JP2000150582A - Manufacturing apparatus of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily change a gap between a semiconductor chip and a lead in a manufacturing apparatus of a LOC-type semiconductor device. SOLUTION: A manufacturing apparatus of a LOC-type semiconductor device has an assembly stage 20 for fixing a semiconductor chip 11 to a lead 12 having an inner lead 12a extending on the main surface of the semiconductor chip 11 with an adhesive 13. The assembly stage 20 is constituted by a chip holding part 21A for holding the semiconductor chip 11 on its bottom surface, a lead holding part 22A arranged at the side of the chip holding part 21A and holding the lead 12 with a spacing 14 between the main surface of the semiconductor chip 11 and the lead 12, and a spacing adjusting part 23 made of plural thin plates 23a removably placed on the holding surface of the lead holding part 22A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a LOC in which a semiconductor chip is held by bonding a main surface of a semiconductor chip and inner leads extending on the main surface to each other.
The present invention relates to an apparatus for manufacturing a semiconductor device having a (lead-on-chip) structure, and more particularly, to an apparatus for manufacturing a semiconductor device capable of adjusting an interval between a semiconductor chip and a lead.

[0002]

2. Description of the Related Art In recent years, as a packaging technique for a semiconductor chip typified by a memory chip or the like, an inner lead portion of a lead frame extends over a main surface of the semiconductor chip, and the inner lead portion and a main surface of the semiconductor chip. So called LO that holds the semiconductor chip by bonding
C technology has been developed. In the conventional LOC type semiconductor device, the main surface of the semiconductor chip and a part of the inner lead portion are fixed by bonding with an insulating tape interposed therebetween, but the semiconductor chip and the inner lead portion are fixed with an adhesive. LOC semiconductor devices have also been developed.

Hereinafter, a manufacturing method using a conventional LOC type semiconductor device manufacturing apparatus will be described with reference to the drawings. 4A and 4B show a LOC semiconductor device, in which FIG. 4A shows a planar configuration, and FIG. 4B shows a IV-IV of FIG.
The cross-sectional configuration along the line is shown. As shown in FIG. 4A, the semiconductor device includes a semiconductor chip 101 and a lead frame 10 bonded on a main surface of the semiconductor chip 101.
2 is provided. The lead frame 102 includes a plurality of inner lead portions 1 extending on the main surface of the semiconductor chip 101.
The adhesive 103 is selectively applied to a position of the inner lead portion 102a facing the peripheral portion on the main surface of the semiconductor chip 101 to form the holding portion 102b. Here, for convenience of explanation, a thin metal wire for electrically connecting the semiconductor chip 101 and the inner lead portion 102a and a sealing resin material for integrally sealing the semiconductor chip 101 and the inner lead portion 102a are omitted. ing.

Hereinafter, a manufacturing apparatus and a manufacturing method of a semiconductor device configured as described above will be described with reference to the drawings. 5 to 7 are cross-sectional views in the order of steps of a conventional method for manufacturing a semiconductor device. FIG. 5 shows a chip bonding (die bonding) step, FIG. 6 shows a wire bonding step, and FIG. The stop process is shown.

First, in the chip bonding step, FIG.
As shown in (a), the semiconductor chip 101 is placed on a fixed stage 104 that can be vacuum-mounted. here,
The back surface of the semiconductor chip is fixed by vacuum suction so that the semiconductor chip 101 does not shift. Pins 104 a for regulating the position of the lead frame 102 are provided on the upper surface of the fixed stage 104.

Next, as shown in FIG. 5B, the nozzle 105 for applying the adhesive is placed on the main surface of the semiconductor chip at a position facing the holding portion 102b of the inner lead portion 102a.
And the adhesive 10 from the adhesive applying nozzle 105.
3 is applied.

[0007] Next, as shown in FIG.
The semiconductor chip 101 coated with the “03” is aligned with the lead frame 102, and then the holding portion 102 b of the inner lead portion 102 a and the semiconductor chip 101 are bonded so that the lead frame 102 holds the semiconductor chip 101. I do.

Next, as shown in FIG. 5D, the lead frame 102 holding the semiconductor chip 101 is placed on a curing furnace stage 106, and thereafter, a heat treatment is performed for a predetermined time to cure the adhesive 103. Let it. Here, the distance between the semiconductor chip 101 and the inner lead portion 102a is determined.

Next, in the wire bonding step, FIG.
As shown in (a), the semiconductor chip 101 held by the lead frame 102 is fixed on the heater block 107 by vacuum suction.

