CN102814874B - Processing unit (plant) - Google Patents
Processing unit (plant) Download PDFInfo
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- CN102814874B CN102814874B CN201210189479.9A CN201210189479A CN102814874B CN 102814874 B CN102814874 B CN 102814874B CN 201210189479 A CN201210189479 A CN 201210189479A CN 102814874 B CN102814874 B CN 102814874B
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- camera
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- mapping graph
- make
- machined object
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- 238000013507 mapping Methods 0.000 claims abstract description 26
- 238000003754 machining Methods 0.000 claims abstract description 9
- 229910052724 xenon Inorganic materials 0.000 description 11
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 6
- 230000011218 segmentation Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Dicing (AREA)
- Laser Beam Processing (AREA)
- Stroboscope Apparatuses (AREA)
- Automatic Focus Adjustment (AREA)
Abstract
Processing unit (plant) of the present invention has chuck table, machining cell, image unit and processing feed unit, and this image unit comprises: camera, and it takes machined object; Stroboscopic light source, its camera watch region to this camera irradiates strobe light; Focusing moving part, its make the focusing of this camera close to and away from machined object; Control part, its make this focusing moving part action make the focusing of this camera close to and away from machined object, irradiate strobe light at predetermined intervals on one side, make the irradiation of this camera and this strobe light synchronously take multiple image continuously; Mapping graph generates storage part, and it is according to the summation of the differential value of multiple pixels of the multiple image operation composing images taken with this camera, generates the mapping graph that associates with the summation of differential value the height and position of this camera and stores; And focusing determination portion, it selects the maximum of differential value from being stored in this mapping graph mapping graph generated storage part, and determines the position of focusing.
Description
Technical field
The present invention relates to the processing unit (plant) such as topping machanism, the laser processing device machined objects such as semiconductor wafer being implemented to processing.
Background technology
Utilize segmentation preset lines divide multiple devices such as IC, LSI and be divided into one by one device by cutter sweep (topping machanism) or laser processing device along segmentation preset lines at the wafer of its surface formation, the device after segmentation is widely used in the electrical equipment such as mobile phone, personal computer.
The processing unit (plant) such as cutter sweep or laser processing device at least has: the chuck table keeping the machined objects such as semiconductor wafer; The machined object being held in chuck table is implemented to the machining cell of processing; The image unit of the machined object that shooting is kept by chuck table; And the processing feed unit processing feeding is relatively carried out to chuck table and machining cell.
The camera that image unit generally comprises shooting machined object and the microscope amplified the picture taken with camera, can detect the segmentation preset lines as region to be processed and bite or laser Machining head are navigated to segmentation preset lines to be processed accurately.
In addition, image unit has following auto-focus function: take immediately below wafer orientation to image unit, carry out stage processing while make image unit be taken into multiple image, differential process is carried out to be taken into image, position maximum for the summation of differential value is positioned (with reference to Japanese Laid-Open Patent Publication 61-198204 publication) image unit as focusing.
[patent document 1] Japanese Laid-Open Patent Publication 61-198204 publication
But, in the autofocus mechanism disclosed in patent document 1, when implementing automatic focus, image unit is made to decline with such as 1 μm of interval stage and stop, thus image unit repeats to take in this position and is taken into image, therefore there is automatic focus and there is the long time, thus the poor such problem of productivity ratio.
Summary of the invention
The present invention completes in view of this problem just, and its object is to provides a kind of processing unit (plant) that can shorten the self-focusing time.
