JP3841576B2 - Substrate fixing device and substrate fixing structure - Google Patents

Substrate fixing device and substrate fixing structure Download PDF

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Publication number
JP3841576B2
JP3841576B2 JP31112398A JP31112398A JP3841576B2 JP 3841576 B2 JP3841576 B2 JP 3841576B2 JP 31112398 A JP31112398 A JP 31112398A JP 31112398 A JP31112398 A JP 31112398A JP 3841576 B2 JP3841576 B2 JP 3841576B2
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Japan
Prior art keywords
substrate
suction
stage
hole
fixing
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Expired - Fee Related
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JP31112398A
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Japanese (ja)
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JP2000138253A (en
Inventor
敏正 赤松
雄二 鵜野
弘道 渡邉
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Denso Ten Ltd
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Denso Ten Ltd
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、基板を固定する基板固定装置及びその基板の固定構造に係り、特に基板に搭載されたベアチップと基板とを接続するワイヤボンディングを適用するものに関する。
【０００２】
【従来の技術】
従来のワイヤボンディング装置の基板の固定構造を図１０を用いて説明する。
【０００３】
図１０は従来の基板固定装置の一部を示す概略構成側断面図である。
【０００４】
９０は、電子部品であるベアチップ８０が搭載された基板８５を吸着固定し、ベアチップ８０の端子と基板８５に形成された接続パターンとの間をワイヤボンディングするために基板８５を吸着固定する基板吸着ステージである。基板吸着ステージ９０はステージ本体９１、基板位置決板９５及び吸引手段（真空発生装置、図示省略）等により構成されている。ステージ本体９１には基板８５をステージ本体９１の基板吸着面９２に吸着する吸引孔９３及び基板位置決板９５を取り付ける取付孔等が形成されている。尚、吸引孔９３は吸引手段に接続されている。
【０００５】
次に、基板の吸着動作を説明する。
【０００６】
ステージ本体９１上に構成された基板位置決板９５に基板８５を位置決め載置する。次に、吸引手段を稼動させ基板８５をステージ本体９１の基板吸着面９２に吸着固定する。そして、ワイヤボンディングが行われる。
【０００７】
【発明が解決しようとする課題】
しかし、上述の基板吸着ステージ９０では基板８５の反りが大きい場合には、基板８５をステージ本体９１の基板吸着面９２に吸着しきれずに、基板８５が基板吸着面９２から浮いた不安定な状態となり、ワイヤボンディング品質の低下につながる。また、基板８５にスルーホール等の孔があいている場合にも、基板８５を吸着する吸着効率が悪くなり基板吸着面９２に基板８５を吸着しきれずに、基板８５が基板吸着面９２から浮いた不安定な状態となるので、ワイヤボンディング品質の低下につながる。
【０００８】
本発明は上述の問題を解決するもので、基板の反りに関係なく特に高品質のワイヤボンディングが可能な基板固定装置及び基板の固定構造を提供することを目的とする。
【０００９】
【課題を解決するための手段】
本発明は上述の目的を達成するもので、電子部品が搭載された基板を固定する基板固定装置において、吸引孔が形成され前記基板をその上面に固定する吸着ステージと、前記基板より下方に位置するものであって、吸引孔を有し前記吸着ステージを貫通するように設けられた吸着筒と、前記両方の吸引孔を通して前記基板を吸引する吸引手段と、前記吸着筒を上下方向へ移動させる上下移動手段とからなり、前記上下移動手段により前記吸着筒が前記基板の下面まで上昇し該基板を直接吸着した状態で下降し該基板を前記吸着ステージの上面に吸着固定することを特徴とするものである。
【００１０】
また、前記吸引筒は前記電子部品の搭載位置の下方に設けられていることを特徴とするものである。
【００１１】
また、電子部品が搭載された基板を固定する基板固定装置において、吸引孔が形成され前記基板をその上面に固定する吸着ステージと、前記吸引孔を通して前記基板を吸引する吸引手段と、前記吸着ステージ及び前記基板に設けた孔を貫通するように設けられ、前記基板の上面を押さえて該基板を該吸着ステージに引着する基板引着部が形成された基板引着手段と、前記基板引着手段を上下方向へ移動させる上下移動手段とからなり、前記上下移動手段により、前記基板引着手段が上昇すると共に前記基板引着部が前記吸着ステージ及び前記基板の孔を貫通して該基板の上方に突出した後、該基板引着手段が下降すると共に該基板引着部が下降して該基板の上面を押さえて該基板を該吸着ステージの上面に引着することを特徴とするものである。
【００１２】
また、前記基板引着部はＴ字形状をなす押さえ部を有するものであって、前記基板の上方で所定角度回動した後、下降するものであることを特徴とするものである。
【００１３】
また、電子部品が搭載された基板を固定する基板固定装置において、吸引孔と前記基板に形成された孔を塞ぐ凸部とが形成され該基板をその上面に吸着固定する吸着ステージと、前記吸引孔を通して前記基板を吸引する吸引手段とからなり、前記凸部により前記基板に形成された孔を塞いだ状態で該基板を前記吸着ステージの上面に吸着固定することを特徴とするものである。
【００１４】
また、電子部品が搭載された基板を固定する基板固定装置において、吸引孔が形成され前記基板をその上面に吸着固定する吸着ステージと、前記基板に形成された孔を覆うシートと、前記吸引孔を通して前記基板を吸引する吸引手段とからなり、前記基板の孔にその上面より前記シートを被せた状態で該基板を前記吸着ステージの上面に吸着固定することを特徴とするものである。
【００１６】
また、電子部品が搭載された基板を固定する基板固定装置において、吸引孔が形成され前記基板をその上面に吸着固定する吸着ステージと、前記吸引孔を通して前記基板を吸引する吸引手段とからなり、前記吸着ステージの上方に設けられ前記基板の上面に対して吹圧するエアーノズルと、前記エアーノズルに高圧エアーを供給する高圧エアー供給手段とからなり、前記基板の上面に高圧エアーを吹き付け該基板を前記吸着ステージの上面に押圧した状態で該基板を該吸着ステージの上面に吸着固定することを特徴とするものである。
【００１７】
また、前記高圧エアーに熱風が用いられてなることを特徴とするものである。
【００１８】
また、電子部品が搭載された基板を固定する基板固定装置において、前記基板をその上面に位置決め固定するステージと、前記基板の端を前記ステージに引着する引着爪が形成された基板引着手段と、前記基板引着手段により前記ステージの上面に位置決めされた前記基板の下面と該ステージの上面との隙間に充填材を充填する充填材供給手段とからなることを特徴とするものである。
【００１９】
また、前記充填材は温度変化により形態が変化する充填部材であることを特徴とするものである。
【００２０】
また、前記充填材は粉体であることを特徴とするものである。
【００２１】
また、前記充填材は微粒体であることを特徴とするものである。
【００２２】
また、電子部品が搭載されると共にスルーホールが形成された基板を固定する基板固定装置において、吸引孔が形成され前記基板をその上面に吸着固定する吸着ステージと、前記吸引孔を通して前記基板を吸引する吸引手段とからなり、前記スルーホールの上面を充填部材で塞いだ状態で前記基板を前記吸着ステージの上面に吸着固定することを特徴とするものである。
【００２３】
また、前記充填部材に塗料が用いられることを特徴とするものである。
【００２４】
また、前記充填部材にレジスト部材が用いられることを特徴とするものである。
【００２５】
また、吸着ステージの上面に吸着固定されるものであって、電子部品が搭載されると共にスルーホールが形成された基板の固定構造において、前記吸着ステージの上面に吸着固定される前に、予め前記スルーホールの上面が充填部材で塞がれていることを特徴とするものである。
【００２６】
また、前記充填部材に塗料が用いられることを特徴とするものである。
【００２７】
また、前記充填部材にレジスト部材が用いられることを特徴とするものである。
【００２８】
また、前記電子部品はベアチップであって、前記固定された基板上において該ベアチップがワイヤボンディングされてなることを特徴とするものである。
【００２９】
【実施例】
本発明の第１実施例を図１を用いて説明する。
【００３０】
図１は本発明の第１実施例の基板固定装置の一部を示す概略構成図で、（ａ）は基板が吸着筒に吸着された状態を示す側断面図、（ｂ）は基板がステージに吸着された状態を示す側断面図である。
【００３１】
２０は、電子部品であるベアチップ１０が搭載された基板を吸着固定し、ベアチップ１０の端子と基板１５に形成された接続パターンとの間をワイヤボンディングするために基板１５を吸着固定する基板吸着ステージである。基板吸着ステージ２０はステージ本体２１、吸着筒２６、基板位置決板２９及び吸引手段（真空発生装置、図示省略）等により構成されている。
【００３２】
ステージ本体２１には基板１５をステージ本体２１の基板吸着面２２に吸着する吸引孔２３と吸着筒２６が上下方向へ摺動する孔２４及び基板位置決板２９を取り付ける取付孔等が形成されている。尚、吸引孔２３は吸引手段に接続されている。
