CN102087997B - Processing device - Google Patents
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- CN102087997B CN102087997B CN201010507726.6A CN201010507726A CN102087997B CN 102087997 B CN102087997 B CN 102087997B CN 201010507726 A CN201010507726 A CN 201010507726A CN 102087997 B CN102087997 B CN 102087997B
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Abstract
A processing device, capable of reliably identifying the contour of an object to be processed and held on a chuck workbench, comprises a process unit for processing an object to be processed, a process feeding unit allowing the chuck workbench processing and feeding along a processing and feeding direction (the X-axis direction), and an X-coordinate detection unit for measuring coordinate value of the chuck workbench along the X-axis direction. The processing device also comprises a contour detection mechanism including a beam lighting unit with a beam irradiator which is arranged on the moving path of the chuck workbench along the X-axis direction and irradiates lights on the surface of an object to be processed at a predetermined incidence angle and along the Y-axis direction orthogonal to the X-axis direction; an imaging unit including beam scan camera utilizing reflected light which is the beam reflected from the surface of an object to be processed; and a control unit for obtaining Y-axis coordinate values of the object to be processed at both ends of Y-axis direction at X-axis based on image signals from the imaging unit and detection signals from the X-coordinate detection unit.
Description
Technical field
The processing unit (plant) that the present invention relates to have the function of profile that can reliable recognition machined object, wherein, this machined object is held on the chuck table that the machined objects such as semiconductor wafer are kept.
Background technology
In semiconductor device manufacturing process, by being arranged as the latticed preset lines of cutting apart that is called as spacing track (street), by being the roughly surface of the semiconductor wafer of circular plate shape, be divided into a plurality of regions, and form the devices such as IC, LSI in the region marking off at this.Thereby then cut off semiconductor wafer along spacing track, cut apart the region that is formed with device, produce semiconductor chip one by one.In addition, also along spacing track, be breaking at the optical device wafer that sapphire substrate surface is laminated with gallium nitride compound semiconductor etc., thereby be divided into the optical device such as light-emitting diode, laser diode, CCD one by one, thereby be widely used in electronic equipment.
Above-mentioned is to be undertaken by being commonly called the topping machanism of slicing machine (ダ ィ サ mono-) along spacing track to the cut-out of wafer.This topping machanism have keep the chuck table of the machined objects such as wafer, for to being held in the cutting unit that the machined object of this chuck table cuts, the processing feed unit that chuck table and cutting unit are relatively moved.Cutting unit comprises cutting mechanism, and this cutting mechanism has: have rotary main shaft and the cutting tools that is installed on the cutting tip of this rotary main shaft; And the driving mechanism that rotary main shaft is rotated to driving.In this topping machanism, with the rotating speed rotary cutting tool of 20000～40000rpm, make cutting tools and the machined object that is held in chuck table relatively cut feeding simultaneously.
In addition, dividing method as above-mentioned wafer, also propose there is following method, be about to focal point alignment wafer inside, along spacing track, irradiate the pulse laser light for example, wafer to the wavelength (1064nm) of penetrability, along spacing track, in wafer inside, form continuously modified layer, by forming this modified layer, along the spacing track of strength decreased, apply external force, thereby cut apart wafer.
In addition, as above-mentioned wafer dividing method, also propose following method, along the spacing track that is formed at wafer, irradiated the pulse laser light for example, wafer to absorbefacient wavelength (355nm), thereby formation laser processing groove, the method for cutting off along this laser processing groove by machine cuts device.
At above-mentioned topping machanism and carrying out in the laser processing device of laser processing, make to keep the processing amount of feeding (processing stroke) of the chuck table of machined object to become the principal element of lifting productivity ratio for Min..Thereby in the disclosed technology of following patent documentation 1, detect the wafer profile that is held in chuck table, make to process stroke for the shortest.In the method for the disclosed detection wafer of this patent documentation 1 profile, from directly over by ccd video camera, take the wafer that is held in chuck table, in the X-Y matrix forming in pixel by ccd video camera, detect wafer shape, position, size.
Patent documentation 1: No. 3173052nd, Japanese Patent
And, the method of the disclosed detection wafer of above-mentioned patent documentation 1 profile be by ccd video camera from directly over take the wafer be held in chuck table, thereby when wafer be in the situation of the such transparent body of sapphire, exist the contrast between wafer and the cutting belt of attaching wafer indefinite, and cannot accurately detect the problem of wafer profile.In addition, in the situation of wafer opaque body, if machined surface is polished and forms mirror status, also can there is same problem.
Summary of the invention
The present invention completes in view of above-mentioned actual conditions, its major technique problem is to provide a kind of processing unit (plant) with the function of profile that can reliable recognition machined object, wherein, this machined object is held on the chuck table that the machined objects such as semiconductor wafer are kept.
