CN103240561B - Suspended gold wire ball bonding workbench - Google Patents
Suspended gold wire ball bonding workbench Download PDFInfo
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- CN103240561B CN103240561B CN201310155619.5A CN201310155619A CN103240561B CN 103240561 B CN103240561 B CN 103240561B CN 201310155619 A CN201310155619 A CN 201310155619A CN 103240561 B CN103240561 B CN 103240561B
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- shell
- air
- breathing
- heating
- chip
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 57
- 230000006835 compression Effects 0.000 claims abstract description 10
- 238000007906 compression Methods 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims description 23
- 239000010931 gold Substances 0.000 claims description 23
- 230000001105 regulatory effect Effects 0.000 claims description 18
- 210000000078 claw Anatomy 0.000 claims description 10
- 230000006978 adaptation Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 3
- 230000003068 static effect Effects 0.000 abstract 2
- 238000003466 welding Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 8
- 230000006698 induction Effects 0.000 description 8
- 208000027418 Wounds and injury Diseases 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000003434 inspiratory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a suspended gold wire ball bonding workbench for connecting a gas-sensitive chip of a gas sensor and a tube shell, which comprises a shell, wherein a central column, a gas suction base, a gas suction column, a heating column, a sliding block, a pressing block, a horizontal compression spring, a vertical compression spring, a pressing plate, a pressing rod, a tube shell movable clamping piece, a tube shell static clamping piece and a static clamping piece base are arranged in the shell; the chip heating device comprises an air suction base, an air suction column, a chip heating solenoid and a chip heating device, wherein the air suction base is provided with an air suction joint communicated with an external air suction device, the lower part of the air suction column is communicated with the air suction base, the top of the air suction column is used for placing the chip, and the periphery of the upper part of the air suction column is provided with the chip heating solenoid used; the heating column is arranged on the outer layer of the air suction column, the top of the heating column is used for placing the tube shell, and the periphery of the upper part of the heating column is provided with a tube shell heating solenoid used for heating the tube shell; the top of the suction column is higher than the top of the heating column. The invention adopts air suction fixing to realize suspended fixing and heating of the chip, is convenient to disassemble and adjust the direction, and has little physical damage to the chip.
Description
Technical field
The present invention relates to a kind of gold ball bonding workbench, more specifically, relating to gold ball bonding under a kind of gas sensor air-sensitive chip vacant state, with heating and fixing workbench, is connected and fixed the pin of air-sensitive chip and shell for auxiliary gold wire bonder by spun gold.
Background technology
The advantages such as gas sensor is widely used in the fields such as industrial production, daily life, environment measuring and national defence at present, and film-type gas sensor is highly sensitive with it, response is fast, and operating temperature is low become a member important in gas sensor.In order to make the circulation of film-type gas sensor air-sensitive chip ambient gas smooth and easy, when work, heat heat non-conducting to encapsulating package base, air-sensitive chip can be suspended on encapsulating package base top.This unsettled design brings very large difficulty just to location, clamping and the heating of air-sensitive chip.Adopt traditional mechanical grip mode, vacant state chip positioning, handling, heating and adjustment difficulty, easily produces physical hazard to chip.For this reason, how air-sensitive chip is carried out to unsettled being fixedly connected with the pin of shell by spun gold, become the important problem of processing.
Summary of the invention
Goal of the invention: technical problem to be solved by this invention is for the deficiencies in the prior art, provides a kind of unsettled gold ball bonding workbench.
