JP2697743B2 - Resin-sealed semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] Regarding improvement of a resin-encapsulated semiconductor device manufactured by a tape automated bonding method, a resin-encapsulated semiconductor device that does not have a die stage and supports a semiconductor chip with leads by a TAB method. In order to provide a resin-encapsulated semiconductor device capable of preventing a semiconductor chip from being displaced in a device, a semiconductor chip having a plurality of electrodes formed on a surface, one end connected to the electrode (1a), A plurality of inner leads whose ends are connected to the outer leads, and a resin-sealed semiconductor device in which a support tape whose surface is connected across the plurality of inner leads to reinforce the inner leads is sealed with resin. In order to reinforce the support tape, a support bar is provided on the back surface of the support tape by bonding.

[Industrial applications]

The present invention relates to a Tape Automated Bonding method (hereinafter referred to as TAB
Abbreviated as the method. The present invention relates to an improvement in a resin-sealed semiconductor device manufactured by the method described in (1).

2. Description of the Related Art In recent years, in order to realize a highly integrated and thinner resin-encapsulated semiconductor device, a die stage of a lead frame on which a semiconductor chip is mounted has been removed, and an assembly method using a TAB method has been employed.

In this TAB assembly, the semiconductor chip is not directly supported, but is supported by a large number of leads crimped on the bumps of the semiconductor chip, so when the semiconductor chip is displaced, the semiconductor chip is supported. The conductor is deformed and various obstacles are caused.

Under the circumstances described above, there is a demand for a resin-encapsulated semiconductor device in which a semiconductor chip is not displaced when assembled by a TAB method using a lead frame without a die stage.

[Conventional technology]

A conventional resin-encapsulated semiconductor device will be described in detail with reference to FIGS.

FIG. 3 is a sectional view showing a conventional resin-encapsulated semiconductor device. As shown in the figure, the ILB of the conductor 3 formed on the surface of the bump 1a of the semiconductor chip 1 and the film support 2a
The lead 3a is crimped and the OLB lead 3 of the conductor 3
b and the lead 14b are crimped, and the semiconductor chip 1 and the lead 14
b is electrically connected.

The conductor 3 formed on the surface of the film support 2a is called a conductor-supported film support. The conductor-supported film support is manufactured by cutting out a central portion of a conductor-attached insulating film which will be described in detail with reference to FIG.

Semiconductor chip 1 assembled by TAB method in this way
Is sealed with a mold resin 15 as shown in the figure using a mold, thereby completing a resin-sealed semiconductor device.

FIG. 4 shows a lead frame 14 used for such a resin-sealed semiconductor device. As shown in the figure, the lead frame 14 made of a copper-based or Fe-Ni alloy-based material having a thickness of 0.15 mm is composed of a tie bar 14a and a lead 14b protruding inside the tie bar 14a.

FIG. 5 shows the above insulating film with a conductor used for assembling the TAB method. As shown in the figure, the insulating film 2 made of polyimide having a thickness of about 125 .mu.m is precisely moved in the manufacturing process of forming a conductor 3 having a thickness of 30 to 35 .mu.m on the peripheral edges on both sides. Is provided with a feed hole 2b used for

At the center of the region of the insulating film 2 where the conductor-attached insulating film is formed, a square hole slightly larger than the semiconductor chip is provided, and a trapezoidal hole surrounding the square hole is provided.

The surface of the insulating film 2 having a width of 2 to 3 mm between the square hole and the trapezoidal hole, which is referred to as a film support 2a, and the surface of the insulating film 2 outside the trapezoidal hole are provided inside the square hole. A protruding continuous conductor 3 is provided, and a test electrode 3c is provided at an outer peripheral end thereof. The portion of the conductor 3 protruding into the inside of this square hole is called an ILB lead 3a.

When such an insulating film with a conductor is used for assembling the TAB method, only the area indicated by the two-dot chain line in the figure is used. In this case, the outer peripheral portion of the conductor 3 is an OLB lead 3b.
It is called.

Such an insulating film with a conductor in a region indicated by a two-dot chain line is called a film support with a conductor.

The film support with conductor, the semiconductor chip 1 and the lead frame 14 are assembled as shown in FIG.

Bump 1a of semiconductor chip 1 and ILB lead 3a of conductor 3;
The OLB lead 3b of the conductor 3 and the lead 14b of the lead frame 14 are crimped and connected.

In the state assembled in this manner, the tie bar 14a and the lead 14b are molded with the molding resin 15 using a molding die.
Is cut off to separate the outer leads 14 as shown in FIG.
A resin-sealed semiconductor device in which e protrudes from the side surface of the mold resin 15 is completed.

[Problems to be solved by the invention]

In the conventional resin-encapsulated semiconductor device described above, the lead frame 14 does not have a die stage as shown in FIG. 1 is supported, and the semiconductor chip 1 is highly integrated and the semiconductor chip 1
When the area of the semiconductor chip 1 becomes large, the semiconductor chip 1 is displaced by the handling in the assembling process and the flow of the molding resin in the molding process, and the bump 1a of the semiconductor chip 1 and the conductor 3
However, there is a problem that the crimped portion with the ILB lead 3a is peeled off and the conductor 3 is cut off, and the thickness of the mold resin 15 is reduced.
The distance between the surface of the mold resin 15 and the semiconductor chip 1 or the conductor 3 becomes small due to the displacement, and the moisture absorption performance is reduced.

In view of the above circumstances, the present invention provides a resin-sealed semiconductor device having no die stage and capable of preventing displacement of the semiconductor chip in a resin-sealed semiconductor device in which a semiconductor chip is supported by leads by a TAB method. It is intended to provide a device.