In order to solve above-mentioned major technique problem, the invention provides a kind of processing unit (plant), it has: chuck table, it keeps machined object; Machining cell, it implements processing to being held in the machined object of this chuck table; Processing feed unit, it makes this chuck table towards processing direction of feed (X-direction) processing feeding; Index feed unit, it makes index feed direction (Y direction) the relativity ground index feed that this chuck table is vertical with X-direction with respect to this machining cell court; And X coordinate measurement unit, it detects this chuck table at the coordinate figure of X-direction, it is characterized in that, this processing unit (plant) has profile testing agency, this profile testing agency has: linear light illumination unit, and it has on the X-direction mobile route that is equipped on this chuck table and with the incidence angle of being scheduled to, irradiates the linear light irradiator of linear light along Y direction to the upper surface that is held in the machined object of this chuck table; Image unit, it has the linear light of accepting to be irradiated by this linear light illumination unit and reflects the reverberation obtaining and the line-scan camera of making a video recording at the upper surface of machined object; And control unit, it is according to from the picture signal of this image unit with from the detection signal of this X coordinate measurement unit, obtains the Y-axis coordinate figure at Y direction two ends at the X-axis coordinate figure place of the machined object that is held in this chuck table.
Above-mentioned linear light illumination unit has polarizing filter, the light that this polarizing filter is S polarised light for the upper surface with respect to being held in the machined object of this chuck table that makes to irradiate from this linear light irradiator the light coming passes through, this image unit have the light that makes S polarised light by and send it to the polarizing filter of this line-scan camera.
The incidence angle of the linear light preferably irradiating from this linear light irradiator in addition, is set to 45 degree～65 degree.
The profile testing agency that processing unit (plant) of the present invention possesses possesses the linear light illumination unit of the linear light irradiator that has on the X-direction mobile route that is equipped on this chuck table and irradiate linear light along Y direction with the incidence angle of being scheduled to the upper surface that is held in the machined object of this chuck table and has the linear light of accepting by this linear light illumination unit was irradiated reflects the reverberation obtaining and the image unit of the line-scan camera of making a video recording at machined object upper surface, even if therefore the such transparent body of machined object sapphire substrate also can reflect, this reverberation is directed to line-scan camera.Therefore, between reverberation and the light reflecting by cutting belt of machined object reflection that is subject to light by line-scan camera, contrast becomes obviously, and the picture signal that control unit basis is sent from line-scan camera 7 can accurately be judged the Y-axis coordinate figure at Y direction two ends of the X-axis coordinate figure of machined object.
Accompanying drawing explanation
Fig. 1 is the stereogram as the laser processing device of the laser processing device forming according to the present invention.
Fig. 2 is the front view of the profile testing agency equipped of the laser processing device shown in Fig. 1.
Fig. 3 is the major part vertical view of the profile testing agency shown in Fig. 2.
Fig. 4 is the stereogram as the wafer of machined object.
Fig. 5 means the stereogram that the wafer shown in Fig. 4 is attached to the state on the cutting belt surface that is arranged on ring-shaped frame.
Fig. 6 is the key diagram of the profile coordinate measurement operation of the profile testing agency shown in Fig. 3.
Fig. 7 means by the key diagram of the coordinate figure of the detected wafer profile of profile coordinate measurement operation shown in Fig. 6.
Fig. 8 is the key diagram that forms the modified layer formation operation of modified layer by the laser processing device shown in Fig. 1 in the wafer shown in Fig. 4.
Label declaration
1 laser machine; 2 stationary base; 3 chuck table mechanisms; 36 chuck tables; 37X direction of principal axis mobile unit; 374X axial coordinate detecting unit; 38 1Y direction of principal axis mobile units; 384Y coordinate measurement unit; 4 laser light irradiation unit bearing mechanisms; 42 movable support pedestals; 43 2Y direction of principal axis mobile units; 5 laser light irradiation unit; 52 laser light irradiation unit; 522 concentrators; 53 focal point position regulating units; 55Z direction of principal axis position detection unit; 6 aligned units; 7 profile testing agencies; 71 linear light illumination units; 711 linear light irradiators; 712 polarizing filters; 72 image units; 721 line-scan cameras; 722 polarizing filters; 8 control units; 10 wafers (machined object); F ring-shaped frame; T cutting belt
Embodiment
Further describe with reference to the accompanying drawings the preferred implementation of the processing unit (plant) forming according to the present invention.
Fig. 1 illustrates the stereogram as the laser processing device of the processing unit (plant) forming according to the present invention.Laser processing device shown in Fig. 1 has: stationary base 2, with can be to the chuck table mechanism 3 of processing the mobile mode of direction of feed (X-direction) shown in arrow X and being equipped on this stationary base 2 and keeping machined object, can be equipped on to the mobile mode of the index feed direction (Y direction) shown in the arrow Y with above-mentioned X-direction quadrature the laser light irradiation unit bearing mechanism 4 of stationary base 2, with can to X-direction and with the laser light irradiation unit 5 that the mobile mode of focal point position adjustments direction (Z-direction) that arrow Z represents is equipped on laser light irradiation unit bearing mechanism 4 that passes through of X-direction quadrature.
Above-mentioned chuck table mechanism 3 possesses: along the parallel pair of guide rails 31,31 being equipped on above stationary base 2 of X-direction; In the mode that can move in X-direction, be equipped on this 1st slide block 32 above guide rail 31,31; In the mode that can move in Y direction, be equipped on the 2nd slide block 33 above the 1st slide block 32; By cylinder part 34, be supported on the 2nd slide block 33 cover platform 35 above; And as the chuck table 36 of machined object holding unit.This chuck table 36 possesses the absorption chuck 361 being formed by porous material, on absorption chuck 361, by not shown absorbing unit, keeps for example discoid semiconductor wafer as machined object.Chuck table 36 is rotated by the not shown pulse motor being equipped in cylinder part 34 as constructed as above.And on chuck table 36, be equipped with the binding clasp 362 for fixing ring-shaped frame described later.
Above-mentioned the 1st slide block 32 is provided with at its lower surface coordinate with above-mentioned pair of guide rails 31,31 a pair of and is directed to groove 321,321, and surface is provided with the pair of guide rails 322,322 along the parallel formation of X-direction thereon.The 1st slide block 32 is configured to by making to be directed to groove 321,321 and coordinates with pair of guide rails 31,31 as constructed as above, and be configured to, can to X-direction, move along pair of guide rails 31,31.Chuck table mechanism 3 in illustrated embodiment has processing feed unit 37, and this processing feed unit 37 is for making the 1st slide block 32 process feeding along pair of guide rails 31,31 to X-direction.Processing feed unit 37 has and is parallelly equipped on external thread rod 371 between above-mentioned pair of guide rails 31 and 31 and for rotariling actuate the drive sources such as pulse motor 372 of this external thread rod 371.One end of external thread rod 371 is supported in the mode that can rotate freely in the drive tab 373 that is fixed on above-mentioned stationary base 2, and the output shaft of the other end and above-mentioned pulse motor 372 is in transmission connection.And external thread rod 371 is screwed in internal thread through hole, this internal thread through hole is formed on the not shown internal thread piece of giving prominence to the central portion lower surface that is arranged at the 1st slide block 32.Therefore, by pulse motor 372, drive external thread rod 371 to rotate and reverse, make thus the 1st slide block 32 move in X-direction along guide rail 31,31.
Laser processing device in illustrated execution mode has for detection of above-mentioned chuck table 36 in the X of the coordinate figure of X-direction coordinate measurement unit 374.X coordinate measurement unit 374 has the linear scale 374a that sets along guide rail 31 with on being equipped on the 1st slide block 32 and the read head 374b moving along linear scale 374a together with the 1st slide block 32.The read head 374b of this X coordinate measurement unit 374 is in the illustrated embodiment every 1 micron of pulse signal that sends 1 pulse to control unit described later.And control unit described later is by inputted pulse signal is counted, and detects the X-axis coordinate figure of chuck table 36.
Above-mentioned the 2nd slide block 33 is provided with a pair of groove 331,331 that is directed to coordinating with the pair of guide rails 322,322 that is arranged at above-mentioned the 1st slide block 32 upper surfaces at its lower surface, above-mentioned the 2nd slide block 33 is configured to and makes this be directed to groove 331,331 to coordinate with pair of guide rails 322,322, thereby can move in Y direction.Chuck table mechanism 3 in illustrated embodiment has 38, the 1 index feed unit 38, the 1st index feed unit for making the 2nd slide block 33 along being arranged on pair of guide rails 322,322 on the 1st slide block 32 at Y direction index feed.The 1st index feed unit 38 has and is parallelly equipped on external thread rod 381 between above-mentioned pair of guide rails 322 and 322 and for rotariling actuate the drive sources such as pulse motor 382 of this external thread rod 381.One end of external thread rod 381 is supported in the mode that can rotate freely in the drive tab 383 that is fixed on above-mentioned the 1st slide block 32 upper surfaces, and the output shaft of the other end and above-mentioned pulse motor 382 is in transmission connection.And external thread rod 381 is screwed in internal thread through hole, this internal thread through hole is formed on the not shown internal thread piece of giving prominence to the central portion lower surface that is arranged at the 2nd slide block 33.Therefore, by pulse motor 382, drive external thread rod 381 to rotate and reverse, the 2nd slide block 33 moves in Y direction along guide rail 322,322 thus.
Laser processing device in illustrated execution mode has for detection of above-mentioned the 2nd slide block 33 in the Y of the coordinate figure of Y direction coordinate measurement unit 384.Y coordinate measurement unit 384 has the linear scale 384a setting along guide rail 322 and the read head 384b that is equipped on the 2nd slide block 33 and moves along linear scale 384a together with the 2nd slide block 33.The read head 384b of this Y coordinate measurement unit 384 is in the illustrated embodiment every 1 micron of pulse signal that sends 1 pulse to control unit described later.And control unit described later is by counting inputted pulse signal, detects the Y-axis coordinate figure of chuck table 36.
Above-mentioned laser light irradiation unit bearing mechanism 4 has along Y direction is parallel and is equipped on the pair of guide rails 41,41 in stationary base 2 and is equipped on the movable support pedestal 42 on this guide rail 41,41 in the mode that can move in Y direction.The mode that this movable support pedestal 42 has moving is equipped on the mobile support 421 on guide rail 41,41 and is installed on this installation portion that moves support 421 422.Installation portion 422 is provided with the pair of guide rails 423,423 of extending along Z-direction a parallel sided.Laser light irradiation unit bearing mechanism 4 in illustrated execution mode has the 2nd index feed unit 43 for movable support pedestal 42 is moved in Y direction along pair of guide rails 41,41.The 2nd index feed unit 43 has and is parallelly equipped on external thread rod 431 between above-mentioned pair of guide rails 41,41 and for rotariling actuate the drive source of the pulse motor 432 etc. of this external thread rod 431.One end of external thread rod 431 is supported in the mode that can rotate freely in the not shown drive tab that is fixed on above-mentioned stationary base 2, and the output shaft of the other end and above-mentioned pulse motor 432 is in transmission connection.And external thread rod 431 is screwed in internal thread hole, this internal thread hole is formed on the not shown internal thread piece of giving prominence to the central portion lower surface that is arranged at the mobile support 421 that forms movable support pedestal 42.Therefore, by pulse motor 432, drive external thread rod 431 to rotate and reverse, movable support pedestal 42 moves in Y direction along guide rail 41,41 thus.
Laser light irradiation unit 5 in illustrated embodiment has unit bearing 51, is installed on the laser light irradiation unit 52 of this unit bearing 51.Unit bearing 51 is provided with a pair of groove 511,511 that is directed to that can coordinate slidably with the pair of guide rails 423,423 that is arranged at above-mentioned installation portion 422, by making this be directed to groove 511,511, coordinates and is supported to and can moves in Z-direction with above-mentioned guide rail 423,423.
Laser light irradiation unit 5 in illustrated embodiment has focal point position regulating unit 53, and this focal point position regulating unit 53 is for making unit bearing 51 move to Z-direction along pair of guide rails 423,423.Focal point position regulating unit 53 has external thread rod (not shown) between pair of guide rails of being equipped on 423,423 and for rotariling actuate the drive sources such as pulse motor 532 of this external thread rod, by pulse motor 532, drive not shown external thread rod to rotate and reverse, unit bearing 51 and laser beam irradiation unit 52 are moved towards Z-direction along guide rail 423,423.And, in illustrated embodiment, by driving pulse motor 532, just transferring laser beam irradiation unit 52 is moved towards top, by 532 reversions of driving pulse motor, laser beam irradiation unit 52 is moved towards below.
Illustrated laser beam irradiation unit 52 has the housing 521 of the drum of horizontal arrangement in fact.The pulse laser light that is equipped with excitation pulse laser beam in housing 521 excites unit.In addition, housing 521 front ends of drum have assembles the pulse laser light that excites unit to excite by above-mentioned pulse laser light, the concentrator 522 irradiating to the machined object that is held in above-mentioned chuck table 36.
At the leading section that forms the housing 521 of above-mentioned laser light irradiation unit 52, be equipped with aligned units 6, this aligned units 6 detects the machining area that should carry out laser processing by above-mentioned laser light irradiation unit 52.This aligned units 6 except utilizing the common imaging apparatus (CCD) that luminous ray makes a video recording, also by forming with inferior parts, that is: is irradiated ultrared infrared illumination unit to machined object in the illustrated embodiment; The ultrared optical system that seizure is irradiated by this infrared illumination unit; And the imaging apparatus (infrared C CD) of exporting the signal of telecommunication corresponding with the infrared ray being captured by this optical system, this aligned units 6 is sent out feeding control unit described later by the picture signal photographing.
Laser processing device in execution mode has the profile testing agency 7 of the profile that detects the machined object that is held in chuck table 36.With reference to Fig. 1, Fig. 2 and Fig. 3, this profile testing agency 7 is described.
As shown in Figure 1, the image unit 72 that profile testing agency 7 has linear light illumination unit on the X-direction mobile route that is equipped on chuck table 36 71 and the linear light accepting to be irradiated by this linear light illumination unit 71 reverberation after the upper surface reflection of machined object that is held in chuck table 36 is made a video recording.
As shown in Figures 2 and 3, above-mentioned linear light illumination unit 71 has and along Y direction, take the incidence angle α that is scheduled to and irradiate towards the upper surface that is held in the machined object W of chuck table 36 polarizing filter 712 that the linear light irradiator 711 of linear light, the light (S ripple) that is S polarised light for the light that makes to irradiate from this linear light irradiator 711 with respect to the machined object W upper surface that is held in chuck table 36 pass through.The scope internal radiation linear light that linear light irradiator 711 is grown in the length of Y direction at the machined object W than being held in chuck table 36.The incidence angle α of the linear light irradiating to the upper surface that is held in the machined object W of chuck table 36 from linear light irradiator 711 in addition, is set to 45 degree～65 degree illustrated embodiment.It is the light (P ripple) of P polarised light with respect to the upper surface that is held in the machined object W of chuck table 36 that above-mentioned polarizing filter 712 covers the light irradiating from linear light irradiator 711, make with respect to the upper surface of machined object W be S polarised light light (S ripple) by and guided to the upper surface of machined object W.This linear light illumination unit 71 with linear light irradiator 711 and polarizing filter 712 as shown in Figure 1, is supported on the X-direction mobile route that unit 710 is supported on chuck table 36.
As shown in Figures 2 and 3, above-mentioned image unit 72 has the polarizing filter 722 of accepting reverberation after the upper surface reflection of machined object W that is held in chuck table 36 of the linear light irradiate by linear light illumination unit 71 line-scan camera 721 of making a video recording, passing through for the light making at the S polarised light of the reverberation of machined object W upper surface reflection.This polarizing filter 722 covers the light (P ripple) of P polarised light in the light of machined object W upper surface reflection, the light (S ripple) that makes S polarised light by and guided to line-scan camera 721.Above-mentioned line-scan camera 721 is equipped with the imaging apparatuss such as a plurality of CCD along Y direction, the signal that the light quantity with accepting is corresponding sends to control unit described later.This image unit 72 with line-scan camera 721 and polarizing filter 722 as shown in Figure 1, is supported on the X-direction mobile route that unit 720 is supported on chuck table 36.
As shown in Figure 2, the profile testing agency 7 of illustrated embodiment has control unit 8, this control unit 8 is according to the picture signal of the line-scan camera 721 from above-mentioned image unit 72 with from the detection signal of above-mentioned X coordinate measurement unit 374, obtains the Y-axis coordinate figure at Y direction two ends at the X-axis coordinate figure place of the machined object W that is held in chuck table 36.This control unit 8 have according to control program carry out the central processing unit (CPU) 81, storage control program etc. of calculation process read-only memory (ROM) 82, store read-write random access memory (RAM) 83, input interface 84 and the output interfaces 85 such as operation result.In the input interface 84 of control unit 8 as constructed as above, be transfused to and have from the read head 374b of above-mentioned X coordinate measurement unit 374, the read head 384b of Y coordinate measurement unit 384, aligned units 6, form the detection signal of line-scan camera 721 etc. of the image unit 72 of profile testing agency 7.In addition, from output interface 85 to above-mentioned pulse motor 372, pulse motor 382, pulse motor 432, pulse motor 532, laser light irradiation unit 52, form the output control signals such as linear light irradiator 711 of the linear light illumination unit 71 of profile testing agency 7.
The laser processing device of illustrated embodiment is as constructed as above, the following describes its effect.
Fig. 4 represents as the stereogram of wafer 10 that is carried out the machined object of laser processing.Wafer 2 shown in Fig. 4 is divided into a plurality of regions by being latticed many spacing tracks 101 that are arranged in sapphire substrate surface 10a, in a plurality of regions that mark off, is formed with optical device 102 at this.
Along the spacing track 101 irradiating laser light of above-mentioned wafer 10, in order to form modified layer in wafer 10 inside along spacing track 101, just need to as shown in Figure 5 wafer 10 be attached on the cutting belt T that is arranged on ring-shaped frame F.Now upward, surperficial 10a side is attached at cutting belt T to the back side 10b of wafer 10.
