CN206312933U - A kind of CSP fluorescence diaphragm is molded plastic packaging machine - Google Patents
A kind of CSP fluorescence diaphragm is molded plastic packaging machine Download PDFInfo
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- CN206312933U CN206312933U CN201621397955.6U CN201621397955U CN206312933U CN 206312933 U CN206312933 U CN 206312933U CN 201621397955 U CN201621397955 U CN 201621397955U CN 206312933 U CN206312933 U CN 206312933U
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Abstract
The utility model discloses a kind of CSP fluorescence diaphragm molding plastic packaging machine, including frame, lower portable plate is provided with the frame, sealing frame is provided with the lower portable plate, lower mould hot plate and fixture are provided with wherein described lower portable plate, the sealing frame is built-in with mould hot plate, and the lower portable plate downside middle is provided with elevating mechanism, balancing spring is distributed between the elevating mechanism and lower portable plate；The packaging machine needs for the CSP fluorescence diaphragm encapsulation of LED, by rational structural improvement, pressurized, heated mode is coordinated to realize LED fast packings especially by upper mould hot plate in vacuum and lower mould hot plate, and by the depth of parallelism between balancing spring adjustment upper and lower mould hot plate, it is ensured that packaging effect.
Description
Technical field
The utility model is related to LED encapsulation technologies, particularly a kind of CSP fluorescence diaphragm molding plastic packaging machine.
Background technology
CSP based on flip-chip exploitation is with its excellent light extraction efficiency, good radiator structure, exquisite appearance and size
The advantages of, have started to be applied to the high-end purposes such as backlight, flash lamp, commercial illumination.The envelope of the Vacuum Heat pressing of CSP fluorescence diaphragms
Dress process is its important production link.In practice, it has been found that traditional positive assembling structure has problems with：First, bonding wire removal is disconnected
Line has potential safety hazard；2nd, the chip thermal resistance of heat transfer pathway is larger；3rd, production efficiency is not high.
The content of the invention
In order to overcome the deficiencies in the prior art, the utility model provides a kind of CSP fluorescence diaphragm molding plastic packaging machine.
The utility model solves the technical scheme that its technical problem used：
A kind of CSP fluorescence diaphragm is molded plastic packaging machine, including frame, and lower portable plate, the lower work are provided with the frame
Sealing frame is provided with dynamic plate, wherein being provided with lower mould hot plate and fixture on the lower portable plate, the sealing frame is built-in with
Mould hot plate, the lower portable plate downside middle is provided with elevating mechanism, is distributed between the elevating mechanism and lower portable plate
Balancing spring.
As a preference, thermal insulation board is provided with the upper mould hot plate, is provided with the downside of the lower mould hot plate
Lower thermal insulation board.
As a preference, support column is provided between the lower mould hot plate and fixture.
As a preference, the upper mould fixed plate on column and column is provided with the frame.
Used as a preference, the upper mould hot plate and lower mould hot plate are built-in with heating rod, thermocouple.
Used as a preference, the lower portable plate downside is provided with grating scale.
Used as a preference, the elevating mechanism uses ball screw type elevator.
As a preference, the axis of guide and cylinder being connected with sealing frame are provided with the upper mould fixed plate, it is described
Pilot seal circle, wear ring and anti-leakage ring fixed plate are provided between sealing frame and the axis of guide at position.
Used as a preference, the axis of guide is hollow shaft, and stem is provided with the axis of guide.
Used as a preference, the elevating mechanism is built-in with pressure sensor.
The beneficial effects of the utility model are：The packaging machine needs for the CSP fluorescence diaphragm encapsulation of LED, by reasonable
Structural improvement, coordinate pressurized, heated mode to realize LED fast packings especially by upper mould hot plate in vacuum and lower mould hot plate,
And by the depth of parallelism between balancing spring adjustment upper and lower mould hot plate, it is ensured that packaging effect.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is front view of the present utility model；
Fig. 2 is structural representation of the present utility model；
Fig. 3 is the structure sectional view in the utility model；
Fig. 4, Fig. 5 are operating diagrams of the present utility model；
Fig. 6, Fig. 7 are the operating diagrams of holder part in the utility model.
