CN100505198C - An automatic operation system of inner leading bonding device of semiconductor device - Google Patents

An automatic operation system of inner leading bonding device of semiconductor device Download PDF

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Publication number
CN100505198C
CN100505198C CN 200710300354 CN200710300354A CN100505198C CN 100505198 C CN100505198 C CN 100505198C CN 200710300354 CN200710300354 CN 200710300354 CN 200710300354 A CN200710300354 A CN 200710300354A CN 100505198 C CN100505198 C CN 100505198C
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CN
China
Prior art keywords
automatic
welding
platform
anchor clamps
bidimensional
Prior art date
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Expired - Fee Related
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CN 200710300354
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Chinese (zh)
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CN101217125A (en
Inventor
高跃红
宋志�
郑福志
魏丽
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Changchun Guanghua Micro Electronic Equipment Engineering Center Co ltd
Changchun Institute of Optics Fine Mechanics and Physics of CAS
Original Assignee
Changchun Guanghua Micro Electronic Equipment Engineering Center Co ltd
Changchun Institute of Optics Fine Mechanics and Physics of CAS
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Application filed by Changchun Guanghua Micro Electronic Equipment Engineering Center Co ltd, Changchun Institute of Optics Fine Mechanics and Physics of CAS filed Critical Changchun Guanghua Micro Electronic Equipment Engineering Center Co ltd
Priority to CN 200710300354 priority Critical patent/CN100505198C/en
Publication of CN101217125A publication Critical patent/CN101217125A/en
Application granted granted Critical
Publication of CN100505198C publication Critical patent/CN100505198C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to an automatic operating system of welding equipment of lead wires in a semiconductor device, which pertains to the improvement of microelectronic encapsulation equipment from manual to automatic operation. The invention removes a clamp base, a microscope and increases an X-Y two-dimensional electric control platform, a lens, a CCD, a main case, a warning light and a display on the basis of an original manual machine table, the automatic displacement of a clamp or a welding head is realized by the X-Y two-dimensional electric control platform and a step motion control card in the main case, the CCD, the lens and an image collection card in the main case are arranged above the welding head to realize the automatic identification of the chip, and the automatic control of the welding is realized by a main control computer in the main case, so as to become the equipment for automatic welding. The invention can improve the product quality and the production efficiency, ensure the consistency and stability of the welding wires, save the human resources and reduce the labor intensity. The invention can greatly improve the application range and using value of a welding wire machine. The invention is high-tech microelectronic production equipment which integrates precision machinery, automatic control, image identification, computer application, ultrasonic welding and other various fields.