Illustrate and use above-mentioned laser processing device, along the spacing track 101 irradiating laser light of above-mentioned wafer 10, in wafer 10 inside, along spacing track 101, form the execution mode of the laser processing of modified layer.First at the chuck table 36 of the laser processing device shown in Fig. 1, upload and be equipped with the cutting belt T side that has attached wafer 10, on this chuck table 36, across cutting belt T absorption, keep wafer 10.Therefore the wafer 10 that, is adsorbed maintenance across cutting belt T on chuck table 36 is usingd back side 10b as upside.And the ring-shaped frame F that the cutting belt T that pastes attached wafer 10 is installed is fixed by binding clasp 362.As mentioned above, the chuck table 36 that absorption keeps wafer 10 by processing feed unit 37 be located in aligned units 6 under.
When chuck table 36 is positioned aligned units 6 under time, by aligned units 6 and control unit 8, carry out the spacing track 101 that detects the predetermined direction that is formed at wafer 10 and whether be oriented to the aligning operation parallel with X-direction.That is, aligned units 6 is taken the spacing track 101 of the predetermined direction that is formed at wafer 10, by taking the picture signal obtaining, sends to control unit 8.Control unit 8 judges that according to the picture signal of sending from aligned units 6 whether captured spacing track 101 is parallel with X-direction, in not parallel with the X-direction situation of spacing track 101, it is parallel with X-direction that rotating chuck workbench 36 is adjusted to spacing track 101.Now, the surperficial 10a that is formed with spacing track 101 of wafer 10 is positioned at downside, and is transparent bodies owing to forming the sapphire substrate of wafer 10, therefore can be from the rear side shooting interval road 101 of sapphire substrate.And when wafer is by silicon substrate like that and in the material of opaque body situation about forming, aligned units 6 is irradiated infrared ray from infrared radiation unit, penetrate the shooting interval road, the back side of silicon substrate.
After having carried out as mentioned above aiming at, as shown in Figure 6, the wafer 10 on chuck table 36 is positioned at the right side of linear light irradiation position of the linear light irradiator 711 of the linear light illumination unit 71 that forms profile detecting unit 7.Then, control unit 8 makes linear light irradiator 711 work irradiate linear lights, and makes to process feed unit 37 work chuck table 36 is moved to direction shown in X1 in Fig. 6.Then control unit 8 makes to form line-scan camera 721 work of the image unit 72 of profile detecting unit 7, accepts the reverberation of the linear light (illuminated line) that chuck table 36 for example irradiates from linear light irradiator 711 during every movement 200 μ m and makes a video recording.And image unit 8 is by obtaining for example amount of movement of every movement 200 μ m of chuck table 36 from the detection signal of X coordinate measurement unit 374.The picture signal that the line-scan camera 721 that this reverberation of accepting linear light (illuminated line) is made a video recording obtains shooting sends to control unit 8.Then, the control unit 8 of having inputted the picture signal of sending from line-scan camera 721 is obtained the Y coordinate figure at Y direction two ends of the X-axis coordinate figure of wafer 10 by the contrast (light and shade) of the picture signal of taking every 200 μ m.Then control unit 8 is according to the light and shade of the picture signal of taking every 200 μ m, and the illuminated line of linear light of take is carried out X coordinate transform to the Y coordinate figure at the Y direction two ends at the X-axis coordinate figure place of wafer 10 as symmetry axis.Fig. 7 illustrate wafer 10 after X coordinate transform, that obtain according to the light and shade of the picture signal of the illuminated line 700 of taking every 200 μ m X-axis coordinate figure place Y direction two ends Y coordinate figure, every x, the y coordinate figure (profile coordinate measurement operation) at the Y direction two ends of the wafer 10 of 200 μ m.If control unit 8 has been obtained as mentioned above every the x at the Y direction two ends of the wafer 10 of 200 μ m, y coordinate figure, this x, y coordinate figure are stored in random access memory (RAM) 83.X, the y coordinate figure at the Y direction two ends of the wafer 10 every 200 μ m of obtaining by combination like this, just can identify the profile of wafer 10.
