printed chartThe bed of material of case layer. Wherein, the first printing bed of material Y01 can be transparent can be also opaque, firstPrinting protective layer P01 can be all transparent or direct with the printed patterns of the first printing pattern layer T01The part of contact is transparent.
In the present embodiment, the second printing pattern layer T02 is the figure layer with printed patterns, the second printing bed of materialY02 is the bed of material for the printed patterns of undertaking the printing of. In the present embodiment, the second printing bed of material Y02 can be wholeTransparent can be also that the part directly contacting with the printed patterns of the second printing pattern layer T02 is transparent.
The profile that the smart card obtaining through above-mentioned technique is also provided in the present embodiment, can be, but not limited toAs shown in Figure 20 or Figure 21 or Figure 22 or Figure 23.
It should be noted that, in the present embodiment, the upper surface of substrate can be covered with respectively on upper and lower surfaceComprise the first printed layers of the first printing pattern layer, the first printing bed of material and the first printing protective layer or comprise theThe second printed layers of two printing pattern layers and the second printing bed of material, or on the upper and lower surface of the upper surface of substrateAll be covered with the first printed layers that comprises the first printing pattern layer, the first printing bed of material and the first printing protective layer;Or on the upper and lower surface of the upper surface of substrate, be all covered with and comprise the second printing pattern layer and the second printing bed of materialThe second printed layers. Correspondingly, in the time also comprising overlay film on substrate, overlay film is positioned at the first printing bed of material and baseBetween plate or between the second printing pattern layer and substrate.
In the present embodiment, the sheet that the suitable employing synthetic resin of printed layers pasting on the surface of substrate is madeShaped material, its raw material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.
In production technology of the present invention, can, in conjunction with multiple active and/or passive electronic building brick, comprise: intelligenceThe core of the card sheet, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc.
The manufacture method of the smart card that the present embodiment provides is carried out photocuring to the substrate of coating light-curing adhesiveProcess, shortened the curing time of substrate of coating light-curing adhesive, the life that has improved greatly smart cardProduce efficiency. And, can specifically use ultraviolet light polymerization equipment bonding to coating ultraviolet light in Preset TimeThe substrate of agent carries out repeatedly photocuring, obtains middle material, obtains smart card according to middle material, wherein, uses ultravioletUv equipment carries out repeatedly photocuring to the substrate of coating ultraviolet light bonding agent and can avoid in Preset TimeIn the time that the substrate of coating light-curing adhesive is carried out to photocuring, the light-curing adhesive Yin Wendu liter on substrateHeight is too fast to be caused the position of interior mold insert in the vacancy section of substrate to be subjected to displacement and solidifies posterior photocuring bonding agentThe technical problems such as surface irregularity, can improve the quality of smart card.
The above, be only preferably detailed description of the invention of the present invention, but not office of protection scope of the present inventionBe limited to this, be anyly familiar with those skilled in the art in technical scope disclosed by the invention, can be easilyThe variation of expecting or replacement, within all should being encompassed in protection scope of the present invention. Therefore, protection of the present inventionScope should be as the criterion with the protection domain of claim.

Claims (38)