In order to solve the problems of the technologies described above, the invention discloses a kind of for connecting the unsettled gold ball bonding workbench of gas sensor air-sensitive chip and shell, comprise shell, in shell, be provided with newel, air-breathing base, air-breathing post, heated beam, slide block, briquetting, horizontal compression spring, vertical Compress Spring, platen, depression bar, shell moving intermediate plate, the quiet intermediate plate of shell and quiet intermediate plate base; The air-breathing joint being communicated with outside getter device is set on described air-breathing base, and air-breathing post below is communicated with air-breathing base, and air-breathing column top is used for placing described chip, is arranged with the chip heating solenoid for heating chip outside air-breathing post top; Heated beam is arranged on air-breathing post skin, and top is used for placing described shell, the outer shell heating solenoid being arranged with for heating shell on heated beam top; Air-breathing column top is higher than heated beam top; Described newel is positioned at shell center, and in newel, vertical direction is provided with cross vertical chute, is provided with horizontal concrete chute on the top of vertical chute; Briquetting is positioned at vertical chute and moves up and down along vertical chute, and briquetting base is made as the cross with vertical chute adaptation, and vertically Compress Spring is positioned at briquetting below; Slide block is positioned at horizontal concrete chute and moves horizontally along horizontal concrete chute, and the moving intermediate plate of shell is positioned at slider top, and slide block connects a horizontal spring seat by horizontal compression spring; The quiet intermediate plate of shell is arranged on quiet intermediate plate base top; Between briquetting and slide block, coordinate by complementary bevel, promote slide block by moving up and down of briquetting and move horizontally; The moving intermediate plate of shell and the quiet intermediate plate of shell are positioned in same level, and higher than heated beam top, lower than air-breathing column top; Described platen is nested in outside newel, and is fixedly connected with described briquetting, and depression bar is fixedly connected with platen, and stretches out described shell, and shell is provided with the slotted eye moving up and down for depression bar.
The present invention adopts air-breathing mode to realize to be suspended from the chip of shell top to fix, and easy disassembly is little to the physical hazard of chip.Use chip heating solenoid, chip heating surface (area) (HS is little, heats up rapidly, and temperature control is accurate, and power consumption is few.Shell is realized and being supported and heating by heated beam and shell heating solenoid, can independently control temperature with chip heating solenoid, the temperature requirement different with chip to shell while meeting pressure welding.
In the present invention, described air-breathing post bottom and air-breathing post base are circular, and both activities are tightly connected, and air-breathing post can rotate on air-breathing post base; Air-breathing post base is provided with regulating wheel, regulating wheel and air-breathing post bottom CONTACT WITH FRICTION.Regulating wheel also can further adopt gear to coordinate with air-breathing post bottom, drives air-breathing post to rotate around axis by regulating wheel, the convenient die orientation that regulates.
In the present invention, be provided with jacking dish in described shell, jacking disk center is provided with locating hole, and the outer facade of newel is provided with and the lower convex platform that is greater than locating hole, for supporting jacking dish.Jacking dish top is provided with driver plate, and driver plate is divided into inside and outside two circles, and driver plate outer ring is provided with one above and the placed hole of described shell shape adaptation, and driver plate inner ring is provided with two circle pulling holes; Described newel end is provided with newel convex platform, and driver plate center is provided with the locating hole with described newel convex platform adaptation; On described briquetting, be provided with vertical upper poking claw and lower pusher dog, upper poking claw and lower pusher dog are provided with inclined-plane, upper poking claw and lower pusher dog are provided with two circle pulling hole adaptations with driver plate inner ring respectively, when briquetting is positioned at top, lower pusher dog is positioned at pulling hole, and when briquetting is positioned at bottom, upper poking claw is positioned at pulling hole, upper poking claw and lower pusher dog insert two circle pulling holes successively, promote the rotation of driver plate pottery newel; Described air-breathing base is fixedly connected with platen.Allocated catch and driver plate collaborative work, realize station automatic rotation, and the shell of not pressure welding is sent into welding post, and the complete shell of welding is sent into finished product station.Shell clamps, driver plate rotation, and aspiration heater is up and down simultaneously by the control lever realization that presses down and upspring, easy to operate.Air-breathing post, in the time that driver plate rotates, drops to below, chassis cleverly, avoids shell and the driver plate of rotation.
In the present invention, described jacking dish top is provided with jacking boss, and jacking boss both sides are provided with slope.Be the inclined-plane at finished product station place, chassis, realize shell automatic lifting and be convenient to capture.
In the present invention, in described jacking dish, be provided with heating rod.Can preheat the shell on the station beyond work station in driver plate thus, increase work efficiency.
The course of work: the unsettled gold ball bonding of gas sensor air-sensitive chip of the present invention is placed on gold wire bonder below with workbench, connect asepwirator pump by air-breathing joint, connect temperature control heating power supply by cable, shell is placed in the shell placed hole outside place's jacking station; Depression bar is in extreme higher position, and the lower allocated catch of allocated catch is in inner ring pulling hole, and shell, shell placed hole, heated beam and air-breathing mast axis overlap, and heated beam and air-breathing post rise to and require height, and moving intermediate plate and quiet intermediate plate clamp shell; Chip is placed into air-breathing capital end face, stirs regulating wheel, regulates die orientation; Open asepwirator pump and heating power supply, give shell and chip heating; Carry out gold ball bonding during at set temperature until temperature stabilization.
