JPH04324950A - Thermocompression bonding head - Google Patents

Thermocompression bonding head

Info

Publication number
JPH04324950A
JPH04324950A JP9540891A JP9540891A JPH04324950A JP H04324950 A JPH04324950 A JP H04324950A JP 9540891 A JP9540891 A JP 9540891A JP 9540891 A JP9540891 A JP 9540891A JP H04324950 A JPH04324950 A JP H04324950A
Authority
JP
Japan
Prior art keywords
thermocompression bonding
bonding piece
thermocompression
bonding head
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9540891A
Other languages
Japanese (ja)
Other versions
JPH07114224B2 (en
Inventor
Yasuto Onizuka
Eiji Watabe
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP9540891A priority Critical patent/JPH07114224B2/en
Publication of JPH04324950A publication Critical patent/JPH04324950A/en
Publication of JPH07114224B2 publication Critical patent/JPH07114224B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To enable a large number of leads extending from a semiconductor device to be well bonded by thermocompression even if the substrate is tilted.
CONSTITUTION: A thermocompression bonding head is composed of a nozzle 2 which sucks a semiconductor chip P blanked out of a film carrier, a thermocompression bonding piece 6 which is provided by the side of the nozzle 2 in a freely and vertically movable manner so as to bond a lead L which extends from the semiconductor chip P to a board 3, and a heating means 4 which is provided above the thermocompression bonding piece 6 in a freely swingable manner to heat the thermocompression bonding piece 6. The heating means 4 is made to swing following the inclination of the thermocompression bonding piece 6 which comes into contact with the board 3, and the thermocompression bonding piece 6 is pressed against the lead L uniform in pressure to execute thermocompression bonding.
COPYRIGHT: (C)1992,JPO&Japio
JP9540891A 1991-04-25 1991-04-25 Bonding head for thermocompression bonding Expired - Fee Related JPH07114224B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9540891A JPH07114224B2 (en) 1991-04-25 1991-04-25 Bonding head for thermocompression bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9540891A JPH07114224B2 (en) 1991-04-25 1991-04-25 Bonding head for thermocompression bonding

Publications (2)

Publication Number Publication Date
JPH04324950A true JPH04324950A (en) 1992-11-13
JPH07114224B2 JPH07114224B2 (en) 1995-12-06

Family

ID=14136853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9540891A Expired - Fee Related JPH07114224B2 (en) 1991-04-25 1991-04-25 Bonding head for thermocompression bonding

Country Status (1)

Country Link
JP (1) JPH07114224B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435303C (en) * 2003-09-22 2008-11-19 优利讯国际贸易有限责任公司 Method for aligning the bondhead of a die bonder
CN100440470C (en) * 2006-02-16 2008-12-03 塔工程有限公司 Bonding head for bonding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435303C (en) * 2003-09-22 2008-11-19 优利讯国际贸易有限责任公司 Method for aligning the bondhead of a die bonder
CN100440470C (en) * 2006-02-16 2008-12-03 塔工程有限公司 Bonding head for bonding machine

Also Published As

Publication number Publication date
JPH07114224B2 (en) 1995-12-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees