CN101426611A - Laser machining apparatus - Google Patents
Laser machining apparatus Download PDFInfo
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- CN101426611A CN101426611A CNA200780014040XA CN200780014040A CN101426611A CN 101426611 A CN101426611 A CN 101426611A CN A200780014040X A CNA200780014040X A CN A200780014040XA CN 200780014040 A CN200780014040 A CN 200780014040A CN 101426611 A CN101426611 A CN 101426611A
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- laser
- machined object
- injection part
- processing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Detection of the three-dimensional shape of a work, enhancement of the precision of the focal point position of a machining laser beam, and compaction of a laser beam machining apparatus are realized. The laser beam machining apparatus (10) operates as follows. While a laser beam output section driver (46) is moving a work (12) from a position near a laser beam output section (22) to a far position, the work (12) is sequentially imaged with a camera (34). Best focused point detection data is extracted from pixels in positions corresponding to best focused point detection positions (P1-n) predetermined in the captured images. A best focused point detection waveform (W) based on the variation of the best focused point detection data is formed for each best focused point detection position (P1-n). The peak values (PK) of the best focused detection waveforms (W) in the best focused detection positions (P1-n) determined from the best focused detection waveforms (W) are compared with one another so as to judge the acceptance/rejection of the work (12). If the work is acceptable, the laser beam output section (22) is moved to the best focused position to perform laser beam machining; contrarily if the work is rejected, the laser beam is not emitted.
Description
Technical field
The present invention relates to can the Laser Processing position probing go out in device in the past can't detected machined object three-dimensional shape defective products and this three-dimensional shape check, simultaneously can be with high accuracy during with Laser Processing laser in focus in the laser processing device of Working position.
Background technology
In the past, adopted by machined object is penetrated the Laser Processing that laser comes machined object is carried out evaporative removal or welding.According to this Laser Processing, by with the laser of energy density maximum in focus in the Working position of machined object, machined object to Working position carries out evaporative removal or fusion, and can carry out cutting, perforate or the welding etc. of machined object, in semiconductor equipment and the manufacturing of other electronic unit, adopt such laser technology mostly at present.
In addition, along with the development of technology in recent years, small-sized day by day, the high precision int of semiconductor equipment and other electronic unit, and laser technology is also required higher machining accuracy.In order to tackle this requirement, for example replace as employed laser in Laser Processing and representational YAG (yttrium/aluminium/garnet) laser is more suitable for precision machined " higher hamonic wave laser " and use than YAG laser.But, compare with YAG laser in the past, the depth of focus of such " higher hamonic wave laser " is very shallow, under the situation of using " higher hamonic wave laser ", requirement is carried out than focusing more accurately in the past, and the precision of precise focusing is very big to the yield rate influence of product.
Simultaneously, along with small-sized, the high precision int of electronic unit, whether the also strict shape of investigating the structure member of being assembled is qualified, also begins to become problem and its three-dimensional shape is whether qualified recently.In other words, even be needed as, also before Laser Processing, removed by strict as at the parts that are counted as the shape the certified products in the past.Therefore, present situation is in the machining accuracy of having relatively high expectations, and about the bad ability that detects of three-dimensional shape to the machined object that is implemented Laser Processing, also requires higher precision.
In the past, in order to check the shape of machined object, quoted the method for utilizing the CCD camera usually.Promptly, store the image (=benchmark image) of the benchmark shape of machined object in advance, the machined object that sends successively with the CCD camera and this image (=photographic images) relatively, judging in the photographic images situation consistent with benchmark image is certified products, removes as defective products under the photographic images situation different with benchmark image by (with reference to patent documentation 1).Yet, though the method for utilizing the CCD camera to judge flat shape whether qualified be effectively, and be not suitable for judging and the fine focusing of laser processing device as the three-dimensional shape that is assembled in the three-dimensional part in the electronic unit.Herein, proposed to carry out the such invention of shape inspection of three-dimensional thing thus, but it can't be applicable to the small three-dimensional thing as the present invention as the CCD camera being tilted with respect to machined object and taking.And it also can't be applicable to the focusing of laser.
Patent documentation 1: Japanese kokai publication hei 4-208844 communique
Patent documentation 2: Japanese kokai publication hei 10-185827 communique
Patent documentation 3: Japanese kokai publication hei 11-230728 communique
Patent documentation 4: Japanese kokai publication hei 11-326235 communique
Patent documentation 5: TOHKEMY 2000-171409 communique
In addition, usually taked before adding the Ministry of worker to judge that the shape of machined object is whether qualified and remove defective products, only provide the method for certified products to adding the Ministry of worker, but adopting under such method situation, cause and whether in a laser processing device, be set up in parallel qualification determination portion and add the Ministry of worker, and exist the device shape to become big such shortcoming, also there is the position of qualification determination portion machined object to the transmission that adds the Ministry of worker the inaccurate such problem that becomes, the miniaturization of except the high performance of above-mentioned whether qualification determination and processing, going back claimed apparatus from whether.
Summary of the invention
The present invention finishes in view of the above problems, its main purpose is to provide a kind of laser processing device, this laser processing device can detect in the past can't detected bad shape processed product, and can further improve processing with the focusing precision of laser and the miniaturization of implement device.
The laser processing device 10 (a) of the 1st aspect penetrates processing by the Working position to machined object 12 and comes above-mentioned machined object 12 is processed with laser X, comprising:
(b) processing laser X takes place with generating device of laser 14 in processing;
(c) lighting device 16, send the illumination light Y of irradiation machined object 12;
(d) the laser injection part 22 that is connected optically with generating device of laser 14 and lighting device 16 with processing penetrates to machined object 12 and to process usefulness laser X and illumination light Y;
(e) laser injection part drive unit 46, make laser injection part 22 with respect to machined object 12 close/leave;
(f) utilize laser injection part drive unit 46 that laser injection part 22 is moved on close/departure direction with respect to machined object 12, at the camera 34 of the machined object 12 that leaves the illumination light Y irradiation for shooting successively of the different shot location of distance of the laser injection part 22 of distance machined object 12; And
(g) image processing apparatus 44, in a plurality of images that different shot location is taken successively, take out successively with a plurality of focus detection position P in the predefined picture for the shape check that is used for machined object 12
1-nThe detected focus detection data in pixel place of corresponding position are at each focus detection position P
1-nForm focus detection waveform W respectively based on the variation of above-mentioned focus detection data, and each the focus detection position P to calculating from above-mentioned each focus detection waveform W
1 -nThe peak value PK of each focus detection waveform W at place compares,
(g-1) be positioned under the situation of predetermined scope (=threshold value) this peak value PK whole, this machined object 12 is judged to be certified products, and make laser injection part 22 move to the focal position Xp of laser injection part 22 relative machining object 12, then to laser injection part 22 output orders, so that laser injection part 22 moves and penetrates laser to machined object and carry out Laser Processing
(g-2) under the situation that one of above-mentioned peak value departs from from predetermined scope, this machined object 12 is judged to be defective products, to 22 instructions of laser injection part, penetrate not carry out laser.
According to the present invention, in Laser Processing portion, whether the three-dimensional shape of judging machined object 12 before just will carrying out Laser Processing is qualified, so not only prevent as example in the past owing to shape decision portion and add the position skew of the different machined objects that take place 12 of the Ministry of worker, and because two portions are gathered is one, so miniaturization that can also implement device.
In addition, by utilizing each focus detection position P
1-nThe peak value PK of each focus detection waveform W at place can be set in laser injection part 22 accurately on the focal position Xp, can further improve the focusing precision of processing with laser.In other words, can tackle 2 or 3 times or the fine focusing of the higher hamonic wave laser that it is above.
In addition, by to each focus detection position P
1-nThe peak value PK of each focus detection waveform W at place compares, can also judge at the three-dimensional shape that on the Laser Processing position, carries out machined object 12 before the Laser Processing simply, as described later, by threshold value being limited near the small scope the peak value PK, can tackle the focusing of above-mentioned higher hamonic wave.
In addition, alleged herein " focus detection data " are meant, data such as pixel (adjacent or contiguous a plurality of pixel groups) extraction/processing brightness that detects from each small part or colourity and the initial data that obtains to the image taken with camera 34, or the mean value of these data (=by the round arithmetic mean of instantaneous value that moves a plurality of initial data at the place, same place that obtains of the lifting of camera 34), standard deviation, minimum of a value and maximum poor, and maximum etc., but adopt an initial data in the present embodiment, describe according to this situation below.Certainly, also identical under the data conditions after processed based on poor and maximum of mean value, standard deviation, minimum of a value and maximum etc.
In addition, " the focal position Xp " of laser injection part 22 relative machined objects 12 is meant, above-mentioned whole focus detection position P
1-nThe arithmetic mean of instantaneous value of peak value PK group or any one peak value PK (being generally and immediate any one the peak value PK of above-mentioned mean value) or the value that calculates with other algorithm.
In the laser processing device that the laser processing device of the 2nd aspect record is put down in writing, it is characterized in that the above-mentioned focus detection position P that image is handled aspect the 1st
1-nBe meant,
(a) 5 points (P-1) in the central authorities of machined object 12 and each bight (P-3) (P-5) (P-7) (P-9),
(b) 8 points (P-1)～(P-8) of each bight of machined object 12 and Ge Bian,
(c) each bight of machined object 12 and Ge Bian and central authorities 9 points (P-1)～(P-9) or
(d) except above-mentioned (P-1)～(P-9), add point arbitrarily on the plane of machined object 12 at 9, can measure the three-dimensional shape that in the past can't measure, can also measure the shape of bowl-shape or cup-shaped machined object 12 especially by measuring these points.
The 3rd aspect is characterised in that, the processing laser about using among the present invention is made as " processing is higher hamonic wave more than 2 times with laser ", obtains higher processing precision thus.In addition, by adopting the measuring method of the 1st aspect of the present invention or the 2nd aspect, can use the higher hamonic wave laser more than 2 times.
According to the present invention, be made as P by the focus detection position that image is handled
1-nWhether a plurality of points like this can judge whether the machined object that has or not machined object, three-dimensional shape is qualified, particularly qualified by be made as more than 5 points, can judge the bad three-dimensional shape with warpage, bending that can't judge in the past.And, owing to can in Laser Processing portion, will carry out judging before the Laser Processing just, so not only can realize the miniaturization of laser processing device, need not in laser processing device, to correct the never advantages such as position of detection position machined object of generation skew during transmit the Laser Processing position of good shape shape but also have.In addition, by utilizing each focus detection position P
1-nThe peak value PK of each focus detection waveform W at place can improve processing and form the precision of position with the focus of laser and can use high order as the 2nd higher hamonic wave or the 3rd higher hamonic wave to process and use laser.
Description of drawings
Fig. 1 is the concept map that laser processing device of the present invention is shown.
Fig. 2 illustrates the concept map of processing with generating device of laser.
Fig. 3 is the concept map that laser injection part of the present invention is shown.
Fig. 4 is the figure that 8 focus detection positions in the machined object of certified products are shown.
Fig. 5 is the figure that illustrates based on the representational waveform of the characteristic quantity of focus detection position.
Fig. 6 is the figure that the waveform of each the focus detection position in the machined object of certified products is shown.
Fig. 7 is the figure that the waveform of each the focus detection position when not having machined object is shown.
Fig. 8 is the figure that the waveform of each the focus detection position in the machined object of bad shape is shown.
Fig. 9 is the figure that the waveform of each the focus detection position in the machined object of bad shape is shown.
Figure 10 is the figure that the waveform of each the focus detection position in the machined object of bad shape is shown.
Figure 11 is the block diagram that each step of laser processing of the present invention is shown.
Label declaration
10...... laser processing device
11...... fixed mount
12...... machined object
14...... processing generating device of laser
16...... lighting device
18...... laser ejecting device
20...... optical fiber
21...... optical fiber
22...... laser injection part
23...... laser injection part position adjustment unit
25...... tubular body
26...... collector lens
28...... processing laser half-reflecting mirror
30...... illumination light half-reflecting mirror
32...... camera collector lens
34...... camera
36...... exit wound of bullet
38...... camera connector
40...... processing laser exit wound of bullet
42...... illumination light exit wound of bullet
44...... image processing apparatus
46...... laser injection part drive unit
100...... Laser room
102...... resonator mirror
104...... resonator shutter
106...... power measurement unit
108...... branch's mirror
110...... branch's shutter
112...... power adjustment unit
114...... optical fiber access unit
116...... He-Ne Lasers oscillator
The mirror 118...... turn back
The specific embodiment
As shown in Figure 1, laser processing device 10 of the present invention is by to being positioned over electronic unit structural elements such as tantalum capacitor on the fixed mount 11, being that three-dimensional machined object 12 (being cuboid or cube in this case) penetrates processing carries out three-dimensional machined object 12 is welded to processing such as fixed mount 11 with laser X device, comprises processing generating device of laser 14, lighting device 16 and laser ejecting device 18.In addition, laser ejecting device 18 is to be used for processing the device of using laser X and illumination light Y to machined object 12 ejaculations or irradiation, as shown in Figure 1, comprises laser injection part 22 and laser injection part position adjustment means 23.
Processing is that the device of processing with laser X takes place with generating device of laser 14, in the present embodiment, adopts the device that the 2nd higher hamonic wave YAG laser (also can be its above higher hamonic wave) taken place.In addition, processing has optical fiber 20 with generating device of laser 14, and processing is directed to laser injection part 22 with laser X by optical fiber 20.In addition, be not limited to the 2nd higher hamonic wave YAG laser with the processing of generating device of laser 14 generations with laser X, and can select the laser with the corresponding wavelength of content of the physical property of machined object 12 and processing by processing.
If processing is described in further detail with generating device of laser 14, then as shown in Figure 2, process a pair of resonator mirror 102, a pair of resonator shutter 104, power measurement unit 106, branch's mirror 108, branch's shutter 110, power adjustment unit 112, the optical fiber access unit 114 that on the light path of connection resonator mirror 102 and Laser room 100, are provided with respectively and the He-Ne Lasers oscillator 116 of the visible light laser Z that vibrates that has Laser room 100, is oppositely arranged mutually across the interval of regulation with generating device of laser 14 in the both sides of Laser room 100.
A pair of resonator mirror 102 is to reflect with laser X from the luminous energy of Laser room 100 emissions and the device that it is come and gone each other in resonator mirror 102 for the processing of vibrating.In addition, set the interval that a pair of resonator mirror 102 is set according to the processing of being vibrated rightly with the wavelength of laser X.
A pair of resonator shutter 104 is the devices that open and close the light path that connects resonator mirror 102 and Laser room 100.At first close resonator shutter 104 till the energy in abundant savings Laser room 100, open resonator shutter 104 and the processing of vibrating laser X through after the stipulated time, thereby can obtain high-intensity processing laser X.
Be set at branch's mirror 108 reflections on the light path from the vibrate processing that of Laser room 100 with laser X, and be directed to optical fiber access unit 114 by branch's shutter 110 and power adjustment unit 112.Then, the processing that imports to optical fiber access unit 114 is imported into optical fiber 20 with laser X after by optically focused.