According to the present invention, provide a kind of processing unit (plant), it has: the chuck table keeping machined object; The machined object being held in this chuck table is implemented to the machining cell of processing; The image unit of the machined object that shooting is kept by this chuck table; And the relative processing feed unit processing feeding is carried out to this chuck table and this machining cell, the feature of this processing unit (plant) is, this image unit has: camera, and it takes machined object; Stroboscopic light source, its camera watch region to this camera irradiates strobe light; Focusing moving part, its make the focusing of this camera close to and away from machined object; Control part, it makes this camera continuous moving when not making the focusing of this camera stage stop, while make this focusing moving part action and make the focusing of this camera close to and away from machined object, irradiate strobe light at predetermined intervals on one side, make the irradiation of this camera and this strobe light synchronously take multiple image continuously; Mapping graph generates storage part, it is according to the summation of the differential value of multiple pixels of the multiple image operation composing images taken with this camera, generate mapping graph also to store, this mapping graph to associate with the summation of differential value the height and position of this camera and obtains; And focusing determination portion, it selects the maximum of differential value from being stored in this mapping graph mapping graph generated storage part, and determines the position of focusing.
According to the autofocus mechanism of processing unit (plant) of the present invention, camera continuous moving can be made when not making the focusing of camera stage stop, be taken into image to determine focusing position with the interval of necessity simultaneously, therefore there is the effect that operating efficiency improves.
Accompanying drawing explanation
Fig. 1 is the summary construction diagram of the topping machanism of embodiment of the present invention.
Fig. 2 is the stereogram being supported on the semiconductor wafer on ring-type frame via cutting belt.
Fig. 3 is the schematic diagram be described structure and the effect thereof of the image unit of embodiment of the present invention.
Fig. 4 is the figure of an example of the mapping graph of relation between the summation of the differential value that the height and position of camera and the pixel of captured image are shown.
Label declaration
2: topping machanism
14:X axle feed mechanism
20: chuck table
36:Y axle feed mechanism
42: pulse motor
44:Z axle feed mechanism
46: cutting unit
50: bite
54: image unit
68: object lens
70: xenon flash lamp
74:CCD camera
76: monitor
82: focusing moving part
84: control part
86: mapping graph generates storage part
88: focusing determination portion
Detailed description of the invention
Below, the topping machanism 2 of embodiment of the present invention is explained with reference to accompanying drawing.Fig. 1 shows the summary construction diagram of topping machanism 2.Topping machanism 2 comprises the pair of guide rails 6 extended along X-direction be equipped in stationary base 4.
X-axis movable block 8 utilizes the X-axis feed mechanism (X-axis feed unit) 14 be made up of ball-screw 10 and pulse motor 12 to move in processing direction of feed, i.e. X-direction.X-axis movable block 8 is equipped with chuck table 20 via cylindric support component 22.
Chuck table 20 has the adsorption section (absorption chuck) 24 formed by porous ceramics etc.Chuck table 20 is equipped multiple (being 4 in the present embodiment) clamper 26 of the ring-type frame F of clamping shown in Fig. 2.
As shown in Figure 2, on the surface of the semiconductor wafer W of the processing object as topping machanism 2, be vertically formed with the 1st spacing track S1 and the 2nd spacing track S2, in the region divided by the 1st spacing track S1 and the 2nd spacing track S2, be formed with multiple device D.
Wafer W is adhered to the cutting belt T as splicing tape, and the peripheral part of cutting belt T is adhered to ring-type frame F.Thus, wafer W becomes the state being supported on ring-type frame F via cutting belt T, by utilizing the clamper 26 gripping ring-like frame F shown in Fig. 1, wafer W being supported and being fixed in chuck table 20.
X-axis feed mechanism 14 comprises the read head 18 being disposed in the lower surface of X-axis movable block 8 of the X-coordinate value being disposed in scale 16 in stationary base 4 along guide rail 6 and read scale 16.Read head 18 is connected with the controller of topping machanism 2.
Stationary base 4 is also fixed with the pair of guide rails 28 extended along Y direction.Y-axis movable block 30 utilizes the Y-axis feed mechanism (index feed mechanism) 36 be made up of ball-screw 32 and pulse motor 34 to move in the Y-axis direction.
