JPS6341031A - Adjusting device for bonding resin surface in resin bonding device - Google Patents

Abstract

PURPOSE:To transfer and apply a bonding resin onto a substrate in proper quantity by using a plurality of sets by the combination of a squeegee and a height regulating mechanism. CONSTITUTION:The combination of adjusting levers 15, 16 consisting of two sets, squeegees 17, 18, height regulating mechanisms 19, 20 and springs 21, 22 is used, regulating knobs 19a, 20a for each height regulating mechanism 19, 20 are operated respectively, and the upper projecting height of height set pins 19b, 20b is adjusted, the position of horizontal height of each squeegee 17, 18, a bonding resin 3, can be set respectively to resin surfaces 3a, 3b having separate thickness. Accordingly, even when the nose size and shape of a stamp pin selected in response to chip size differ to each other, a fixed quantity of the resin in predetermined thickness can be applied onto a substrate at all times.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a bonding resin surface adjustment device in a resin bonding device, and more specifically, it relates to a bonding resin surface adjustment device in a resin bonding device, and more specifically, it relates to a bonding resin surface adjustment device for a resin bonding device, and more specifically, it relates to a bonding resin surface adjustment device for a resin bonding device. The present invention relates to an improvement of an adjustment device for adjusting the height of a bonding resin surface to correspond to the type of semiconductor chip in a resin bonding device for die bonding.

[Conventional technology]

A general configuration of a conventional resin bonding apparatus of this type is shown in FIGS. 3 and 4.

That is, in each of these figures, the reference numeral 1 is a substrate on which a semiconductor chip is mounted, here is a substrate made of ceramic or the like to which semiconductor chips of different sizes are die-bonded with resin, and 2 is a substrate holding this substrate 1 and pointing at an arrow. This is a bonding stage that can be controlled to move in the front/back and left/right directions as shown in the figure.

In addition, 3 is a bonding resin such as silver epoxy, and 4 is a bonding resin such as silver epoxy.
5 is a stamp plate that receives the bonding resin 3, and 5 is a rotary mechanism 5a that pivotally supports the stamp plate 4.
6 is a stamp stand which is rotated at a predetermined speed by the stamp stand, and 6 is a horizontally extended intermediate portion pivotably supported on the stamp stand 5, and its tip is placed on the stamp plate 4. It's just one adjustment lever that you can see. is attached to the tip of this adjustment lever 6, and the stamp plate 4
This is a squeegee that contacts the upper surface of the bonding resin 3 inside and constantly scrapes the resin surface into a horizontal plane at an adjusted height.

Reference numeral 8 denotes a height adjustment mechanism mounted vertically on an extension of the stamp stand 5, and in this case, the height can be adjusted upward by manually rotating the adjustment knob 8a. The setting pin 8b can be moved up and down. The lower surface of the proximal end of the adjustment lever 8 is brought into contact with the upper end surface of the height setting pin 8b by the elastic force of the spring 9, so that play in the adjustment lever 6 is removed.

Furthermore, a stamp pin 10 has a tip shape corresponding to the chip size, and a plurality of stamp pins 10 (10a, 10b) for each chip size are attached radially at equal angular intervals, and each A rotary member 13 whose rotation can be freely changed according to the mounting angle allows the rotary member 11 to be controlled and moved in the vertical direction shown by the arrow, and is designed to move between the substrate l side and the stamp plate 4 side. This is a stamp head that can be moved in a reciprocating manner as shown by the arrow.

Therefore, in the case of this conventional configuration, one set of the adjustment lever 6, squeegee 7, and height adjustment mechanism 8 is used, and the adjustment knob 8a of the height adjustment mechanism 8 is first operated to adjust the height. Adjust the upper protruding height of the setting pin 8b to set the horizontal height position of the squeegee 7 as specified, and
The rotation mechanism 12 of the stamp pad 13 is operated to rotate the rotation member 11, and the stamp pin is adjusted to correspond to the chip size at that time.

Here, the stamp pin 10a is selected.

That is, as a result of these operations, in the former case, the surface of the bonding resin 3 in the rotating stamp pan 4 is smoothed by the squeegee 7, so that the entire surface always corresponds to the set height position. It is maintained. In other words, the entire surface of the bonding resin in contact with one squeegee 7 is supplied in the concave dish 4 while maintaining a constant thickness.

In the latter case, the selected stamp pin 10a is moved downward.

In this state, first, the pad 13 is controlled and driven to move it onto the stamp plate 4 and is moved up and down, and the lower end of the stamp pin 10a selected according to the chip size at this time is moved onto the stamp plate 4. The bonding resin 3 is brought into contact with the surface of the bonding resin 3 which is set to have a certain thickness in advance, and only the required amount of the resin 3 is attached to the tip of the pin and taken out.