In addition, a plurality of laser irradiation devices 18 are being supplied with under the situation of processing that takes place by a Laser room 100 with laser X, shown in dashed lines among Fig. 2 like that, a plurality of branches mirror 108, branch's shutter 110, power adjustment unit 112 and optical fiber access unit 114 are set.At this moment, use laser X, in branch's mirror 108, use half-reflecting mirror (or being also referred to as half-mirror) for each optical fiber 20 branches processing to correspondence.In addition, in power adjustment unit 112, by each processing intensity of laser X of branch of adjustment institute, and the intensity that each is processed with laser X becomes even respectively.And then, by opening and closing branch's shutter 110 as required, and can select to import the optical fiber 20 of processing rightly with laser X.
In addition, adjust the position of the He-Ne Lasers oscillator 116 and the mirror 118 of turning back so that turned back after mirror 118 reflections from the vibrate visible light laser Z that of He-Ne Lasers oscillator 116, by with processing with the identical light path of laser X.Thus, can be with visible light laser Z as the guiding light in vibration adjustment of processing usefulness laser X or the incident adjustment etc.
As shown in Figure 1, lighting device 16 is to penetrate to be used for to be the device of illumination light Y, to use LED in the present embodiment at the luminous ray that the focusing of 22 pairs of machined objects 12 of laser injection part is used.In addition, lighting device 16 can also use other light-emitting devices such as Halogen lamp LED.In addition, lighting device 16 has optical fiber 21, and illumination light Y is directed to laser injection part 22 by optical fiber 21.In addition, in the present embodiment, use optical fiber 20,21 will process and import laser ejecting device 18, but can certainly realize these with fixed optical system with laser X and illumination light Y.
As shown in Figure 3, laser injection part 22 comprises tubular body 25, objective system 26, processing laser half-reflecting mirror 28, illumination light half-reflecting mirror 30, camera condensing lens system 32, camera 34.
Processing is to have in its surface reflection processing to use laser X with laser half-reflecting mirror 28, and makes the tabular half-reflecting mirror of the character that the reverberation to the illumination light Y of machined object 12 ejaculations passes through.In addition, processing is fixed or adjustable ground is arranged on the inside of tubular body 25 with predetermined angular (for example 45 °) in the relation of the position of laser exit wound of bullet 40 and the position of exit wound of bullet 36 in processing with laser half-reflecting mirror 28, reflecting the processing laser X that uses 40 incidents of laser exit wound of bullet from processing to exit wound of bullet 36.
Illumination light half-reflecting mirror 30 is at its surperficial indirect illumination light Y, and the tabular half-reflecting mirror that the reverberation of illumination light Y is passed through.And, illumination light half-reflecting mirror 30 is fixed with predetermined angular (for example 45 °) in the relation of the position of the position of illumination light exit wound of bullet 42 and exit wound of bullet 36 or adjustable ground is arranged on the inside of tubular body 25, as one man reflects to exit wound of bullet 36 with the optical axis R of processing with laser X can make from the optical axis R in the leaded light path of the illumination light Y of illumination light exit wound of bullet 42 incidents.
Camera is to be installed in camera connector 38 by the reverberation optically focused of the illumination light Y of the machined object 12 reflection lens combination to camera 34 with condensing lens system 32.
As shown in Figure 1, laser injection part position adjustment unit 23 comprises image processing apparatus 44, laser injection part drive unit 46, camera 34, and the circuit 48 that respectively image processing apparatus 44 and laser injection part drive unit 46 is electrically connected, above-mentioned laser injection part drive unit 46 is following means: in the moving range of predefined laser injection part 22, under laser injection part 22 state different with the distance of machined object 12 (promptly, make laser injection part 22 relative to machined object 12 along near the moving of departure direction (=only along near or departure direction mobile, perhaps 1 time or repeatedly come and go to move) process in, each camera site T of Que Dinging bit by bit), take the image of the machined object 12 that shines by illumination light Y for more than 34 time with camera, and make laser injection part 22 in above-mentioned scope along the direction vertical with machined object 12 near leaving, and make laser injection part 22 move to processing with laser X to penetrate appropriate position (focal position Xp) with laser in order to penetrate processing.
Otherwise, under the situation that one of above-mentioned peak value departs from from predetermined scope (=threshold value), this machined object is judged to be defective products, and, penetrates not carry out laser to laser injection part 22 output orders.In the present embodiment, in order to carry out above-mentioned operation, and in image processing apparatus 44, used general personal computer.
This machined object 12 is judged to be certified products and utilizes laser injection part drive unit 46 laser injection part 22 to be moved under the situation of focal position Xp of 22 pairs of machined objects of laser injection part above-mentioned, only have focus detection position P
1-nThis peak value PK of quantity.Therefore, the focal position Xp of the relative machined object 12 that will move for laser injection part 22, adopt this peak value PK group arithmetic mean of instantaneous value, with immediate peak value PK of mean value wherein or the numerical value that utilizes other best means to obtain.