Y-axis movable block 30 is formed a pair (only the illustrating one) guide rail 38 extended along Z-direction.Z axis movable block 40 utilizes the Z axis feed mechanism 44 be made up of not shown ball-screw and pulse motor 42 to move in the Z-axis direction.
46 is cutting units, is inserted by the main shaft housing 48 of cutting unit 46 and supports in Z axis movable block 40.In main shaft housing 48, be accommodated with main shaft, main shaft utilizes air bearing to be rotatably supported.Main shaft utilizes the not shown motor be accommodated in main shaft housing 48 to carry out rotary actuation, is provided with bite 50 removably in the leading section of main shaft.
Main shaft housing 48 is equipped with aligned units 52.Aligned units 52 has the image unit 54 taken the wafer W kept by chuck table 20.Be arranged bite 50 and image unit 54 in the X-axis direction.
Then, be described in detail with reference to the structure of Fig. 3 to the image unit 54 of embodiment of the present invention.Image unit 54 has the framework 56 of the storage object lens 68 relative with camera watch region, is provided with the dividing plate 58 with light transmission window 59 near the leading section of framework 56.
Having water filled chamber 60 by dividing in the leading section of framework 56, dividing plate 58 and the space that is divided into by the wafer W that chuck table 20 keeps.Interval between the front end 56a of framework 56 and the wafer W kept by chuck table 20 is preferably about about 0.5 ~ 1mm.When the tool marks of wafer W check, provide the water from water source 64 via open and close valve 66 and water supply port 62 to water filled chamber 60 and fill in water filled chamber 60.
The image unit 54 of present embodiment has a kind of xenon flash lamp 70 as stroboscopic light source.Reflected by spectroscope 72 from a part for the strobe light of xenon flash lamp 70 outgoing, and be irradiated to via object lens 68 and light transmission window 59 wafer W kept by chuck table 20.
The optical axis of object lens 68 is equipped the CCD camera 74 of the light-struck wafer W of stroboscopic for shooting.The image display of taking by CCD camera 74 on a monitor 76.
The camera watch region of the wafer W kept by chuck table 20 is synchronously taken in CCD camera 74 and the luminescence of xenon flash lamp 70, and captured image display on a monitor 76.Xenon flash lamp 70 is connected with control unit 80 with CCD camera 74, is controlled by control unit 80.
Control unit 80 comprises: focusing moving part 82, its make the focusing of CCD camera 74 close to and away from wafer W; And control part 84, its make focusing moving part 82 action to make the focusing of CCD camera 74 close to and away from wafer W, (such as CCD camera 74 in the Z-axis direction often move 1 μm) makes xenon flash lamp 70 luminous at predetermined intervals simultaneously, makes CCD camera 74 synchronously take the camera watch region of wafer W continuously with the luminescence of xenon flash lamp 70.
Control unit 80 also has: mapping graph generates storage part 86, the multiple images taken by CCD camera 74 are divided into multiple pixel by respectively, generate and store the such as mapping Figure 85 as shown in Figure 4 associated with the Z-direction position (height and position) of CCD camera 74 summation of the differential value of each pixel; And focusing determination portion 88, it selects the maximum of differential value from being stored in mapping graph mapping Figure 85 generated storage part 86, and determines the position of focusing.
The generation of the mapping Figure 85 shown in Fig. 4 make use of the auto focusing method such as disclosed in Japanese Laid-Open Patent Publication 61-198204 publication.In this auto focusing method, by the pixel that the Iamge Segmentation taken by CCD camera 74 is such as 256 × 256, the pixel of taking out 3 × 3 from these pixels carries out differential process as a block, thus the summation of differential value is associated with the height and position (Z position) of CCD camera 74.
Whenever CCD camera 74 decline 1 μm time implement this process, generate mapping Figure 85 of associating with the summation of the differential value of the pixel of captured image of the height and position to CCD camera 74 (Z position) shown in Fig. 4.
