200812705 九、發明說明： 【發明所屬之技術領域】 之严半導體製程有關’特別是有關於-種點膠 之尽紅制方法，用以控制銀膠點於_基板上的厚度。 5【先前技術】 -般的點财式剌用—轉機將銀卵卿力點在一 基板(Substrate)上，再由一取放臂(Pick and Place Arm)將切 割後的晶片（Die)-顆顆吸取至已點膠的基板上，並施以一 外力下壓，將銀膠均勻的塗佈在基板的表面，如此一來， 1〇晶片即可藉由銀膠黏著固定於基板上。 然而’為因應不同產品的需求，通常會使用到不同材 質的基板，如金屬導線架或陶竟基板等，由於不同材質的 基板所要點的銀膠量都不一樣，若銀膠點的量太多，取放 臂下壓時，會將大部份的銀膠向外擠出，造成材料上的浪 15費’若銀膠點的量太少，取放臂下壓時，則無法將銀膠均 • 自地塗佈在基板的表面，使晶片無法確實地黏著於基板 • 上。另外，不同材質製成的基板厚度係不盡相同，若基板 的厚度較厚，而操作人員沒有調整取放臂下壓的高度，取 放臂下壓的力量容易造成晶片的損壞，若基板的厚度較 20薄，取放臂則無法將銀膠均勻的塗佈在基板表面。 因此，當更換不同材質的基板時，操作人員除了必須 重新調整銀膠的量，還要重新調整取放臂下壓的高度，再 施予適當的下壓力量，才能將銀膠均勻的塗佈在基板的表 面，但是有時為了因應產品的需求，必須時常更換不同材 4 200812705 質的基板’如此-來，操作人員隔 的量與取放臂下壓的高度，進而造#:間就要调整銀膠 困擾與不便。 ^缝作人員在操作時的 【發明内容】 本务明之主要目的在於提供—種 :在該其=r——度，使_=塗 為達成上述目的，本發明之厚度柃 驟：㈠在該基板的一上膠範圍周圍^數=包含有2步 =凸柱；㈡依照該等凸柱的财高度調整該銀膠的^ 將該銀膠點於該上職圍；㈢吸取u至該亚 =力f壓’使該晶片與該等凸柱接觸，並擠壓鄭 15 該曰曰片之__，錢轉柄地賴在絲板的表面。” 藉此，本發明之厚度控制方法可針對不同材 :材質調整該等凸柱的高度’只要讓該晶片與該等凸ς碰 ’即可讓銀料~地塗佈在該基板表面，肋增加操 在操作時的便利性。 ” 、 20【實施方式】 兹配合圖式列舉以下較佳實施例，用以對本發明之結 構及=效進行詳細說明；其中所用圖式先簡要說明如下： 第一圖係本發明一較佳實施例之流程圖； 第二圖係一立體圖，主要係顯示本發明一較佳實施例 5 200812705 所提供之凸柱設於基板的狀態。 請先參閱第一圖，係為本發明一較佳實施例之厚度控 制方法’該方法包含有下列步驟·· 5200812705 IX. Description of the Invention: [Technical Fields of the Invention] The strict semiconductor process is particularly concerned with the method of controlling the thickness of silver paste on the substrate. 5 [Prior Art] - The same kind of financial use - the transfer of the silver egg to a substrate (Substrate), and then a pick and place arm (Pick and Place Arm) will be the cut wafer (Die) - The particles are sucked onto the substrate which has been dispensed, and an external force is applied to press the silver paste uniformly on the surface of the substrate, so that the 1 〇 wafer can be fixed to the substrate by silver glue. However, in order to meet the needs of different products, it is common to use substrates of different materials, such as metal lead frames or ceramic substrates, because the amount of silver glue is different for different materials, if the amount of silver glue is too If the arm is pressed down, most of the silver glue will be squeezed out, causing the wave on the material. If the amount of silver glue is too small, the silver can not be removed when the arm is pressed down. The glue is applied to the surface of the substrate so that the wafer cannot be reliably adhered to the substrate. In addition, the thickness of the substrate made of different materials is not the same. If the thickness of the substrate is thick, and the operator does not adjust the height of the pressing arm, the force of the pressing arm is easy to cause damage to the wafer. The thickness is thinner than 20, and the pick-and-place arm cannot uniformly apply silver paste on the surface of the substrate. Therefore, when replacing the substrate of different materials, in addition to having to re-adjust the amount of silver glue, the operator must re-adjust the height of the lowering of the arm and the appropriate amount of pressing force to uniformly coat the silver glue. On the surface of the substrate, but sometimes in order to meet the needs of the product, it is necessary to change the different materials from time to time. 4200812705 The quality of the substrate 'so-, the amount of operator separation and the height of the lowering of the arm, and then #: Adjusting the trouble and inconvenience of silver glue. The content of the invention is based on the following: The thickness of the present invention is as follows: The circumference of a sizing range of the substrate includes 2 steps = protrusions; (2) adjusting the silver glue according to the height of the protrusions; the silver glue is spotted on the upper part; (3) sucking u to the sub = force f pressure 'to make the wafer in contact with the studs, and squeeze the 15 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Therefore, the thickness control method of the present invention can adjust the height of the pillars for different materials: the material can be applied to the surface of the substrate by the silver wafer being rubbed with the bumps. The convenience of the operation is increased. ”, 20 [Embodiment] The following preferred embodiments are listed with reference to the drawings for a detailed description of the structure and the effect of the present invention; wherein the drawings are briefly described as follows: 1 is a flow chart of a preferred embodiment of the present invention; the second drawing is a perspective view showing a state in which the studs provided in a preferred embodiment 5 200812705 of the present invention are disposed on a substrate. Please refer to the first figure, which is a thickness control method according to a preferred embodiment of the present invention. The method includes the following steps.