Next the image that carries out in image processing apparatus 44 is handled and be described in detail.Use Fig. 4 to preestablished 8 (P-1～8) with camera machined object 12 (certified products) time, can detect the three-dimensional shape of machined object 12 qualified/the bad high focus detection position P of possibility
1-nSituation describe.Certainly be not limited thereto focus detection position P
1-nCan be more than 5 in the practical application for a plurality of.
At each image (image at the T place, camera site that the quilt in the moving process in the moving range segments of taking with camera 34, at finely divided state shown in Fig. 5 (a)～(c)), put aside the pixel located above-mentioned 8 focus detection positions (P-1～8) successively and (or comprise near the pixel groups of the pixel it, short of in this manual necessity, then only be called " pixel ") the focus detection data, and abandon the focus detection data of the pixel of other parts.During the savings of the focus detection data of the pixel of locating when the focus detection position (P-1～8) that is through with at all images, next, the variable quantity of drawing the focus detection data at each of each focus detection position (P-1～8) is described focus detection waveform W.
Promptly, according to the order (i.e. the order apart from fixed mount 11) of taking with camera 34 near position to position far away, the focus detection data of drawing the pixel of locating each focus detection position (P-1～8) on the chart (under situation of the present invention, being brightness or deep or light), and obtain focus detection waveform W.As concrete example, use Fig. 5 that the situation of the focus detection waveform W that obtains focus detection position (P-1) and locate is described.
The camera site T that the position from laser injection part 22 when the double dot dash line among Fig. 5 is illustrated in the moving of camera 34 (=move continuously or intermittence of stopping in shooting moves) process and takes machined objects 12 with camera 34 changes the zero hour.
In the present embodiment, the brightness of the pixel of the intersection point of camera site T (double dot dash line among Fig. 5) and focus detection position (P-1) is recorded as the focus detection data, the focus of laser injection part 22 is positioned at the position near the bight C of machined object 12, because focus is aimed at, so the brightness that pixel detection goes out (or deep or light) is high more.
Therefore, when these focus detection data (brightness etc.) in the drafting moving range, certainly such shown in Fig. 5 (a), the focus that generates laser injection part 22 is positioned at the position of the bight C of close machined object 12, and focus detection data (brightness) become the focus detection waveform W of peak value more.In other words, the peak value PK that can be judged to be this focus detection waveform W is focal position (highly) Xp consistent with the focal length of laser injection part 22.
In addition, when supposing that as Fig. 5 (b) bight C is positioned at than the also low position of Fig. 5 (a), produce the peak value PK of focus detection data (brightness) in low position.And then, not having machined object 12, promptly not existing under the situation of focal position, shown in Fig. 5 (c), do not produce peak value PK.In addition, if the depth of focus (focusing range) of laser injection part 22 or its following numerical value (for example 1/2 of the depth of focus) are set at threshold value, and definite height and position apart from machined object 12 that should form peak value PK, then under the situation of Fig. 5 (a), peak value PK becomes in the threshold range, and is judged to be certified products.
On the other hand, under the situation of Fig. 5 (b), peak value PK becomes outside the threshold range, and the thickness of machined object 12 is outside specification as can be known.And then, under the situation of Fig. 5 (c),, there is not machined object 12 so be judged to be because peak value PK can't arrive threshold value.As mentioned above, if the situation of Fig. 5 (a) is made as certified products, then, can also judge whether the height relationships of machined object 12 is qualified by the height of detection peak PK apart from machined object 12.
Consider such relation and with reference to Fig. 6.As shown in Figure 6, the focus detection waveform W that locates in the focus detection position (P-1～8) of machined object 12 all is presented under the situation of shape that same position (being made as height relationships also is in the certified products scope) has peak value PK, and the shape that can judge machined object 12 is not have crooked certified products such as bending or perk on four angles and four limits.
Suppose not exist under the situation of machined object 12 at machining area, as shown in Figure 7, the peak value of the waveform that focus detection position (P-1～8) is located is no more than threshold value, and, have or not machined object 12 by checking focus detection data (brightness) also can detect at once along with diminishing gradually away from machined object 12 focus detection data (brightness).
In addition, as shown in Figure 8, be positioned under the situation of higher position in the end of machined object 12 for shape one side of warpage, the peak value PK that can obtain locating with focus detection position (P-1～3) compares, and the peak value PK that focus detection position (P-5～7) are located is arranged in the such result of figure upside (=have focal position in higher position).
In addition, as shown in Figure 9, at machined object 12 is under the situation of the warped shapes of lower convexity, the peak value PK that can obtain locating with focus detection position (P-1～3,5～7) compares, the peak value PK that focus detection position (P-4 and 8) is located is arranged in the such result of figure downside, as can be known the state of the warpage of the machined object 12 in 8 point measurements.But, because the central authorities of not measuring machined object 12, so can't detect whether bowl-shape or down bowl-shape of crooked one-tenth of machined object 12.
And then, as shown in figure 10, under machined object 12 situation for the warpage that raises up, the peak value PK that can obtain locating with focus detection position (P-1～3,5～7) compares, and the peak value PK that focus detection position (P-4 and 8) locates is arranged in the such result of figure upside.
In addition, in the present embodiment, with each focus detection position P
1-nBe set at each bight and these 8 positions of Ge Bian of machined object 12, if but measure the central authorities of machined object 12 and 5 points in each bight at least, then as can be known warpage, crooked one-tenth is bowl-shape or bowl-shape down.In addition, by each bight, each limit and 9 the central points of measuring machined object 12, can measure more accurately.And then, except above-mentioned 9,, then can detect the defective on the plane of machined object 12 if also measure arbitrfary point on the plane of machined object 12.That is focus detection position P,
1-nQuantity many more, can further improve the precision of the machined object 12 of judging that three-dimensional shape is bad.
For example, when using Fig. 9 explanation with focus detection position P
1-nWhen being set at the situation of 9 positions,, can obtain and the identical waveform in focus detection position (P-4 and 8) from focus detection position (P-9) by set the 9th focus detection position (P-9) at the central portion of machined object 12.Therefore, be under the situation of 8 positions with the focus detection set positions, the central portion of the machined object 12 of bad shape shown in Figure 9 be the depression or outstanding shape becomes indeterminate, though repeat, but by being 9 positions with the focus detection set positions, the upper surface that can be judged to be machined object 12 is the possibility height that do not have concavo-convex curved surface.
Next, the 10 pairs of machined objects of use laser processing device 12 according to block diagram illustrations present embodiment shown in Figure 11 carry out method for processing.In addition, when beginning this method, finished the location of the X-Y direction (with the direction of processing) of machined object 12 with the ejaculation direction quadrature of laser X and illumination light Y.
At first, penetrate illumination light Y (illumination light penetrates step [S-1]) from lighting device 16.In this step, make the illumination light Y that penetrates from lighting device 16 incide tubular body 25 inside from illumination light entrance port 42 by optical fiber 21.Incide illuminated smooth half-reflecting mirror 30 reflections of the illumination light Y of tubular body 25 inside and towards the direction that is changed into exit wound of bullet 36, by objective system 26 time, be refracted, be irradiated to machined object 12 then, shine whole of machined object 12 with the lightness of equalization.
Next, utilize laser injection part drive unit 46 that laser injection part 22 is moved to the predefined position near machined object 12 after, make laser injection part 22 along from machined object 12 away from direction only in moving range, move continuously or intermittently.Along with this moves,, take the image of the machined object 12 of predefined number with camera 34, and output to image processing apparatus 44 (the shooting step [S-2] of machined object image) in the different distances of leaving of distance machined object 12.In addition, in the present embodiment, each image that will be when difference is left distance and taken outputs to image processing apparatus 44 with the positional information of laser injection part 22 from laser injection part drive unit 46, and is recorded in the image processing apparatus 44.
Then, as mentioned above, judge by image processing apparatus 44 whether the shape of machined object 12 is qualified, and judge focal position (focal position determination step [S-3]), and judging into machined object 12 is under the situation of bad shape, stop later Laser Processing, and at the processed object of the next one from beginning to carry out the Laser Processing operation at first.
On the other hand, machined object 12 is being judged under the situation of certified products, used laser injection part drive unit 46 laser injection part 22 to be moved to position, the focal position (the laser injection part moves step [S-4]) of the laser injection part 22 when taking the image corresponding with peak value PK.In the present embodiment, as mentioned above, because the positional information of the laser injection part 22 of each image of shooting machined object 12 is recorded in the image processing apparatus 44, so this positional information when taking the corresponding image of peak value PK with the focus detection data, laser injection part 22 is moved to focal position, but because peak value PK has a plurality of (minimum 5), so for example with the arithmetic mean of instantaneous value of these values, value among the peak value PK near the center, or be made as the focal position Xp of laser injection part 22, and make laser injection part 22 move to this position with the value that the best approach is in addition asked for.Above-mentioned peak value PK is present in the depth of focus of laser injection part 22, so no matter use which value can the misalignment focus, but preferably use arithmetic mean of instantaneous value.
Behind the mobile end of laser injection part 22, use processing processing laser X to take place at last with generating device of laser 14, and penetrate processing with laser exit wound of bullet 40 to tubular body 25 inside from processing via optical fiber 20 and use laser X, and machined object 12 is carried out Laser Processing (Laser Processing step [S-5]).In the present embodiment, will import to optical fiber 20 with the processing that generating device of laser 14 takes place with laser X from processing, and use laser entrance port 40 to tubular body 25 inner incidents from processing.Then, by using the processing laser X of processing, and will be, by objective system 26 time, make its optically focused and inject on the machined object 12 towards the direction that changes over exit wound of bullet 36 with the incident of laser half-reflecting mirror 28 reflection institutes.At this moment, because laser injection part 22 is moved to the focal position of laser injection part 22 in advance exactly, so the processing that injects to machined object 12 with high precision alignment machined object 12, is processed machined object 12 and can become maximum focal position with the energy density of laser X with processing with the focus of laser X.
In addition, in the present embodiment, adjusts the focal position, adjust the focal position but only also can pass through mobile objective system 26 by laser injection part 22 whole the moving of utilizing laser injection part drive unit 46 to make to comprise objective system 26.In addition, in the present embodiment, use pipe in the tubular body 25 to laser injection part 22, but be not limited thereto, also can use rectangular tube etc.In addition, in the present embodiment, in illumination light Y, use visible light, but can not damage the light of machined object 12 so long as energy density is low, then also can use other light.