In the above-mentioned profile coordinate measurement operation of implementing by profile testing agency 7, with incidence angle α (45 degree～65 degree), from linear light irradiator 711, to wafer 10 upper surfaces that are held in chuck table 36, irradiate the illuminated line 700 being taken every 200 μ m as mentioned above, even if therefore wafer 10 is that the such transparent body of sapphire substrate also can reflect, this reverberation is directed to line-scan camera 721.Therefore, by line-scan camera 721, be subject to the light of wafer 10 reflection of light and comparatively clear and definite in the light and shade of the light of cutting belt T reflection, so control unit 8 can accurately be judged by the picture signal of sending from line-scan camera 721 the Y coordinate figure at Y direction two ends of the X coordinate figure of wafer 10.In addition, profile testing agency 7 in illustrated embodiment makes to irradiate the linear light that comes from linear light irradiator 711 upper surface that the light of S polarised light (S ripple) is only directed to wafer 10 by polarizing filter 712, accept the line-scan camera 721 that reverberation makes a video recording and only accept to make a video recording by the light (S ripple) of the S polarised light of polarizing filter 722, therefore distinguish more clear and definite with the light and shade of light in cutting belt T reflection.; because the surface of cutting belt T is rough surface; the light of P polarised light (P ripple) reflects on matsurface; therefore the reflectivity that is radiated at the light (S ripple) of S polarised light in the light (S ripple) of the S polarised light of cutting belt T reduces, and therefore distinguishes more clear and definite be subject to the light and shade of light (S ripple) of the S polarised light in wafer 10 upper surfaces reflections of light by line-scan camera 721.And, profile testing agency 7 in illustrated embodiment is set as 45 degree～65 degree by the linear light incidence angle α that is irradiated to the machined object W upper surface that is held in chuck table 36 from linear light irradiator 711, therefore by line-scan camera 721, is subject to the light (S ripple) of the S polarised light in wafer 10 upper surfaces reflections of light with more clear and definite in the catoptrical light and shade of cutting belt T reflection.; about the light (S ripple) of S polarised light and light (P ripple) reflectivity of P polarised light; light (P ripple) height of the luminance factor P polarised light of the light (S ripple) of S polarised light in incidence angle α is the scope of 45 degree～65 degree, is therefore subject to the light (S ripple) of the S polarised light in wafer 10 upper surfaces reflections of light with more clear and definite in the catoptrical light and shade of cutting belt T reflection by line-scan camera 721.
When having implemented as mentioned above profile coordinate measurement operation, on wafer 10, along spacing track, implement laser processing.The following describes the example that forms the modified layer formation operation of modified layer in wafer 10 inside along spacing track 101.
In modified layer, form in operation, first as shown in Fig. 8 (a), chuck table 36 is moved to the laser light irradiation region that the concentrator 522 of laser light irradiation unit 52 is positioned at, the one end (left end in Fig. 8 (a)) in predetermined space road 101 that makes to be held in the wafer 10 of chuck table 36 be positioned at laser light irradiation unit 52 concentrator 522 under.Then, from concentrator 522 to wafer 10, irradiate the pulse laser light of the wavelength with penetrability, make chuck table 36 move to direction shown in the middle arrow X1 of Fig. 8 (a) with the processing feed speed of being scheduled to simultaneously.Then, as shown in Fig. 8 (b), after the other end (right-hand member in Fig. 8 (b)) of spacing track 101 arrives the irradiation position of concentrator 522 of laser light irradiation unit 52, the irradiation of stop pulse laser beam also stops the movement of chuck table 36.In this modified layer, form in operation, by the pars intermedia of the thickness direction of the focal point P alignment wafer 10 of pulse laser light.Consequently, in wafer 10 inside, be that Fig. 8 (b) institute wafer that is shown in 10 inside form modified layer 110 (modified layer formation operation) along spacing track 101.In this modified layer, form in operation, in above-mentioned profile coordinate measurement operation, detect the profile of wafer 10, therefore can make the processing stroke of chuck table 36 for the shortest, can promote productivity ratio.
And for example the above-mentioned modified layer of following setting forms the processing conditions in operation.
Light source Yb laser: ytterbium-doping optical fiber laser
Wavelength 1045nm
Repetition rate 100kHz
Average output 0.3W
Optically focused spot diameter Φ 1～2 μ m
Energy density 100～400J/cm
2
Process feed speed 400mm/ second
As mentioned above, along predetermined space road 101, carried out above-mentioned modified layer and formed after operation, made chuck table 36 to Y direction index feed, be equivalent to the amount at the interval of spacing track 101.Now control unit 8 is by obtaining the Y direction amount of movement of chuck table 36 from the detection signal of Y coordinate measurement unit 384.As above, after having carried out index feed, along being positioned at spacing track 101 under the concentrator 522 of laser light irradiation unit 52, carrying out above-mentioned modified layer and form operation.Then when all spacing tracks 101 that the predetermined direction along at wafer 10 extends, having carried out above-mentioned modified layer forms after operation, by chuck table 36 90-degree rotations, each spacing track 101 extending along the direction with above-mentioned predetermined direction quadrature is carried out above-mentioned modified layer and is formed operation.Now, modified layer forms x that operation is x to detecting in above-mentioned profile coordinate measurement operation, y coordinate figure and y and carries out coordinate transform and implement.As above, when carried out above-mentioned modified layer along all spacing tracks 101 that are formed at wafer 10, form after operation, keep the chuck table 36 of wafer 10 to turn back to the position that initial absorption keeps wafer 10, at this, remove the absorption of wafer 10 is kept.Then wafer 10 is moved to segmentation process by not shown carrying unit.