Specific embodiment
In order that the object, technical solution and advantage of the application become more apparent, it is right below in conjunction with drawings and Examples
The utility model is further elaborated.It is the thorough explanation present invention, can be related to some special in following description
Determine details.And when without these specific details, of the invention then can still may realize, i.e., the technical staff in art uses
Herein these describe and state effectively to introduce their work essence to the others skilled in the art in art.This external demand
It is noted that word " front side ", " rear side ", " left side ", " right side ", " upside ", " downside " for being used in description below etc. refer to
Be direction in accompanying drawing, word " interior " and " outward " are referred respectively to towards or away from the direction of particular elements geometric center, phase
Pass technical staff is beyond to above-mentioned direction work, simple, need not be creative adjustment should not be construed as the application protection domain
Technology.It should be appreciated that specific embodiment described herein is only used to explain the application, it is not used to limit real protection model
Enclose.And it is the purpose of the present invention of avoiding confusion, due to well known manufacture method, control program, part dimension, material composition, electricity
The technology of road layout etc. is not it will be understood that therefore they are described in detail.
A kind of reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, CSP fluorescence diaphragm is molded plastic packaging machine, including frame 1, the frame 1
On be provided with lower portable plate 2, sealing frame 3 is provided with the lower portable plate 2, can form one between sealing frame 3 and lower portable plate 2
Individual vacuum-packed space.Lower mould hot plate 4 and fixture 5 are provided with wherein described lower portable plate 2, the sealing frame 3 is built-in with
Upper mould hot plate 6, the downside middle of the lower portable plate 2 is provided with elevating mechanism 7, between the elevating mechanism 7 and lower portable plate 2
Balancing spring 71 is distributed with.
Actual CSP encapsulation process：Reference picture 4, Fig. 6, the LED flip chip of array is fixed in chip fixed plate, chip
Fixed plate is placed on the lower clamp of fixture 5, semi-solid preparation premix fluorescent powder silica gel diaphragm is placed on into chip fixed plate top, then cover
The upper fixture of fixture 5.Referring next to Fig. 5, Fig. 7, whole fixture 5 is placed in vacuum environment, by upper mould hot plate 6 and lower mould heat
Plate 4 coordinates pressurized, heated mode, and chip is fitted in fluorescence diaphragm.Because CSP encapsulation is to the depth of parallelism between upper and lower mould hot plate
It is required that very high, in bonding processes, balancing spring 71 can play a part of the depth of parallelism between adjustment upper and lower mould hot plate, and can make
The pressure of diverse location of whole working region is obtained than more consistent.
Further embodiment, a kind of CSP fluorescence diaphragm molding plastic packaging machine of reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, wherein
" embodiment " referred to herein refers to that may be included in special characteristic in the implementation of the application at least one, structure or characteristic.
" in the embodiment " that different places occur in this manual not refers both to same embodiment, nor individually or selective
The embodiment mutually exclusive with other embodiment.Embodiment includes frame 1, and lower portable plate 2, institute are provided with the frame 1
State and sealing frame 3 is provided with lower portable plate 2, wherein being provided with lower mould hot plate 4 and fixture 5, the sealing on the lower portable plate 2
Frame 3 is built-in with mould hot plate 6, and thermal insulation board 61 is provided with the upper mould hot plate 6, and the downside of the lower mould hot plate 4 is provided with
Lower thermal insulation board 41, reduces scattering and disappearing for heat, and also avoiding heat from directly leaking influences workman to work.The upper mould hot plate 6 and lower mould
Hot plate 4 is built-in with heating rod 42, thermocouple 43, and wherein heating rod 42 is responsible for heating, and thermocouple 43 is used for thermometric, realizes adding
Hot temperature is precisely controlled.Be provided with support column 51 between the lower mould hot plate 4 and fixture 5, make fixture 5 and lower mould hot plate 6 it
Between have certain interval, can be easy to artificial pick and place fixture or pick and place fixture with corresponding frock by hand.In the present embodiment, support column
51 use spring-loaded plunger, are easy to the jack-up of fixture 5.The middle working region of lower mould hot plate 4 is raised, is set in raised working region surrounding
There is sealing together.The downside middle of the lower portable plate 2 is provided with elevating mechanism 7, the elevating mechanism 7 and lower portable plate 2
Between balancing spring 71 is distributed with.