Description

The automatic operation system of inner leading bonding device of semiconductor device
Technical field
The automatic operation system of inner leading bonding device of semiconductor device of the present invention belongs to microelectronics Packaging equipment by manually improving to automatic.Be the equipment that the manual operation of inner leading bonding device of semiconductor device is transformed into automatic welding.
Background technology
In China, microelectronics Packaging equipment is all introduced by the U.S., Korea S, Japan at present, and the microelectronics Packaging equipment of developing China as early as possible is the important business that promotes China's modern high technology.The lead welding equipment of China's introduction at present is gold wire bonder mostly, the spun gold cost is very high, for reducing production costs, the domestic ultrasonic aluminum wire press welder of developing in succession, but can only manual operation, welding is by the eye contraposition, for microelectronic industry, human resources and labour intensity that manual operation expends are big, and manually operated inconsistency causes unsteadiness and inefficiency also for the performance of product.
Summary of the invention
In order to address these problems, my company has used image recognition technology, automatic control technology and Computer Control Technology on former manual inner leading bonding device of semiconductor device basis, its improvement is become can carry out welding equipment automatically, has improved welding efficiency and quality greatly.
Former manual inner leading bonding device of semiconductor device comprises board, clamping fixture seat, anchor clamps, soldering tip, wire feeder, microscope, sees Fig. 1.
Improved automated semiconductor device intraconnection welding equipment has removed jig seat, microscope on former hand-machine stylobate plinth, new design has added that X-automatically controlled platform of Y bidimensional, camera lens, charge coupled device, mainframe box, warning lamp, display etc. are constructed to automatic equipment, see Fig. 2 and Fig. 3.
Realize the automatic displacement of anchor clamps or soldering tip by the step motion control card in X-automatically controlled platform of Y bidimensional and the mainframe box, image pick-up card in soldering tip upper fixed CCD and camera lens and the mainframe box is realized the automatic identification of chip, realize welding control automatically by the main control computer in the mainframe box, make original manual handling equipment be transformed into the equipment of automatic welding.
The improvement type has been removed the microscope on the former welding machine, the substitute is the IMAQ of being realized chip by the image pick-up card in camera lens, charge coupled device and the mainframe box jointly, by the position of the automatic identification chip of software processes.
Improve the type fixing X-automatically controlled platform of Y bidimensional and turntable under former manual ultrasonic aluminum wire press welder anchor clamps or soldering tip, the fixed form of bidimensional platform can have dual mode, a kind of be the X-axis platform on the Y-axis platform, a kind of is that the X-axis platform is under the Y-axis platform.Realize the automatic displacement of anchor clamps or soldering tip by computer according to the automatically controlled platform of the chip welding spot Position Control X-Y bidimensional that collects, thereby realize welding automatically.Solder joint location accurately, the bonding wire high conformity has improved the quality of product.
On disk at the bottom of the anchor clamps, carve the twice arc groove, but manual adjustments anchor clamps angle.When the very oblique situation of needs welding lead bonding wire, fix with screw after anchor clamps are changeed certain angle, the cabling of bonding wire just becomes straight line or near straight line, this scheme is economical and practical like this, has reached good effect.Another kind method is to adopt automatically controlled or manual turntable.
Beneficial effect of the present invention, filled up the domestic blank that does not have the automatic bonding equipment of lead, improved automatic bonding equipment, production efficient and quality have been improved, the consistency and the stability of bonding wire have particularly been guaranteed, improve the qualification rate of product, and saved human resources, greatly reduced labour intensity.The chip that is difficult to do for former manual welder particularly, automaton with its automatically superiority of control be easy to finish.Improve the range of application and the use value of bonding equipment greatly, be the bigger effect of production performance of semiconductor device.It is Modern High-Tech's microelectronics production equipment of multi-field technology such as collection precision optical machinery, control automatically, image recognition, computer application, optics, mechanics, ultrasonic bonding.
Description of drawings
Fig. 1 is former manual inner leading bonding device of semiconductor device composition.
Comprise board 1, clamping fixture seat 2, anchor clamps 3, soldering tip 4, wire feeder 5, microscope 6 among the figure.
