CN101474736A - Spun gold ball welding machine, and device and method for adjusting welding spot position thereof - Google Patents
Spun gold ball welding machine, and device and method for adjusting welding spot position thereof Download PDFInfo
- Publication number
- CN101474736A CN101474736A CNA2009101048435A CN200910104843A CN101474736A CN 101474736 A CN101474736 A CN 101474736A CN A2009101048435 A CNA2009101048435 A CN A2009101048435A CN 200910104843 A CN200910104843 A CN 200910104843A CN 101474736 A CN101474736 A CN 101474736A
- Authority
- CN
- China
- Prior art keywords
- platform
- bond pad
- computer
- adjusting device
- pad locations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a welding point position adjustment device, a method thereof and a gold ball welding apparatus. The gold ball welding apparatus comprises a base, a workbench and the welding point position adjustment device arranged between the base and the workbench. The welding point position adjustment device comprises a digital vedio recording device, a bracket, a positioning adjustment platform, a driver and a computer, wherein the digital vedio recording device is supported by the bracket and is connected with the computer, the position adjustment platform is used for supporting the workbench and adjusting the position thereof, and the computer is connected with the position adjustment platform by the driver. The method for adjusting the welding point position includes the steps: firstly, pictures of a work piece to weld are taken and transferred to the computer; secondly, after processing the pictures, the computer calculates the position deviation of the welding point; and thirdly, the position adjustment platform is driven to eliminate the position deviation. As an operator is no longer needed to adjust the position of the welding point with a microscope, the training cost is greatly saved, the health of the operator is ensured, and the consistency of the welding quality is improved on the basis of reduced labor intensity and increased production efficiency.
Description
Technical field
The present invention relates to welding technology field, be specifically related to a kind of bond pad locations adjusting device and bond pad locations method of adjustment, and the gold ball welding apparatus that comprises this bond pad locations adjusting device.
Background technology
Existing gold ball welding apparatus of carrying out accurate welding all comprises a microscope, need the operator whether to aim at during use by the microscopic examination solder joint, and manually adjust the position of solder joint by a manual adjustment means (universal rocking bar is manually chopped the chop), just can weld after adjusting.This kind gold ball welding apparatus is owing to need more human intervention, and operator's labour intensity is big, and welding efficiency is low.Could be skilled after the operator need train in a large number and practise, the training cost height.And the operator need remove to observe solder joint by microscope, and long-term work is bigger to vision impairment, thereby the operator after skilled can't long-term work, causes training cost higher.In addition, operator's technical merit, degree of fatigue, eyesight change, even working attitude and mood etc. all can affect to welding quality, thereby can't well guarantee the uniformity of product quality.The problems referred to above have become the major issue that the puzzlement gold ball bonding meets processing enterprise in a word, are necessary correlation technique and equipment are improved.
Summary of the invention
Technical problem to be solved by this invention is: a kind of bond pad locations adjusting device and method are provided, and the gold ball welding apparatus that comprises above-mentioned bond pad locations adjusting device.
For solving the technical problem of above-mentioned bond pad locations adjusting device, the present invention adopts following technical scheme:
The bond pad locations adjusting device comprises: platform, driver and computer are adjusted in digital camera, support, position; Described digital camera passes through stent support, and is connected with computer; The position that platform is used to support and adjust workbench is adjusted in described position; Described computer is adjusted platform by driver and position and is connected.
For solving the technical problem of above-mentioned gold ball welding apparatus, the present invention adopts following technical scheme:
Gold ball welding apparatus comprises base, workbench, and the bond pad locations adjusting device that is used to adjust relative position between workbench and the base; Described bond pad locations adjusting device is arranged between base and the workbench, comprising: platform, driver and computer are adjusted in digital camera, support, position; Described digital camera passes through stent support, and is connected with computer; The position that platform is used to support and adjust workbench is adjusted in described position; Described computer is adjusted platform by driver and position and is connected.