【００３３】
吸着筒２６は、基板１５を吸着する吸引孔２７が形成された筒形状をしており、吸着筒２６は上下移動手段（例えばエアシリンダ、図示省略）に接続され、ステージ本体２１の孔２４に係合して上下方向（吸着筒２６の吸着面が基板１５の下面とステージ本体２１の基板吸着面２２との間）へ摺動する。吸着筒２６は基板１５の下面まで上昇して基板１５を吸着した状態で基板吸着面２２まで下降して基板１５を吸着固定する。
【００３４】
次に、基板の吸着動作を説明する。
【００３５】
ステージ本体２１上に構成された基板位置決板２９の所に基板１５を位置決め載置する。次に、吸着筒２６が基板１５の下面まで上昇すると同時に、吸引手段が稼動し基板１５が吸着筒２６に吸着される。基板１５を吸着した吸着筒２６がステージ本体２１の上面まで下降し、ステージ本体２１の吸引孔２３と共に基板１５を吸引してステージ本体２１の基板吸着面２２に吸着固定する。そして、ワイヤボンディングが行われる。
【００３６】
以上説明したように本実施例によれば、吸着筒２６が基板１５の下面とステージ本体２１の基板吸着面２２との間を移動するので、浮いた基板１５の部分に吸着筒２６の吸着面を当接させることができ、基板１５と吸着筒２６の吸着面との隙間が小さくなり基板１５を吸引する吸引効率が向上する。吸引効率が向上することにより、基板１５が反っていても基板１５をステージ本体２１の基板吸着面２２に密着した状態で吸着固定することができる。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。
【００３７】
次に、本発明の第２実施例を図２を用いて説明する。
【００３８】
図２は本発明の第２実施例の基板固定装置の一部を示す概略構成図で、（ａ）は基板固定前の状態の側断面図、（ｂ）は基板固定後の状態の側断面図である。尚、第２実施例は第１実施例と同じ構成については同じ符号を付し説明を省略する。
【００３９】
３０は基板吸着ステージで、ステージ本体３１、基板位置決板２９、基板引着部３１及び吸引手段（図示省略）等により構成されている。
【００４０】
ステージ本体３１には基板１５をステージ本体３１の基板吸着面３２に吸着する吸引孔３３と、基板引着部３５が挿通する孔３４及び基板位置決板２９を取り付ける取付孔等が形成されている。尚、吸引孔３３は吸引手段に接続されている。
【００４１】
基板引着部３５は、基板押さえ部３６、上下動手段（例えばエアシリンダ、図示省略）及び回転手段（例えば回転式のエアシリンダ、図示省略）等により構成されている。基板押さえ部３６はＴ字形状をしており、軸３７の先端部には基板１５を挟着する基板押面３８が形成されており、軸３７の下端部には上下動手段（図示省略）及び回転手段（図示省略）に接続されている。尚、基板１５には基板押さえ部３６を通すための孔１７が予め設けられている。
【００４２】
次に、基板の吸着動作を説明する。
【００４３】
ステージ本体３１上に構成された基板位置決板２９に基板１５を載置し位置決めする。次に、基板引着部３５の基板押さえ部３６の基板押面３８が基板１５の表面を通過する位置まで上昇し、基板引着部３５を１８０度回転させ、その状態で上下動手段を稼働させ、基板押さえ部３６を下降させて基板１５を基板吸着面３２に引着すると同時に吸引手段を稼働させて基板１５を吸着固定する。そして、ワイヤボンディングが行われる。
【００４４】
以上説明したように本実施例においては、基板押面３８により基板１５をステージ本体３１の基板吸着面３２に挟着するので、基板１５が反っていても基板１５をステージ本体３１の基板吸着面３２に密着した状態で吸着固定することができる。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。尚、本実施例では基板１５には基板押さえ部３６を通すための孔１７を設けたが、その他に複数枚の基板を並べ基板押さえ部３６の基板押面３８で基板１５の端部を圧着して固定することもできる。
【００４５】
次に、本発明の第３実施例を図３を用いて説明する。
【００４６】
図３は本発明の第３実施例の基板固定装置の一部を示す概略構成図で、（ａ）は基板固定状態の側断面図、（ｂ）はＡ部拡大図である。尚、第３実施例は第１実施例の一部を変更したものであり、第１実施例と同じ構成については同じ符号を付し説明を省略する。
【００４７】
４０は基板１５を吸着固定する基板吸着ステージで、ステージ本体４１と基板位置決板２９及び吸引手段（図示省略）等により構成されている。ステージ本体４１には基板１５をステージ本体４１の基板吸着面４２に吸着する吸引孔４３と、基板吸着面４２には基板１５に形成された孔（例えば、スルーホール１６等）に挿入する凸部４４と、基板位置決板２９を取り付ける取付孔等が形成されている。尚、凸部４４はスルーホール１６の全ての孔に対応した位置に形成される。また、吸引孔４３は吸引手段に接続されている。
【００４８】
以上説明したように本実施例においては、ステージ本体４１の基板吸着面４２に基板１５に形成されたスルーホール１６等の孔に挿入する凸部４４が形成されていおり、凸部４４でスルーホール１６等の孔が塞がれるのでステージ本体４１の吸引効率が向上する。吸引効率が向上することにより、基板１５にスルーホール１６等の孔が形成されていても基板１５を基板吸着面４２に密着した状態で吸着固定することができる。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。尚、本実施例ではスルーホール孔について説明したが、その他の孔例えば角孔等の孔についても同じように、基板吸着面４２に孔の形状に係合する凸部を形成することにより同じ効果を得ることができる。
【００４９】
次に、本発明の第４実施例を図４を用いて説明する。
【００５０】
図４は本発明の第４実施例の基板固定装置の一部を示す概略構成図で、（ａ）は基板固定状態の側断面図、（ｂ）はＢ部拡大図である。尚、第４実施例は第１実施例と同じ構成については同じ符号を付し説明を省略する。
【００５１】
４５は基板１５を吸着固定する基板吸着ステージで、ステージ本体４６、基板位置決板２９及び吸引手段（図示省略）等により構成されている。
【００５２】
ステージ本体４６には基板１５をステージ本体４６の基板吸着面４７に吸着する吸引孔４８と、基板位置決板２９を取り付ける取付孔等が形成されている。尚、吸引孔４８は吸引手段に接続されている。
【００５３】
４９はシートで、基板１５をステージ本体４６の基板吸着面４７に吸着する際に、基板１５に形成された孔（例えば、スルーホール１６等）を塞ぐためのものである。シート４９にはベアチップ１０のワイヤボンディング部や、その他の例えば大型の電子部品等の部分だけ孔が形成されており、基板１５のスルーホール１６の部分はシート４９で塞ぐようになっている。シート４９の材料には基板１５の表面に沿い易く、また、スルーホール１６をはじめその他の孔を塞ぎ易いように例えば薄いビニルシート等が用いられる。
【００５４】
以上説明したように本実施例においては、基板１５をステージ本体４６の基板吸着面４７に吸着させる際に、基板１５にシート４９を被せることにより、基板１５に形成されたスルーホール１６等の孔が図４（ｂ）に示すように塞がれるので、ステージ本体４６の吸引効率が向上する。吸引効率が向上することにより、基板１５にスルーホール１６等の孔が形成されていても、基板１５を基板吸着面４７に密着した状態で吸着固定することができる。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。
【００５５】
次に、本発明の第５実施例を図５を用いて説明する。
【００５６】
図５は本発明の第５実施例の基板固定装置の一部を示す概略構成側断面図である。尚、第５実施例は第１実施例と同じ構成については同じ符号を付し説明を省略する。
【００５７】
５０は基板１５を吸着固定する基板吸着ステージで、ステージ本体５１と基板位置決板２９及び吸引手段（図示省略）等により構成されている。ステージ本体５１の基板吸着面５２は、基板１５の反りの度合に合わせて略反りに近い形状（本例凸面形状）に予め形成されている。また、ステージ本体５１には基板１５を基板吸着面５２に吸着する吸引孔５３と、基板位置決板２９を取り付ける取付孔等が形成されている。尚、吸引孔５３は吸引手段に接続されている。
【００５８】
以上説明したように本実施例においては、ステージ本体５１の基板吸着面５２を、基板１５の反りに略近い形状に形成することにより、基板吸着面５２と基板１５との隙間がなくなり、ステージ本体５１の吸引効率が向上するので、基板１５が基板吸着面５２に密着した状態で吸着固定される。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。尚、本実施例ではステージ本体５１の基板吸着面５２を基板１５の反りに略近い凸面形状に形成したが、基板１５が本例と逆反りの場合には基板吸着面５２を基板１５の反りに略近い凹面形状に形成にすることにより同じような効果を得ることができる。
【００５９】
次に、本発明の第６実施例を図６を用いて説明する。
【００６０】
図６は本発明の第６実施例の基板固定装置の一部を示す概略構成側断面図である。尚、第６実施例は第４実施例の一部を変更したものであり、その他については第４実施例と略同じであるので同じ構成については同じ符号を付し説明を省略する。
【００６１】
５５は高圧エアー噴射用のエアーノズルで、 基板吸着ステージ４５のステージ本体４６の上方に設けられており、ステージ本体４６に載置した基板１５に高圧エアーを吹き付けて、基板１５を基板吸着面４７に密着させるためのものである。エアーノズル５５は、基板１５の反りの大きさ、基板１５の面積、基板１５の形状等により設置数量、設置位置及びエアー圧等を決める。
【００６２】
次に、基板の吸着動作を説明する。
【００６３】
ステージ本体４５上に構成された基板位置決板２９に基板１５を載置し位置決めする。次に、位置決めされた基板１５の上にエアーノズル５５から高圧エアーを吹き付けて、基板１５を基板吸着面４７に密着させると同時にステージ本体４５の吸引孔４８より吸引し基板吸着面４７に吸着固定する。そして、ワイヤボンディングが行われる。
【００６４】