Fig. 2 is improved automated semiconductor device intraconnection welding equipment structure front view.Improved automated semiconductor device intraconnection welding equipment has removed jig seat 2 on former hand-machine stylobate plinth, microscope 6, new design has added that the automatically controlled platform 8 of X-Y bidimensional, camera lens 9, charge coupled device 10, mainframe box 7, warning lamp 11, display 12 etc. are constructed to automatic equipment.
Fig. 3 is improved automatic thick aluminum thread pressure welding machine structure right view.
Comprise board 1, anchor clamps 3, soldering tip 4, wire feeder 5, mainframe box 7, the automatically controlled platform 8 of X-Y bidimensional, camera lens 9, charge coupled device 10, warning lamp 11 among the figure.
Embodiment
Below in conjunction with accompanying drawing the present invention being elaborated, is example with manual ultrasonic aluminum wire press welder,
The contraposition of former manual ultrasonic aluminum wire press welder solder joint is to utilize microscope to lean on eye to observe, the operator does not stop a moment stares at welding zone, very big to the damage of eye, because there is misoperation in the people when fatigue or energy are not concentrated, thereby cause product percent defective height, product quality descends.The improvement type has been removed the microscope 6 on the former welding machine, the substitute is by camera lens 9, CCD10, reaches the IMAQ that mainframe box 7 interior image pick-up cards are realized chip jointly, by the position of the automatic identification chip of software processes.Liberate manpower, improved product quality.
Anchor clamps displacement on the former manual ultrasonic aluminum wire press welder is to realize by the manual chucking operation seat 2 of people, the operation that operator's two hands do not stop a moment, labour intensity is big, because there is misoperation in the people when fatigue or energy are not concentrated, thereby cause product percent defective height, product quality descends.Improve type at former manual ultrasonic aluminum wire press welder anchor clamps 3 or soldering tip 4 times fixedly automatically controlled platform 8 of X-Y bidimensional and turntable, the fixed form of bidimensional platform can have dual mode, a kind of be the X-axis platform on the Y-axis platform, a kind of is that the X-axis platform is under the Y-axis platform.Realize the automatic displacement of anchor clamps or soldering tip by computer according to the automatically controlled platform 8 of the chip welding spot Position Control X-Y bidimensional that collects, thereby realize welding automatically.Solder joint location accurately, the bonding wire high conformity has improved the quality of product.Platform adopts ball-screw and V-type to intersect ball-shaped guide rail or line style slide block guide rail, and the platform motor adopts stepping or servomotor, can also be according to production requirement on X-automatically controlled platform of Y bidimensional or add manual or automatic turntable down.
Because soldering tip has only Y, Z two-dimensional motion, platform also is X, Y two-dimensional motion, so for drawing the very oblique line of bonding wire in the welding semiconductor device, depend platform motion alone and easily aluminium wire is pulled out the chopper groove, causes on the frame pin solder joint rosin joint or does not weld.Our solution is, carves the twice arc groove on 3 end of anchor clamps disk, but manual adjustments anchor clamps 3 angles.When the very oblique situation of needs welding lead bonding wire, fix with screw after anchor clamps are changeed certain angle, the cabling of bonding wire just becomes straight line or near straight line, this scheme is economical and practical like this, has reached good effect.Another kind method is to adopt automatically controlled or manual turntable.
The technical solution adopted for the present invention to solve the technical problems is:
1. adopt camera lens 9, charge coupled device 10, reach the IMAQ that mainframe box 7 interior image pick-up cards are realized chip.
2. adopt automatically controlled platform 8 of X-Y bidimensional and the step motion control card in the mainframe box 7 to realize the automatic displacement of anchor clamps or soldering tip.
3. adopt the analytical calculation of the main control computer realization view data in the mainframe box 7, its operation result is sent to the step motion control card, thereby the automatically controlled platform 8 of control X-Y bidimensional is realized the automatic contraposition of solder joints.
4. carry out welding automatically by the software program of writing in the main control computer, realized becoming the welding equipment of automation, carry out the production requirement of different chips by parameter is set by original manually operated scrap build.
5. the situation of chip and bonding wire be can observe by display 12, the setting or the operation of parameter carried out according to different situations by keyboard.
6. for the very oblique line of bonding wire angle, adopt two kinds of schemes to solve
3) on the automatically controlled platform 8 of X-Y bidimensional or under add manually or automatic turntable.
4) carve the twice arc groove on anchor clamps 3 fixed underpans, anchor clamps can also the manual adjustments angle.