For solving the technical problem of above-mentioned bond pad locations method of adjustment, the present invention adopts following technical scheme:
The bond pad locations method of adjustment comprises the steps:
S1, take the photo of workpiece to be welded and send computer to by digital camera;
S2, computer are handled according to the solder joint data comparison film that prestores and are found out solder joint;
S3, computer go out the position deviation of solder joint according to the solder joint data computation that prestores;
S4, computer are adjusted platform by the driver drives position and are moved elimination aforementioned location deviation.
The invention has the beneficial effects as follows:
Because gold ball welding apparatus of the present invention has adopted bond pad locations adjusting device of the present invention and method; no longer need the operator to adjust the position of solder joint by microscope; on the basis that reduces labour intensity, enhances productivity; can also save training cost greatly; protection operator's health, and the uniformity that keeps welding quality.
The present invention is described in further detail below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the structural representation of the position regulator of gold ball welding apparatus of the present invention.
Fig. 2 is the structural representation of X-Y axial adjustment platform in the bond pad locations adjusting device of the present invention.
Fig. 3 is the exploded view of X-Y axial adjustment platform in the bond pad locations adjusting device of the present invention.
Fig. 4 is the workflow diagram of bond pad locations adjusting device of the present invention.
The specific embodiment
The gold ball welding apparatus of this specific embodiment is in existing gold ball welding apparatus, especially weld to improve on the basis of gold ball welding apparatus of light-emitting diode chip for backlight unit and obtain, it mainly is (stereoscopic) microscope of having cancelled existing gold ball welding apparatus, and adopt computer by connected camera, obtain the image information of workpiece to be welded on the workbench, then by the software in the computer, identify solder joint according to the template that prestores, calculate residing physical location of solder joint and reference point locations (the orthographic projection position of chopper on workbench then, that is to say the desired location of solder joint) between position deviation, come activation point to adjust corresponding stepper motor on the platform by the driver that is connected with computer at last, finely tune the position that drives the workbench butt welding point, thereby position deviation is eliminated in the position of adjusting solder joint automatically, so that carry out the precision welding.Platform is adjusted between original workbench and base in the position, has replaced existing precision welding to meet sb. at the airport and has gone up manual governor motion.Owing under the control of computer, adjust the position of solder joint automatically, can make production capacity improve more than 30%.
As shown in Figure 1, the position regulator of the gold ball welding apparatus of this specific embodiment is fixed on the base 1, comprising: platform 3, keyset 2, driver and computer (driver and computer do not draw in the drawings) are adjusted in digital camera 5, support 4, position.
Digital camera 5 is supported on appropriate location, workbench (workbench does not draw in the drawings) top by the support 4 that is positioned at base 1 one sides.Workbench is arranged in the top of figure keyset 2, and digital camera 5 selects for use definition high slightly, and the digital camera head that shooting speed is high slightly gets final product, and by adjusting described support 4 welding region of the central part of digital camera 5 alignment work platforms is got final product.Certainly the essential illuminance that guarantees shooting area, and regulate the definition that the focal length assurance is taken pictures.Digital camera 5 is connected with computer, takes digital photograph and pass to Computer Analysis and processing under the control of computer.
Fixedly connected with base 1 in the below of position adjustment platform 3, its top then is connected with stationary table by described keyset 2.Be X-Y axial adjustment platform in this specific embodiment, this is because of the position that only need adjust in most occasion on the X-Y direction, and does not need to adjust the position on the Z direction again.X-Y axial adjustment platform has two vertically disposed stepper motors, is respectively first motor 31 and second motor 32.Stepper motor all links to each other with computer by driver, thereby can turn round under the control of computer, thereby adjusts the position of workbench on the X-Y direction.This specific embodiment has been selected the servo-driver of servomotor and specialty for use, and drive plate that can certainly own simplicity of design drives stepper motor.
The concrete structure of X-Y axial adjustment platform comprises aforesaid first motor 31 and second motor 32 as shown in Figures 2 and 3, and: platform lower cover 33, slide block 34, slide rail 35, platform loam cake 36, first bindiny mechanism, second bindiny mechanism and motor cabinet 39.Wherein, first bindiny mechanism comprises: first leading screw 381, nut seat 382, nut Connection Block 383 and shaft joint 384; Second bindiny mechanism comprises: second leading screw 371, bearing (ball) cover 372, copper nut 373, bearing 374 and packing ring 375.