After welding, close asepwirator pump, lower moulded rod; Depression bar drives platen, briquetting, allocated catch, air-breathing fixing and heater, direction adjusting apparatus and shell supporting and heater decline, and heated beam and air-breathing post drop to driver plate and shell below; Briquetting inclined-plane and slide block ramp effect promote slide block and retreat along horizontal concrete chute, and slide block drives moving intermediate plate to unclamp shell; Outer ring pulling hole is inserted in allocated catch subsequently, drives driver plate to turn clockwise; Unclamp depression bar, briquetting and connected mechanism thereof rise under uprighting spring effect; Inner ring pulling hole is inserted in allocated catch, drives driver plate to turn clockwise, and the shell of welding does not forward welding post to, and the sensor having welded forwards jacking station to; With rear slider return under horizontal spring effect, moving intermediate plate clamps shell, and heated beam and air-breathing post are got back to original position; Place new air-sensitive chip, open asepwirator pump, adjust die orientation, take the shell having welded away, place new shell; Band temperature stabilization carries out gold ball bonding in the time of set temperature.So loop welding, or close all power supplys stop welding.
Beneficial effect: the unsettled gold ball bonding of gas sensor air-sensitive chip of the present invention is 1, adopts air-breathing fixing with workbench beneficial effect, realizes the unsettled fixing and heating of chip, and dismounting and orientation adjustment are convenient, little to the physical injury of chip; 2, chip heating surface (area) (HS is little, heats up rapidly, and temperature control is accurate; 3, the heating of shell and chip and control separately, can accurately be heated to best welding temperature separately, improve welding quality; 4, each modular construction and size design are ingenious, and the collaborative work of Shi Ge mechanism, changes station automatically, and clamping and jacking are easy to loading and unloading, raise the efficiency.
Brief description of the drawings
Fig. 1 is embodiment partial sectional view.
Fig. 2 is linkage part and shell clamping device partial sectional view in embodiment.
Fig. 3 is embodiment newel internal structure schematic diagram.
Fig. 4 is embodiment shell clamping device structural representation.
Fig. 5 is three kinds of station schematic diagrames of shell time to be welded such as embodiment.
Fig. 6 is dial structure schematic diagram in embodiment.
Fig. 7 is heating and temperature-measuring part structural representation in embodiment.
Fig. 8 is the scheme of installation of quiet Working-Clip seat in embodiment, horizontal spring seat and heating rod.
Fig. 9 is air-breathing fixing, the direction adjusting apparatus of embodiment chips and shell supporting arrangement combination assumption diagram.
Figure 10 a and Figure 10 b are inspiratory component structure and connection diagram in embodiment.
Figure 11 is the schematic diagram that in embodiment, direction adjusting apparatus is adjusted front and back.
Figure 12 is embodiment housing cutaway view.
Figure 13 is the axle side schematic diagram of newel in embodiment.
Figure 14 is newel structural representation in embodiment.
Figure 15 is device placement location schematic diagram on gold wire bonder described in embodiment.
Detailed description of the invention
The invention discloses the unsettled gold ball bonding workbench of a kind of gas sensor air-sensitive chip, comprise shell, at shell, central authorities connect newel; In described newel, vertical direction is provided with cross vertical chute, and top is provided with horizontal concrete chute, and is provided with the different supporting table of two-layer diameter; In described vertical chute, briquetting is set, in described horizontal concrete chute, slide block is set, described supporting surface major diameter place arranges jacking dish, and described supporting surface minor diameter place arranges driver plate, described newel bottom overcoat platen; Described briquetting is provided with inclined-plane, and described briquetting is with vertically Compress Spring, platen and allocated catch are connected; Described slide block is provided with inclined-plane, and described inclined-plane and the laminating of briquetting inclined-plane are slided, and described slide block is connected with horizontal compression spring and the moving intermediate plate of shell; The described horizontal compression spring other end is placed on spring base, and described spring base is fixed on jacking dish by two screws; On described jacking dish, have through hole at welding post, described jacking dish is connected and fixed quiet intermediate plate base on the same radial position periphery of through hole; Described jacking dish is provided with the jacking step of slope and jacking boss composition at next station place of welding post, described jacking dish is provided with two heating rods in inside; On described driver plate, be evenly provided with each 10 pulling holes of inside and outside two circle, two circle pulling holes are staggered 18 °; On described driver plate, be evenly provided with 10 stepped ramp type shell placed holes of a circle, described placed hole is all provided with locating notch; Described platen and depression bar, allocated catch, air-breathing fixing and heater, direction adjusting apparatus and shell supporting and heater are connected, and under vertical chute restriction, slide up and down.
