JP3180590B2 - Solder ball mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus for mounting a solder ball for forming a bump on a work such as a substrate.

[0002]

2. Description of the Related Art As a method of forming bumps (protruding electrodes) on electrodes of a work such as a substrate or a chip, a method of mounting a solder ball on a work and then heating and melting and solidifying the solder ball is known. Generally, many bumps are formed on a work, and thus a large number of solder balls are mounted on the work. Hereinafter, a solder ball supply unit used in a conventional solder ball mounting apparatus for mounting a large number of solder balls on a work at once will be described.

FIG. 5 is a cross-sectional view of a solder ball supply section provided in a conventional solder ball mounting apparatus, and FIG. 6 is a partial cross-sectional view of the same head. In FIG. 5, reference numeral 1 denotes a solder ball, which is stored in a container 2. A vibrator 3 is mounted on the lower surface of the container 2. The container 2 is supported by a support portion 5 via an elastic member 4 so as to be able to vibrate. Reference numeral 7 denotes a head, on the lower surface of which a suction hole 8 for vacuum-sucking the solder ball 1 is formed.

When the vibrator 3 is driven to vibrate the container 2, the head 7 moves the solder balls 1 into a plurality of suction holes 8.
Fluidizes the solder ball 1 so that the
By lowering and raising the head 7 in this state, the solder ball 1 is vacuum-adsorbed to the suction hole 8 and picked up. Next, the head 7 moves above a work (not shown) such as a substrate, and mounts the solder ball 1 on the work.

[0005]

However, the conventional solder ball supply section has the following problems.
That is, the solder ball 1 is fluidized by vibrating the container 2 by the vibrator 3.
Since the vibration direction N is vertical, the upper surface of the solder ball 1 is wavy as shown in FIG.
The solder ball 1 was difficult to be vacuum-sucked. Further, as shown in FIG. 6, a plurality of solder balls 1 were easily adsorbed in one suction hole 8 in a dumpling shape.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a solder ball mounting apparatus which can surely vacuum-adsorb solder balls one by one into suction holes on a lower surface of a head and mount the solder balls on a work.

[0007]

According to the present invention, there is provided a solder ball supply unit comprising: a container for storing solder balls; and a vibration for imparting an oblique vibration including vertical and horizontal components to the container. The vibration applying means.
Is composed of a vibrator and a plurality of spring members in an inclined posture . Preferably, the planar shape of the container is a quadrangle.
And there are four spring members, and these four spring members
Are provided corresponding to the four sides of the container.
is there.

[0008]

According to the above construction, the container vibrates not only in the vertical direction but also in the horizontal direction, so that the upper surface of the solder ball inside the container does not undulate and is substantially horizontal, and therefore the solder ball is provided in all the suction holes of the head. Can be reliably vacuum-adsorbed. Even if a plurality of solder balls are sucked into the suction hole, the extra solder ball is shaken off by applying horizontal vibration, so that only one solder ball is vacuum-sucked to the suction hole.

[0009]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a solder ball mounting apparatus according to one embodiment of the present invention, FIG. 2 is a sectional view of a solder ball supply unit provided in the solder ball mounting apparatus, FIG. FIG. 2 is a partial sectional view of the head.

In FIG. 1, reference numeral 11 denotes a solder ball supply unit, which will be described in detail with reference to FIGS. Reference numeral 12 denotes a container in which the solder balls 1 are stored. Reference numeral 13 denotes a tube for blowing gas into the container 12. The gas may be air or nitrogen gas which is effective for preventing oxidation of the solder balls. The tube 13 is connected to a gas supply device 20 (FIG. 1). 14 is a base plate. Stoppers 15 and 16 are mounted on the base plate 14 and the lower surface of the container 12. Upper and lower ends of a spring plate 17 made of a leaf spring are fixed to a stopper 15 on the base plate 14 and a stopper 16 on the lower surface of the container 12 with screws 18. There are four spring members 17,
Each is fixed to the stoppers 15 and 16 in an inclined posture.
As shown in FIG. 3, the four spring members 17 have a planar shape of four.
Provided so as to correspond to the four sides of the rectangular container 12.
I have. A vibrator 19 is mounted at the center of the lower surface of the container 12.

In FIG. 2, when the vibrator 19 vibrates,
The spring member 17 vibrates in an oblique direction N1 perpendicular to the length direction, and the container 12 coupled to the spring member 17 also vibrates in the same oblique direction. The oblique direction N1 has a component in the vertical direction N2 and a component in the horizontal direction N3, and the vibration direction of the container 12 also includes a component in the vertical direction N2 and a component in the horizontal direction N3. Therefore, the solder balls 1 stored in the container 12 vibrate not only in the vertical direction N2 but also in the horizontal direction N3.

Here, the vibration in the vertical direction N2 acts to undulate the upper surface of the solder ball 1 as shown in FIG. 5, while the vibration in the horizontal direction N3 acts to disperse the undulation. Therefore, when the solder ball 1 is caused to flow by driving the vibrator 19 to vibrate the container 12, the upper surface of the solder ball 1 keeps a substantially horizontal surface. The four spring members 17 are inclined in the same direction when viewed from the center of the container 12. Therefore, due to the vibration component in the horizontal direction N3, the solder balls 1 in the container 12
As shown by, they rotate in the same direction as a whole.

