JPH0530851Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] In order to solder parts such as flat package ICs to a board, the present invention involves applying cream solder to the required locations on the board, and then applying the above-mentioned cream solder on top of this. This invention relates to a solder applicator for setting parts.

[Conventional technology]

Conventionally, when applying cream solder to such a board, the board was set on an X-Y table and moved in the X-Y direction until it was set at a certain height when the desired location was reached. Cream solder is poured out from a nozzle, and flat package type ICs are placed on top of the cream solder.

[Problem that the invention attempts to solve]

However, the substrate is sometimes warped, which can result in a gap between the nozzle and the substrate.

If this gap is too wide, the gap between the nozzle and the board will become wider, and the area to which the cream solder poured out from the nozzle will spread will spread, causing the cream solder to be applied to unnecessary areas. , the amount of cream solder in the necessary areas may become thinner, making it impossible to solder completely.

On the other hand, if this gap is too narrow, the amount of cream solder becomes thick, causing problems such as flowing during soldering and causing bridging, or soldering to unnecessary areas.

[Purpose of invention]

The present invention is intended to eliminate the above-mentioned drawbacks of conventional solder applicators, and the guide pin slides on the board surface to move the nozzle position up and down.
By keeping the distance between the nozzle and the board constant, the application range and thickness of the cream solder can be kept constant, and the purpose is to always achieve good soldering.

[Summary of the idea]

In order to achieve the above-mentioned object, the present invention has a guide pin set at a fixed interval between the lower end of the nozzle and slides on the substrate, and the nozzle is moved up and down by the up and down movement of the guide pin. The gist is that the nozzle is rotated around the nozzle by a drive means using a guide pin, and the nozzle and guide pin are moved up and down so as not to interfere with the setting of parts.

[Example of idea]

An example of implementation of the invention will be described below with reference to the drawings.

In this solder applicator as well, the board A is set on an X-Y table (not shown), and
As in the conventional case, the table is moved in the X-Y directions according to a program for the table.

In the drawing, 1 is a flat package type
A suction chuck equipped with a suction cup 3 that suctions IC2.
IC2 is attracted by creating a vacuum inside the suction cup 3, and IC2 is released by creating atmospheric pressure inside the suction cup 3.
The lower end of the shaft 4 is attached.

This shaft 4 is rotatable together with the sleeve 5 by a bearing 6 that supports a sleeve 5 spline-fitted thereto, and can move up and down within the sleeve 5.

7 is a DC servo motor, and a timing belt 11 is stretched between the gear 8 and the gear 10 of the screw shaft 9, and when the DC servo motor 7 rotates, the screw shaft 9 also rotates.

A connecting block 12 is screwed onto the screw shaft 9, and one end of the connecting block 12 is rotatable with respect to the shaft 4 by a bearing 13, but is attached so as to move vertically. The connecting block 12 is non-rotatable and therefore the screw shaft 9
When the connecting block 12 rotates, the connecting block 12 moves up and down, and the shaft 4 also moves up and down accordingly.

A spring 1 is attached to the connecting block 12.
4 is stretched so as to balance the weight of the shaft 4 and the connecting block 12, thereby reducing the load on the DC servo motor 7.

Two gears 15 and 16 are attached to the sleeve 5, and a timing belt 19 is stretched between the gear 18 of the motor 17 and the gear 15, and the rotation of the motor 17 causes the sleeve 5, axis 4
The suction chuck 1 also rotates via.

On the other hand, a bearing block 22 is attached to the support plate 21 attached to the fixed guide frame 20, and the gear 24 of the shaft 23 that is supported by this is engaged with the gear 16 of the sleeve 5, and the rotation of the motor 17 is controlled by the shaft. 23.

Reference numeral 25 denotes a dispenser unit supported so as to be movable up and down with respect to the fixed guide frame 20, and is attached to a plunger 27 of a cylinder 26 attached to the fixed guide frame 20.

Therefore, although the dispenser unit 25 moves up and down due to the operation of the cylinder 26, the fixed guide frame 2
A spring 29 is stretched between the spring receiving part 28 of 0, and the plunger 27 and the dispenser unit 2
The weight of 5 and the tension of spring 29 are balanced.

Therefore, when the dispenser unit 25 is in the lowered state, even if a slight vertical force is applied to the dispenser unit 25, the dispenser unit 25 will move up and down accordingly.
By moving up and down with high sensitivity even to the slightest warp or slight unevenness of the substrate A, the distance between the substrate A and the nozzle 31 can be maintained extremely accurately.

A connection port 30 connected to a cream solder tank is provided at the upper end of the dispenser unit 25.
A nozzle 31 for dispensing cream solder is provided at the lower end, and the cream solder is dispensed from the nozzle 31 according to a set program.

A gear 33 is rotatably supported on the lower outer periphery of the dispenser unit 25 by a bearing 32, and this gear 33 meshes with a gear 34 of the shaft 23.
As the motor 17 rotates, the gear 33 also rotates, but even if the dispenser unit 25 moves up and down as described above, it will not become disengaged.

A rotary disk 36 is attached to this gear 33 and has a guide pin 35 located close to the nozzle 31 and below the lower end of the nozzle 31 by a distance α as shown in FIG.