More than represented to apply the present invention to laser processing device, in wafer inside, along spacing track, form the example of modified layer, and the present invention is applied to have the laser beam of absorbefacient wavelength along spacing track to wafer illumination in wafer surface, on wafer, in the processing of spacing track formation laser processing groove, also can obtain identical action effect.In addition, apply the present invention to also can obtain same action effect along the topping machanism of spacing track 101 cut-out wafers 10.
And, in the above-described embodiment, represented that the line-scan camera 721 that forms the linear light irradiator 711 of profile testing agency 7 and form image unit 72 has the length over the diameter of wafer 10, the example of the profile by 1 motion detection wafer 10, but, when linear light irradiator 711 and line-scan camera 721 are than the diameter of wafer 10 also examinations operation several times in short-term.In addition, in the above-described embodiment, under the state that is held in the chuck table 36 that wafer 10 is processed, detect the profile of wafer 10, therefore the coordinate of profile can be directly used in laser processing, thereby precision is higher.In addition, in the above-described embodiment, profile testing agency 7 is equipped on the mobile route of chuck table 36, can in the movement of chuck table 36, detect the profile of the wafer 10 that is held in chuck table 36, thereby can promote productivity ratio.
Claims (3)
1. a processing unit (plant), it has: chuck table, it keeps machined object; Machining cell, it implements processing to being held in the machined object of this chuck table; Processing feed unit, it makes this chuck table is X-direction processing feeding towards processing direction of feed; Index feed unit, it makes this chuck table is Y direction relativity ground index feed with respect to this machining cell towards the index feed direction vertical with X-direction; And X coordinate measurement unit, it detects this chuck table at the coordinate figure of X-direction, it is characterized in that,
This processing unit (plant) has profile testing agency, this profile testing agency has: linear light illumination unit, and it has on the X-direction mobile route that is equipped on this chuck table and with the incidence angle of being scheduled to, irradiates the linear light irradiator of linear light along Y direction to the upper surface that is held in the machined object of this chuck table; Image unit, it has the linear light of accepting to be irradiated by this linear light illumination unit and reflects the reverberation obtaining and the line-scan camera of making a video recording at the upper surface of machined object; And control unit, it is according to from the picture signal of this image unit with from the detection signal of this X coordinate measurement unit, obtains the Y-axis coordinate figure at Y direction two ends at the X-axis coordinate figure place of the machined object that is held in this chuck table.
2. processing unit (plant) according to claim 1, it is characterized in that, this linear light illumination unit has polarizing filter, the light that this polarizing filter is S polarised light for the upper surface with respect to being held in the machined object of this chuck table that makes to irradiate from this linear light irradiator the light coming passes through, this image unit have the light that makes S polarised light by and send it to the polarizing filter of this line-scan camera.
3. processing unit (plant) according to claim 2, is characterized in that, the incidence angle of the linear light irradiating from this linear light irradiator is set to 45 degree～65 degree.
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| JP6215730B2 (en) * | 2014-02-26 | 2017-10-18 | 株式会社ディスコ | Wafer center detection method in processing equipment |
| JP6285784B2 (en) | 2014-04-09 | 2018-02-28 | 株式会社ディスコ | Height position detector |
| JP6610026B2 (en) * | 2015-06-23 | 2019-11-27 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| JP2018055584A (en) * | 2016-09-30 | 2018-04-05 | 株式会社ディスコ | Processing device |
| DE102017129811A1 (en) * | 2017-09-29 | 2019-04-04 | Festool Gmbh | Mobile machine tool |
| CN111928776A (en) * | 2020-07-31 | 2020-11-13 | 中国航空工业集团公司济南特种结构研究所 | Multi-sensor-based non-contact online measurement system and method for numerical control machine tool |
| CN113319669B (en) * | 2021-06-24 | 2022-04-08 | 福州天瑞线锯科技有限公司 | Polishing method and system for grinding surface of material rod |
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| CN101116928A (en) * | 2006-08-04 | 2008-02-06 | 株式会社迪思科 | Laser beam irradiation apparatus and laser working machine |
| CN101378037A (en) * | 2007-08-29 | 2009-03-04 | 株式会社迪思科 | Cutting method and cutting device |
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