以上説明したように本実施例においては、ステージ本体４６に載置した基板１５に高圧エアーを吹き付けるので、基板吸着面４７と基板１５との隙間がなくなり、ステージ本体４６の吸引効率が向上する。吸引効率が向上することにより、基板１５が反っていても基板１５を基板吸着面４７に密着した状態で吸着固定することができる。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。その他に、常温の高圧エアーの代わりに高温の高圧エアーを用いることにより、特に、金線を用いたワイヤボンディングの品質が向上する。
【００６５】
次に、本発明の第７実施例を図７を用いて説明する。
【００６６】
図７は本発明の第７実施例の基板固定装置の一部を示す概略構成側断面図である。尚、第７実施例は第１実施例と同じ構成については同じ符号を付し説明を省略する。
【００６７】
６０は基板１５を吸着固定する基板吸着ステージで、ステージ本体６１と基板位置決板（図示省略）、基板押さえ６５及び充填材供給手段（図示省略）等により構成されている。
【００６８】
ステージ本体６１には基板１５とステージ本体６１の基板固定面６２との隙間に充填材６８を供給する充填材供給孔６３と、基板位置決板を取り付ける取付孔等が形成されている。尚、充填材供給孔６３は充填材供給手段に接続されている。
【００６９】
基板押さえ６５は基板位置決板により位置決めされた基板１５を基板固定面６２に押さえ付けるもので、基板押部６６と垂直部６７とからなり垂直部６７の下端が上下方向へ移動する移動手段（例えばエアーシリンダ、図示省略）に接続されている。
【００７０】
充填材６８は、基板１５の下面とステージ本体６１の基板固定面６２との隙間を埋める部材である。充填材６８には例えば熱を加えることにより流動化し、常温で固化する充填材、例えばアピエゾンワックス（英国アピエゾン社製のワックス）６８等が用いられる。
【００７１】
次に、基板の固定動作を説明する。
【００７２】
ステージ本体６１に構成された基板位置決部に基板１５を載置し、基板押さえ６５を下降させ位置決めされた基板１５をステージ本体６１の基板固定面６２に押圧固定する。次に、基板１５の下面と基板固定面６２との隙間（基板１５の反りにより発生する隙間）に、充填材供給手段を稼働させ、加熱して流動化したアピエゾンワックス６８をステージ本体６１の充填材供給孔６３から充填し冷却させて固定する。そして、ワイヤボンディングが行われる。尚、ワイヤボンディングが完了した基板１５を取り出し、基板１５に付着したアピエゾンワックスは必要により加熱して除去する。
【００７３】
以上説明したように本実施例においては、基板１５の下面とステージ本体６１の基板固定面６２との隙間を充填材６８により埋めることにより隙間がなくなる。また、基板押さえ６５により基板１５をステージ本体６１の基板固定面６２に密着した状態で固定することができる。従って、基板１５に反りがあっても安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。尚、本実施例では充填材６８にアピエゾンワックスを用いたが、その他に例えば蝋材等を用いることもできる。
【００７４】
次に、本発明の第８実施例を図８を用いて説明する。
【００７５】
図８は本発明の第８実施例の基板固定装置の一部を示す概略構成側断面図である。尚、第８実施例は充填材を除き第７実施例と略同じであるので同じ構成については同じ符号を付し説明を省略する。
【００７６】
６０は基板１５を吸着固定する基板吸着ステージで、ステージ本体６１と基板位置決板（図示省略）、基板押さえ６５及び充填材供給手段（図示省略）等により構成されている。
【００７７】
ステージ本体６１には基板１５とステージ本体６１の基板固定面６２との隙間に充填材７０を供給する充填材供給孔６３と、基板位置決板を取り付ける取付孔等が形成されている。尚、充填材供給手段は充填材７０の吐出及び吸入が可能でステージ本体６１の充填材供給孔６３に接続されている。
【００７８】
充填材７０は、基板１５の下面とステージ本体６１の基板固定面６２との隙間を埋める部材である。充填材７０には例えばアルミナ等の粉末が用いられる。
【００７９】
次に、基板の吸着動作を説明する。
【００８０】
ステージ本体６１に構成された基板位置決板に基板１５を載置し、基板押さえ６５を下降させ位置決めされた基板１５をステージ本体６１の基板固定面６２に押さえ付ける。次に、基板１５の下面と基板固定面６２との隙間（基板１５の反りにより発生する隙間）に、充填材供給手段を稼働させ、ステージ本体６１の充填材供給孔６３から充填材（アルミナの粉末）７０を充填する。そして、ワイヤボンディングが行われる。ワイヤボンディングが完了した時点で、充填材供給手段を吸入モードに切替え、アルミナの粉末７０を充填材供給手段の方へ吸入して回収する。
【００８１】
以上説明したように本実施例においては、基板１５の下面とステージ本体６１の基板固定面６２との隙間をアルミナの粉末７０により埋めることにより該隙間がなくなる。また、基板押さえ６５により基板１５をステージ本体６１の基板固定面６２に密着した状態で固定することができる。従って、基板１５に反りがあっても安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。また、充填材７０に粉末を用いることにより繰り返しの使用が可能で作業性もよい。尚、本実施例では充填材７０にアルミナの粉末を用いたが、その他に例えば、ガラスの粉末または粉末以外に微小球等を用いることもできる。
【００８２】
次に、本発明の第９実施例を図９を用いて説明する。
【００８３】
図９は本発明の第９実施例の基板固定装置の一部を示す概略構成図で、（ａ）は側断面図、（ｂ）はＣ部拡大図である。尚、第９実施例は一部を除き第４実施例と略同じであるので同じ構成については同じ符号を付し説明を省略する。
【００８４】
７５は基板で、ベアチップ１０をはじめ電子部品を実装するパターン（いずれも図示省略）及びスルーホール１６等が形成されている。基板１５はベアチップ１０と基板１５に形成された接続パターンとのワイヤボンディングの際に、基板１５を基板吸着ステージ４５のステージ本体４６に吸着固定して行うが、図示するように基板１５に例えばスルーホール１６が開いていると、ステージ本体４６の吸引効率が低下し、基板１５がステージ本体４６の基板吸着面４７から浮いた状態となり、安定したワイヤボンディングができなくなる。この対策として基板１５を加工する段階で他の印刷と同じ工程でシルクまたはレジスト印刷等により図９（ｂ）の拡大図で示すようにスルーホール１６の表面に蓋７６を形成し予め塞いでいる。
【００８５】
以上説明したように本実施例においては、基板１５に形成されたスルーホール１６が基板製作の段階で予め塞がれているので、ステージ本体４６の吸引効率が向上する。吸引効率が向上することにより、基板１５を基板吸着面４７に密着した状態で吸着固定することができる。従って、安定したワイヤボンディングが可能となり、ワイヤボンディング品質を向上させることができる。尚、本実施例では電子部品がベアチップ１０であるワイヤボンディングに適用したが、その他に表面実装部品の実装等に適用することも可能である。
【００８６】
【発明の効果】
以上説明したように本発明によれば、基板の反りに関係なく基板を安定した状態で所定の位置に固定することができるので、特に高品質のワイヤボンディングが可能となる。
【図面の簡単な説明】
【図１】本発明の第１実施例の基板固定装置の一部を示す概略構成図である。
【図２】本発明の第２実施例の基板固定装置の一部を示す概略構成図である。
【図３】本発明の第３実施例の基板固定装置の一部を示す概略構成図である。
【図４】本発明の第４実施例の基板固定装置の一部を示す概略構成図である。
【図５】本発明の第５実施例の基板固定装置の一部を示す概略構成側断面図である。
【図６】本発明の第６実施例の基板固定装置の一部を示す概略構成側断面図である。
【図７】本発明の第７実施例の基板固定装置の一部を示す概略構成側断面図である。
【図８】本発明の第８実施例の基板固定装置の一部を示す概略構成側断面図である。
【図９】本発明の第９実施例の基板固定装置の一部を示す概略構成図である。
【図１０】従来の基板固定装置の一部を示す概略構成側断面図である。
【符号の説明】
１０・・・・・・・・ベアチップ
１５，７５・・・・・基板
１６・・・・・・・・スルーホール
１７，２４，３４・・孔
２０，３０，４０，４５，５０，６０・・基板吸着ステージ
２１，３１，４１，４６，５１，６１・・ステージ本体
２２，３２，４２，４７，５２・・・・・基板吸着面
２３，２７，３３，４３，４８，５３・・吸引孔
２６・・・・・吸着筒
２９・・・・・基板位置決板
３５・・・・・基板引着部
３６・・・・・基板押さえ部
３７・・・・・軸
３８・・・・・基板押面
４４・・・・・凸部
４９・・・・・シート
５５・・・・・エアーノズル
６２・・・・・基板固定面
６３・・・・・充填材供給孔
６５・・・・・基板押さえ
６６・・・・・基板押部
６７・・・・・垂直部
６８・・・・・充填材（アピエゾンワックス）
７０・・・・・充填材（アルミナの粉末）
７６・・・・・蓋[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate fixing device for fixing a substrate and a structure for fixing the substrate, and more particularly to a device to which wire bonding for connecting a bare chip mounted on a substrate and the substrate is applied.
[0002]
[Prior art]
A substrate fixing structure of a conventional wire bonding apparatus will be described with reference to FIG.
[0003]
FIG. 10 is a schematic sectional side view showing a part of a conventional substrate fixing apparatus.
[0004]