Described air-breathing fixing and heater comprises air-breathing base, air-breathing post, heating solenoid and thermocouple; Described air-breathing base is provided with circular induction chamber, and induction chamber inner underside face is provided with horizontal through hole, and described through hole outside connects air-breathing joint, and the side joint that described joint is not connected with through hole has air intake duct, and described air intake duct is connected with asepwirator pump; Described induction chamber upper inside walls is provided with the air-breathing packing ring of copper, and described air-breathing packing ring and air-breathing post form shaft hole matching; On described air-breathing post, be wound with heating solenoid, described air-breathing column top is embedded with thermocouple.
Described direction adjusting apparatus, comprises air-breathing post and regulating wheel; Under described air-breathing post, side discs is provided with rubbing surface, and the rubbing surface arranging on described rubbing surface and regulating wheel is bonded to each other, and described regulating wheel center is provided with through hole, in described through hole, through screw, regulating wheel is fixed on air-breathing seat; Described regulating wheel drives air-breathing post around induction chamber central rotation, the chip generation orientation rotation on the moving top of described air-breathing cornice.
Described shell supporting and heater comprise upper cover plate, heated beam, heating solenoid and thermocouple; Described upper cover plate is connected with air-breathing base and heated beam connects, and is wound around heating solenoid in described heated beam, and described heating styletable is embedded with thermocouple; Described heated beam is bearing in shell central authorities and contacts with shell leg.
Embodiment
More particularly, as shown in Fig. 1, Figure 12, Fig. 5, Figure 13 and Figure 14, the unsettled gold ball bonding of gas sensor air-sensitive chip comprises shell 22 with workbench described in the present embodiment, is connected by four screws in shell central authorities with newel 21; In described newel, vertical direction is provided with cross vertical chute 44, and top is provided with horizontal concrete chute 43, and is provided with the different supporting table of two-layer diameter, and the outer facade downside major diameter supporting surface of described newel place arranges newel lower convex platform 50; Briquetting 18 is set in described vertical chute, slide block 17 is set in described horizontal concrete chute, described newel lower convex platform 50 tops arrange jacking dish 14, described upside minor diameter supporting surface place arranges newel convex platform 45, described newel convex platform 45 coordinates with the locating hole 49 arranging on driver plate 12, driver plate 12 tops are provided with driver plate spacing collar 48, and described driver plate spacing collar 48 is connected with newel 21 by screw thread.
As shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, described newel bottom overcoat platen 23; Described briquetting 18 is provided with inclined-plane, and described briquetting is connected with platen 23 and allocated catch 13 respectively by the cooperation between face and face and a screw, is provided with vertical Compress Spring 20 at briquetting downside; Described slide block 17 is provided with inclined-plane, and described inclined-plane and briquetting 18 inclined-plane laminatings are slided, and described slide block 17 is connected with the moving intermediate plate 11 of shell with U-lag by top screw, is provided with horizontal compression spring 16 in horizontal direction of retreat; Described horizontal compression spring 16 other ends are placed on spring base 15, and described spring base 15 is fixed on jacking dish 14 by two screws.
As shown in Fig. 2, Fig. 5 and Fig. 8, on described jacking dish 14, have through hole 39 at welding post, described jacking dish 14 is connected and fixed quiet intermediate plate base 7 on the same radial position periphery of through hole 38; Described jacking dish 14 is provided with the jacking step that slope 27 and jacking boss 28 form at next station place of welding post, described jacking dish 14 is provided with two heating rods 37 in inside.