When CCD camera 74 is taken at focusing place, can take, therefore the summation of the differential value of pixel is maximum clearly.In addition, about the details of auto focusing method, the content disclosed in Japanese Laid-Open Patent Publication 61-198204 publication is taken in this description.
Below the automatic focus of the image unit 54 formed as described above is described.First, utilize chuck table 20 to adsorb the wafer W kept as the object of machining, X-axis feed mechanism 14 is driven wafer W is navigated to immediately below image unit 54.
The pulse motor 42 from the focusing moving part 82 of control unit 80 drive pulse signal DR being outputted to Z axis feed mechanism 44 drives to carry out pulse motor 42.While utilizing pulse motor 42 to make image unit 54 decline continuously, whenever height and position decline such as 1 μm time from control part 84 to xenon flash lamp 70 output drive signal, make xenon flash lamp 70 luminous.
Synchronous with this luminescence, export control signal from control part 84 to CCD camera 74, taken the camera watch region of the wafer W utilizing the strobe light from xenon flash lamp 70 to throw light on by CCD camera 74.
Captured image display on a monitor 76, and be taken in control unit 80, by control unit 80 mapping graph generate storage part 86 be divided into 256 × 256 pixel, the pixel of 3 × 3 is carried out differential process as a block, union carried out all pixels of differential process and.Do not make image unit 54 stop and whenever image unit 54 decline 1 μm time repeat this operation, thus generate mapping Figure 85 shown in Fig. 4 storing.
In focusing determination portion 88, the Z position (height and position) of the CCD camera 74 selecting the differential value of pixel maximum from the mapping Figure 85 stored by mapping graph generation storage part 86, and this position is defined as the focusing position of CCD camera 74.In the diagram Z3 position is defined as focusing position.
When the CCD camera 74 declined continuously has carried out overshoot by focusing position, make pulse motor 42 make CCD camera 74 increase towards reverse rotation, searched for focusing position simultaneously.
In the auto focusing method of present embodiment, while making CCD camera 74 decline continuously, make xenon flash lamp 70 luminous with predetermined space, synchronously take camera watch region by CCD camera 74 with this luminescence and perform automatic focus, therefore do not need to make CCD camera stage stop as in the past, and image can be taken into continuously with the interval of necessity, therefore, it is possible to effectively implement automatic focus.
In the above-described embodiment, the example autofocus mechanism of image unit 54 of the present invention being applied to topping machanism 2 is illustrated, but the present invention is not limited thereto, similarly can also be applied to the automatic focus of the image unit being such as equipped on other processing unit (plant)s such as laser processing device.
Claims (1)
1. a processing unit (plant), it has: the chuck table keeping machined object; The machined object being held in this chuck table is implemented to the machining cell of processing; The image unit of the machined object that shooting is kept by this chuck table; And the relative processing feed unit processing feeding is carried out to this chuck table and this machining cell,
The feature of this processing unit (plant) is,
This image unit has:
Camera, it takes machined object;
Stroboscopic light source, its camera watch region to this camera irradiates strobe light;
Focusing moving part, its make the focusing of this camera close to and away from machined object;
Control part, it makes this camera continuous moving when not making the focusing of this camera stage stop, while make this focusing moving part action and make the focusing of this camera close to and away from machined object, irradiate strobe light at predetermined intervals on one side, make the irradiation of this camera and this strobe light synchronously take multiple image continuously;