Then, the stamp head 13 is moved from the stamp plate 4 side to the bonding stage 2 side.

Similarly, the required amount of bonding resin 3 attached to the lower end of the stamp pin 10a is moved up and down to a predetermined position on the substrate l mounted on this bonding stage 2.
That is, transfer coating is applied to the chip bonding position at that time.

Subsequently, the stamp head 13 switches the previously selected stamp pin 10a to a stamp pin 9 corresponding to the next mounting chip size, for example, a stamp pin toh, and also moves the bonding stage 2 to the next mounting position. and wait, then repeat the above steps one after another,
The operation of applying the resin 3 onto the substrate 1 is performed continuously.

Note that a semiconductor chip is bonded in a separate process onto the substrate 1 onto which the required amount of the bonding resin 3 has been transferred and coated at a predetermined position.

[Problem that the invention seeks to solve]

However, in the case of the conventional individual packaging configured as described above, one set of adjustment lever 6 degree squeegee 7 and height adjustment mechanism 8 is used, and one squeegee 7 is used to adjust the stamp plate 4 to which it comes into contact. Even if the surface of the bonding resin 3 inside the stamp pin 10 is kept at a constant thickness at all times, depending on the target chip size, the stamp pin 10 inevitably
Since the tip size and shape of the bonding resin 3 are different, when one of them is selected, the amount of resin adhered to the same tip portion may vary due to the viscosity of the bonding resin 3 itself.

As a result, this will cause a difference in the amount of resin transferred and coated onto the substrate.If the amount of coating is too large, the resin will wrap around to the surface of the chip during bonding and mounting of the semiconductor chip, and if the amount of coating is too small, However, there was a problem in that it caused problems such as insufficient bonding strength.

This invention was made in order to solve these conventional problems, and its purpose is to provide a stamp pin that can be used even when the tip size and shape of the stamp pin selected to correspond to the chip size differs. A constant amount and thickness of resin can be applied onto the substrate at any time. An object of the present invention is to provide a bonding resin surface adjustment device in this type of resin bonding apparatus.

[Means for solving problems]

In order to achieve the above object, the bonding resin surface in the resin bonding apparatus according to the present invention,! The adjustment device uses a plurality of sets of adjustment levers, squeegees, and height adjustment mechanisms, and allows the height position of the squeegee and the resin to be adjusted to different thicknesses for each set, The required amount of bonding resin can be separately taken out from each resin surface corresponding to the selected stamp pin.

[For production]

That is, in this invention, the adjustment lever.

By using multiple sets of combinations of squeegees and height adjustment mechanisms, and selectively setting the height positions of each set of squeegees, that is, the same number of squeegees, it is possible to increase the The surface of the bonding resin can be adjusted to different height positions and thus different thicknesses, and in this way, corresponding to each stamp pin that is selected, the surface of the bonding resin can be adjusted from each adjusted resin surface to the same stamp pin. , the required amount of bonding resin can be taken out separately for each.

〔Example〕

Hereinafter, one embodiment of the bonding resin surface adjusting device in the resin bonding apparatus according to the present invention will be described in detail with reference to FIGS. 1 and 2.

Fig. 1 is a perspective view showing the general configuration of this embodiment device;
The figure is an explanatory cross-sectional view of the stamp plate portion same as above, and in the embodiment apparatus of FIGS. 1 and 2, the same reference numerals as those of the conventional example apparatus of FIGS. 3 and 4 represent the same or corresponding parts. .

In this embodiment device, the adjustment lever 6 in the conventional example described above is
, multiple sets of squeegee 7 and height adjustment mechanism 8, here two sets of adjustment levers 15.1.
8. Squeegee 17.1B and height adjustment mechanism 19,2
0. By using the combination of springs 21, 22 and operating the adjustment knobs 19a + 20 & of each height adjustment mechanism 19, 20, respectively, the height of the upper protrusion of the height setting pins 19b, 20b is adjusted. , each squeegee 17.1
8 horizontal height positions, and thus the bonding resin 3 can be set respectively on resin surfaces 3a and 3b having different thicknesses.

Therefore, in this embodiment, the same effect as in the conventional structure described above is achieved, but in this embodiment, the horizontal height position of the squeegee 17, 18 is adjusted for each set by the stamp pin 10a, The stamp pin 10a must be adjusted and set as specified in accordance with the tip size and shape of the stamp pin 10b, so that a resin surface 3a of a thickness corresponding to this can be obtained. For the stamp pin IOb, the resin surface 3 has a thickness corresponding to that of the stamp pin IOb.
By adjusting and setting each so that b can be obtained, the following effects can be obtained.