Next, as shown in FIG. 6B, a first clamper 108A for supporting the lead frame 102 and a second clamper 108 for supporting the inner lead portion 102a.
B, the lead frame 102 is pressed against the heater block 107 so that the inner lead portion 102
a is brought into contact with the main surface of the semiconductor chip 101. Thereafter, a thin metal wire 110 is formed by using a capillary 109 for a wire bonder, and the inner lead portion 102a is connected to the terminal 101a on the semiconductor chip 101 by using the formed thin metal wire 110.

Next, as shown in FIG. 6 (c), when the first clamper 108A and the second clamper 108B are removed, the inner lead portion 102a returns to the original state, and FIG.
As shown in (d), the inner lead portion 102a and the semiconductor chip 101 are electrically connected by the thin metal wires 110.

Next, in the resin sealing step, FIG.
As shown in FIG. 7B, after placing the semiconductor chip 101 held by the lead frame 102 inside a resin sealing mold 111 having a gate port 111a, as shown in FIG. 7 (c) when the sealing resin material 112 is injected from the gate port 111a of FIG.

Next, as shown in FIG.
When the semiconductor chip 101 is taken out from the semiconductor device 101, the LOC semiconductor device in which the semiconductor chip 101 and the holding portion 102b of the inner lead 102a are fixed by the adhesive 103 and the periphery is sealed by the sealing resin material 112 is obtained.

[0014]

However, the above-mentioned conventional LOC type semiconductor device manufacturing apparatus employs a semiconductor chip 1
Since the distance between the lead frame 01 and the lead frame 102 is regulated by the fixed stage 104 shown in FIG. 5, if this distance is changed at the time of manufacturing, the fixed stage 104 capable of obtaining the predetermined distance must be newly prepared. There is a problem that it does not.

[0015] The present invention solves the above-mentioned conventional problem and provides a LOC.
An object of the present invention is to make it possible to easily change the distance between a semiconductor chip and a lead frame in an apparatus for manufacturing a semiconductor device.

[0016]

In order to achieve the above-mentioned object, the present invention has a construction in which an assembly stage for fixing a semiconductor chip to a lead has a spacing adjusting means for adjusting a spacing between the semiconductor chip and the lead.

More specifically, an apparatus for manufacturing a semiconductor device according to the present invention is an apparatus for manufacturing a semiconductor device having a semiconductor chip and a lead provided on the main surface of the semiconductor chip and holding the semiconductor chip. A chip holding portion for holding a semiconductor chip on a lower surface thereof, and a lead provided on a side of the chip holding portion for holding a lead at a distance from a main surface of the semiconductor chip held by the chip holding portion. An assembly stage having a lead holding section and an interval adjusting means for adjusting an interval between a semiconductor chip held by the chip holding section and a lead held by the lead holding section is provided.

According to the semiconductor device manufacturing apparatus of the present invention,
An assembly stage that adjusts an interval between a chip holding unit that holds a semiconductor chip, a lead holding unit that holds a lead, and a semiconductor chip held by the chip holding unit and a lead held by the lead holding unit; Means, when the semiconductor device is manufactured, even when the distance between the semiconductor chip to be manufactured and the lead is changed, the distance adjusting means can be used to adjust the distance between the semiconductor chip and the lead. The spacing can be easily adjusted.

In the apparatus for manufacturing a semiconductor device according to the present invention,
It is preferable that the interval adjusting means is composed of a plurality of thin plates removably mounted on a holding surface of the lead holding portion for holding the leads.

In the apparatus for manufacturing a semiconductor device according to the present invention,
It is preferable that the gap adjusting means is a screw member whose lower part is rotatably held by the apparatus main body and whose upper part is screwed to the chip holding part, and which moves the chip holding part up and down with respect to the apparatus main body.

In the semiconductor device manufacturing apparatus of the present invention,
It is preferable that the gap adjusting means is composed of a plurality of thin plates which are detachably inserted between the chip holding portion and the device main body holding the chip holding portion on its lower surface.

[0022]

(First Embodiment) A first embodiment of the present invention.
An embodiment will be described with reference to the drawings.

FIG. 1 shows an LO according to a first embodiment of the present invention.
1 shows a cross-sectional configuration of a manufacturing apparatus for a C-type semiconductor device. As shown in FIG. 1, reference numeral 20 denotes a die bonding process.
This is an assembly stage for fixing the semiconductor chip 11 and the lead 12 having the inner lead 12a extending on the main surface of the semiconductor chip 11 with an adhesive 13 made of a light or thermosetting resin. In the present embodiment,
It is assumed that the lead 12 includes an inner lead 12a and an outer lead extending outside the inner lead 12a.

The assembling stage 20 according to the present embodiment includes a chip holding portion 21A for holding the semiconductor chip 11 on the lower surface of the semiconductor chip 11, and a side portion of the chip holding portion 21A. A lead holding portion 22A that holds the lead 14 at a distance 14 from the main surface thereof, and a spacing adjusting portion 23 that is provided on the holding surface of the lead holding portion 22A that holds the lead 12.

The interval adjusting section 23 has a thickness of 1 μm.
A plurality of thin plates 23a having a size of about m to 100 μm and removably mounted on the holding surface of the lead holding unit 22A, and each thin plate 23a is inserted into a hole provided in an upper part of the lead holding unit 22A to thereby separate each thin plate 23a. And a supporting rod 23b for supporting.

The chip holder 21A penetrates up and down,
A first vacuum suction hole 20a for vacuum-suctioning the lower surface of the semiconductor chip 11 is provided. The first vacuum-suction hole 20a penetrates vertically through the lead holding portion 22A and each of the gap adjusting plates 23 to vacuum-suction the lower surface of the lead 12. A second vacuum suction hole 20b is provided.

Usually, the space 14 between the semiconductor chip 11 and the lead 12 is often about 50 μm to 200 μm. In the present embodiment, the distance between the semiconductor chip 11 and the lead 12 is between the lead holding portion 22 A and the lead 12. Since the interval adjuster 23 composed of a plurality of thin plates 23a capable of adjusting the interval 14 is provided, a plurality of thin plates 23a having a predetermined thickness are prepared in advance, and the intervals of the thin plates 23a are adjusted so that a desired interval 14 is obtained. Addition to the adjustment unit 23 or interval adjustment unit 23
, The spacing 14 can be easily changed. Further, when thin plates 23a having different thicknesses are stacked on the gap adjusting unit 23, fine adjustment is facilitated.

It is sufficient that the support bar 23a does not protrude from the upper surface of the gap adjusting section 23, and therefore, it may be a single member or a plurality of members. In the case where it is composed of a plurality of members, it may be formed integrally with each thin plate 23a.

(Second Embodiment) Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

FIG. 2 shows an LO according to a second embodiment of the present invention.
1 shows a cross-sectional configuration of a manufacturing apparatus for a C-type semiconductor device. In FIG. 2, the same components as those shown in FIG.

As shown in FIG. 2, the assembling stage 20 according to the present embodiment includes a support base 24 as a part of the apparatus main body.
A chip holder 21B placed on the support 24 and holding the semiconductor chip 12 on its lower surface, and a lower part rotatably supported by the support 24 and an upper part screwed into the chip holder 21B. Then, the chip holding portion 21B is
A screw member 25 as an interval adjusting means for moving up and down with respect to 4, and provided on the support base 24 and beside the chip holding portion 21 </ b> B so that the lead 12 is spaced from the main surface of the semiconductor chip 11 by an interval 14. And a lead holding portion 22B for holding.

As described above, according to the present embodiment, LOC
When it is necessary to change the interval 14 between the semiconductor chip 11 and the lead 12 when manufacturing the semiconductor device,
By rotating the screw member 25, the interval 14 can be easily and steplessly adjusted.

In this embodiment, the screw member 2
5 is supported on the support 24, but the screw member 25 may be screwed so as to penetrate the support 24 up and down.

(Third Embodiment) Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

FIG. 3 shows an LO according to a third embodiment of the present invention.
1 shows a cross-sectional configuration of a manufacturing apparatus for a C-type semiconductor device. In FIG. 3, the same components as those shown in FIG.

As shown in FIG. 3, the assembly stage 20 according to the present embodiment includes a support 24, a chip holder 21C mounted on the support 24, and holding the semiconductor chip 12 on its lower surface. An interval adjusting unit 26 composed of a plurality of thin plates 26a detachably inserted between the support 24 and the chip holder 21C, and a lead 12 provided on the support 24 and beside the chip holder 21C, and the lead 12 It is composed of a main surface of the chip 11 and a lead holding portion 22C which holds the chip 11 at an interval.

As described above, the interval adjusting section 26 is provided on the support base 2.
4 and a plurality of thin plates 26a which are removably inserted between the chip holder 21C and each of the thin plates 26a.
A plurality of thin plates 26a of about 100 μm to 100 μm are prepared, and when it is necessary to change the interval 14 between the semiconductor chip 11 and the lead 12, the thin plates 26a are separated so that a desired interval 14 is obtained. The space 14 can be easily adjusted by additionally inserting it into the adjusting unit 26 or removing it from the space adjusting unit 26. Further, when the thin plates 26a having different thicknesses are stacked, fine adjustment becomes easy.