1. a smart card, is characterized in that, comprising: substrate and paste the printed layers on described substrate;In described substrate, be filled with interior mold insert; In described substrate, be filled with light-curing adhesive.
2. smart card according to claim 1, is characterized in that, described light-curing adhesive is filled inBetween described substrate and described interior mold insert.
3. smart card according to claim 1, is characterized in that, described light-curing adhesive is speciallyUltraviolet light bonding agent or visible-light curing bonding agent or infrared light curing adhesive.
4. smart card according to claim 1, is characterized in that, has interior mold insert and fill out on described substrateFill district, described interior mold insert is filled in described interior mold insert fill area.
5. smart card according to claim 4, is characterized in that, described light-curing adhesive is filled inIn described interior mold insert fill area.
6. smart card according to claim 4, is characterized in that, described interior mold insert fill area is speciallyTrench structure or engraved structure;
In the time that described interior mold insert fill area is specially described trench structure, the raw material of described substrate are light-permeableMaterial;
In the time that described interior mold insert fill area is specially described engraved structure, the raw material of described substrate comprise can be saturatingLuminescent material and/or not transparent material.
7. smart card according to claim 1, is characterized in that, the raw material of described substrate are can be saturatingLuminescent material.
8. smart card according to claim 1, is characterized in that, described printed layers and described substrate itBetween also comprise overlay film.
9. smart card according to claim 1, is characterized in that, described printed layers comprises: the first printingPatterned layer, the first printing bed of material and the first printing protective layer; Described first printing the bed of material be positioned at described substrate andBetween described the first printing pattern layer, described the first printing pattern layer be positioned at described first printing the bed of material and described inBetween the first printing protective layer.
10. smart card according to claim 9, is characterized in that, described the first printing bed of material and instituteState and between substrate, also comprise overlay film.
11. smart cards according to claim 1, is characterized in that, described printed layers comprises: secondPrinting pattern layer and the second printing bed of material, described the second printing pattern layer is positioned at described the second printing bed of material and instituteState between substrate; The described second printing bed of material is transparent.
12. smart cards according to claim 11, is characterized in that, described the second printing pattern layer andBetween described substrate, also comprise overlay film.
Smart card described in 13. according to Claim 8 or 10 or 12, is characterized in that, described overlay filmRaw material are transparent material.
14. smart cards according to claim 13, is characterized in that, the raw material of described overlay film are wholeFor the raw material in transparent material or the region corresponding with described interior mold insert are transparent material.
15. smart cards according to claim 1, is characterized in that, described interior mold insert comprises alternatelyCircuit module.
16. smart cards according to claim 15, is characterized in that, described interior mold insert also comprises non-friendshipCircuit module mutually.
17. smart cards according to claim 16, is characterized in that, described mutual circuit module is concreteComprise: key-press module and/or display module; Described nonreciprocal circuit module specifically comprises: power module and controlMolding piece.
The manufacture method of 18. 1 kinds of smart cards, is characterized in that, comprising:
Step s1: the substrate with interior mold insert fill area is provided;
Step s2: interior mold insert is filled in the described interior mold insert fill area of described substrate, at described interior mold insertOn the surface at fill area place, apply light-curing adhesive;
Step s3: the described substrate that applies described light-curing adhesive is carried out to photocuring, obtain middle material, rootObtain smart card according to described middle material.
19. methods according to claim 18, is characterized in that, described interior mold insert fill area is speciallyTrench structure or engraved structure;
In the time that described interior mold insert fill area is specially described engraved structure, described in described interior mold insert fill area instituteSurface on also comprise before applying light-curing adhesive: overlay film on described substrate.
20. methods according to claim 19, is characterized in that, the raw material of described overlay film are can be saturatingLuminescent material.
21. methods according to claim 18, is characterized in that, described interior mold insert fill area is speciallyTrench structure or engraved structure;
In the time that described interior mold insert fill area is specially described trench structure, the raw material of described substrate are light-permeableMaterial;
In the time that described interior mold insert fill area is specially described engraved structure, the raw material of described substrate comprise can be saturatingLuminescent material and/or not transparent material.