Reference numeral 90 denotes a substrate suction for fixing and fixing the substrate 85 on which the bare chip 80 as an electronic component is mounted and wire bonding between the terminal of the bare chip 80 and the connection pattern formed on the substrate 85. It is a stage. The substrate suction stage 90 includes a stage main body 91, a substrate positioning plate 95, suction means (vacuum generator, not shown), and the like. The stage main body 91 is formed with a suction hole 93 for adsorbing the substrate 85 to the substrate adsorption surface 92 of the stage main body 91 and an attachment hole for attaching the substrate positioning plate 95. The suction hole 93 is connected to suction means.
[0005]
Next, the adsorption operation of the substrate will be described.
[0006]
The substrate 85 is positioned and placed on the substrate positioning plate 95 configured on the stage main body 91. Next, the suction means is operated to suck and fix the substrate 85 to the substrate suction surface 92 of the stage body 91. Then, wire bonding is performed.
[0007]
[Problems to be solved by the invention]
However, in the above-described substrate suction stage 90, when the substrate 85 is warped largely, the substrate 85 cannot be attracted to the substrate suction surface 92 of the stage body 91, and the substrate 85 is lifted from the substrate suction surface 92. As a result, the wire bonding quality is degraded. Further, even when a hole such as a through hole is formed in the substrate 85, the adsorption efficiency for adsorbing the substrate 85 is deteriorated, and the substrate 85 cannot be adsorbed to the substrate adsorption surface 92, and the substrate 85 floats from the substrate adsorption surface 92. As a result, the wire bonding quality is degraded.
[0008]
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate fixing device and a substrate fixing structure capable of particularly high-quality wire bonding regardless of the warp of the substrate.
[0009]
[Means for Solving the Problems]
The present invention achieves the above-described object. In a substrate fixing apparatus for fixing a substrate on which electronic components are mounted, a suction stage in which a suction hole is formed and the substrate is fixed to the upper surface thereof, and a position below the substrate. A suction cylinder provided with a suction hole so as to pass through the suction stage, a suction means for sucking the substrate through both suction holes, and the suction cylinder being moved in the vertical direction. The vertical movement means comprises the vertical movement means, wherein the vertical movement means raises the suction cylinder to the lower surface of the substrate and lowers the substrate while directly sucking the substrate, and sucks and fixes the substrate to the upper surface of the suction stage. Is.
[0010]
Further, the suction cylinder is provided below the mounting position of the electronic component.
[0011]
Further, in a substrate fixing device for fixing a substrate on which an electronic component is mounted, a suction stage in which a suction hole is formed to fix the substrate to the upper surface thereof, a suction means for sucking the substrate through the suction hole, and the suction stage And a substrate attachment means provided so as to pass through the hole provided in the substrate, and having a substrate attachment portion that holds the substrate to the suction stage while pressing the upper surface of the substrate, and the substrate attachment And a vertical movement means for moving the means in the vertical direction. The vertical movement means raises the substrate attracting means, and the substrate attracting portion penetrates the suction stage and the hole of the substrate. After projecting upward, the substrate attracting means descends and the substrate attracting part descends to press the upper surface of the substrate and attract the substrate to the upper surface of the suction stage. Ah .
[0012]
Further, the substrate attracting portion has a holding portion having a T-shape, and is rotated after a predetermined angle above the substrate and then descends.
[0013]
Further, in a substrate fixing device for fixing a substrate on which an electronic component is mounted, a suction stage for forming a suction hole and a convex portion for closing the hole formed in the substrate, and suction-fixing the substrate on the upper surface thereof, and the suction And a suction means for sucking the substrate through a hole, wherein the substrate is sucked and fixed to the upper surface of the suction stage in a state where the hole formed in the substrate is closed by the convex portion.