As shown in Figure 5 and Figure 6, on described driver plate 12, be evenly provided with each 10 pulling holes, 31 and 32, the two circle pulling holes 31 and 32 of inside and outside two circle and be staggered 18 °; On described driver plate 12, be evenly provided with 10 stepped ramp type shell placed holes 33 of a circle, described placed hole 33 is all provided with locating notch.
As shown in Figures 2 and 3, described platen 23 and depression bar 19, allocated catch 13, air-breathing fixing and heater, direction adjusting apparatus and shell supporting and heater are connected, and under vertical chute 44 restrictions, slide up and down;
As shown in Fig. 7, Fig. 9 and Figure 10 a and Figure 10 b, described air-breathing fixing and heater, comprises air-breathing base 2, air-breathing post 3, heating solenoid 24 and thermocouple 38; Described air-breathing base 2 is provided with circular induction chamber 36, and induction chamber inner underside face is provided with horizontal through hole, and described through hole outside connects air-breathing joint 1, and the side joint that described air-breathing joint 1 is not connected with through hole has air intake duct 41, and described air intake duct 41 is connected 42 with asepwirator pump; Described induction chamber 36 upper inside walls and the air-breathing packing ring 35 of copper form interference air-tight fit, described air-breathing packing ring 35 and 3 one-tenth shaft hole matchings of air-breathing cylindricality; On described air-breathing post, be wound with heating solenoid 24, described air-breathing post 3 tops are embedded with thermocouple 38.
As shown in Fig. 9, Figure 10 a and Figure 10 b and Figure 11, described direction adjusting apparatus, comprises air-breathing post 3 and regulating wheel 4; Under described air-breathing post, side discs is provided with rubbing surface, and the rubbing surface arranging on described rubbing surface and regulating wheel is bonded to each other, and described regulating wheel center is provided with through hole, in described through hole, through screw, regulating wheel 4 is fixed on air-breathing base 2; Described regulating wheel 4 drives air-breathing post 3 around induction chamber 36 central rotations, and described air-breathing post 3 drives the chip 10 on top that orientation rotation occurs.
With shown in Fig. 9, described shell supporting and heater, comprise upper cover plate 5, heated beam 6, heating solenoid 26 and thermocouple 25 as shown in Figure 1, Figure 2; Described upper cover plate 5 is connected by 4 screws with air-breathing base 2, and described upper cover plate 5 joins by screw thread and heated beam 6, is wound around heating solenoid 26 in described heated beam 6, and described heated beam 6 ends are embedded with thermocouple 25; Described heated beam 6 is bearing in shell 8 central authorities and contacts with shell leg 34.
As shown in Figure 7, the heating solenoid 26 of described heated beam 6, thermocouple 25, the heating solenoid 24 of air-breathing post 3, the line hole 40 that the electric wire of thermocouple 38 and heating rod 37 is all provided with by shell 22 sides is connected with temp. controlling box.
The operation principle of the present embodiment is as follows:
As shown in Fig. 1, Fig. 5, Fig. 8 and Figure 15, the unsettled gold ball bonding of gas sensor air-sensitive chip is placed on gold wire bonder 47 belows with workbench 46, connect asepwirator pump 42 by air intake duct 41, connect temperature control heating power supply by cable, in outside sensor shell 8 place's of being placed on jacking stations 9 the shell placed hole 33 with locating notch; Depression bar 19 is in extreme higher position, the lower allocated catch of allocated catch 13 in inner ring pulling hole 31, shell 8, shell placed hole 33, heated beam 6 and 3 deads in line of air-breathing post, heated beam 6 and air-breathing post 3 rise to and require height, moving intermediate plate 11 and quiet intermediate plate 9 clamp shell 8; Chip 10 is placed into air-breathing post 3 top end faces, stirs regulating wheel 3, regulates die orientation; Open asepwirator pump 42 and heating power supply, heat to shell 8 and chip 10; Carry out gold ball bonding during at set temperature until temperature stabilization.