In other words, in this case, the rotation mechanism 1 of the ladder 13 to the stamp
2 to rotate the rotary member 11 and select a stamp pin, in this case the stamp pin 10a, corresponding to the chip size at that time. After moving it onto the resin surface 3a of the corresponding thickness in 4,
By moving it up and down, this stamp pin 10a
The required amount of bonding resin 3 suitable for the stamp pin 1 can be attached to the tip and taken out.
When 0b is selected, the required amount of bonding resin 3 suitable for this stamp pin 10b can be taken out from the resin surface 3b in the same way. The adjusted resin surfaces 3a and 3b can be used properly as desired, and as a result, each of these stamp pins IOa and 10
A required amount of bonding resin 3 that matches the size and shape of the tip of b can be taken out and transferred and applied to a predetermined position on the substrate 1.

In the configuration of the above embodiment, two sets of adjustment levers 15.1B, squeegees 17.18. and height adjustment mechanism 19.20. In addition, a combination of springs 21 and 22 are arranged in parallel to each other for convenience in adjustment operations, etc., but if necessary, more than one set may be used in combination. Furthermore, it goes without saying that the same functions and effects can be obtained even if the sets are not necessarily arranged in parallel.

〔Effect of the invention〕

As described in detail below, according to the present invention, in order to resin die bond a plurality of types of semiconductor chips of different sizes onto a substrate such as a ceramic substrate, a stamp plate that receives bonding resin and rotates, and a stamp plate are provided. It has a squeegee that sets the thickness of the resin by scraping the inner resin surface, and a height adjustment mechanism that adjusts the height position of the squeegee, and the stamp pin is switched and selected according to the chip size.
When taking out a part of the bonding resin that has been leveled and has a set thickness, multiple sets of squeegee and height adjustment mechanisms are used, so the height position of the squeegee can be adjusted for each set. In addition, the bonding resin surface in the stamp pan can be set to a different thickness that matches the tip size and shape of each individual stamp pin, and the resin surface of each of these different thicknesses can be set. are used to correspond to each stamp pin that is selectively switched, and the required amount of bonding resin can be taken out from each resin surface using each stamp pin, so as a result, the bonding resin can be taken out separately. It has excellent features such as being able to be transferred onto a substrate in just the right amount, having a relatively simple structure, and being easy to implement.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the general structure of a resin bonding device to which an embodiment of the bonding resin surface adjusting device according to the present invention is applied, FIG. The figure is a perspective view showing the general structure of the conventional resin bonding apparatus, and FIG. 4 is a cross-sectional explanatory view of the stamp plate portion of the same. 1... Board, 2... Bonding stage, 3
...Resin for bonding, 3a, 3b...
Resin surface (resin surface with different thickness), 4... Stamp plate, 5... Stamp stand, 5a... Rotation mechanism, 1
0. (10a, 10b) Stamp pin, 11.
-... Rotating member, 12... Rotating mechanism, 13...
Stamp head, 15.18...adjustment lever, 17
．． 18...Squeegee, 19.20...Height adjustment mechanism, 19a, 20a...Adjustment knob, 19b, 2
0b... Height setting pin. Agent Masu Oiwa゛Ro゛°°゛- -Nn(v'>5tLrJo- Figure 3 Figure 4 Procedural Amendment 1, Indication of Case Patent Application Sho/Nno 7f7 Nono 1ゝ3
, the representative of the person making the amendment, Moriya Shiki 5, the drawing to be amended 6, and the content of the amendment, Figure 1, as shown in the attached drawings. Above Figure 1

Claims (1)

[Claims] (1) In order to resin die-bond multiple types of semiconductor chips of different sizes onto a substrate such as ceramic, there is at least a stamp plate that receives the bonding resin and rotates, and a stamp plate that receives the bonding resin and rotates, and the resin surface in the stamp plate is scraped and the resin is bonded. It has a squeegee that sets the thickness of the resin and a height adjustment mechanism that adjusts the height position of the squeegee, and a stamp pin that is switched and selected according to the chip size takes out a part of the resin with the set thickness. In this resin bonding apparatus, a plurality of sets of the squeegee and the height adjustment mechanism are used, and the height position of the squeegee can be adjusted and set separately for each set, and the squeegee is compatible with the stamp pin that is selectively switched. A device for adjusting a bonding resin surface in a resin bonding apparatus, characterized in that a required amount of bonding resin can be separately taken out from each resin surface.