Claims (according to the modification of the 19th of treaty)
1. laser processing device, (a) this laser processing device penetrates processing by the Working position to machined object and with laser above-mentioned machined object is processed, and it is characterized in that, comprising:
(b) generating device of laser is used in processing, and above-mentioned processing laser takes place;
(c) lighting device sends the illumination light of shining above-mentioned machined object;
(d) the laser injection part that is connected optically with generating device of laser and above-mentioned lighting device with above-mentioned processing penetrates above-mentioned processing with laser and above-mentioned illumination light to above-mentioned machined object;
(e) laser injection part drive unit, make the above-mentioned relatively machined object of above-mentioned laser injection part close/leave;
(f) utilize above-mentioned laser injection part drive unit that above-mentioned laser injection part is moved along close/departure direction relative to above-mentioned machined object, at the camera that leaves the different light-struck above-mentioned machined object of shot location above-mentioned illumination for shooting successively of distance apart from the above-mentioned laser injection part of above-mentioned machined object; And
(g) image processing apparatus; In a plurality of images that different shot location is taken successively; Take out successively with the detected focus detection data of pixel of position corresponding to a plurality of focus detection position in the predefined picture for the shape check that is used for above-mentioned machined object; Form respectively focus detection waveform based on the variation of above-mentioned focus detection data for each above-mentioned focus detection position; And will compare from the peak value of above-mentioned each focus detection waveform of above-mentioned each focus detection position that above-mentioned each focus detection waveshape goes out
(g-1) be positioned in the situation of predetermined scope above-mentioned peak value whole; Above-mentioned machined object is judged to be certified products; And with above-mentioned laser injection part move to the arithmetic mean of instantaneous value of above-mentioned peak value group or above-mentioned peak value group in near the peak value of mean value focal position corresponding, the relative above-mentioned machined object of above-mentioned laser injection part; Then to above-mentioned laser injection part output order; So that above-mentioned laser injection part work and carry out Laser Processing by penetrating laser to above-mentioned machined object
(g-2) under the situation that one of above-mentioned peak value departs from from predetermined scope, above-mentioned machined object is judged to be defective products,, penetrates not carry out laser to above-mentioned laser injection part output order.
2. laser processing device according to claim 1 is characterized in that,
Above-mentioned machined object is cuboid or cube,
The above-mentioned focus detection position that image is handled is
(a) 5 points in the central authorities of above-mentioned machined object and each bight,
(b) 8 points of each bight of above-mentioned machined object and Ge Bian,
(c) 9 points of each bight of above-mentioned machined object and Ge Bian and central authorities or
(d) except 9 points of each bight of above-mentioned machined object and Ge Bian and central authorities, add point arbitrarily on the plane of above-mentioned machined object.
3. laser processing device according to claim 1 and 2 is characterized in that,
Above-mentioned processing laser is the higher hamonic wave more than 2 times.
Claims (3)
1. laser processing device, (a) this laser processing device penetrates processing by the Working position to machined object and with laser above-mentioned machined object is processed, and it is characterized in that, comprising:
(b) generating device of laser is used in processing, and above-mentioned processing laser takes place;
(c) lighting device sends the illumination light of shining above-mentioned machined object;
(d) the laser injection part that is connected optically with generating device of laser and above-mentioned lighting device with above-mentioned processing penetrates above-mentioned processing with laser and above-mentioned illumination light to above-mentioned machined object;
(e) laser injection part drive unit, make the above-mentioned relatively machined object of above-mentioned laser injection part close/leave;
(f) utilize above-mentioned laser injection part drive unit that above-mentioned laser injection part is moved along close/departure direction relative to above-mentioned machined object, at the camera that leaves the different light-struck above-mentioned machined object of shot location above-mentioned illumination for shooting successively of distance apart from the above-mentioned laser injection part of above-mentioned machined object; And
(g) image processing apparatus; In a plurality of images that different shot location is taken successively; Take out successively with the detected focus detection data of pixel of position corresponding to a plurality of focus detection position in the predefined picture for the shape check that is used for above-mentioned machined object; Form respectively focus detection waveform based on the variation of above-mentioned focus detection data for each above-mentioned focus detection position; And will compare from the peak value of above-mentioned each focus detection waveform of above-mentioned each focus detection position that above-mentioned each focus detection waveshape goes out
(g-1) be positioned under the situation of predetermined scope above-mentioned peak value whole, above-mentioned machined object is judged to be certified products, and above-mentioned laser injection part is moved to the focal position of the above-mentioned relatively machined object of above-mentioned laser injection part, then to above-mentioned laser injection part output order, so that above-mentioned laser injection part work and carry out Laser Processing by penetrating laser to above-mentioned machined object
(g-2) under the situation that one of above-mentioned peak value departs from from predetermined scope, above-mentioned machined object is judged to be defective products,, penetrates not carry out laser to above-mentioned laser injection part output order.
