JPH0528763Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial field of application] This invention relates to a bonding resin surface adjustment device in a resin bonding device. This invention relates to an improvement of an adjustment device for adjusting the height of a bonding resin surface to correspond to the type of semiconductor chip in a resin bonding device for die bonding.

[Conventional technology]

A schematic configuration of a conventional resin bonding apparatus of this type is shown in FIGS. 4 and 5.

That is, in each of these figures, reference numeral 1 indicates a substrate on which a semiconductor chip is mounted, here a substrate made of ceramic or the like to which semiconductor chips of different sizes are die-bonded with resin, and 2 indicates this substrate 1.
This is a bonding stage that can be held and controlled to move in the front/back and left/right directions shown by the arrows.

Further, 3 is a resin for bonding such as silver epoxy, 4 is a stamp plate that receives the bonding resin 3, and 5 is a rotary member that supports the stamp plate 4 and rotates it at a predetermined speed by a rotation mechanism 5a. 6 is an adjustment lever whose horizontally extended intermediate portion is pivotally supported on the stamp pad 5 so as to be able to swing freely, and whose tip portion faces the stamp tray 4; 7 is attached to the tip of this adjustment lever 6, and the stamp plate 4
This is a squeegee that contacts the upper surface of the bonding resin 3 in the interior and constantly scrapes the resin surface into a horizontal plane at an adjusted height.

Reference numeral 8 denotes a height adjustment mechanism installed in the vertical direction on an extension of the stamp pad 5, in which a height setting pin is projected upward by manual rotation of the adjustment knob 8a. 8b can be moved up and down. The lower surface of the proximal end of the adjustment lever 6 is brought into contact with the upper end surface of the height setting pin 8b by the elastic force of the spring 9, thereby eliminating play in the adjustment lever 6.

Furthermore, 10 is a stamp pin having a tip shape corresponding to the chip size, 11 is a plurality of stamp pins 10, 10a, 10b for each chip size,
A rotating member 13 is mounted radially at equal angular intervals and can be freely switched to correspond to each mounting angle by a rotating mechanism 12. Reference numeral 13 is capable of controlling and moving the rotating member 11 in the vertical direction indicated by the arrow. The stamp head is capable of reciprocating control movement between the substrate 1 side and the stamp plate 4 side as shown by the arrow.

Therefore, in the case of this conventional configuration, a combination of the adjustment lever 6, the squeegee 7, and the height adjustment mechanism 8 is used, and the height adjustment mechanism 8 is first
Operate the adjustment knob 8a to adjust the upper protrusion height of the height setting pin 8b to set the horizontal height position of the squeegee 7 as specified, and also operate the rotation mechanism 12 of the stamp head 13. Then, the rotating member 11
is rotated to select a stamp pin, in this case stamp pin 10a, corresponding to the chip size at that time.

That is, by these operations, in the former case,
By smoothing the surface of the bonding resin 3 in the rotating stamp pan 4 with the squeegee 7, the entire surface is always maintained at a set height position, that is, the same pan 4 In the latter case, the entire surface of the bonding resin in contact with the squeegee 7 can be supplied while maintaining a constant thickness, and in the latter case, the selected stamp pin 10a is positioned below.

In this state, first, press the stamp head 13.
The lower end of the stamp pin 10a, which is selected according to the chip size at this time, is moved to the top of the stamp pan 4 and moved up and down, and the lower end of the stamp pin 10a, which is selected according to the chip size at this time, is moved to the stamp pan 4 with a preset thickness. The pin is brought into contact with the surface of the bonding resin 3, and only the required amount of the resin 3 is attached to the tip of the pin and then taken out.

Next, the stamp head 13 is moved from the stamp plate 4 side to the bonding stage 2 side, and is similarly moved up and down, so that the stamp pin 10a
Required amount of bonding resin 3 attached to the lower end of
is transferred and applied to a predetermined position on the substrate 1 mounted on the bonding stage 2, that is, the chip bonding position at that time.

Subsequently, the stamp head 13 replaces the previously selected stamp pin 10a with a stamp pin 10a corresponding to the next mounted chip size, for example, a stamp pin 10a that has been selected previously.
At the same time as switching to 0b, bonding stage 2
, the substrate 1 is moved to the next mounting position and stands by, and the above operations are repeated one after another to continue applying the resin 3 onto each substrate 1.

In addition, in this way, the required amount of bonding resin 3
A semiconductor chip is bonded in a separate process onto the substrate 1 which has been transfer-coated to a predetermined position.