22. according to the method described in claim 18 or 19, it is characterized in that, described step s2 is specially:After described interior mold insert being filled in the interior mold insert fill area of substrate, at described interior mold insert fill area placeThe described light-curing adhesive of coating on surface; Or apply institute on the surface at described interior mold insert fill area placeAfter stating light-curing adhesive, described interior mold insert is filled in the interior mold insert fill area of described substrate or willDescribed interior mold insert is filled in the described interior mold insert fill area of described substrate together with described light-curing adhesive.
23. according to the method described in claim 18 or 19, it is characterized in that, and after described step s2,Before described step s3, also comprise: on the described substrate of the described light-curing adhesive of coating, paste overlay film.
24. methods according to claim 23, is characterized in that, at the described light-curing adhesive of coatingDescribed substrate on the raw material of the described overlay film that pastes be transparent material.
25. methods according to claim 23, is characterized in that, described sticky to applying described photocuringThe described substrate that connects agent carries out also comprising after photocuring: remove the overlay film on described substrate.
26. according to the method described in claim 18 or 19, it is characterized in that described light-curing adhesiveBe specially ultraviolet light bonding agent or visible-light curing bonding agent or infrared light curing adhesive.
27. according to the method described in claim 18 or 19, it is characterized in that the raw material of described substrateFor transparent material.
28. according to the method described in claim 18 or 19, it is characterized in that, described step s3 is specially:Use light source in Preset Time, the described substrate that applies described light-curing adhesive to be irradiated, described in makingDescribed light-curing adhesive on substrate solidifies, and obtains middle material, obtains smart card according to described middle material.
29. methods according to claim 28, is characterized in that, described Preset Time is no more than 120Second.
30. methods according to claim 28, is characterized in that, described light source is specially unidirectional light sourceOr multidirectional light source.
31. methods according to claim 28, is characterized in that, described use light source is at Preset TimeIn irradiates and is specially applying the described substrate of described light-curing adhesive: use described light source presettingIn time, to applying, the described substrate of described light-curing adhesive carries out once or repeatedly irradiation.
32. methods according to claim 31, is characterized in that, use described light source at Preset TimeIn when applying the described substrate of described light-curing adhesive and repeatedly irradiate, each institute using of irradiatingThe power of stating light source is identical or different.
33. methods according to claim 28, is characterized in that, described use light source is at Preset TimeIn irradiates and is specially applying the described substrate of described light-curing adhesive: use described light source presettingOne-sided or many sides of the described substrate of the described light-curing adhesive of inherent coating of time are irradiated.
34. methods according to claim 28, is characterized in that, described light-curing adhesive is ultravioletLight bonding agent; Described light source is ultraviolet lamp.
35. according to the method described in claim 18 or 19, it is characterized in that, described according to described middle materialObtain smart card, specifically comprise: on described substrate, paste printed layers, obtain smart card.
36. according to the method described in claim 18 or 19, it is characterized in that, described interior mold insert comprises friendshipCircuit module and nonreciprocal circuit module mutually; Described mutual circuit module specifically comprises: key-press module and/or aobviousShow module; Described nonreciprocal circuit module specifically comprises: power module and control module.
37. methods according to claim 28, is characterized in that, described use light source is at Preset TimeIn the described substrate that applies described light-curing adhesive is irradiated, make the described photocuring on described substrateBonding agent solidifies, and obtains middle material, obtains smart card specifically comprise according to described middle material:
Step a1: light source is adjusted into the first default power, use light source in the first Preset Time to coatingThe described substrate of described light-curing adhesive irradiates for the first time, makes the described photocuring on described substrate stickyConnecing agent first solidifies;
Step a2: light source is adjusted into the second default power, use light source in the second Preset Time to coatingThe described substrate of described light-curing adhesive irradiates for the second time, makes the described photocuring on described substrate stickyConnect agent and solidify for the second time, obtain middle material, obtain smart card according to middle material.
38. according to the method described in claim 18 or 19, it is characterized in that, described step s3 is specially:Use light source in Preset Time, the described substrate that is fixed on the described light-curing adhesive of coating on tool to be enteredRow irradiates, and the described light-curing adhesive on described substrate is solidified, and obtains middle material, obtains intelligence according to middle materialCan card.
CN201510947396.5A 2015-12-17 2015-12-17 Smart card and manufacturing method thereof Pending CN105608485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510947396.5A CN105608485A (en) 2015-12-17 2015-12-17 Smart card and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510947396.5A CN105608485A (en) 2015-12-17 2015-12-17 Smart card and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN105608485A true CN105608485A (en) 2016-05-25