As shown in Fig. 2, Fig. 3 and Fig. 5, after welding, close asepwirator pump 42, lower moulded rod 19; Depression bar 19 drives platen 23, briquetting 18, allocated catch 13, air-breathing fixing and heater, direction adjusting apparatus and shell supporting and heater decline, and heated beam 6 and air-breathing post 3 drop to driver plate 12 and shell 8 belows; Briquetting 18 inclined-planes and slide block 17 ramp effect promote slide block and retreat along horizontal concrete chute, and slide block 17 drives moving intermediate plate 11 to unclamp shell; Outer ring pulling hole 32 is inserted in allocated catch subsequently 13, drives driver plate 12 to be rotated counterclockwise 18 °; Unclamp depression bar 19, briquetting 18 and connected mechanism thereof rise under uprighting spring 20 effects; Inner ring pulling hole 31 is inserted in allocated catch 13, drives driver plate 12 to be rotated counterclockwise 18 °, and the shell 8 of welding is not forwarded to the welding post at Fig. 4 shell 8 places by preheating station 30, and the sensor having welded forwards jacking station 29 to; With rear slider 17 return under horizontal spring 16 effects, moving intermediate plate 11 clamps shell, and heated beam 6 and air-breathing post 3 are got back to original position; Place new air-sensitive chip, open asepwirator pump 42, adjust die orientation, take the shell having welded away, place new shell; Band temperature stabilization carries out gold ball bonding in the time of set temperature.So loop welding, or close all power supplys stop welding.
The unsettled gold ball bonding of this gas sensor air-sensitive chip adopts air-breathing fixing with workbench, realize the unsettled fixing and heating of chip, and dismounting and orientation adjustment are convenient, little to the physical injury of chip; Chip heating surface (area) (HS is little, heats up rapidly, and temperature control is accurate; The heating of shell and chip and control separately, can accurately be heated to best welding temperature separately, improve welding quality; Each modular construction and size design are ingenious, and the collaborative work of Shi Ge mechanism, changes station automatically, and clamping and jacking are easy to loading and unloading, raise the efficiency.
The invention provides a kind of thinking and method of unsettled gold ball bonding workbench; method and the approach of this technical scheme of specific implementation are a lot; the above is only the preferred embodiment of the present invention; should be understood that; for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.In the present embodiment not clear and definite each part all available prior art realized.
Claims (5)
1. one kind for connecting the unsettled gold ball bonding workbench of gas sensor air-sensitive chip and shell, it is characterized in that, comprise shell, in shell, be provided with newel, air-breathing base, air-breathing post, heated beam, slide block, briquetting, horizontal compression spring, vertical Compress Spring, platen, depression bar, shell moving intermediate plate, the quiet intermediate plate of shell and quiet intermediate plate base;
The air-breathing joint being communicated with outside getter device is set on described air-breathing base, and air-breathing post below is communicated with air-breathing base, and air-breathing column top is used for placing described chip, is arranged with the chip heating solenoid for heating chip outside air-breathing post top; Heated beam is arranged on air-breathing post skin, and top is used for placing described shell, the outer shell heating solenoid being arranged with for heating shell on heated beam top; Air-breathing column top is higher than heated beam top;
Described newel is positioned at shell center, and in newel, vertical direction is provided with cross vertical chute, is provided with horizontal concrete chute on the top of vertical chute; Briquetting is positioned at vertical chute and moves up and down along vertical chute, and briquetting base is made as the cross with vertical chute adaptation, and vertically Compress Spring is positioned at briquetting below; Slide block is positioned at horizontal concrete chute and moves horizontally along horizontal concrete chute, and the moving intermediate plate of shell is positioned at slider top, and slide block connects a horizontal spring seat by horizontal compression spring; The quiet intermediate plate of shell is arranged on quiet intermediate plate base top; Between briquetting and slide block, coordinate by complementary bevel, promote slide block by moving up and down of briquetting and move horizontally; The moving intermediate plate of shell and the quiet intermediate plate of shell are positioned in same level, and higher than heated beam top, lower than air-breathing column top;
Described platen is nested in outside newel, and is fixedly connected with described briquetting, and depression bar is fixedly connected with platen, and stretches out described shell, and shell is provided with the slotted eye moving up and down for depression bar.
2. according to claim 1 a kind of for connecting the unsettled gold ball bonding workbench of gas sensor air-sensitive chip and shell, it is characterized in that, described air-breathing post bottom and air-breathing post base are circular, and both activities are tightly connected, and air-breathing post can rotate on air-breathing post base; Air-breathing post base is provided with regulating wheel, regulating wheel and air-breathing post bottom CONTACT WITH FRICTION.