Mapping graph generates storage part, it is according to the summation of the differential value of multiple pixels of the multiple image operation composing images taken with this camera, generate mapping graph also to store, this mapping graph to associate with the summation of differential value the height and position of this camera and obtains; And
Focusing determination portion, it selects the maximum of differential value from being stored in this mapping graph mapping graph generated storage part, and determines the position of focusing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011130213A JP2012256795A (en) | 2011-06-10 | 2011-06-10 | Processing device |
| JP2011-130213 | 2011-06-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102814874A CN102814874A (en) | 2012-12-12 |
| CN102814874B true CN102814874B (en) | 2016-01-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210189479.9A Active CN102814874B (en) | 2011-06-10 | 2012-06-08 | Processing unit (plant) |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2012256795A (en) |
| CN (1) | CN102814874B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104184951A (en) * | 2013-05-23 | 2014-12-03 | 光道视觉科技股份有限公司 | Method of shooting object image in industrial production line |
| US9292765B2 (en) * | 2014-01-07 | 2016-03-22 | Microsoft Technology Licensing, Llc | Mapping glints to light sources |
| JP6224470B2 (en) * | 2014-01-28 | 2017-11-01 | 株式会社ディスコ | Processing equipment |
| JP6388823B2 (en) * | 2014-12-01 | 2018-09-12 | 株式会社ディスコ | Laser processing equipment |
| CN107203182A (en) * | 2017-07-27 | 2017-09-26 | 苏州艾乐蒙特机电科技有限公司 | A kind of electromechanical equipment automatic sensing focusing software |
| CN108307117B (en) * | 2018-02-09 | 2020-03-10 | 湖南大学 | Full-field optical measurement multifunctional synchronous control device and method |
| CN108747001A (en) * | 2018-07-26 | 2018-11-06 | 中国科学院西安光学精密机械研究所 | Multifunctional monitoring system, monitoring method and pointing method for laser processing |
| TWI809251B (en) * | 2019-03-08 | 2023-07-21 | 日商東京威力科創股份有限公司 | Substrate processing device and substrate processing method |
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|---|---|---|---|---|
| CN1103227A (en) * | 1993-07-30 | 1995-05-31 | 松下电器产业株式会社 | Method for detecting state of focusing |
| CN101271245A (en) * | 2007-03-20 | 2008-09-24 | 安奇逻辑股份有限公司 | Focal point adjusting method and focal point adjusting device in imaging apparatus |
| CN101422848A (en) * | 2008-11-21 | 2009-05-06 | 陈伟良 | Distance-measurement focusing method applied for laser cutting processing |
| CN101426611A (en) * | 2006-06-30 | 2009-05-06 | O.M.C株式会社 | Laser machining apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198204A (en) * | 1985-02-28 | 1986-09-02 | Disco Abrasive Sys Ltd | Automatic focusing method for microscope |
| JPS62261907A (en) * | 1986-05-09 | 1987-11-14 | Disco Abrasive Syst Ltd | Measuring method for thickness or the like by automatic focusing |
| JPH0897271A (en) * | 1994-09-29 | 1996-04-12 | Disco Abrasive Syst Ltd | Autofocus method |
| JP2005258360A (en) * | 2004-03-15 | 2005-09-22 | Sharp Corp | Out-of-focus detecting device |
| JP2009169238A (en) * | 2008-01-18 | 2009-07-30 | Nikon Corp | Camera |
| JP5274960B2 (en) * | 2008-09-26 | 2013-08-28 | 株式会社ディスコ | Cutting equipment |
| JP5390292B2 (en) * | 2009-08-06 | 2014-01-15 | 株式会社ミツトヨ | Image measuring machine |
-
2011
- 2011-06-10 JP JP2011130213A patent/JP2012256795A/en active Pending
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2012
- 2012-06-08 CN CN201210189479.9A patent/CN102814874B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1103227A (en) * | 1993-07-30 | 1995-05-31 | 松下电器产业株式会社 | Method for detecting state of focusing |
| CN101426611A (en) * | 2006-06-30 | 2009-05-06 | O.M.C株式会社 | Laser machining apparatus |
| CN101271245A (en) * | 2007-03-20 | 2008-09-24 | 安奇逻辑股份有限公司 | Focal point adjusting method and focal point adjusting device in imaging apparatus |
| CN101422848A (en) * | 2008-11-21 | 2009-05-06 | 陈伟良 | Distance-measurement focusing method applied for laser cutting processing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012256795A (en) | 2012-12-27 |
| CN102814874A (en) | 2012-12-12 |
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