Family

ID=55988409

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510947396.5A Pending CN105608485A (en) 2015-12-17 2015-12-17 Smart card and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN105608485A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108764429A (en) * 2018-03-07 2018-11-06 厦门信达光电物联科技研究院有限公司 A kind of RFID electronic label and preparation method thereof of frangible anti-transfer
CN109558929A (en) * 2018-11-22 2019-04-02 上海东方磁卡信息股份有限公司 The processing technology of visual intelligent card based on domestic mechanism of communicating with code telegram

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1159037A (en) * 1997-08-08 1999-03-02 Tokin Corp Ic card
CN1229495A (en) * 1996-08-05 1999-09-22 格姆普拉斯有限公司 Improvement to method for making smart cards and resulting cards
TW201515828A (en) * 2013-08-21 2015-05-01 X Card Holdings Llc Apparatus and method for making information carrying cards through radiation curing, and resulting products
CN104781832A (en) * 2012-09-04 2015-07-15 X卡控股有限公司 Information carrying card comprising crosslinked polymer composition, and method of making the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1229495A (en) * 1996-08-05 1999-09-22 格姆普拉斯有限公司 Improvement to method for making smart cards and resulting cards
JPH1159037A (en) * 1997-08-08 1999-03-02 Tokin Corp Ic card
CN104781832A (en) * 2012-09-04 2015-07-15 X卡控股有限公司 Information carrying card comprising crosslinked polymer composition, and method of making the same
TW201515828A (en) * 2013-08-21 2015-05-01 X Card Holdings Llc Apparatus and method for making information carrying cards through radiation curing, and resulting products

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108764429A (en) * 2018-03-07 2018-11-06 厦门信达光电物联科技研究院有限公司 A kind of RFID electronic label and preparation method thereof of frangible anti-transfer
CN109558929A (en) * 2018-11-22 2019-04-02 上海东方磁卡信息股份有限公司 The processing technology of visual intelligent card based on domestic mechanism of communicating with code telegram

Similar Documents

Publication Publication Date Title
CN104175580B (en) Transfer printing equipment and manufacturing method of light guide film
CN101434155B (en) Method for forming texture pattern on plate
TWI472444B (en) Production method of three dimensional pattern and production device of three dimensional pattern
CN103317825B (en) UV makeup method of holographic dedicated plate
CN102501560A (en) Binding method for capacitive touch screen
JP2014233922A (en) Method of manufacturing laminate
CN105608485A (en) Smart card and manufacturing method thereof
US20210382202A1 (en) Optical Film
CN108667958A (en) A kind of preparation method of mobile phone faceplate frame porose area substratum transparent
CN203012669U (en) Touch screen
KR20140141815A (en) Cover surface for electronic device and treatment method thereof
CN111054596A (en) Gluing mold and UV glue coating method for electronic component
CN102744898A (en) UV (Ultraviolet) transfer printing process
JP2014117833A (en) Decoration film and method for manufacturing the same
CN104690955A (en) Method and device for manufacturing stereo grating
CN204487901U (en) A kind of can the wire drawing texture mould of filters ultra violet linear light
CN102830846A (en) Touch screen panel formed by attaching and manufacturing method thereof
CN114222460B (en) Method for preparing outer frame of electronic equipment
TWI495552B (en) Method of manufacturing transfer die
KR100905343B1 (en) Manufacturing Method of Molding Key Pad Assembly
CN105198238A (en) Glass attaching method
CN109866410A (en) The preparation method and its molding machine of arc electrochromism piece
KR101621458B1 (en) manufacturing method of master for touch screen panel and substrate for touch screen panel thereby
CN108427909A (en) A kind of production method of patterning fingerprint module
CN104859272B (en) Method for bonding of touch screen and mask plate used by method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160525

RJ01 Rejection of invention patent application after publication