[Problem that the invention attempts to solve]

However, in the case of the conventional device configured as described above, a combination of the adjustment lever 6, the squeegee 7, and the height adjustment mechanism 8 is used, and the squeegee 7 controls the bonding in the stamp pan 4 with which it comes into contact. Even if the surface of the resin 3 is always kept at a constant thickness, depending on the target chip size, the tip size of the stamp pin 10,
Because the shapes are different, when one of them is selected, there will be a difference in the amount of resin adhered to the same tip and, ultimately, the amount of resin transferred and coated onto the substrate 1 due to the viscosity of the bonding resin 3 itself. If the amount of resin applied is too large, the resin will wrap around the surface of the chip during bonding and mounting of the semiconductor chip, and if the amount of applied resin is too small, problems such as insufficient bonding strength may occur. There was a problem.

This invention was devised to solve these conventional problems, and its purpose is to always provide the same control even when the tip size and shape of the stamp pin selected to correspond to the chip size differs. An object of the present invention is to provide a bonding resin surface adjustment device in this type of resin bonding apparatus, which enables a fixed amount and thickness of resin to be applied onto a substrate.

[Means for solving problems]

In order to achieve the above object, the bonding resin surface adjusting device in the resin bonding apparatus according to the present invention has a plurality of grooves having a height difference on at least one of the inner bottom surface of the stamp plate and the lower end surface of the squeegee. The thickness of the bonding resin in the stamp plate can be set separately for each of these stepped surfaces, and the thickness of the bonding resin can be set separately for each of the stamp pins to be selected. The required amount of bonding resin can be taken out separately from each resin part.

[Effect]

That is, in this invention, since a plurality of stepped surfaces having height differences are formed on at least one of the inner bottom surface of the stamp pan and the lower end surface of the squeegee, each of these stepped surfaces is formed in advance. The thickness of the bonding resin in the stamp pan can be set separately according to the selection of the stamp pin, and the required amount of bonding resin can be drawn from resin parts of different thicknesses depending on the stamp pin that is selected. It can be taken out.

〔Example〕

Hereinafter, embodiments of the bonding resin surface adjusting device in the resin bonding apparatus according to this invention will be described in detail with reference to FIGS. 1 to 3.

Fig. 1 is a perspective view showing the general configuration of an embodiment of the device of this invention, Fig. 2 is a cross-sectional explanatory view of the stamp plate portion of the same as above, and Fig. 3 is a cross-sectional view of the stamp plate portion of another embodiment of the device. 1 to 3, the same reference numerals as in the conventional apparatus shown in FIGS. 4 and 5 represent the same or corresponding parts.

First, in one embodiment of the apparatus shown in FIGS. 1 and 2, a corresponding stamp plate 14 is provided in place of the stamp plate 4 rotated by the rotation mechanism 5a in the conventional apparatus described above. , within the respective concentric circles on the inner bottom surface of the stamp plate 14, particularly within the range of contact with the bonding resin 3 by the flat lower end surface of the squeegee 7, with a difference in height from the center side. Each of a plurality of stepped surfaces 14
a, 14b are formed, and each of these stepped surfaces 14
a, 14b, the bonding resin 3 in the stamp plate 14 is bonded to the stamp pins 10a, 1 on the corresponding resin surfaces 3a, 3b, respectively.
The thickness is adjusted to a predetermined thickness corresponding to the size and shape of the tip of the 0b.

Therefore, the configurations of the embodiments shown in FIGS.
4, the corresponding resin surfaces 3a, 3b of the bonding resin 3 can be adjusted to the tip size of each of the stamp pins 10a, 10b by the step surfaces 14a, 14b formed on the inner bottom surface of the bonding resin 3. , the thickness is adjusted to correspond to the shape, that is, for the stamp pin 10a, a resin surface 3a having a thickness corresponding to this is obtained, and for another stamp pin 10b, a resin surface 3a having a thickness corresponding to this is obtained. A resin surface 3b having a corresponding thickness is obtained.

For this purpose, the rotating mechanism 12 of the stamp head 13 is operated to rotate the rotating member 11, and when the stamp pin corresponding to the chip size at that time, in this case the stamp pin 10a, is selected, the stamp pin 10a is selected. When the head 13 is operated, the stamp pin 10a is moved onto the resin surface 3a of the corresponding thickness in the stamp plate 4, and then moved up and down.
The required amount of bonding resin 3 that conforms to (a) can be attached to the tip and taken out, and
When the stamp pin 10b is selected, the required amount of bonding resin 3 suitable for the stamp pin 10b can be taken out from the resin surface 3b in the same way.In other words, each stamp pin 10a,
10b, the resin surfaces 3a and 3b adjusted to different thicknesses can be used properly as desired, and as a result, each of these stamp pins 1
A required amount of bonding resin 3 suitable for the size and shape of the tips 0a and 10b can be taken out and transferred and applied to a predetermined position on the substrate 1.

Further, in another embodiment of the apparatus shown in FIG. 3, the stamp plate 4 rotated by the rotation mechanism 5a in the conventional apparatus described above is kept as is, and the squeegee 7 is replaced with a corresponding one. Using squeegee 15,
The lower end surface of this squeegee 15 is formed with a plurality of step surfaces 15a and 15b having height differences.

Similarly to the apparatus of the embodiment shown in FIG. 1 and FIG.
15b, the bonding resin 3 in the stamp pan 14 can be adjusted to a predetermined thickness corresponding to the respective resin surfaces 3a, 3b and the tip size and shape of the stamp pins 10a, 10b. Therefore, similar actions and effects can be obtained.

Incidentally, in the configuration of the embodiment described above, a case has been described in which two stepped surfaces are formed, but it goes without saying that more stepped surfaces may be formed as necessary.

[Effect of idea]

As detailed above, according to this invention, in order to resin die bond a plurality of types of semiconductor chips of different sizes onto a substrate such as ceramic, a stamp plate that receives bonding resin and rotates;
It has a squeegee that scrapes the resin surface in the stamp pan to set the thickness of the resin, and a height adjustment mechanism that adjusts the height position of the squeegee, and is switched to correspond to the chip size depending on the selected stamp pin. When taking out a part of the bonding resin that has been leveled and has a set thickness, a plurality of layers with different heights are placed on at least one of the inner bottom surface of the stamp plate and the lower end surface of the squeegee. Since the stepped surfaces were formed, in advance, corresponding to each of these stepped surfaces,
The thickness of the bonding resin in the stamp pan can be adjusted to suit the size and shape of the tip of each stamp pin, and also,
These resin surfaces with different thicknesses are used to correspond to each stamp pin that is selectively switched, so that the required amount of bonding resin can be separately taken out from each resin surface using each of these stamp pins. Therefore, the bonding resin can be effectively transferred onto the substrate in just the right amount, and has excellent features such as being relatively simple in structure and easy to implement.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the general structure of a resin bonding apparatus to which an embodiment of the bonding resin surface adjustment device according to the invention is applied, FIG. FIG. 4 is a perspective view illustrating a general configuration of the resin bonding apparatus according to the conventional example, and FIG. be. 1...Substrate, 2...Bonding stage, 3
...Resin for bonding, 3a, 3b...Resin surface (resin surface with different thickness), 4 and 14...Stamp plate, 14a, 14b...Stamp plate stepped surface, 5...Stamp stand, 5a... Rotating mechanism, 6...
...Adjustment lever, 7 and 15...Squeegee, 15
a, 15b... Squeegee step surface, 8... Height adjustment mechanism, 8a... Adjustment knob, 8b... Height setting pin, 10, 10a, 10b... Stamp pin, 1
1... Rotating member, 12... Rotating mechanism, 13... Stamp head.

Claims (1)

[Scope of claims for utility model registration] (1) Multiple types of semiconductor chips of different sizes,
In order to perform resin die bonding on a substrate such as ceramic, at least a stamp plate that receives the bonding resin and rotates, a squeegee that scrapes the resin surface in the stamp plate to set the thickness of the resin, and the height of the squeegee. In a resin bonding apparatus, a part of the resin having a set thickness is taken out by a stamp pin that is switched and selected according to the chip size and has a height adjustment mechanism that adjusts the position. A plurality of stepped surfaces with height differences are formed on at least one of the bottom surface and the lower end surface of the squeegee, and the thickness of the bonding resin in the stamp pan is set separately for each of these stepped surfaces. In the resin bonding apparatus, the required amount of bonding resin can be separately taken out from resin parts of different thicknesses corresponding to the stamp pins to be selectively switched. Bonding resin surface adjustment device. (2) On the inner bottom surface of the stamp plate, form a plurality of step surfaces with mutual height differences within a concentric range corresponding to the flat lower end surface of the squeegee in contact with the bonding resin surface, and Then,
A bonding resin surface adjusting device in a resin bonding apparatus according to claim 1 of the utility model registration claim, characterized in that the thickness of a corresponding portion of the bonding resin can be set corresponding to each stamp pin. . (3) Form multiple stepped surfaces with height differences on the lower end surface of the squeegee, and use these stepped surfaces to set the thickness of the corresponding portion of the bonding resin in correspondence with each stamp pin. Claim No. 1 for utility model registration, which is characterized by making it possible to
A device for adjusting a bonding resin surface in the resin bonding device described in 2.