[0014]
Further, in a substrate fixing device for fixing a substrate on which an electronic component is mounted, a suction stage in which a suction hole is formed and sucking and fixing the substrate to the upper surface thereof, a sheet covering the hole formed in the substrate, and the suction hole And sucking and fixing the substrate to the upper surface of the suction stage in a state where the sheet is covered from the upper surface of the hole of the substrate.
[0016]
Further, in the substrate fixing device for fixing the substrate on which the electronic component is mounted, the suction stage includes a suction stage in which a suction hole is formed and suction-fixes the substrate to the upper surface thereof, and a suction unit that sucks the substrate through the suction hole. The air nozzle is provided above the suction stage and blows pressure against the upper surface of the substrate, and high-pressure air supply means for supplying high-pressure air to the air nozzle. The substrate is sucked and fixed to the upper surface of the suction stage while being pressed against the upper surface of the suction stage.
[0017]
Further, hot air is used for the high-pressure air.
[0018]
Further, in a substrate fixing apparatus for fixing a substrate on which an electronic component is mounted, a substrate attachment in which a stage for positioning and fixing the substrate on an upper surface thereof and an attachment claw for attaching an end of the substrate to the stage are formed. And a filler supply means for filling the gap between the lower surface of the substrate positioned on the upper surface of the stage by the substrate attracting means and the upper surface of the stage. .
[0019]
Further, the filler is a filling member whose form changes with temperature change.
[0020]
Further, the filler is a powder.
[0021]
Further, the filler is a fine particle.
[0022]
Further, in a substrate fixing apparatus for fixing a substrate on which an electronic component is mounted and a through hole is formed, a suction stage in which a suction hole is formed and suction-fixes the substrate to the upper surface thereof, and the substrate is sucked through the suction hole. The substrate is sucked and fixed to the upper surface of the suction stage in a state where the upper surface of the through hole is covered with a filling member.
[0023]
In addition, a paint is used for the filling member.
[0024]
Further, a resist member is used as the filling member.
[0025]
Further, in the substrate fixing structure in which the electronic component is mounted and the through hole is formed and is fixed to the upper surface of the suction stage, before the suction fixing to the upper surface of the suction stage, the above-mentioned The upper surface of the through hole is covered with a filling member.
[0026]
In addition, a paint is used for the filling member.
[0027]
Further, a resist member is used as the filling member.
[0028]
The electronic component is a bare chip, and the bare chip is wire-bonded on the fixed substrate.
[0029]
【Example】
A first embodiment of the present invention will be described with reference to FIG.
[0030]
FIG. 1 is a schematic configuration diagram showing a part of a substrate fixing apparatus according to a first embodiment of the present invention. FIG. 1A is a side sectional view showing a state in which a substrate is adsorbed by an adsorption cylinder, and FIG. It is a sectional side view which shows the state adsorbed to.
[0031]
Reference numeral 20 denotes a substrate suction stage that sucks and fixes a substrate on which a bare chip 10 as an electronic component is mounted, and sucks and fixes the substrate 15 to wire-bond between a terminal of the bare chip 10 and a connection pattern formed on the substrate 15. It is. The substrate suction stage 20 includes a stage body 21, a suction cylinder 26, a substrate positioning plate 29, suction means (vacuum generator, not shown), and the like.
[0032]
The stage main body 21 is formed with a suction hole 23 for adsorbing the substrate 15 to the substrate adsorption surface 22 of the stage main body 21, a hole 24 for the adsorption cylinder 26 to slide in the vertical direction, and a mounting hole for attaching the substrate positioning plate 29. Yes. The suction hole 23 is connected to suction means.
[0033]
The suction cylinder 26 has a cylindrical shape in which a suction hole 27 for sucking the substrate 15 is formed. The suction cylinder 26 is connected to a vertical movement means (for example, an air cylinder, not shown) and is connected to the hole 24 of the stage main body 21. Engage and slide in the vertical direction (the suction surface of the suction cylinder 26 is between the lower surface of the substrate 15 and the substrate suction surface 22 of the stage body 21). The suction cylinder 26 rises to the lower surface of the substrate 15 and lowers to the substrate suction surface 22 in a state where the substrate 15 is sucked, thereby fixing the substrate 15 by suction.
[0034]
Next, the adsorption operation of the substrate will be described.
[0035]
The substrate 15 is positioned and placed on the substrate positioning plate 29 formed on the stage main body 21. Next, at the same time when the suction cylinder 26 rises to the lower surface of the substrate 15, the suction means is activated and the substrate 15 is sucked by the suction cylinder 26. The suction cylinder 26 that sucks the substrate 15 descends to the upper surface of the stage main body 21, sucks the substrate 15 together with the suction holes 23 of the stage main body 21, and sucks and fixes the substrate 15 to the substrate suction surface 22 of the stage main body 21. Then, wire bonding is performed.
[0036]
As described above, according to the present embodiment, the suction cylinder 26 moves between the lower surface of the substrate 15 and the substrate suction surface 22 of the stage body 21, so that the suction surface of the suction cylinder 26 is placed on the floating substrate 15. Since the gap between the substrate 15 and the suction surface of the suction cylinder 26 is reduced, the suction efficiency for sucking the substrate 15 is improved. By improving the suction efficiency, even if the substrate 15 is warped, the substrate 15 can be sucked and fixed while being in close contact with the substrate suction surface 22 of the stage main body 21. Therefore, stable wire bonding is possible, and wire bonding quality can be improved.
[0037]
Next, a second embodiment of the present invention will be described with reference to FIG.
[0038]
FIGS. 2A and 2B are schematic configuration diagrams showing a part of a substrate fixing apparatus according to a second embodiment of the present invention, in which FIG. 2A is a side sectional view before fixing the substrate, and FIG. 2B is a side sectional view after fixing the substrate. FIG. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
[0039]
Reference numeral 30 denotes a substrate suction stage, which includes a stage main body 31, a substrate positioning plate 29, a substrate attracting portion 31, suction means (not shown), and the like.
[0040]
The stage main body 31 is formed with a suction hole 33 for adsorbing the substrate 15 to the substrate adsorption surface 32 of the stage main body 31, a hole 34 through which the substrate attaching portion 35 is inserted, an attachment hole for attaching the substrate positioning plate 29, and the like. . The suction hole 33 is connected to suction means.
[0041]
The substrate attracting part 35 includes a substrate pressing part 36, vertical movement means (for example, an air cylinder, not shown), rotation means (for example, a rotary air cylinder, not shown), and the like. The substrate pressing portion 36 has a T-shape, and a substrate pressing surface 38 for sandwiching the substrate 15 is formed at the tip portion of the shaft 37, and a vertical movement means (not shown) is provided at the lower end portion of the shaft 37. And rotating means (not shown). The substrate 15 is provided with a hole 17 through which the substrate pressing portion 36 passes.
[0042]
Next, the adsorption operation of the substrate will be described.
[0043]
The substrate 15 is placed and positioned on the substrate positioning plate 29 formed on the stage main body 31. Next, the substrate pressing surface 38 of the substrate pressing portion 36 of the substrate attracting portion 35 rises to a position passing through the surface of the substrate 15, rotates the substrate attracting portion 35 by 180 degrees, and operates the vertical movement means in that state. Then, the substrate pressing portion 36 is lowered to attract the substrate 15 to the substrate suction surface 32, and at the same time, the suction means is operated to fix the substrate 15 by suction. Then, wire bonding is performed.
[0044]
As described above, in this embodiment, the substrate 15 is sandwiched between the substrate pressing surface 38 and the substrate suction surface 32 of the stage main body 31, so that the substrate 15 can be held even if the substrate 15 is warped. It can be adsorbed and fixed in close contact with 32. Therefore, stable wire bonding is possible, and wire bonding quality can be improved. In this embodiment, the substrate 15 is provided with the holes 17 for allowing the substrate pressing portion 36 to pass therethrough. In addition, a plurality of substrates are arranged and the end of the substrate 15 is crimped by the substrate pressing surface 38 of the substrate pressing portion 36. Can also be fixed.
[0045]
Next, a third embodiment of the present invention will be described with reference to FIG.
[0046]
3A and 3B are schematic configuration diagrams showing a part of a substrate fixing apparatus according to a third embodiment of the present invention. FIG. 3A is a side sectional view of the substrate fixing state, and FIG. In the third embodiment, a part of the first embodiment is changed, and the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
[0047]
Reference numeral 40 denotes a substrate suction stage for sucking and fixing the substrate 15, which includes a stage body 41, a substrate positioning plate 29, suction means (not shown), and the like. The stage main body 41 has a suction hole 43 for adsorbing the substrate 15 to the substrate adsorption surface 42 of the stage main body 41, and the substrate adsorption surface 42 has a convex portion that is inserted into a hole (for example, the through hole 16) formed in the substrate 15. 44 and mounting holes for attaching the substrate positioning plate 29 are formed. The convex portions 44 are formed at positions corresponding to all the holes of the through hole 16. The suction hole 43 is connected to suction means.
[0048]
As described above, in this embodiment, the convex portion 44 to be inserted into the hole such as the through hole 16 formed in the substrate 15 is formed on the substrate suction surface 42 of the stage main body 41, and the through hole is formed by the convex portion 44. Since the holes such as 16 are closed, the suction efficiency of the stage main body 41 is improved. By improving the suction efficiency, the substrate 15 can be sucked and fixed in close contact with the substrate suction surface 42 even if holes such as the through holes 16 are formed in the substrate 15. Therefore, stable wire bonding is possible, and wire bonding quality can be improved. In the present embodiment, the through hole hole has been described. However, the same effect can be obtained by forming a convex portion that engages the shape of the hole on the substrate suction surface 42 in the same manner for other holes such as a square hole. Can be obtained.
[0049]
Next, a fourth embodiment of the present invention will be described with reference to FIG.
[0050]
4A and 4B are schematic configuration diagrams showing a part of a substrate fixing apparatus according to a fourth embodiment of the present invention. FIG. 4A is a side sectional view of the substrate fixing state, and FIG. In the fourth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
[0051]
Reference numeral 45 denotes a substrate suction stage for sucking and fixing the substrate 15, which includes a stage body 46, a substrate positioning plate 29, suction means (not shown), and the like.
[0052]
The stage main body 46 is formed with a suction hole 48 for adsorbing the substrate 15 to the substrate adsorption surface 47 of the stage main body 46 and an attachment hole for attaching the substrate positioning plate 29. The suction hole 48 is connected to suction means.
[0053]
Reference numeral 49 denotes a sheet for closing a hole (for example, the through hole 16) formed in the substrate 15 when the substrate 15 is adsorbed to the substrate adsorption surface 47 of the stage main body 46. The sheet 49 is formed with holes only in the wire bonding portion of the bare chip 10 and other portions such as large electronic components, and the through hole 16 portion of the substrate 15 is closed with the sheet 49. The material of the sheet 49 is, for example, a thin vinyl sheet so that it can easily follow the surface of the substrate 15 and can easily close other holes including the through hole 16.
[0054]
As described above, in the present embodiment, when the substrate 15 is attracted to the substrate attracting surface 47 of the stage main body 46, the sheet 49 is placed on the substrate 15 to cover the holes such as the through holes 16 formed in the substrate 15. However, as shown in FIG. 4B, the suction efficiency of the stage body 46 is improved. By improving the suction efficiency, even if holes such as the through holes 16 are formed in the substrate 15, the substrate 15 can be sucked and fixed while being in close contact with the substrate suction surface 47. Therefore, stable wire bonding is possible, and wire bonding quality can be improved.
[0055]
Next, a fifth embodiment of the present invention will be described with reference to FIG.
[0056]
FIG. 5 is a schematic side sectional view showing a part of a substrate fixing apparatus according to a fifth embodiment of the present invention. In the fifth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
[0057]
Reference numeral 50 denotes a substrate suction stage for sucking and fixing the substrate 15, and is composed of a stage main body 51, a substrate positioning plate 29, suction means (not shown), and the like. The substrate attracting surface 52 of the stage main body 51 is formed in advance in a shape (in this example, a convex shape) that is nearly warped in accordance with the degree of warping of the substrate 15. Further, the stage main body 51 is formed with a suction hole 53 for sucking the substrate 15 to the substrate suction surface 52, an attachment hole for attaching the substrate positioning plate 29, and the like. The suction hole 53 is connected to suction means.
[0058]
As described above, in the present embodiment, by forming the substrate suction surface 52 of the stage main body 51 in a shape substantially similar to the warp of the substrate 15, there is no gap between the substrate suction surface 52 and the substrate 15, and the stage main body. Since the suction efficiency of 51 is improved, the substrate 15 is sucked and fixed in a state of being in close contact with the substrate suction surface 52. Therefore, stable wire bonding is possible, and wire bonding quality can be improved. In the present embodiment, the substrate suction surface 52 of the stage main body 51 is formed in a convex shape substantially similar to the warp of the substrate 15. However, when the substrate 15 is warped in the reverse direction to this example, the substrate suction surface 52 is warped of the substrate 15. A similar effect can be obtained by forming a concave shape substantially similar to the above.
[0059]
Next, a sixth embodiment of the present invention will be described with reference to FIG.
[0060]
FIG. 6 is a schematic side sectional view showing a part of a substrate fixing apparatus according to a sixth embodiment of the present invention. The sixth embodiment is obtained by changing a part of the fourth embodiment, and the other parts are substantially the same as the fourth embodiment. Therefore, the same components are denoted by the same reference numerals and the description thereof is omitted.
[0061]
Reference numeral 55 denotes an air nozzle for high-pressure air injection, which is provided above the stage main body 46 of the substrate suction stage 45. The high-pressure air is blown onto the substrate 15 placed on the stage main body 46, so that the substrate 15 is placed on the substrate suction surface 47. It is for making it adhere to. The air nozzle 55 determines an installation quantity, an installation position, an air pressure, and the like depending on the warp size of the substrate 15, the area of the substrate 15, the shape of the substrate 15, and the like.
[0062]
Next, the adsorption operation of the substrate will be described.
[0063]
The substrate 15 is placed and positioned on the substrate positioning plate 29 formed on the stage main body 45. Next, high-pressure air is blown from the air nozzle 55 onto the positioned substrate 15 to bring the substrate 15 into close contact with the substrate suction surface 47 and at the same time, sucked through the suction holes 48 of the stage body 45 and suction fixed to the substrate suction surface 47. To do. Then, wire bonding is performed.
[0064]
As described above, in this embodiment, since high-pressure air is blown onto the substrate 15 placed on the stage main body 46, there is no gap between the substrate suction surface 47 and the substrate 15, and the suction efficiency of the stage main body 46 is improved. By improving the suction efficiency, even if the substrate 15 is warped, the substrate 15 can be sucked and fixed while being in close contact with the substrate suction surface 47. Therefore, stable wire bonding is possible, and wire bonding quality can be improved. In addition, the quality of wire bonding using a gold wire is improved by using high-temperature high-pressure air instead of room-temperature high-pressure air.
[0065]
Next, a seventh embodiment of the present invention will be described with reference to FIG.
[0066]
FIG. 7 is a schematic side sectional view showing a part of a substrate fixing apparatus according to a seventh embodiment of the present invention. In the seventh embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
[0067]
Reference numeral 60 denotes a substrate suction stage for sucking and fixing the substrate 15, and includes a stage main body 61, a substrate positioning plate (not shown), a substrate holder 65, a filler supply means (not shown), and the like.
[0068]
The stage main body 61 is formed with a filler supply hole 63 for supplying the filler 68 into a gap between the substrate 15 and the substrate fixing surface 62 of the stage main body 61, a mounting hole for attaching the substrate positioning plate, and the like. The filler supply hole 63 is connected to a filler supply means.
[0069]
The substrate holder 65 presses the substrate 15 positioned by the substrate positioning plate against the substrate fixing surface 62. The substrate holder 65 includes a substrate pressing portion 66 and a vertical portion 67, and is a moving means for moving the lower end of the vertical portion 67 in the vertical direction. For example, it is connected to an air cylinder (not shown).