Next, the operation of this solder applicator will be explained.

First, the IC 2 is attracted to the suction cup 3 of the suction chuck 1, and the shaft 4 and the suction chuck 1 are in a raised state and on standby.

Then, board A is set on the X-Y table, and according to the program, the X-Y table moves to the mounting position of IC2 as shown in Figure 8.
When the nozzle 31 comes to the position, the cylinder 25 operates to lower the dispenser unit 25.

At this time, the guide pin 35 is at the position c in the same figure, and when this guide pin 35 comes into contact with the substrate A, the descending force of the cylinder 26 is canceled out, the dispenser unit 25 stops at that position, and the substrate A space having a dimension α is formed between A and the nozzle 31.

Then, the X-Y table moves according to the program in the direction of the arrow in FIG.
is drawn.

When the nozzle 31 reaches the shaded part of the trajectory D, cream solder is poured out from the nozzle 31, and when it reaches the end of the shaded area, the dispensing stops, so that the cream solder is applied to the shaded area of the trajectory D. .

At this time, if the board A is warped, the guide pin 35 will move up and down according to the warp, and the dispenser unit 25 will also move up and down accordingly.
Since the distance between the nozzle 31 and the nozzle 31 is kept constant, the width and thickness of the cream solder applied are constant.

Next, when reaching a bend in the trajectory D, the X-Y table stops, the motor 17 rotates to rotate the rotary disk 36, and the guide pin 35 is rotated 90 degrees in a circular arc.

Then, in the same manner as described above, the X-Y table is moved, cream solder is poured out from the nozzle 31, and the nozzle 31 is moved up and down in response to the warping of the board A due to the sliding of the guide pin 35, and the next step is performed. Trajectory D
Cream solder is applied to the shaded areas.

By repeating the above, when the nozzle 31 returns to the starting point B of the trajectory D and the guide pin 35 reaches the ending point F of the trajectory E, the cylinder 26 operates in the opposite direction to raise the dispenser unit 25 and move the nozzle 3
1. Raise the guide pin 35 from the substrate A.

Then, the X-Y table moves again to match the trajectory D on the board A with IC2, rotates the motor 17, and aligns the trajectory D with the direction of IC2.
The DC servo motor 7 rotates to lower the suction chuck 1 and place the IC 2 on the trajectory D.

After introducing the atmosphere into the suction cup 3 and setting the IC2, the DC servo motor 7 rotates in the reverse direction again to raise the suction chuck 1, and the IC2 is set.

Then, by heating the cream solder
The work is completed when IC2 is soldered to board A.

[Effect of idea]

As mentioned above, this invention uses guide pins to rub the top surface of the board when applying cream solder to the part of the board where parts such as flat package ICs are soldered. The distance between the board and the nozzle for dispensing cream solder can be kept constant.

Therefore, it is possible to achieve a constant application range and application thickness of the cream solder, and it is possible to prevent the application range from being wide or narrow, and the application thickness to be excessive or insufficient due to changes in the dimensions between the nozzle and the board caused by the warping of the board. Since this does not occur, good soldering can always be achieved.

Since the guide pin that slides on the substrate can be moved out of the trajectory of the nozzle by its rotation, the guide pin does not rub on the applied cream solder.

Furthermore, since the dispensing unit and the up/down means are suspended from the fixed member by the spring means in a state of almost equilibrium with gravity, no matter how heavy the dispenser unit and the up/down means are, the guide pin will not move. The guide pin slides against the board with extremely small pressure, and the guide pin does not damage the board even when it rubs on the board, and it also resists slight dimensional changes between the nozzle and the board. Since the dispenser unit follows the solder with good sensitivity, accurate solder application can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a cross-sectional side view of the suction chuck drive section, FIG. 3 is a side view of the vertical mechanism of the dispenser unit, and FIG. 4 is a plan view. Fig. 5 is a front view showing the relationship between the nozzle and the guide pin, Fig. 6 is a front view showing the same as above when applying cream solder, Fig. 7 is a front view showing the same as above when IC is set, Fig. 8 is a nozzle, FIG. 3 is a trajectory diagram of a guide pin. A...Substrate, 1...Adsorption chuck, 2...IC,
3... Suction cup, 4... Shaft, 5... Sleeve, 7...
DC servo motor, 9...Screw shaft, 12...Connection unit, 17...Motor, 20...Fixed guide frame, 25...Dispenser unit, 26...Cylinder, 29...Spring, 31...Nozzle,
35...Guide pin, 36...Rotary disk.

Claims (1)

[Claims for Utility Model Registration] A dispenser unit equipped with a nozzle capable of dispensing cream solder, a guide pin rotatably supported by the dispenser unit around the nozzle and sliding on a substrate, and the guide pin a drive means for rotating the dispenser unit around the nozzle; and a vertical means for moving the guide pin up and down together with the dispenser unit and moving the dispenser unit up and down according to the height of the substrate that the guide pin slides on. A spring means having a tension approximately equal to the weight of the dispenser unit and the up-and-down means is provided between the dispenser unit and the fixed part, and the dispenser unit and the up-and-down means are suspended by the spring means. A solder applicator characterized by: