CN1229495A - Improvement to method for making smart cards and resulting cards - Google Patents

Abstract

An improvement to a method for making cards with an electronic module is disclosed. The method comprises the steps of providing a card body having a cavity, an electronic module shaped to fit said cavity, and at least one first adhesion means adherable to the card body and the module, depositing at least said first adhesion means in said cavity, inserting said module into the cavity in a substantially centred position, and pressing at least said first adhesion means between the card and the module. The method further comprises a step of providing a second adhesion means which is also deposited in the cavity. Said second adhesion means is capable of having sufficient tackiness to maintain the module in a centred position in the cavity, at least until said first adhesion means has been pressed. The cards produced by carrying out the method are also disclosed.

Description

The improvement of manufacture method of intelligent cards and thus obtained smart card

The present invention relates to a kind of improvement of the manufacture method of intelligent cards that constitutes by card body and electronic module, and with smart card that this method obtained.

In the conventional method, people are provided by a kind of card that has cavity body that provides, mainly contain the electronic module of contact region and contain the semi-conductor chip of integrated circuit,, electronic module is fixed on method in the above-mentioned cavity by bonding agent such as cyanoacrylate adhesive (cyanocrylate).Usually, bonding process comprises goes up glue process in advance, and module is inserted the cavity operation and the operation of exerting pressure in the given time.

This method is commonly referred to as the method for board plug type in the automatic industrial field, actual enforcement needs different device to have the operation of obvious rhythm, transport another device to as blocking from a device with high rhythm, therefore a per hour thousands of card are the cradles that influences the variety of issue of end product quality approximately.

The special confirmation of inventor often has a large amount of defectives according to the bonding card that obtains of above-mentioned operation.

In these defectives, people will lead the module of discovery in cavity and be difficult for defective placed in the middle.In fact, although module is accurately inserted in the cavity, the inventor finds the module off-center after bonding, that is, and not on initial position of inserting.The form of expression of this confirmed disalignment or fine rotation, or translation, or fine rotation and translation appear in cavity simultaneously, or shift out cavity and the contact region imbricate that blocks on the surface in extraordinary circumstances.

The inventor finds that off-centring is by causing from device power that card produces to the process that another device moves at it, particularly by insert device begin and snap into the unexpected acceleration that produces respectively on the pressure apparatus or deceleration power caused.

Off-centring is to have the unnecessary stress of slight introversion to cause by the module that can make that has on the module equally.In this case, module is come out in cavity in will or slowing down in each acceleration.

People find that also the module and card body does not have fine bonding shortcoming.In this case, card can not reach bending/distortion physical strength standard, or (ISO, AFNOR) pull-out strength of act.std defined.

Therefore, need when not reducing production efficiency, address these problems.

The objective of the invention is to propose a kind of improvement that blocks module method of attaching in the body, but its industrial automation production, and efficient is very high, can not produce above-mentioned defective,, module is inserted the center that is, again can be bonding good.

For this reason, the present invention is a kind of electronic module manufacture method of intelligent cards, this method is to provide a kind of card body that has cavity, a kind of volume and the corresponding to electronic module of above-mentioned cavity, the alite paste of bonding card body of at least a energy and module, and comprise some processing steps, according to these steps, put into above-mentioned cavity to the above-mentioned first kind of alite paste of major general, what above-mentioned module was inserted cavity obviously is the position at center, and between card and module above-mentioned first kind of alite paste is exerted pressure.

The characteristics of this method are, also has a step, the alite paste that provides second kind to put into cavity equally is provided, above-mentioned second kind of alite paste can have viscous characteristics, is enough to make module in cavity to be in the center and remains at least above-mentioned first kind of alite paste exerted pressure.

Thanks to having used have adhering performance second kind of alite paste of (bonding and high viscosity), card can bear any acceleration or the deceleration in it is made, and off-centring can not occur.

In addition, also can reduce the time that is used for inserting mould in a large number, therefore improve production efficiency.

The present invention equally can preferred first kind of alite paste, and it is used under top condition, so that anti-better module pulling force and bending/twisting stress.

According to effective enforcement of this method, people select second kind of alite paste from the material that is applicable to stretching resistance and/or bending/twisting stress after processing, and use above-mentioned material, so that it resists these power generation effects.

After second kind of alite paste suitably handled, it had increased the supplementary function of stretching resistance and/or bending/twisting stress (existing standard regulation) with first kind of alite paste.

According to preferred forms, people use a kind of photoactivation epoxy resin.This resin can bear ultraviolet ray irradiation before the module insertion, wishes that as people its long-term mechanical property and integral body that card body and module are constituted of keeping has mechanical property.

Because adopted this mode, people can make second kind of alite paste activation most effectively, the operating conditions around not being subjected to influences.In addition, but the time shutter and the intensity of people's regulated at will ultraviolet ray irradiation resin, and the control resin keeps the polyreaction activation always.

According to another characteristics, can make module keep good result, resin to have the viscosity of 50 000m.p/ seconds.

The characteristics of good result can be arranged and be convenient to implement this method according to another, 0.003 gram drop be put into the cavity center place and resin is placed ultraviolet ray down, so that make its opening time be about 60 seconds.

According to second mode that this method is implemented, people use and a kind ofly use the cyanoacrylate adhesive gel under the condition of atmospheric humidity that is fit to insert mould in advance and temperature.

The use of this gel has very big benefit, because can use gel under economic condition.

Use the gel module to keep the characteristics of good result according to another, drop is put into cavity center, atmospheric humidity and temperature conditions can make the opening time be about 60 seconds.

According to another characteristics of this method, according to first or second embodiment, this method can be to use cyanoacrylate adhesive type gel as first alite paste.

This bonding agent has easy to use, economic characteristics.

First alite paste can be placed the quantity of 50% and 100% adhesive surface that can cover above-mentioned cavity surface, after exerting pressure, between 60% and 75%, at least is four lateral points in the place of contact plate in 18-24 ℃ of temperature and atmospheric humidity.

But the suitability for industrialized production of the few defective of this operating conditions high-level efficiency, first alite paste is a cyanoacrylate adhesive.

According to another best characteristics of this method, before inserting mould, cyanoacrylate adhesive is put into.

Like this, people obtain the bonding optimum efficiency of cyanoacrylate adhesive and module.

According to another characteristics of this method, people preferably select quite pure cyanoacrylate adhesive, and the breakdown time of cyanoacrylate adhesive is about 60 seconds under the aforesaid operations condition.

This bonding agent can guarantee bonding well, because its polymerization is quite slow.

The present invention relates to the electronic module smart card that obtains according to said method equally.

The explanation of two kinds of main modes implementing with an example below reading can more clearly understand other characteristics of the present invention and benefit.It is illustrated with reference to the accompanying drawings:

Fig. 1 is the card body that uses in the methods of the invention;

Fig. 2 is the sectional view that is used for the electronic module of the inventive method;

Fig. 3 is an electronic module carrier-pellet vertical view;

Fig. 4 is the synoptic diagram of module and card assembly.

Fig. 5 is the cavity schematic top plan view that has the bonding agent set-point;

Fig. 6 is an alite paste adhesive surface synoptic diagram on the back cavity of exerting pressure;

Fig. 7 to Figure 12 is the different step of this method, or the different operating device of installing;

Figure 13 is a pressurizing unit;

Figure 14 is that two-forty is implemented this method equipment example vertical view;

Figure 15 is the ethanol damping device.

According to first kind of embodiment among Fig. 5 to Figure 12, the inventive method is described now.

The inventive method need provide the card body and the embodiment electronic module consistent with above-mentioned cavity that has cavity.

Introduced the example of the smart card body 1 that is used for this method among Fig. 1.It comprises one by the cavity of casting or processing and the card body obtains simultaneously.

This card body is by ISO, the AFNOR standard production, and have predetermined.

Cavity can be put into module.So it can have different shapes according to module.It is to be made of two grooves in this example, first opening 3, and shape is generally rectangle, leads to the front surface of card, and second opening 4 is generally circle, and is darker than first rectangle that is in the center, leads to first bottom.Second opening diameter is 8.2mm, high 0.6mm (Fig. 4).

The material that uses, normally plastics will depend on purposes.For example telephony intelligence card or phonecard all are ABS (acrylonitrile butadiene-styrene).Also PVC (Polyvinylchloride), or polycarbonate in the form of sheets (PC) or PC/ABS or PC/PVC.

In example, people use the cavity of a kind of ISO and ABS card body material.

Electronic module 5 (Fig. 2 and Fig. 3) generally comprises a kind of insulation synthetic material carrier film 6a, and the contact plate 7 of conductive material, silicon chip 8 contain an integrated circuit, the line 9 of silicon chip and contact plate, the resin protective layer 10 of covering silicon chip and line.

Usually protective seam is a thermosetting epoxy resin, forms a kind of bossing that irregular size, especially variable thickness are arranged.Lug boss can be cut flat according to the accurate thickness of a side with milling, to be convenient to card body inner module bonding process.The present invention preferably directly uses bossing, and need not milling.

Module (Fig. 2 and Fig. 3) can have multiple shape, and for example " LFCC " type (lead Frame contrecoll é) has the polyimide carrier film, or a kind of type that contains the epoxy resin carrier film.

In example, module is " LFCC " type, so have a polyimide lower surface.It is the module that provides by the continuous film 6b (Fig. 3) on reel.

The cavity of card is used for receiver module as shown in Figure 4.For this reason, groove 4 is consistent with bossing 10, and groove 3 is consistent with the contact plate 5 that has the required gap of assembling (J).This gap causes single rotation of the module in the clamp or single translation in same plate, can with the naked eye notice, constitutes the defective of off-centring thus.

This method is to provide the first kind of alite paste that is suitable for bonding card body and module at least equally.Normally after activation or processing, carry out bonding.When being the electronic module card, alite paste will guarantee to have the effect of the stretching resistance and/or the bending/twisting stress of the standard that above relates to.

First kind of alite paste can have many kinds.For example it can be based on the liquid cyanoacrylate adhesive that is point-like or wire placement.Also a kind of heat bonding or thermoplastic and the material that is the film like placement.It was the ingredient of card body it can replenish the card body or resemble in French Patent (FRP) FR2579799.It can be placed on card body or the module.

In the example of narration, according to the best sketch that will be described below and describe in Fig. 5, people have used the cyanoacrylate adhesive of placing in the cavity.

According to this method, it comprises several steps, according to these steps, above-mentioned cyanoacrylate adhesive is put into cavity or be placed on the module, preferably put into cavity, with above-mentioned module insert cavity to the center, and above-mentioned first bonding agent of extruding between card and module at least.To describe these steps in detail by the embodiment among Fig. 7 to Figure 12.

The feature of the inventive method is, second kind of bonding agent that is to provide and be placed in the cavity also is provided, it can make module keep centering the position in cavity, and is compacted up to above-mentioned first bonding agent.

According to the present invention, spendable second kind of bonding agent contains the material with viscous characteristics.Stickum can be regarded as the jointing material of being not only plastic body thus, and it also has very high viscosity, and is as described below.This is bonding will to be no matter module runs into any power, can not come unglued up to compressing.This as an example material can be enumerated a lot, especially single synthetic epoxy resin, cyanoacrylate adhesive gel, thermosetting epoxy resin etc.These materials are about 190mP/s than the viscosity of often using the viscosity of cyanoacrylate adhesive is higher.People wish the viscosity height of this material than above-mentioned cyanoacrylate adhesive, so the viscosity of this material is than high ten times of the viscosity of above-mentioned cyanoacrylate adhesive.Preferably use a kind of viscosity to be higher than the material of 100 coefficients.

In example, people have used the single synthetic epoxy resin of photoactivationization (although its not activation in this example), because the single synthetic of it is effective and ABS and polyimide module film is bonding preferably.In example,, this resin is put into cavity according to the step of Fig. 7 explanation.

The viscosity of this resin was 50 000P/ seconds, and when module was born the acceleration of quickening to equal to exist in two-forty industry of the present invention is installed, it can make module keep the center well, and this example is described below.

The total measurement (volume) of cohesive material will depend on the power that the position of putting (available appearance in cavity), its bond property, its viscosity and it will be born especially.

When it was placed on the point, its general assembly (TW) can be 0.002 and 0.004 gram.This capacity also can be divided into four points for example to be placed when resin and is placed on from the side in first groove, just four points of 0.001 gram.

In example, the viscosity that causes module to maintain a good state is the resin of 50 000mP/s, is placed into cavity center with the drop of 0.003 gram weight.This value with make consistently, for example adopt the device that will be described below, in this production run, will block from a station by the contact that impacts from rear side and to transport to another station, this can cause the height acceleration.

Can infer that under not too violent working condition, it is less promptly to block displacing force, can reduce the amount of resin or/and reduce viscosity.

Be used for example as the cyanoacrylate adhesive gel of first bonding agent according to the mode of following explanation according to gel point, be placed in the position of contact plate with 4 gel side point forms of 0.001 gram.

In the known schedule time, the professional can use various laying methods with cyanoacrylate adhesive of some.It also is various that the branch of resin is put device.The resin that uses is preferably singly synthetic and thixotroping (tixtropique) type, so that it is consistent with the high rhythm of producing that branch is put.