2. laser processing device according to claim 1 is characterized in that,
The above-mentioned focus detection position that image is handled is
(a) 5 points in the central authorities of above-mentioned machined object and each bight,
(b) 8 points of each bight of above-mentioned machined object and Ge Bian,
(c) 9 points of each bight of above-mentioned machined object and Ge Bian and central authorities or
(d) except above-mentioned 9 points, add point arbitrarily on the plane of above-mentioned machined object.
3. laser processing device according to claim 1 and 2 is characterized in that,
Above-mentioned processing laser is the higher hamonic wave more than 2 times.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP182398/2006 | 2006-06-30 | ||
| JP2006182398 | 2006-06-30 | ||
| JP2006338772 | 2006-12-15 | ||
| JP338772/2006 | 2006-12-15 | ||
| PCT/JP2007/062903 WO2008001808A1 (en) | 2006-06-30 | 2007-06-27 | Laser machining apparatus |
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| Publication Number | Publication Date |
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| CN101426611A true CN101426611A (en) | 2009-05-06 |
| CN101426611B CN101426611B (en) | 2012-07-04 |
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| CN200780014040XA Active CN101426611B (en) | 2006-06-30 | 2007-06-27 | Laser machining apparatus |
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| JP (1) | JP4852098B2 (en) |
| KR (1) | KR101376995B1 (en) |
| CN (1) | CN101426611B (en) |
| WO (1) | WO2008001808A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102814874A (en) * | 2011-06-10 | 2012-12-12 | 株式会社迪思科 | Processing device |
| CN112384324A (en) * | 2018-07-05 | 2021-02-19 | 浜松光子学株式会社 | Laser processing apparatus |
| CN112584961A (en) * | 2018-08-08 | 2021-03-30 | 罗杰斯德国有限公司 | Method for processing a cermet substrate, installation for carrying out the method and cermet substrate produced by means of the method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5207890B2 (en) * | 2008-09-10 | 2013-06-12 | トリニティ工業株式会社 | Surface decoration system for automotive decorative parts |
| JP5947571B2 (en) * | 2012-03-08 | 2016-07-06 | 株式会社アマダホールディングス | Welding robot and gap adjustment method for welding robot |
| KR101362029B1 (en) * | 2012-05-30 | 2014-02-13 | 주식회사 현대케피코 | Asymmetric laser welding equipment |
| KR102117608B1 (en) * | 2013-08-14 | 2020-06-02 | 삼성디스플레이 주식회사 | Sealing apparatus, substrate sealing apparatus comprising the same and substrate sealing method |
| JP7003903B2 (en) * | 2018-12-20 | 2022-01-21 | ブラザー工業株式会社 | Laser marker |
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| JPS571594A (en) * | 1980-06-03 | 1982-01-06 | Nec Corp | Laser working machine |
| JPH01107990A (en) * | 1987-10-21 | 1989-04-25 | Komatsu Ltd | Automatic focus detector |
| JPH0553786U (en) * | 1991-12-28 | 1993-07-20 | 村田機械株式会社 | Head height controller for laser processing machine |
| JPH1123952A (en) * | 1997-06-30 | 1999-01-29 | Nec Corp | Automatic focusing device and laser beam machining device using the same |
| JP2000263273A (en) * | 1999-03-19 | 2000-09-26 | Amada Co Ltd | Teaching method and its device for yag laser beam machine |
| JP2000326085A (en) * | 1999-05-20 | 2000-11-28 | Nec Corp | Laser beam machine and inspection device |
| JP2002321080A (en) * | 2001-04-24 | 2002-11-05 | Tokyo Instruments Inc | Automatic focussing apparatus for laser precision processing |
| CN1166486C (en) * | 2001-06-27 | 2004-09-15 | 西北工业大学 | Material feeding method for 3D laser forming of 3D metal part |
| US6670574B1 (en) * | 2002-07-31 | 2003-12-30 | Unitek Miyachi Corporation | Laser weld monitor |
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2007
- 2007-06-27 JP JP2008522606A patent/JP4852098B2/en active Active
- 2007-06-27 CN CN200780014040XA patent/CN101426611B/en active Active
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102814874A (en) * | 2011-06-10 | 2012-12-12 | 株式会社迪思科 | Processing device |
| CN102814874B (en) * | 2011-06-10 | 2016-01-20 | 株式会社迪思科 | Processing unit (plant) |
| CN112384324A (en) * | 2018-07-05 | 2021-02-19 | 浜松光子学株式会社 | Laser processing apparatus |
| CN112384324B (en) * | 2018-07-05 | 2022-06-03 | 浜松光子学株式会社 | Laser processing apparatus |
| CN112584961A (en) * | 2018-08-08 | 2021-03-30 | 罗杰斯德国有限公司 | Method for processing a cermet substrate, installation for carrying out the method and cermet substrate produced by means of the method |
Also Published As
| Publication number | Publication date |
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| CN101426611B (en) | 2012-07-04 |
| JPWO2008001808A1 (en) | 2009-11-26 |
| WO2008001808A1 (en) | 2008-01-03 |
| KR101376995B1 (en) | 2014-03-24 |
| KR20090030254A (en) | 2009-03-24 |
| JP4852098B2 (en) | 2012-01-11 |
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