Further embodiment, a kind of CSP fluorescence diaphragm molding plastic packaging machine of reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, including
Frame 1, is provided with lower portable plate 2 in the frame 1, sealing frame 3 is provided with the lower portable plate 2, wherein the lower activity
Lower mould hot plate 4 and fixture 5 are provided with plate 2, the sealing frame 3 is built-in with mould hot plate 6, in the middle of the downside of the lower portable plate 2
Place is provided with elevating mechanism 7, and balancing spring 71, the elevating mechanism 7 are distributed between the elevating mechanism 7 and lower portable plate 2
It is built-in with pressure sensor.The downside of the lower portable plate 2 is provided with grating scale 21, can read out portable plate by grating scale 21
Stop position.Grating scale 21 is vertically fixed on the lower section of lower portable plate 2, and the movable end of grating scale 21 passes through grating scale connecting rod 22
It is connected with the lower section of lower portable plate 2.The elevating mechanism 7 uses the leading screw end of ball screw type elevator, ball screw type elevator to connect
Pressure sensor is connect, pressure sensor is connected with portable plate lower section by spring.The input shaft end of ball screw type elevator and watch
The output shaft end for taking motor is respectively provided with synchronizing wheel, is connected with Timing Belt between synchronizing wheel.Column 11 is provided with the frame 1
With the upper mould fixed plate 12 on column 11, lower portable plate 2 can be along the oscilaltion of column 11, and raising structural strength is flat with motion
Stability.The axis of guide 8 and cylinder 81 being connected with sealing frame 3, the sealing frame 3 and guiding are provided with the upper mould fixed plate 12
Pilot seal circle 82, wear ring 83 and anti-leakage ring fixed plate 84 are provided between axle 8 at position, wherein anti-leakage ring fixed plate 84 is used
In fixed guide sealing ring 82, wear ring 83, pilot seal circle 82 can ensure that sealing frame is close when being moved up and down along the axis of guide 8
Feng Xing.The axis of guide 8 is hollow shaft, and stem 85 is provided with the axis of guide 8, is easy to circuit to involve.
In the present embodiment, the top of sealing frame 3 is provided with two anti-leakage ring fixed plates 84, anti-leakage ring fixed plate 84 installs
There are wear ring 83 and pilot seal circle 82.The lower section of upper mould fixed plate 12 is fixed with two hollow axis of guides 8, and the axis of guide 8 is worn
Cross anti-leakage ring fixed plate 84.There is the hollow structure that can wear cable in top mold frame 31, the hollow structure phase of this structure and the axis of guide 8
Even.Leaded cover plate is installed in the top of upper mould fixed plate 12, and stem, the heating plate of upper mould hot plate 6 are fixed with lead cover plate
Cable with thermocouple 43 passes through the hollow structure of top mold frame 31 and the axis of guide 8, is welded on the lower end of stem 85, stem 85
Upper end welding cable connection in control cabinet.
In real work, be placed on fixture 5 on the spring-loaded plunger of lower mould hot plate 4 by reference picture 4, Fig. 6.During matched moulds, rolling
The leading screw of ballscrew lift promotes lower portable plate 2 to move upwards, and the fixture 5 on mould hot plate 4 soon touches mould heat instantly
During 6 lower surface of plate, the shaft end of cylinder 81 is stretched out, and sealing frame 3 is moved downward, the diaphragm seal of the lower surface of sealing frame 3 and lower mould hot plate 4
It is in contact.Can be by setting the size of the power output of cylinder 81, sealing frame 3 is constant to the active force of diaphragm seal, will not be pressed
During fluorescence diaphragm thickness change and cause the change of the pressure output of lift.Now open the vacuum valve of vavuum pump
Door, vacuum environment will be formed in the cavity of sealing frame 3.Reference picture 5, Fig. 7, lower portable plate 2 is continued up, and fixture 5 will
It is pressed between mould hot plate 6, lower mould hot plate 4, now the bossing of spring-loaded plunger will be reduced in lower mould hot plate 4.By one
The heating pressurization fixed time, the chip in fixture 5 will be fitted in fluorescence diaphragm.After encapsulation terminates, vacuum valve is closed, opened
Open destruction valve so that vacuum breaking in the chamber of sealing frame 3.During die sinking, lower portable plate 2 is moved downward, after lower portable plate 2 stops,
Fixture 5 can be taken out spring-loaded plunger the jack-up of fixture 5.Pressure controling mode is the use of in above-mentioned workflow, also according to
Product requirement can use position control mode.
According to above-mentioned principle, the utility model can also carry out appropriate change and modification to above-mentioned implementation method.Therefore,
The utility model is not limited to specific embodiment disclosed and described above, to some modifications and changes of the present utility model
Should also be as falling into scope of the claims of the present utility model.