Platform lower cover 33 is fixedly installed on the base 1, which is provided with along the axial chute of second motor 32, and described slide block 34 slidably is arranged in the described chute.Second motor 32 also is fixedly installed on the base 1, and is connected with slide block 34 power by described second bindiny mechanism, thereby drives slide block 34 axially moving within the specific limits along second motor 32.Second bindiny mechanism mainly comprises second leading screw 371, and order is arranged in bearing 374, packing ring 375, bearing (ball) cover 372 and copper nut 373 on second leading screw 371.Second leading screw 371 and slide block 34 engagements, the other end is connected with the main shaft power of second motor 32, rotates under the driving of second motor 32, and then drives slide block 32 moving linearlies.
Described slide rail 35 has four, and two is one group, the parallel both sides that are symmetricly set on described slide block 34, and the direction of slide rail 35 is vertical with the glide direction of slide block 34.Described platform loam cake 36 is arranged on the slide rail 35, and therefore base 1 slides on the direction of motion perpendicular to slide block 34 relatively.Slide block 34 is connected with first motor, 31 power by first bindiny mechanism, and first motor 31 is fixedlyed connected with platform loam cake 36 by described motor cabinet 39, when therefore first motor 31 turns round, and slide block 34 motions relatively, thus drive 36 motions of platform loam cake.Nut Connection Block 383 in described first bindiny mechanism is fixedlyed connected with slide block 34, and nut seat 382 is then fixedlyed connected with nut Connection Block 383.One end of described first leading screw 381 and nut seat 382 engagements, the other end then is connected with the main shaft of first motor 31 by described shaft joint 384.
Because first motor 31 and the 32 vertical settings of second motor are so can adjust the position of platform loam cake 36 in X and Y direction.And platform loam cake 36 is connected with original stationary table by keyset 2, thereby finally can regulate the position of the solder joint on the workpiece on the workbench, welds under solder joint to be welded is delivered to chopper one by one.
The precision welding of this specific embodiment is met sb. at the airport, its workflow as shown in Figure 4, start back System self-test, (open related software then, remove relevant alarm signal, check whether the state of bonding equipment is ready to, unripe just the continuation prepared) just take pictures after being ready to.The photo of taking is transmitted to computer, computer uses related software to analyze automatically, mainly utilizes image processing techniques such as geometric match, gray scale coupling and BLOG analysis, analyzes the solder joint feature, and then compare, thereby find out solder joint with the picture that prestores.If fail to find solder joint, then take pictures again, seek the solder joint analysis again, up to finding solder joint.Continue down to carry out after finding solder joint, calculate the position deviation between residing physical location of solder joint and the desired location, send control instruction then and give driver, final control X-axis stepper motor and/or y-axis stepper motor operation, thereby adjust the position of workbench, to eliminate the position deviation of solder joint, solder joint is accurately aimed at, position deviation can be welded after eliminating.Certainly, the more than solder joint of possibility on the workpiece, so weld after what a solder joint, computer can be controlled driver travelling table once more, welds thereby next one solder joint to be welded is moved to the welding reference point.After all solder joints welding on the workpiece to be welded was finished, feed system can be delivered to welding region on the workbench with next one workpiece to be welded by original flow process; Camera is taken pictures once more, thereby enters next working cycles.
Precision welding of the present invention is met sb. at the airport does not need the position of operator by microscope adjustment solder joint, on the basis that reduces labour intensity, enhances productivity, can also save training cost greatly, protection operator's health, and the uniformity that keeps welding quality.
Need to prove, improvements of the present invention at be not only to be used for the manufacturing precision welding of light emitting diode to meet sb. at the airport, also meet sb. at the airport at other precision welding, it also is not only X-Y axial adjustment platform that platform is adjusted in the position, also can be three-dimensional X-Y-Z axial adjustment platform.This specific embodiment only illustrates, but not limitation of the invention.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1, the bond pad locations adjusting device is characterized in that, described bond pad locations adjusting device comprises: platform, driver and computer are adjusted in digital camera, support, position; Described digital camera passes through stent support, and is connected with computer; The position that platform is used to support and adjust workbench is adjusted in described position; Described computer is adjusted platform by driver and position and is connected.
2, bond pad locations adjusting device as claimed in claim 1 is characterized in that: it is X-Y axial adjustment platform that platform is adjusted in described position.
3, bond pad locations adjusting device as claimed in claim 2 is characterized in that: described X-Y axial adjustment platform comprises: first motor, second motor, platform lower cover, slide block, platform loam cake, first bindiny mechanism and second bindiny mechanism; Described platform lower cover is provided with chute, and described slide block slidably is arranged on the described chute; Described second motor is connected with slide block power by second bindiny mechanism; Described platform loam cake slidably is arranged on the slide block, and its relative slide block slides in the direction vertical with the slide block glide direction; Described first motor is connected with slide block power by first bindiny mechanism, and also fixedlys connected with the platform loam cake.
4, bond pad locations adjusting device as claimed in claim 3 is characterized in that: described first bindiny mechanism comprises: first leading screw, nut seat, nut Connection Block and shaft joint; Described nut Connection Block is fixedlyed connected with slide block; Described nut seat is fixedlyed connected with the nut Connection Block, and meshes with described first leading screw, and an end of first leading screw is connected with first motor power by described shaft joint.
5, bond pad locations adjusting device as claimed in claim 3 is characterized in that: described second bindiny mechanism comprises second leading screw; One end of described second leading screw and slide block engagement, the other end is connected with the main shaft power of second motor.
6, bond pad locations adjusting device as claimed in claim 5 is characterized in that: described second bindiny mechanism also comprises: bearing, packing ring, bearing (ball) cover and copper nut; Described bearing, packing ring, bearing (ball) cover and copper nut are located on second leading screw in proper order.
7, bond pad locations adjusting device as claimed in claim 3 is characterized in that: described X-Y axial adjustment platform also comprises motor cabinet, and described first motor is fixedlyed connected with the platform loam cake by motor cabinet.
8, bond pad locations adjusting device as claimed in claim 3 is characterized in that: described X-Y axial adjustment platform also comprises slide rail; Described slide rail is arranged on the slide block, and described platform loam cake slidably is arranged on the slide block by slide rail.
9, gold ball welding apparatus comprises base and workbench, it is characterized in that: described gold ball welding apparatus also comprises the bond pad locations adjusting device that is used to adjust relative position between workbench and the base; Described bond pad locations adjusting device is any described bond pad locations adjusting device in the claim 1 to 8, and it is arranged between described base and the workbench.
10, the bond pad locations method of adjustment comprises the steps:
S1, take the photo of workpiece to be welded and send computer to by digital camera;
S2, computer are handled according to the solder joint data comparison film that prestores and are found out solder joint;
S3, computer go out the position deviation of solder joint according to the solder joint data computation that prestores;
S4, computer are adjusted platform by the driver drives position and are moved elimination aforementioned location deviation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101048435A CN101474736B (en) | 2009-01-07 | 2009-01-07 | Spun gold ball welding machine, and device for adjusting welding spot position thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101048435A CN101474736B (en) | 2009-01-07 | 2009-01-07 | Spun gold ball welding machine, and device for adjusting welding spot position thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101474736A true CN101474736A (en) | 2009-07-08 |
| CN101474736B CN101474736B (en) | 2011-12-28 |
Family
ID=40835557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101048435A Expired - Fee Related CN101474736B (en) | 2009-01-07 | 2009-01-07 | Spun gold ball welding machine, and device for adjusting welding spot position thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101474736B (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774078A (en) * | 2010-03-19 | 2010-07-14 | 周志坚 | Ultrasonic gold wire bonder |
| CN103240561A (en) * | 2013-04-28 | 2013-08-14 | 南京工业大学 | Suspended gold wire ball bonding workbench |
| CN103878789A (en) * | 2014-04-10 | 2014-06-25 | 太仓斯普宁精密机械有限公司 | Image acquisition mechanism of precise welding robot |
| WO2015120667A1 (en) * | 2014-02-14 | 2015-08-20 | 北京中电科电子装备有限公司 | Electronic sparking apparatus and communication method therefor |
| CN106944707A (en) * | 2017-05-29 | 2017-07-14 | 冯斌斌 | A kind of self-retaining welder |
| CN106956056A (en) * | 2017-05-29 | 2017-07-18 | 冯斌斌 | A kind of welder |
| CN107160023A (en) * | 2017-06-20 | 2017-09-15 | 新昌县科创自动化设备有限公司 | A kind of intelligent positioning ratio-frequency welding and its welding method |
| CN108237299A (en) * | 2017-05-29 | 2018-07-03 | 广州子赫建筑装饰有限公司 | A kind of self-retaining welder of practicality |
| CN108284312A (en) * | 2018-01-26 | 2018-07-17 | 京东方科技集团股份有限公司 | Screen separator |
| CN111242989A (en) * | 2019-12-31 | 2020-06-05 | 芯思杰技术(深圳)股份有限公司 | Platform adjusting method and device, computer equipment and storage medium |
| CN111992880A (en) * | 2020-09-29 | 2020-11-27 | 华中科技大学 | Flexible device for laser welding of curved track |
| CN112045293A (en) * | 2020-09-30 | 2020-12-08 | 杨宝辉 | Auxiliary expanding device of spot welding machine |
| CN112935675A (en) * | 2021-03-15 | 2021-06-11 | 成都焊研威达科技股份有限公司 | Special angle steel camber forming spot welding machine for web angle steel assembly |
| CN114713978A (en) * | 2022-05-13 | 2022-07-08 | 深圳市新浩科技有限公司 | Laser spot welding machine for processing optical photoelectron product |
| CN115106763A (en) * | 2022-07-27 | 2022-09-27 | 安徽华生机电集团有限公司 | Full-automatic gantry three-axis broken screw tap taking machine structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4277963B2 (en) * | 1998-07-16 | 2009-06-10 | 株式会社カイジョー | Wire bonding equipment |
| CN2804994Y (en) * | 2005-05-19 | 2006-08-09 | 中国地质大学（武汉） | Means for driving the probe used for analog electrostatic field survey and draw |
| CN100351721C (en) * | 2005-07-05 | 2007-11-28 | 李光 | Welding apparatus with micropicture automatic-computing positioning system and operation mode |
| CN100505198C (en) * | 2007-12-29 | 2009-06-24 | 中国科学院长春光学精密机械与物理研究所 | An automatic operation system of inner leading bonding device of semiconductor device |
| CN201366602Y (en) * | 2009-01-07 | 2009-12-23 | 深圳市因沃客科技有限公司 | Gold wire ball welding machine and welding spot position adjusting device thereof |
-
2009
- 2009-01-07 CN CN2009101048435A patent/CN101474736B/en not_active Expired - Fee Related
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774078A (en) * | 2010-03-19 | 2010-07-14 | 周志坚 | Ultrasonic gold wire bonder |
| CN103240561A (en) * | 2013-04-28 | 2013-08-14 | 南京工业大学 | Suspended gold wire ball bonding workbench |
| CN103240561B (en) * | 2013-04-28 | 2014-11-26 | 南京工业大学 | Suspended gold wire ball bonding workbench |
| WO2015120667A1 (en) * | 2014-02-14 | 2015-08-20 | 北京中电科电子装备有限公司 | Electronic sparking apparatus and communication method therefor |
| CN103878789A (en) * | 2014-04-10 | 2014-06-25 | 太仓斯普宁精密机械有限公司 | Image acquisition mechanism of precise welding robot |
| CN108237299A (en) * | 2017-05-29 | 2018-07-03 | 广州子赫建筑装饰有限公司 | A kind of self-retaining welder of practicality |
| CN106944707A (en) * | 2017-05-29 | 2017-07-14 | 冯斌斌 | A kind of self-retaining welder |
| CN106956056A (en) * | 2017-05-29 | 2017-07-18 | 冯斌斌 | A kind of welder |
| CN107160023B (en) * | 2017-06-20 | 2019-08-02 | 新昌县科创自动化设备有限公司 | A kind of intelligent positioning high-frequency induction welder and its welding method |
| CN107160023A (en) * | 2017-06-20 | 2017-09-15 | 新昌县科创自动化设备有限公司 | A kind of intelligent positioning ratio-frequency welding and its welding method |
| CN108284312A (en) * | 2018-01-26 | 2018-07-17 | 京东方科技集团股份有限公司 | Screen separator |
| CN108284312B (en) * | 2018-01-26 | 2020-06-02 | 京东方科技集团股份有限公司 | Screen separation device |
| CN111242989A (en) * | 2019-12-31 | 2020-06-05 | 芯思杰技术(深圳)股份有限公司 | Platform adjusting method and device, computer equipment and storage medium |
| CN111242989B (en) * | 2019-12-31 | 2023-04-18 | 芯思杰技术(深圳)股份有限公司 | Platform adjusting method and device, computer equipment and storage medium |
| CN111992880A (en) * | 2020-09-29 | 2020-11-27 | 华中科技大学 | Flexible device for laser welding of curved track |
| CN111992880B (en) * | 2020-09-29 | 2021-07-27 | 华中科技大学 | Flexible device for laser welding of curved track |
| CN112045293A (en) * | 2020-09-30 | 2020-12-08 | 杨宝辉 | Auxiliary expanding device of spot welding machine |
| CN112935675A (en) * | 2021-03-15 | 2021-06-11 | 成都焊研威达科技股份有限公司 | Special angle steel camber forming spot welding machine for web angle steel assembly |
| CN114713978A (en) * | 2022-05-13 | 2022-07-08 | 深圳市新浩科技有限公司 | Laser spot welding machine for processing optical photoelectron product |
| CN114713978B (en) * | 2022-05-13 | 2022-09-06 | 深圳市新浩科技有限公司 | Laser spot welding machine for processing optical photoelectron product |
| CN115106763A (en) * | 2022-07-27 | 2022-09-27 | 安徽华生机电集团有限公司 | Full-automatic gantry three-axis broken screw tap taking machine structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101474736B (en) | 2011-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101474736B (en) | Spun gold ball welding machine, and device for adjusting welding spot position thereof | |
| US11099369B2 (en) | Fully automatic microscopic scanner having flat light source | |
| CN206216237U (en) | A kind of camera module assembly equipment | |
| CN206696201U (en) | A kind of multiple dimensioned Automatic Visual Inspection device towards flexible PCB | |
| CN106425451A (en) | Assembly device for camera module | |
| CN103033919B (en) | System capable of automatically compensating and focusing in process of automatic scanning and method and application thereof | |
| CN202994201U (en) | Automatic optical detector | |
| CN100351721C (en) | Welding apparatus with micropicture automatic-computing positioning system and operation mode | |
| CN102814874B (en) | Processing unit (plant) | |
| CN201893321U (en) | BGA (ball grid array) chip repair device | |
| CN106824677A (en) | A kind of vision guide robot aligns point gum machine | |
| CN108919456A (en) | A kind of high-definition camera precision focusing platform and focus adjustment method | |
| CN209102985U (en) | A kind of high-definition camera precision focusing platform | |
| CN108267291A (en) | A kind of schlieren edge of a knife accurate positioning device based on image | |
| CN201366602Y (en) | Gold wire ball welding machine and welding spot position adjusting device thereof | |
| CN202177736U (en) | Automatic straight-arranged metallographic microscope | |
| CN109807472A (en) | It is a kind of can remote control laser cutting device | |
| CN106254742B (en) | Double-camera image measuring mechanism | |
| CN209969856U (en) | Novel laser unsealing machine | |
| CN107024479A (en) | A kind of wave-soldering on-line checking machine and its detection method | |
| KR20150110071A (en) | Laser marking apparatus for Large Area | |
| CN212946053U (en) | Laser coding machine capable of automatically positioning, reading codes and adjusting laser focus | |
| CN210426544U (en) | CCD vision counterpoint mechanism | |
| CN210075406U (en) | Automatic focusing device on detection module of rotary table detection machine | |
| CN214839454U (en) | Machine vision universal detection platform |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20140107 |