[0070]
The filler 68 is a member that fills a gap between the lower surface of the substrate 15 and the substrate fixing surface 62 of the stage main body 61. As the filler 68, for example, a filler that is fluidized by applying heat and solidifies at room temperature, for example, Apiezon wax (wax made by Apiezon UK) 68 or the like is used.
[0071]
Next, the substrate fixing operation will be described.
[0072]
The substrate 15 is placed on the substrate positioning portion configured in the stage main body 61, and the substrate holder 65 is lowered to press and fix the positioned substrate 15 to the substrate fixing surface 62 of the stage main body 61. Next, the filler supply means is operated in a gap between the lower surface of the substrate 15 and the substrate fixing surface 62 (a gap generated by the warp of the substrate 15), and the heated and fluidized Apiezon wax 68 is added to the stage main body 61. It is filled from the filler supply hole 63 and cooled and fixed. Then, wire bonding is performed. In addition, the board | substrate 15 which wire bonding was completed is taken out, and the Apiezone wax adhering to the board | substrate 15 is heated and removed as needed.
[0073]
As described above, in this embodiment, the gap is eliminated by filling the gap between the lower surface of the substrate 15 and the substrate fixing surface 62 of the stage body 61 with the filler 68. Further, the substrate 15 can be fixed in close contact with the substrate fixing surface 62 of the stage main body 61 by the substrate presser 65. Accordingly, stable wire bonding is possible even when the substrate 15 is warped, and the wire bonding quality can be improved. In this embodiment, Apiezon wax is used for the filler 68, but other materials such as wax can also be used.
[0074]
Next, an eighth embodiment of the present invention will be described with reference to FIG.
[0075]
FIG. 8 is a schematic side sectional view showing a part of a substrate fixing apparatus according to an eighth embodiment of the present invention. Since the eighth embodiment is substantially the same as the seventh embodiment except for the filler, the same components are denoted by the same reference numerals and description thereof is omitted.
[0076]
Reference numeral 60 denotes a substrate suction stage for sucking and fixing the substrate 15, and includes a stage main body 61, a substrate positioning plate (not shown), a substrate holder 65, a filler supply means (not shown), and the like.
[0077]
The stage main body 61 is formed with a filler supply hole 63 for supplying the filler 70 into a gap between the substrate 15 and the substrate fixing surface 62 of the stage main body 61, an attachment hole for attaching the substrate positioning plate, and the like. The filler supply means can discharge and suck the filler 70 and is connected to the filler supply hole 63 of the stage body 61.
[0078]
The filler 70 is a member that fills a gap between the lower surface of the substrate 15 and the substrate fixing surface 62 of the stage main body 61. For the filler 70, powder such as alumina is used.
[0079]
Next, the adsorption operation of the substrate will be described.
[0080]
The substrate 15 is placed on the substrate positioning plate configured in the stage main body 61, and the substrate presser 65 is lowered to press the positioned substrate 15 against the substrate fixing surface 62 of the stage main body 61. Next, the filler supply means is operated in the gap between the lower surface of the substrate 15 and the substrate fixing surface 62 (the gap generated by the warp of the substrate 15), and the filler (alumina) Powder) 70 is filled. Then, wire bonding is performed. When the wire bonding is completed, the filler supply means is switched to the suction mode, and the alumina powder 70 is sucked into the filler supply means and collected.
[0081]
As described above, in this embodiment, the gap between the lower surface of the substrate 15 and the substrate fixing surface 62 of the stage body 61 is filled with the alumina powder 70 to eliminate the gap. Further, the substrate 15 can be fixed in close contact with the substrate fixing surface 62 of the stage main body 61 by the substrate presser 65. Accordingly, stable wire bonding is possible even when the substrate 15 is warped, and the wire bonding quality can be improved. Further, by using powder for the filler 70, it can be used repeatedly and has good workability. In this embodiment, alumina powder is used as the filler 70, but other than this, for example, microspheres can be used in addition to glass powder or powder.
[0082]
Next, a ninth embodiment of the present invention will be described with reference to FIG.
[0083]
9A and 9B are schematic configuration views showing a part of a substrate fixing apparatus according to a ninth embodiment of the present invention. FIG. 9A is a side sectional view and FIG. Since the ninth embodiment is substantially the same as the fourth embodiment except for a part thereof, the same components are denoted by the same reference numerals and description thereof is omitted.
[0084]
Reference numeral 75 denotes a substrate on which a pattern (both not shown) for mounting electronic components including the bare chip 10 and through holes 16 are formed. The substrate 15 is formed by adsorbing and fixing the substrate 15 to the stage body 46 of the substrate adsorption stage 45 during wire bonding between the bare chip 10 and the connection pattern formed on the substrate 15. If the hole 16 is open, the suction efficiency of the stage body 46 is lowered, and the substrate 15 is lifted from the substrate suction surface 47 of the stage body 46, so that stable wire bonding cannot be performed. As a countermeasure against this, a lid 76 is formed on the surface of the through-hole 16 and closed in advance at the stage of processing the substrate 15 as shown in the enlarged view of FIG. 9B by silk or resist printing in the same process as other printing. .
[0085]
As described above, in the present embodiment, since the through hole 16 formed in the substrate 15 is closed in advance at the stage of substrate manufacture, the suction efficiency of the stage body 46 is improved. By improving the suction efficiency, the substrate 15 can be sucked and fixed while being in close contact with the substrate suction surface 47. Therefore, stable wire bonding is possible, and wire bonding quality can be improved. In this embodiment, the electronic component is applied to the wire bonding in which the bare chip 10 is used. However, the present invention can also be applied to mounting of a surface mount component.
[0086]
【The invention's effect】
As described above, according to the present invention, since the substrate can be fixed at a predetermined position in a stable state regardless of the warp of the substrate, particularly high-quality wire bonding is possible.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing a part of a substrate fixing apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic configuration diagram showing a part of a substrate fixing apparatus according to a second embodiment of the present invention.
FIG. 3 is a schematic configuration diagram showing a part of a substrate fixing apparatus according to a third embodiment of the present invention.
FIG. 4 is a schematic configuration diagram showing a part of a substrate fixing apparatus according to a fourth embodiment of the present invention.
FIG. 5 is a schematic side sectional view showing a part of a substrate fixing apparatus according to a fifth embodiment of the present invention.
FIG. 6 is a schematic side sectional view showing a part of a substrate fixing apparatus according to a sixth embodiment of the present invention.
FIG. 7 is a schematic side sectional view showing a part of a substrate fixing apparatus according to a seventh embodiment of the present invention.
FIG. 8 is a schematic side sectional view showing a part of a substrate fixing apparatus according to an eighth embodiment of the present invention.
FIG. 9 is a schematic configuration diagram showing a part of a substrate fixing apparatus according to a ninth embodiment of the present invention.
FIG. 10 is a schematic sectional side view showing a part of a conventional substrate fixing apparatus.