Select a kind ofly suitablely need to keep high rhythm to divide the cohesive material of the commercial plant of putting will be different fast, in view of the above, put a kind of material, need to divide more and more viscosity and bonding of the material put in order to divide more and more easily and fast with precedent.Although thanks to thixotropic nature and its very thickness and adhesion of resin, people can be easy to and divide soon put on the contrary with precedent, especially No. 4597 epoxy resin of " Delo " company.

As for the cyanoacrylate adhesive under the environmental operations condition, confirmed that too low temperature and atmospheric humidity make the bonding agent polymerization very slow, and therefore caused the not bonding and off-center (owing to surface contamination appears in polymerization: " blooming ") of module.On the contrary, confirmed that temperature and atmospheric humidity are too high, made the bonding agent rapid polymerization, caused on the one hand not bondingly equally, had again on the other hand and make dirty and be blocked in the deficiency that the bonding agent branch is put used needle tubing in the method.In addition, confirmed equally that the too low meeting of atmospheric humidity causes static.The defective of static is the powerful messy cyanoacrylate adhesive that scatters and produce shortcoming that attracts.

When between 18 ℃ to the 24 ℃ temperature and under 60% and 75% the humidity, when processing or enforcement cyanoacrylate adhesive, no matter be that stretching resistance or counter-bending/twisting stress all have the favorable mechanical performance.

Effective and efficient manner is, according to the present invention, thanks to the effect of the direct stuck-module of second bonding agent, people can select a kind of purer cyanoacrylate adhesive that tells in the relatively long time, so that have the optimum adhesion quality such as being higher than in time of 60 seconds.

In this example, bonding agent has about 60 seconds opening time under above-mentioned environmental operations condition.Opening time is its time that during this period of time can also use the bonding a kind of object of bonding agent.This time is long more, and its polymerization is just good more.This polymerization can finish after the operation of exerting pressure if necessary.

In the example that adopts this method, people have used the best sketch of describing among a kind of Fig. 5 and expression has 11a to 15a to put of cavity.It comprises a so-called central point 11a and four so-called side point 12a to 15a, and 11a is in the round shape groove 3, and 12a to 15a then is in the contact plate groove 4 and in four angles of this groove.

Four side points overlayable adhesive surface after extruding is the 50-100% of above-mentioned cavity surface (Fig. 6).Push so that obtain the cyanoacrylate adhesive pad that thickness is about 0.02mm.Each side glue point shows as " U " type semicircle surface 12c to 15c, and from obviously expand near the right angle of being demarcated by first groove near second groove, 4 limits radially, " U " type bottom faces is to the bight.Therefore, the module that people obtain is bonding, is enough to the intensity of anti-above-mentioned standard code.

According to a kind of preferred mode of operation of the present invention, people put into cyanoacrylate adhesive after putting into first kind of bonding agent again before the pressing steps.Like this, the potentiality that bonding agent can keep polymerization and adhere to when module is inserted into and compress.

In the example of implementing, can represent diverse ways step and the equipment continued operation processing stations that will be described below equally from Fig. 7 to Figure 12.

Go up and according to first step a), at first resin drop 11b is put into the cavity center place at the first operation position platform (Fig. 7), will block handover next operator's console (Fig. 8) then by divider 16.

On this operation position platform and according to the second step b,,, will block and transfer so-called insertion operator's console (Figure 10) four bights that so-called four side cyanoacrylate adhesive drop 12b to 14b put into top groove by divider 17 and 18.

Inserting on the platform of operation position and according to method d) another step, with inserting device 19 electronic module 5 is inserted, in this example, the insertion time is 300 milliseconds (ms), but also can shorten again, card is sent to extrusion position platform (Figure 11) or (according to advantageous variant is: Figure 12).

On squeeze station (Figure 11), according to method e) another step, by pressure apparatus 20a, in 22 seconds, exert pressure to adhesive with the power of about 34daN.

According to preferred another pressure mode and according to step F, by pressure apparatus 20b, only to exert pressure to around the contact plate, the benefit of doing like this is only bonding agent suitably to be exerted pressure, and can not cause semiconductor circle shape thing or the hurtful mechanical stress of line.

In fact, as top by the agency of, the thickness that protrudes coating can have slight variation.In extraordinary circumstances, the effect that cavity bottom can play limited block is partly pressed close in convex protrusion, and produces a module centers point a little more than contact plate thus, is in same level with the card surface.This structure that often runs in commercial production is forbidden having the bonding essential pressurization of better quality.

The example of spendable pressure device 20b will be described among Figure 13 below.