In addition, in the present embodiment, since the interval adjusting section 26 is provided only at one position of the chip holding section 22C, it can be adjusted more easily than in the first embodiment, and the second embodiment can be adjusted. It is easier to obtain a desired interval than the screw member 25 and the accuracy is improved.

[0039]

According to the semiconductor device manufacturing apparatus of the present invention, the assembly stage for manufacturing the semiconductor device has the interval adjusting means for adjusting the interval between the semiconductor chip and the lead. Even when the distance between the semiconductor chip and the lead is changed, the distance adjusting means
Since the distance between the semiconductor chip and the lead can be easily adjusted, the number of steps required for manufacturing can be reduced.

In the semiconductor device manufacturing apparatus of the present invention,
When the interval adjusting means is composed of a plurality of thin plates removably mounted on a holding surface for holding the lead in the lead holding unit, the number of thin plates is increased or decreased by adding or removing thin plates, thereby increasing the number of thin plates. Since the holding portion is substantially moved up and down with respect to the semiconductor chip, the distance between the semiconductor chip and the lead can be reliably changed.

In the semiconductor device manufacturing apparatus of the present invention,
A thread adjusting member having a lower portion rotatably held by the apparatus main body and an upper portion screwed to the chip holding portion, and the tip adjusting portion being vertically moved with respect to the device main body; By rotating, the chip holder moves up and down with respect to the lead, so that the distance between the semiconductor chip and the lead can be reliably changed.

In the apparatus for manufacturing a semiconductor device according to the present invention,
When the interval adjusting means is composed of a plurality of thin plates detachably inserted between the chip holding portion and the apparatus body holding the chip holding portion on the lower surface, the number of thin plates is increased by additionally inserting or removing the thin plates. By increasing or decreasing the distance, the chip holder moves up and down with respect to the lead, so that the distance between the semiconductor chip and the lead can be reliably changed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of an apparatus for manufacturing a LOC semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a configuration sectional view showing an apparatus for manufacturing a LOC semiconductor device according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a configuration of an apparatus for manufacturing a LOC semiconductor device according to a third embodiment of the present invention.

FIGS. 4A and 4B show a conventional semiconductor device,
(A) is a plan view, and (b) is a cross-sectional view taken along line IV-IV of (a).

FIG. 5 is a cross-sectional configuration view illustrating a step of a chip bonding step in a conventional method of manufacturing a semiconductor device.

FIG. 6 is a cross-sectional configuration view illustrating a wire bonding step of a conventional method of manufacturing a semiconductor device in a process order.

FIG. 7 is a cross-sectional view of a process sequence showing a resin sealing process of a conventional method for manufacturing a semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Semiconductor chip 12 Lead 12a Inner lead 13 Adhesive material 14 Distance between semiconductor chip and lead 20 Assembly stage 20a First vacuum suction hole 20b Second vacuum suction hole 21A Chip holder 22A Lead holder 23 Interval adjuster 23a Thin plate 23b support rod 21B chip holding part 22B lead holding part 24 support base (apparatus main body) 25 screw member 21C chip holding part 22C lead holding part 26 interval adjusting part

 ──────────────────────────────────────────────────の Continuing on the front page (72) Yoshiyuki Arai, 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Yukiyuki Nose 1006 Kadoma, Kazuma, Kadoma, Osaka Pref. (72) Inventor Keiichi Fujimoto 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.F-term (reference) 5F044 AA01 GG03 GG08 5F067 AA01 AB02 BB19 BE10 CC03 CC07

Claims (4)

[Claims] 1. An apparatus for manufacturing a semiconductor device comprising: a semiconductor chip; and a lead provided to extend on a main surface of the semiconductor chip and holding the semiconductor chip, wherein the semiconductor chip is held on a lower surface thereof. A chip holding unit provided on a side of the chip holding unit, the lead holding unit holding the lead at an interval from a main surface of a semiconductor chip held by the chip holding unit; An apparatus for manufacturing a semiconductor device, comprising: an assembly stage having an interval adjusting means for adjusting an interval between a semiconductor chip held by a unit and a lead held by the lead holding unit. 2. The semiconductor device according to claim 1, wherein said gap adjusting means comprises a plurality of thin plates removably mounted on a holding surface of said lead holding portion for holding a lead. Manufacturing equipment. 3. The distance adjusting means has a lower part rotatably held by the apparatus main body and an upper part screwed into the chip holding part, and moves the chip holding part up and down with respect to the apparatus main body. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein the semiconductor device is a screw member. 4. The apparatus according to claim 1, wherein said gap adjusting means comprises a plurality of thin plates removably inserted between said chip holding portion and an apparatus body holding said chip holding portion on a lower surface thereof. 2. The apparatus for manufacturing a semiconductor device according to 1.