[Explanation of symbols]
10 ... Bare chip
15,75 ... Board
16 ... through hole
17, 24, 34 .. hole
20, 30, 40, 45, 50, 60 .. Substrate adsorption stage
21, 31, 41, 46, 51, 61 ... Stage body
22, 32, 42, 47, 52 ... Substrate adsorption surface
23, 27, 33, 43, 48, 53 .. Suction hole
26 …… Adsorption cylinder
29 …… Substrate positioning plate
35 .. Board attachment part
36 .... Board holding part
37 ... axis
38 ・ ・ ・ ・ ・ Substrate pressing surface
44 ... Convex
49 ... Sheet
55 ... Air nozzle
62 .. substrate fixing surface
63 ... Filler supply hole
65 .. Board holding
66 .. substrate pressing part
67 ・ ・ ・ ・ ・ Vertical section
68 .. Filler (Apiezon Wax)
70 ... Filler (alumina powder)
76 ... Lid

Claims (9)

電子部品が搭載された基板を固定する基板固定装置において、
吸引孔が形成され前記基板をその上面に固定する吸着ステージと、
前記基板より下方に位置するものであって、吸引孔を有し前記吸着ステージを貫通するように設けられた吸着筒と、
前記両方の吸引孔を通して前記基板を吸引する吸引手段と、
前記吸着筒を上下方向へ移動させる上下移動手段とからなり、
前記上下移動手段により前記吸着筒が前記基板の下面まで上昇し該基板を直接吸着した状態で下降し該基板を前記吸着ステージの上面に吸着固定することを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic components are mounted,
A suction stage in which a suction hole is formed and the substrate is fixed to the upper surface;
An adsorption cylinder that is located below the substrate and has a suction hole and is provided so as to penetrate the adsorption stage;
A suction means for sucking the substrate through both the suction holes;
Comprising a vertical movement means for moving the suction cylinder in the vertical direction;
The substrate fixing apparatus characterized in that the suction cylinder rises to the lower surface of the substrate by the vertical movement means and descends in a state of directly adsorbing the substrate, and the substrate is sucked and fixed to the upper surface of the suction stage. 電子部品が搭載された基板を固定する基板固定装置において、
吸引孔が形成され前記基板をその上面に固定する吸着ステージと、
前記吸引孔を通して前記基板を吸引する吸引手段と、
前記吸着ステージ及び前記基板に設けた孔を貫通するように設けられ、前記基板の上面を押さえて該基板を該吸着ステージに引着する基板引着部が形成された基板引着手段と、
前記基板引着手段を上下方向へ移動させる上下移動手段とからなり、
前記上下移動手段により、前記基板引着手段が上昇すると共に前記基板引着部が前記吸着ステージ及び前記基板の孔を貫通して該基板の上方に突出した後、該基板引着手段が下降すると共に該基板引着部が下降して前記基板の上面を押さえて該基板を該吸着ステージの上面に引着することを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic components are mounted,
A suction stage in which a suction hole is formed and the substrate is fixed to the upper surface;
Suction means for sucking the substrate through the suction holes;
A substrate attaching means provided so as to pass through the holes provided in the suction stage and the substrate, and having a substrate attachment portion for holding the substrate to the adsorption stage while pressing the upper surface of the substrate;
It consists of vertical movement means for moving the substrate attracting means in the vertical direction,
The substrate moving means rises by the vertical moving means, and the substrate attracting means descends after the substrate attracting portion passes through the suction stage and the hole of the substrate and protrudes above the substrate. A substrate fixing apparatus, wherein the substrate attracting part descends and presses the upper surface of the substrate to attract the substrate to the upper surface of the suction stage. 電子部品が搭載された基板を固定する基板固定装置において、
吸引孔と前記基板に形成された孔を塞ぐ凸部とが形成され該基板をその上面に吸着固定する吸着ステージと、
前記吸引孔を通して前記基板を吸引する吸引手段とからなり、前記凸部により前記基板に形成された孔を塞いだ状態で該基板を前記吸着ステージの上面に吸着固定することを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic components are mounted,
A suction stage in which a suction hole and a convex portion for closing the hole formed in the substrate are formed, and the substrate is sucked and fixed to the upper surface;
And a suction means for sucking the substrate through the suction hole, wherein the substrate is sucked and fixed to the upper surface of the suction stage in a state where the hole formed in the substrate is closed by the convex portion. apparatus. 電子部品が搭載された基板を固定する基板固定装置において、
吸引孔が形成され前記基板をその上面に吸着固定する吸着ステージと、
前記基板に形成された孔を覆うシートと、
前記吸引孔を通して前記基板を吸引する吸引手段とからなり、
前記基板の孔にその上面より前記シートを被せた状態で該基板を前記吸着ステージの上面に吸着固定することを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic components are mounted,
A suction stage in which a suction hole is formed and the substrate is sucked and fixed to the upper surface;
A sheet covering the hole formed in the substrate;
Comprising suction means for sucking the substrate through the suction hole;
A substrate fixing apparatus, wherein the substrate is sucked and fixed to the upper surface of the suction stage in a state where the sheet is covered from the upper surface of the hole of the substrate. 電子部品が搭載された基板を固定する基板固定装置において、
吸引孔が形成され前記基板をその上面に吸着固定する吸着ステージと、
前記吸引孔を通して前記基板を吸引する吸引手段とからなり、
前記吸着ステージの上方に設けられ前記基板の上面に対して吹圧するエアーノズルと、
前記エアーノズルに高圧エアーを供給する高圧エアー供給手段とからなり、
前記基板の上面に高圧エアーを吹き付け該基板を前記吸着ステージの上面に押圧した状態で該基板を該吸着ステージの上面に吸着固定することを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic components are mounted,
A suction stage in which a suction hole is formed and the substrate is sucked and fixed to the upper surface;
Comprising suction means for sucking the substrate through the suction hole;
An air nozzle that is provided above the suction stage and blows against the upper surface of the substrate;
Comprising high pressure air supply means for supplying high pressure air to the air nozzle,
A substrate fixing apparatus characterized in that high-pressure air is blown onto the upper surface of the substrate and the substrate is sucked and fixed to the upper surface of the suction stage in a state where the substrate is pressed against the upper surface of the suction stage. 電子部品が搭載された基板を固定する基板固定装置において、
前記基板をその上面に位置決め固定するステージと、
前記基板の端を前記ステージに引着する引着爪が形成された基板引着手段と、
前記基板引着手段により前記ステージの上面に位置決めされた前記基板の下面と該ステージの上面との隙間に充填材を充填する充填材供給手段とからなることを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic components are mounted,
A stage for positioning and fixing the substrate on its upper surface;
Substrate attracting means on which an attracting claw for attracting the end of the substrate to the stage is formed;
A substrate fixing apparatus comprising: a filler supply unit that fills a gap between the lower surface of the substrate positioned on the upper surface of the stage by the substrate attracting unit and the upper surface of the stage. 電子部品が搭載されると共にスルーホールが形成された基板を固定する基板固定装置において、
吸引孔が形成され前記基板をその上面に吸着固定する吸着ステージと、
前記吸引孔を通して前記基板を吸引する吸引手段とからなり、
前記スルーホールの上面を充填部材で塞いだ状態で前記基板を前記吸着ステージの上面に吸着固定することを特徴とする基板固定装置。In a board fixing device for fixing a board on which electronic parts are mounted and through holes are formed,
A suction stage in which a suction hole is formed and the substrate is sucked and fixed to the upper surface;
Comprising suction means for sucking the substrate through the suction hole;
A substrate fixing apparatus, wherein the substrate is sucked and fixed to the upper surface of the suction stage in a state where the upper surface of the through hole is closed with a filling member. 吸着ステージの上面に吸着固定されるものであって、電子部品が搭載されると共にスルーホールが形成された基板の固定構造において、
前記吸着ステージの上面に吸着固定される前に、予め前記スルーホールの上面が充填部材で塞がれていることを特徴とする基板の固定構造。In the fixing structure of the substrate on which the electronic component is mounted and the through hole is formed while being fixed to the upper surface of the suction stage,
A substrate fixing structure, wherein an upper surface of the through hole is previously closed with a filling member before being fixed to the upper surface of the suction stage. 前記電子部品はベアチップであって、前記固定された基板上において該ベアチップがワイヤボンディングされてなることを特徴とする請求項１乃至請求項７のいずれか一に記載の基板固定装置あるいは請求項８に記載の基板の固定構造。The electronic component is a bare chip, claims 1 to substrate fixing apparatus or claim 8 as claimed in any one of claims 7 wherein the bare chip in said fixed on a substrate, characterized by comprising a wire bonding The board fixing structure described in 1 .
JP31112398A 1998-10-30 1998-10-30 Substrate fixing device and substrate fixing structure Expired - Fee Related JP3841576B2 (en)

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JP4604384B2 (en) * 2001-04-16 2011-01-05 サンケン電気株式会社 Circuit board mounting method
JP4659634B2 (en) 2006-02-08 2011-03-30 富士通株式会社 Flip chip mounting method
JP2007329283A (en) 2006-06-07 2007-12-20 Shinkawa Ltd Method and program of securing curved circuit board in wire bonding apparatus
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