(not shown) in next procedure will be blocked extraction or be carried out pre-service, and the plug-in card operation finishes like this.

According to a feature of this method, people use second kind of binder substance, so that it produces the good result of tension and/or counter-bending/twisting stress.

Although resin need not to place cruelly ultraviolet radiation, just have good module fixation, people wish it is solidified, and are not in order to prevent the microfracture of (12c to 15c among Fig. 6) between two contact plates or adhesive surface between the film chamber.When solidifying, the bonding agent with fixed attention of some stickums such as above-mentioned resin or cyanoacrylate has the mechanical property of good tension and/or counter-bending/twisting stress.

When using epoxy resin, according to first embodiment, this method comprises a replenish step, betwixt, above-mentioned resin is placed under the ultraviolet radiation, accelerates polymerization, before this step is inserted prior to module.

In example, preferably only after placing step, above-mentioned drop of resin implements this step as shown in Figure 9.

The intensity and the time of exposure are adjustable, so that make the opening time of resin be higher than 60 seconds, this time is consistent with the opening time of the cyanoacrylate adhesive of use.In pressing above-mentioned rhythm commercial Application, the time shutter was 0.5 to 1 second.Its intensity can also can be adjusted by the distance that bulb and resin separate by the power adjustments of bulb.

The irradiation of resin alternately can be carried out in the same time that the cyanoacrylate adhesive drop is placed the latest.

People can understand like this, and the activation of pressing steps first and second bonding agents reduces interval time as far as possible, only have an operator's console will push with activation and separate, and it is bonding to carry out high-quality like this, all long because extrusion time was compared with the opening time of every kind of bonding agent.

According to the second way of implementing, the different step of the inventive method is described now.

In second kind of embodiment, use the cyanoacrylate adhesive gel to replace epoxy resin.

This gel is when bear when causing off-centered power, also have the performance that can make module fixing in manufacture process.

Use same quantity, and the identical placement step of using according to epoxy resin, different is the replenish step that does not have activated adhesive.In fact, the activation of gel especially all is to carry out under identical temperature and atmospheric humidity as cyanoacrylate adhesive.

The activation that it is believed that second bonding agent is easier to implement, also less expensive.Do not use the ultraviolet radiation generating means in fact, because this device is very expensive.

Other known activator of professional can use equally.For example, can pass through ethanol dampening processing module film, so that promote the cyanoacrylate adhesive gel to contact with module.This method has been described among Figure 15.

Insertion is identical with the step of the description that is used for resin with pressing steps.

Referring now to Figure 14, the device instance of the industrial high rhythm enforcement of the inventive method is described.

It comprises for card device 21, multiple card body can be provided; The feedway 22a of multiple module; The shape resin distribution device 23 that resin distributing device 23b is housed; A ultraviolet radiation irradiation unit 24 that has ultraviolet radiation device 24b; The cyanoacrylate adhesive that the divider 25b of two needle tubings 16 and 17 is housed drips shape distributor 25; The module that inserter 26b is housed is inserted device 26; The squeeze station 27 of pressurizing unit 27a is housed, pressurizing unit 27a be placed on circulation conveyer 28 around, card can be in this stop during pushing; Insertion table apparatus 29 is cut and transported to module; Ethanol damping device 30; Be withdrawing device 31 then.This equipment comprises a temperature and atmospheric humidity regulating box (not shown) equally.

Feedway is made of two reels.The first reel 22a is loaded with the film 6a of band module, and the second reel 22b is equipped with the film of not being with module, in another rolled-up time, and an expansion.Film is before process module cutter sweep 29, by above-mentioned ethanol fogger 30.

Resin distribution device 23 comprises a vertical moveable hollow pin 16.

Bestrahlungstisch is connected with the ultraviolet radiation generator (UV) of known type by ultraviolet radiation (UV) being transferred near the extension optics instrument 32 (Fig. 9) of resin, so that cavity is only exposed under radiation, some coating of card is very sensitive to ultraviolet radiation.

The cyanoacrylate adhesive distributor comprises two hollow needles 17,18 (Fig. 8), and they can vertically and laterally move.

Module is taken off and is sent to the insertion platform by conveyer 29 from film 6a by cutter sweep, and they are inserted into the center of the cavity of each card at this.Especially discharge unnecessary stress in the film cutting operation, this is caused by above-mentioned module bending.

Each squeeze station 27 all is equipped with squeezer 27a, and it comprises the edge 20a of a vertical activity that contacts with module.In order to implement the extruding of optimised form, this edge is equipped with the extruding lining 20b of central hole, like this can be to the edge pressure of module.Pressing lining is that the resilient material that does not damage contact plate with a kind of energy dispense pressure is made.It has the rectangle the same with modular shape.Center pit 20c diameter is identical with second groove diameter.

Module bottom surface ethanol fogger 30 (Figure 15) is to be made of a sponge product that is immersed in the container in 95 ° of ethanol grooves 33 in this example.Sponge and module are supplied with film and are kept in touch for a long time.Can make the activation of cyanoacrylate adhesive or gel like this, so that generation directly is adjacent to and/or forms the different connections of module and card to bonding agent or gel with module.

The displacement of card from an operator's console to another operator's console is that mechanization is finished, so that make efficient bring up at least per hour 2000 cards.

When snapping into when reaching resin distribution platform 23 positions, distribute needle tubing 16 be in the central point 11a position consistent with Fig. 5 sketch above, then, reduce near the cavity surface, the control system (not shown) discharges 0.003 gram resin, puts into cavity; Then, syringe needle rises, and hangs over the unnecessary resin thread of syringe needle so that cut off, and the next card of the wait that resets.Controller can be adjusted, so that can descend in 1.5 seconds, distributes, and rises; Then, will block fortune through Bestrahlungstisch 24.

On this station platform, with resin in 0.5 to 1 time in second by ultraviolet radiation exposure, so that to make the resin opening time be 60 seconds and card is sent to cyanoacrylate adhesive drop dispense station 25.

On dispense station, two needle tubings 17,18 are in the position with corresponding to 12a to the 15a point of predefined sticker mark, descend, distribute dripping of four 0.001 grams, put into cavity, rise then and wait for next example card, and at this moment card is sent to and inserts platform 26b.

On this platform, put into module in the card, the insertion time is 300 milliseconds, then card is sent to squeeze station 27.

On this platform, each module and card body compresses, and the power that applies is 34daN.Be stuck on the cycle operation device and stopped 22 seconds, then by bullet to next platform.

In circulating device outlet, can be to sticking into performing check, and withdraw to storage facility 31.

Claims (12)

1. manufacture method of electronic module smart card that card body (1) type of band cavity (2) is provided, the size of electronic module (5) is consistent with above-mentioned cavity, first bonding agent (12c to 15c) that has bonding card body of energy and module at least, also comprise several steps, according to these steps, put into above-mentioned cavity to above-mentioned first bonding agent of major general, above-mentioned module is inserted the center of cavity, compress to above-mentioned first bonding agent between major general card and the module, it is characterized in that further comprising the steps of:

-second bonding agent (11b) in the same placement cavity (2) is provided, above-mentioned second bonding agent has viscous characteristics, is enough to make module (5) to keep the center in cavity, and is compacted until above-mentioned first bonding agent.

2. method according to claim 1 is characterized in that: select second kind of bonding agent in the material of energy tension and/or counter-bending/twisting stress after processing, use above-mentioned material, so that produce the effect of anti-these stress.

3. method according to claim 1 and 2, the feature of this method is to use the epoxy resin of photoactivation single component.

4. method according to claim 1 and 2 is characterized in that, uses the cyanoacrylate adhesive gel.

5. method according to claim 3 is characterized in that, the viscosity of resin is 50P/ second.

6. method according to claim 3 is characterized in that, the drop of 0.003 gram is put into cavity center, resin is exposed under radiation, so that its opening time was greater than or equal to 60 seconds.

7. method according to claim 4 is characterized in that, will drip the shape gel and put into cavity center, and temperature and atmospheric humidity condition are respectively between 18 ℃-24 ℃ and 60%-75%.

8. each described method in requiring according to aforesaid right is characterized in that using cyanoacrylate or bonding agent as first bonding agent.

9. method according to claim 8, it is characterized in that, the quantity of putting into, after compressing, can cover the adhesive surface of the 50-100% of above-mentioned cavity surface, above-mentioned bonding agent is placed in contact plate groove under the atmospheric humidity of 18 ℃ to 24 ℃ temperature and 60% to 75% with the form of four side point bonding agents at least.

10. method according to claim 8 is characterized in that, only before inserting step, just cyanoacrylate adhesive is put into.

11. method according to claim 9 is characterized in that, selects quite pure cyanoacrylate adhesive, the opening time of cyanoacrylate adhesive was greater than or equal to 60 seconds.

12. use according to any electronic module smart card that described method obtained in the claim 1 to 11.

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