In FIG. 1, a movable table 25 as a work positioning unit is provided on the side of the supply unit 11. A clamper 26 is provided on the movable table 25, and the substrate 27 is clamped by the clamper 26 and positioned. When the movable table 25 is driven, the substrate 27 moves in the horizontal direction, and its position is adjusted.

In FIG. 1, reference numeral 30 denotes a head, which is held by a block 32 via a shaft 31. Although not shown, the block 32 includes a vertical movement unit for vertically moving the head 30. In FIG. 2, reference numeral 29 denotes a suction hole formed on the lower surface of the head 30. A moving table 33 is provided between the supply unit 11 and the movable table 25. The moving table 33 is provided with a horizontal feed screw 34. A nut 35 provided on the back surface of the block 32 is screwed to a feed screw 34. When the motor 36 is driven to rotate the feed screw, the block 32 and the head 30 move laterally along the feed screw 34.
The head 30 is connected to a vacuum device 38 via a tube 37.
It is connected to the.

This solder ball mounting device is configured as described above, and the operation will be described next. 1 and 3
Then, the head 30 descends toward the container 12, and the suction force of the vacuum device 38 suction-adsorbs the solder balls 1 stored in the container 12 to the suction holes 29 thereof.
Next, after the head 30 is raised, the motor 36 is driven to rotate the feed screw 34, and the head 30 moves above the substrate 27. Then, the head 30 is lowered, the solder balls 1 vacuum-adsorbed on its lower surface are mounted on the substrate 27, and the vacuum suction state is released, and then the head 30 is raised. Next, when the motor 36 is driven, the head moves above the container 12, and the above-described operation is repeated.

In FIG. 2, when the head 30 descends to vacuum-suck the solder ball 1 in the container 12, the gas is blown out of the tube 13 into the container 12 and the vibrator 19 is operated to facilitate the vacuum suction. By driving the container 12 to vibrate, the solder ball 1 is fluidized. In this case, as described above, the vibration direction of the container 12 includes not only a component in the vertical direction N2 but also a component in the horizontal direction N3.
The upper surface of the solder ball 1 keeps a substantially horizontal surface, so that the solder ball 1 can be reliably sucked and picked up in all the suction holes 29.

As described with reference to FIG. 6, a plurality of solder balls 1 are easily vacuum-sucked in the suction holes 7, but as shown in FIG. 4, the solder balls 1 also vibrate in the horizontal direction N3. Therefore, the attached solder balls other than the solder ball (blackened) 1 that is strongly vacuum-sucked directly to the suction holes 29 have a small vacuum suction force and are shaken off by vibration in the horizontal direction N3. Therefore, the plurality of solder balls 1 are not vacuum-adsorbed to one suction hole 29, and only one solder ball 1 directly vacuum-adsorbed to the suction hole 29 is picked up and mounted on the substrate 27. Further, in this embodiment, since the solder balls 1 in the container 12 are moved in the horizontal direction (arrow Q in FIG. 3), the effect of shaking off the accompanying solder balls without being directly sucked into the suction holes 29 is further enhanced. I have.

[0018]

As described above, according to the present invention, the upper surface of the solder ball in the container keeps a substantially horizontal surface, so that the solder ball can be securely inserted into all the suction holes on the lower surface of the head. It can be picked up by vacuum suction and mounted on a work. Also, even if a plurality of solder balls are sucked into the suction holes, the excess solder balls are shaken off by applying horizontal vibration, so that only one solder ball is vacuum-sucked into the suction holes and the work piece is sucked into the work. Will be installed.

[Brief description of the drawings]

FIG. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a solder ball supply unit provided in the solder ball mounting device according to one embodiment of the present invention;

FIG. 3 is a plan view of a solder ball supply unit provided in the solder ball mounting device according to one embodiment of the present invention;

FIG. 4 is a partial cross-sectional view of a head provided in the solder ball mounting device according to one embodiment of the present invention.

FIG. 5 is a cross-sectional view of a solder ball supply unit provided in a conventional solder ball mounting device.

FIG. 6 is a partial sectional view of a head provided in a conventional solder ball mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 11 Supply part 12 Container 17 Spring material 19 Vibrator 25 Movable table (positioning part) 27 Substrate (work) 29 Suction hole 30 Head 33 Moving table

Claims (2)

(57) [Claims] A head having a plurality of suction holes formed on a lower surface thereof for vacuum-sucking the solder balls; and a head provided between the supply portion and the positioning portion. A solder ball mounting device comprising: a moving means for moving the container, wherein the supply unit applies a vibration to the container for storing the solder ball and an oblique vibration including vertical and horizontal components to the container. Means, and the vibration applying means is a vibrator.
And a plurality of spring members having an inclined posture . 2. The planar shape of the container is a quadrangle, and
There are four spring materials, and these four spring materials are
Is provided corresponding to the four sides of the container.
The mounting device for a solder ball according to claim 1.