Claims (10)
1. a kind of CSP fluorescence diaphragm molding plastic packaging machine, including frame（1）, it is characterised in that：The frame（1）On be provided with down
Portable plate（2）, the lower portable plate（2）On be provided with sealing frame（3）, wherein the lower portable plate（2）On be provided with lower mould heat
Plate（4）And fixture（5）, the sealing frame（3）It is built-in with mould hot plate（6）, the lower portable plate（2）Downside middle is provided with
Elevating mechanism（7）, the elevating mechanism（7）With lower portable plate（2）Between balancing spring is distributed with（71）.
2. a kind of CSP fluorescence diaphragm according to claim 1 is molded plastic packaging machine, it is characterised in that：The upper mould hot plate（6）
On be provided with thermal insulation board（61）, the lower mould hot plate（4）Downside be provided with lower thermal insulation board（41）.
3. a kind of CSP fluorescence diaphragm according to claim 1 is molded plastic packaging machine, it is characterised in that：The lower mould hot plate（4）
And fixture（5）Between be provided with support column（51）.
4. a kind of CSP fluorescence diaphragm according to claim 1 is molded plastic packaging machine, it is characterised in that：The frame（1）On set
It is equipped with column（11）And column（11）On upper mould fixed plate（12）.
5. a kind of CSP fluorescence diaphragm according to claim 1 and 2 is molded plastic packaging machine, it is characterised in that：The upper mould hot plate
（6）With lower mould hot plate（4）It is built-in with heating rod（42）, thermocouple（43）.
6. a kind of CSP fluorescence diaphragm according to claim 1 is molded plastic packaging machine, it is characterised in that：The lower portable plate（2）
Downside is provided with grating scale（21）.
7. a kind of CSP fluorescence diaphragm according to claim 1 is molded plastic packaging machine, it is characterised in that：The elevating mechanism（7）
Using ball screw type elevator.
8. a kind of CSP fluorescence diaphragm according to claim 4 is molded plastic packaging machine, it is characterised in that：The upper mould fixed plate
（12）On be provided with and sealing frame（3）The axis of guide of connection（8）And cylinder（81）, the sealing frame（3）And the axis of guide（8）Between
Pilot seal circle is provided with position（82）, wear ring（83）With anti-leakage ring fixed plate（84）.
9. a kind of CSP fluorescence diaphragm according to claim 8 is molded plastic packaging machine, it is characterised in that：The axis of guide（8）For
Hollow shaft, the axis of guide（8）On be provided with stem（85）.
10. a kind of CSP fluorescence diaphragm according to claim 1 is molded plastic packaging machine, it is characterised in that：The elevating mechanism
（7）It is built-in with pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621397955.6U CN206312933U (en) | 2016-12-19 | 2016-12-19 | A kind of CSP fluorescence diaphragm is molded plastic packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621397955.6U CN206312933U (en) | 2016-12-19 | 2016-12-19 | A kind of CSP fluorescence diaphragm is molded plastic packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206312933U true CN206312933U (en) | 2017-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621397955.6U Active CN206312933U (en) | 2016-12-19 | 2016-12-19 | A kind of CSP fluorescence diaphragm is molded plastic packaging machine |
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| CN (1) | CN206312933U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107310190A (en) * | 2017-07-19 | 2017-11-03 | 宜兴市宜轻机械有限公司 | A kind of overall vacuum device of new type high temperature |
| CN111640840A (en) * | 2020-06-17 | 2020-09-08 | 鸿利智汇集团股份有限公司 | LED vacuum packaging process and vacuum pressing device |
| WO2021000913A1 (en) * | 2019-07-03 | 2021-01-07 | 华南理工大学 | Mould pressing device with high pressure resistance and uniform heating for csp fluorescent diaphragm, and mould pressing method |
-
2016
- 2016-12-19 CN CN201621397955.6U patent/CN206312933U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107310190A (en) * | 2017-07-19 | 2017-11-03 | 宜兴市宜轻机械有限公司 | A kind of overall vacuum device of new type high temperature |
| WO2021000913A1 (en) * | 2019-07-03 | 2021-01-07 | 华南理工大学 | Mould pressing device with high pressure resistance and uniform heating for csp fluorescent diaphragm, and mould pressing method |
| CN111640840A (en) * | 2020-06-17 | 2020-09-08 | 鸿利智汇集团股份有限公司 | LED vacuum packaging process and vacuum pressing device |
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