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20 步驟一 ··在一基板(ίο)之一上膠範圍（12)的四個角落各 電鍍上-凸柱(20)，各該凸柱(2G)具有—預定高度，如第二 圖所示。 步驟二··依照各該凸柱(2〇)高度調整銀膠(3〇)的量，並 使用一點膠機將該銀膠(30)點於該基板(1〇)之該上膠範圍 (12)内。 步驟三··使用一取放臂吸取一晶片（4〇)至該基板(1〇)上 方，以適當力量往下壓，使該晶片（4〇)的底面碰觸該等凸柱⑽ 的頂端，用以擠壓該基板⑽與該晶片(4〇)之間的銀膠(场，使 該銀膠(30)均勻地塗佈在該基板(1〇)表面。 在上述之方法中，操作人員可針對不同材質的基板(1〇) 調整該等凸柱⑽的高度，若所使用的基板⑽厚度較厚， ，可降低該等凸柱㈣的高度，若所使用的基板⑽厚度較 薄，則可增加該等凸柱(2〇)的高度，只要操作人員使用該取 放臂將該晶片（4G)碰觸到料凸柱⑽，使該轉(3〇)被該 晶片（40)所擠壓而部分向外溢出，即表示該銀膠(3〇)係均勻 地塗佈在5亥基板(10)表面，如此一來，操作人員不需要針對 不同材質的基板(10)而一再地調整該取放臂下壓的高度。 、另、外’刼作人員在操作時，只須利用目視觀察該銀膠(3〇) 被擠壓後是否有部份溢出的狀況，即可得知該銀膠(30)的量 是否足夠，若該銀膠(3〇)被擠壓後並未部分向外溢出，即表 6 200812705 示該銀膠(30)‘_量不夠，而必朗加該銀膠⑽的量，如 此來“作人員亦不需要針對不同材質的基板⑽而一再 地調整該銀膠(30)的量。20 Step 1·· Each of the four corners of a sizing range (12) of one substrate is plated with a stud (20), each of the studs (2G) having a predetermined height, as shown in the second figure. Show. Step 2·· Adjust the amount of silver glue (3〇) according to the height of each of the protrusions (2〇), and use a point glue machine to point the silver glue (30) to the glue range of the substrate (1〇) (12) inside. Step 3: Use a pick-and-place arm to pick up a wafer (4 〇) above the substrate (1 〇), press down with appropriate force, and touch the bottom surface of the wafer (4 〇) to the top of the studs (10). a silver paste (field) between the substrate (10) and the wafer (4 Å) for uniformly coating the silver paste (30) on the surface of the substrate (1 〇). In the above method, the operation The height of the studs (10) can be adjusted for different substrates (1〇). If the substrate (10) used is thicker, the height of the studs (4) can be reduced, if the substrate (10) used is thin. , the height of the studs (2 〇) can be increased, as long as the operator touches the wafer (4G) to the material studs (10) using the pick-and-place arm, so that the turn (3 〇) is the wafer (40) Extrusion and partial outward overflow means that the silver paste (3〇) is evenly coated on the surface of the 5H substrate (10), so that the operator does not need to be different for the substrate (10) of different materials. Adjust the height of the lowering arm of the pick-and-place arm. When the other person is working, it is only necessary to visually observe whether the silver glue (3〇) is squeezed. If the amount of the silver glue (30) is sufficient, the silver glue (3) is not partially overflowed after being squeezed, that is, the silver glue (30) is shown in Table 6 200812705. The amount of '_ is not enough, and the amount of the silver glue (10) is added, so that the person does not need to adjust the amount of the silver glue (30) repeatedly for the substrate (10) of different materials.
⑽rt提的是’料凸柱_設置方式可依照該基板 )的材貝而用不同方式進行，亦可植球、轉合、封 或鑄模成型(Pimple)的方式設於該(10) rt refers to the "material studs _ setting method can be carried out according to the substrate" in different ways, can also be placed in the ball, turn, seal or mold (Pimple)
可達到本發明的目的。 K 藉此，本發明之厚度控制方法係利用調整該等 的南度來控制該基板⑽與該晶片(40)之間的銀 声 =地塗佈在該基板⑽的表面，以達到二 10 200812705 【圖式簡單說明】 第一圖係本發明一較佳實施例之流程圖。 第二圖係一立體圖，主要係顯示本發明一較佳實施例 所提供之凸柱設於基板的狀態。 【主要元件符號說明】 基板(10) 凸柱(20) 晶片（40) 上膠範圍（12) 銀膠(30)The object of the invention can be achieved. Therefore, the thickness control method of the present invention controls the silver sound between the substrate (10) and the wafer (40) to be coated on the surface of the substrate (10) by adjusting the southness of the substrate to reach two 10 200812705. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of a preferred embodiment of the present invention. The second drawing is a perspective view showing a state in which the studs provided in a preferred embodiment of the present invention are disposed on a substrate. [Main component symbol description] Substrate (10) Post (20) Wafer (40) Gluing range (12) Silver glue (30)