3. according to claim 1 a kind of for connecting the unsettled gold ball bonding workbench of gas sensor air-sensitive chip and shell, it is characterized in that, in described shell, be provided with jacking dish, jacking dish top is provided with driver plate, driver plate is divided into inside and outside two circles, driver plate outer ring is provided with one above and the placed hole of described shell shape adaptation, and driver plate inner ring is provided with two circle pulling holes; Described newel end is provided with convex platform, and driver plate center is provided with the locating hole with described convex platform adaptation; On described briquetting, be provided with vertical upper poking claw and lower pusher dog, upper poking claw and lower pusher dog are provided with inclined-plane, upper poking claw and lower pusher dog are provided with two circle pulling hole adaptations with driver plate inner ring respectively, when briquetting is positioned at top, lower pusher dog is positioned at pulling hole, and when briquetting is positioned at bottom, upper poking claw is positioned at pulling hole, upper poking claw and lower pusher dog insert two circle pulling holes successively, promote the rotation of driver plate pottery newel; Described air-breathing base is fixedly connected with platen.
4. according to claim 3 a kind ofly it is characterized in that for connecting the unsettled gold ball bonding workbench of gas sensor air-sensitive chip and shell, described jacking dish top is provided with jacking boss, and jacking boss both sides are provided with slope.
5. according to claim 3 a kind ofly it is characterized in that for connecting the unsettled gold ball bonding workbench of gas sensor air-sensitive chip and shell, in described jacking dish, be provided with heating rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310155619.5A CN103240561B (en) | 2013-04-28 | 2013-04-28 | Suspended gold wire ball bonding workbench |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310155619.5A CN103240561B (en) | 2013-04-28 | 2013-04-28 | Suspended gold wire ball bonding workbench |
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| CN103240561A CN103240561A (en) | 2013-08-14 |
| CN103240561B true CN103240561B (en) | 2014-11-26 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107553884A (en) * | 2017-11-01 | 2018-01-09 | 池州市东聚新能源科技有限公司 | A kind of PET film preheats rotating mechanism |
| CN110227885B (en) * | 2018-03-06 | 2024-03-01 | 南京工业职业技术学院 | Mobile phone charging connector welding equipment |
| CN112692500A (en) * | 2020-12-29 | 2021-04-23 | 卡斯马汽车系统（重庆）有限公司 | Rotary positioner |
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| JP3841576B2 (en) * | 1998-10-30 | 2006-11-01 | 富士通テン株式会社 | Substrate fixing device and substrate fixing structure |
| CN101474736A (en) * | 2009-01-07 | 2009-07-08 | 深圳市因沃客科技有限公司 | Spun gold ball welding machine, and device and method for adjusting welding spot position thereof |
| CN101774078A (en) * | 2010-03-19 | 2010-07-14 | 周志坚 | Ultrasonic gold wire bonder |
| WO2012121046A1 (en) * | 2011-03-04 | 2012-09-13 | 東京エレクトロン株式会社 | Bonding device, bonding system and bonding method |
| CN102842558A (en) * | 2012-08-21 | 2012-12-26 | 华天科技（西安）有限公司 | Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on solder paste layers and packaging method thereof |
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2013
- 2013-04-28 CN CN201310155619.5A patent/CN103240561B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3841576B2 (en) * | 1998-10-30 | 2006-11-01 | 富士通テン株式会社 | Substrate fixing device and substrate fixing structure |
| CN101474736A (en) * | 2009-01-07 | 2009-07-08 | 深圳市因沃客科技有限公司 | Spun gold ball welding machine, and device and method for adjusting welding spot position thereof |
| CN101774078A (en) * | 2010-03-19 | 2010-07-14 | 周志坚 | Ultrasonic gold wire bonder |
| WO2012121046A1 (en) * | 2011-03-04 | 2012-09-13 | 東京エレクトロン株式会社 | Bonding device, bonding system and bonding method |
| CN102842558A (en) * | 2012-08-21 | 2012-12-26 | 华天科技（西安）有限公司 | Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on solder paste layers and packaging method thereof |
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| CN103240561A (en) | 2013-08-14 |
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