[Means for solving the problem]

The resin-encapsulated semiconductor device of the present invention includes a semiconductor chip having a plurality of electrodes formed on a surface thereof, a plurality of inner leads having one end connected to the electrode, and the other end connected to an outer lead, and the inner lead. In a resin-encapsulated semiconductor device in which a support tape whose surface is bonded across the plurality of inner leads to reinforce is sealed with resin,
In order to reinforce the support tape, a support bar is provided on the back surface of the support tape by bonding.

[Operation] That is, in the present invention, the bump of the semiconductor chip and the ILB lead projecting inside the film support of the conductor formed on the surface of the film support surrounding the semiconductor chip are pressure-bonded to the inside from the tie bar of the lead frame. The protruding lead and the OLB lead protruding outside the film support of the conductor are crimped, the tie bar of this lead frame and the support bar are connected by the support, and the support bar and the film support are bonded and integrated. Since the film support is reinforced in this way, it is possible to prevent displacement during handling or molding of the semiconductor chip supporting the conductor and the bump formed on the surface of the film support by crimping. Prevents peeling of the crimped part between the bump of the semiconductor chip and the ILB lead and cutting of the ILB lead It is possible to make the mold resin surface and the semiconductor chip or IL
It is possible to prevent a decrease in moisture resistance due to a reduction in the distance from the B lead.

〔Example〕

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1, 2, 5, and 6.

FIG. 1 is a sectional view showing a resin-sealed semiconductor device according to one embodiment of the present invention. As shown in the figure, the bump 1a of the semiconductor chip 1 and the ILB lead 3a of the conductor 3 formed on the surface of the film support 2a are crimped, and the OLB lead 3b and the lead 1b of the conductor 3 are crimped. The semiconductor chip 1 and the leads 4b are electrically connected.

In the present invention, a support bar 4c adhered to and integrated with the film support 2a is provided below the film support 2a.

The bonding between the film support 2a and the support bar 4c is performed using an adhesive or an insulative double-sided tape. When the position of the film support 2a and the conductor 3 are reversed, a short circuit of the conductor 3 by the support bar 4c is prevented. To do so, it is necessary to use an insulating double-sided tape.

Semiconductor chip 1 assembled by TAB method in this way
Is sealed with a molding resin using a mold resin 5 as shown in the figure, thereby completing a resin-sealed semiconductor device.

FIG. 2 shows a lead frame 4 used for such a resin-sealed semiconductor device. As shown in the figure, the lead frame 4 includes a tie bar 4a, a lead 4b protruding inside the tie bar 4a, and a support bar 4c connected to the tie bar 4a by a support 4d.

The film support with conductor used for assembling the TAB method of the present invention is the same as that of the conventional insulating film with conductor shown in FIG.

The film support with conductor, the semiconductor chip 1 and the lead frame 4 are assembled in the same manner as in FIG.

Bump 1a of semiconductor chip 1 and ILB lead 3a of conductor 3;
The OLB lead 3b of the conductor 3 and the lead 4b of the lead frame 4 are crimped and connected.

In this state, the tie bar 4a and the lead 4b are cut and separated from each other by molding with a molding resin in a molding die, and the outer lead 4e as shown in FIG. The completed resin-sealed semiconductor device is completed.

As described above, when the resin-encapsulated semiconductor device is assembled using the lead frame 4 having the support bar 4c connected to the tie bar 4a and the support portion 4d at the central portion, the support bar 4c and the film support of the film support with conductor are assembled. 2a
And the film support
2a is reinforced by the strength of the support bar 4c, and the semiconductor chip 1 is firmly supported via the conductor 3 formed on the surface of the film support 2a.

〔The invention's effect〕

As is apparent from the above description, according to the present invention, it is possible to prevent the displacement of the semiconductor chip by reinforcing the film support by a very simple structure change in which a support bar is provided on a lead frame having no die stage. It is possible to provide a resin-encapsulated semiconductor device that can prevent various obstacles caused by the displacement of the semiconductor chip, and that can be expected to have significant economical and reliability improvement effects. Become.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a resin-sealed semiconductor device according to one embodiment of the present invention, FIG. 2 is a plan view showing a lead frame according to one embodiment of the present invention, and FIG. FIG. 4 is a plan view of a conventional lead frame, FIG. 5 is a view showing an insulating film with a conductor used for assembling a TAB method, and FIG. 6 is a semiconductor chip, a film support with a conductor and leads. FIG. 7 is a view showing a state where the frame is assembled, and FIG. 7 is a sectional view showing a problem to be solved by the invention. In the figure, 1 is a semiconductor chip, 1a is a bump, 2 is an insulating film, 2a is a film support, 2b is a feed hole, 3 is a conductor, 3a is an ILB lead, 3b is an OLB lead, 3c is a test electrode, and 4 is a test electrode. A lead frame, 4a indicates a tie bar, 4b indicates a lead, 4c indicates a support bar, 4d indicates a support portion, 4e indicates an outer lead, and 5 indicates a mold resin.

Claims (1)

(57) [Claims] 1. A semiconductor chip (1) having a plurality of electrodes (1a) formed on its surface, one end connected to the electrode (1a), and the other end connected to an external lead (4e).
A plurality of inner leads (3) connected to the support tape, and a support tape (2a) whose surface is bonded over the plurality of inner leads (3) to reinforce the inner leads (3) is sealed with a resin. A resin-sealed semiconductor device, wherein a support bar (4c) is provided on the back surface of the support tape so as to reinforce the support tape (2a).