Claims (2)

  1. The automatic operation system of 1 inner leading bonding device of semiconductor device is characterized in that the automatic operation system of this inner leading bonding device of semiconductor device comprises board (1), anchor clamps (3), soldering tip (4), wire feeder (5), mainframe box (7), the X-automatically controlled platform of Y bidimensional (8), camera lens (9), charge coupled device (10), warning lamp (11) and display (12); This automatic operation system combines with image identification system, computer control system, automatic control system, make it become automatic welding device, the position of each several part and annexation: go up sectional fixture (3) and soldering tip (4) at board (1), soldering tip (4) upper fixed charge coupled device (10) and camera lens (9), X-automatically controlled platform of Y bidimensional (8) is positioned on the board (1), be fixed under anchor clamps (3) or the soldering tip (4), fixed form has two kinds, a kind of be the X-axis platform on the Y-axis platform, a kind of is that the X-axis platform is under the Y-axis platform;
    Adopt the IMAQ of the image pick-up card realization chip in camera lens (9), charge coupled device (10) and the mainframe box (7);
    Adopt X-automatically controlled platform of Y bidimensional (8) and the step motion control card in the mainframe box (7) to realize the automatic displacement of anchor clamps (3) or soldering tip (4);
    Adopt the analytical calculation of the main control computer realization view data in the mainframe box (7), its operation result is sent to the step motion control card, thereby control X-automatically controlled platform of Y bidimensional (8) is realized the automatic contraposition of solder joint;
    Carry out welding automatically by the software program of writing in the main control computer, by the production requirement that parameter satisfies different chips is set;
    By the situation that display (12) can be observed chip and bonding wire, carry out the setting or the operation of parameter by keyboard according to different situations.
  2. The automatic operation system of 2 inner leading bonding device of semiconductor device according to claim 1 is characterized in that for the very oblique line of bonding wire angle, adopts two kinds of schemes:
    1) go up or add manual or automatic turntable down at X-automatically controlled platform of Y bidimensional (8),
    2) on anchor clamps (3) fixed underpan, carve the twice arc groove, realize anchor clamps manual adjustments angle.
CN 200710300354 2007-12-29 2007-12-29 An automatic operation system of inner leading bonding device of semiconductor device Expired - Fee Related CN100505198C (en)

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CN100505198C true CN100505198C (en) 2009-06-24

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100585825C (en) * 2008-08-27 2010-01-27 中国科学院长春光学精密机械与物理研究所 Ultrasonic thick aluminum thread pressure welding machine
CN101474736B (en) * 2009-01-07 2011-12-28 深圳市因沃客科技有限公司 Spun gold ball welding machine, and device for adjusting welding spot position thereof
CN101697024B (en) * 2009-10-23 2011-06-08 东南大学 Single-lens multi-angle high-magnification photonic chip coupling and packaging device
CN101920395B (en) * 2010-09-07 2012-02-08 中国科学院长春光学精密机械与物理研究所 Machine head for ultrasonic aluminum wire press welder
CN103213941B (en) * 2013-04-01 2015-08-26 北京工业大学 Based on the pads wire structure of three sight stereomicroscopes
CN104014924B (en) * 2014-05-06 2016-01-06 长春光华微电子设备工程中心有限公司 Full-automatic aluminum thread pressure welding machine is for silk device
CN105965153A (en) * 2016-05-09 2016-09-28 禹伟 Fine adjustment control panel of ultrasonic gold wire ball welder
CN110238474B (en) * 2019-07-05 2021-03-26 上海朋熙半导体有限公司 Semiconductor device mounting and welding system and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1134607A (en) * 1995-04-24 1996-10-30 三星电子株式会社 Apparatus for inner lead bonding (ILB) comprising heat dissipation pin and method of ILB using such apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1134607A (en) * 1995-04-24 1996-10-30 三星电子株式会社 Apparatus for inner lead bonding (ILB) comprising heat dissipation pin and method of ILB using such apparatus

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Assignee: Wuxi Roum Semiconductor Technology Co., Ltd.

Assignor: Changchun Guanghua microelectronic equipment Engineering Center Co., Ltd.|Changchun Institute of optics, fine mechanics and physics, Chinese Academy of Sciences

Contract record no.: 2010320000467

Denomination of invention: An automatic operation system of inner leading bonding device of semiconductor device

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