JPH03177060A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPH03177060A
JPH03177060A JP31623189A JP31623189A JPH03177060A JP H03177060 A JPH03177060 A JP H03177060A JP 31623189 A JP31623189 A JP 31623189A JP 31623189 A JP31623189 A JP 31623189A JP H03177060 A JPH03177060 A JP H03177060A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
die pad
part
protrusion
semiconductor element
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31623189A
Inventor
Yoji Nagabuchi
Hiroyuki Noguchi
Yoshiaki Ogawa
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To prevent crack of a semiconductor element from occurring and improve reliability in an outer lead bending process by providing a reinforcing fixing part at a die pad part where the semiconductor element of a lead frame is adhered.
CONSTITUTION: In a case where a mold resin 4 on the surface of a lead frame 1 are removed. a protrusion 8 corresponding to the reinforcing fixing part is provided at the tip part within a mold resin 4 at a die pad part 5. Then, the protrusion 8 has the same thickness as the die pad part 5, is provided with a rectangular shape a having a horizontal width L1 which is longer than the width in horizontal direction of the die pad 5, and is connected to the die pad part 5 through a connection part 9 with a shorter width l than the horizontal width of this rectangular shape a. Thus, in a process for bending an outer lead 7 of the semiconductor device, the die pad 6 is pulled toward the outside and is subjected to stress. However, since a protrusion 8 is provided at the die pad 5, the protrusion 8 can be resistant at the mold resin 4 even if the die pad 5 is subjected to stress so that the stress cannot be centered to the semiconductor element 2, thus reducing the possibility that a crack may be produced at the semiconductor element 2 drastically.
COPYRIGHT: (C)1991,JPO&Japio
JP31623189A 1989-12-05 1989-12-05 Lead frame for semiconductor device Pending JPH03177060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31623189A JPH03177060A (en) 1989-12-05 1989-12-05 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31623189A JPH03177060A (en) 1989-12-05 1989-12-05 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPH03177060A true true JPH03177060A (en) 1991-08-01

Family

ID=18074772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31623189A Pending JPH03177060A (en) 1989-12-05 1989-12-05 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPH03177060A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

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