CN214917660U - Glue dispenser for packaging semiconductor optical chip - Google Patents
Glue dispenser for packaging semiconductor optical chip Download PDFInfo
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- CN214917660U CN214917660U CN202121223148.3U CN202121223148U CN214917660U CN 214917660 U CN214917660 U CN 214917660U CN 202121223148 U CN202121223148 U CN 202121223148U CN 214917660 U CN214917660 U CN 214917660U
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Abstract
The utility model discloses a point gum machine is used in encapsulation of semiconductor optical chip relates to chip technical field. This point gum machine for semiconductor optical chip encapsulation, including the supporter, the last fixed surface of supporter is connected with the riser, and the upper surface of supporter is provided with adjustment mechanism loading mechanism and includes the spout, and the spout is seted up at the upper surface of supporter. This point gum machine for semiconductor optical chip encapsulation loads mechanism and adjustment mechanism through setting up, when the position that the chip was placed needs to be adjusted, at first rotates the button piece, makes the button piece drive gear revolve, drives the stopper simultaneously and slides, and the stopper drives the fixed plate and slides, and the upper surface at the fixed plate is just placed to the chip, so when rotating the button piece, can drive the fixed plate and slide, just can drive the chip removal when the fixed plate slides, and the device is convenient for adjust the position that the chip was placed.
Description
Technical Field
The utility model relates to a chip technology field specifically is a point gum machine is used in semiconductor optical chip encapsulation.
Background
The dispensing machine is also called a glue spreader, a glue dripping machine, a glue dispenser, a glue pouring machine and the like, is specially used for controlling fluid and dripping and coating the fluid on the surface of a product or in the product, can realize three-dimensional and four-dimensional path dispensing, accurate positioning, accurate glue control, no wire drawing, no glue leakage and no glue dripping, is mainly used for accurately dispensing, injecting, coating and dripping glue and other liquid in the product process to each accurate position of the product, and can be used for realizing dispensing, line drawing, circular or arc.
Present point gum machine for chip packaging is when using, if the position of point gluing is inaccurate, when the position of adjustment point gum machine, the process is comparatively loaded down with trivial details, because the point gum machine is by computer control, during the adjustment position, need write the procedure, so comparatively loaded down with trivial details, and the rigidity that the point gum machine chip was placed for current chip packaging, when the chip of different models needs the point gluing, can't be fine fix the chip in assigned position, can some partially when leading to the point to glue, based on current technique not enough, the utility model discloses a point gum machine for semiconductor optical chip packaging.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model discloses a point gum machine is used in semiconductor optical chip encapsulation to solve the problem that proposes in the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a dispenser for semiconductor optical chip packaging, comprising:
the upper surface of the supporting body is fixedly connected with a vertical plate, and the upper surface of the supporting body is provided with an adjusting mechanism;
the loading mechanism comprises a sliding groove, and the sliding groove is formed in the upper surface of the supporting body.
Preferably, one side of the supporting body is provided with a groove, one side of the supporting body is provided with a hole groove, and one side of the vertical plate slides the glue dispensing head.
Preferably, the loading mechanism further comprises a fixing plate, a clamping block, a limiting block and a toothed plate, the fixing plate is slidably connected to the upper surface of the supporting body, the fixing plate is fixedly connected with the clamping block, the fixing plate is fixedly connected with the limiting block, and the limiting block is fixedly connected with the toothed plate.
Preferably, fixed plate sliding connection is at the upper surface of supporter, and stopper sliding connection is in the inside of spout, and pinion rack sliding connection is in the inside of spout.
Preferably, adjustment mechanism includes gear, button piece, cardboard, slider and spring, and gear revolve connects in the inside of supporter, and one side fixedly connected with button piece of gear, one side sliding clamping of gear have the cardboard, and one side fixedly connected with slider of cardboard, one side activity joint of slider have the spring.
Preferably, the button block is rotatably connected inside the hole groove, the clamping plate is slidably connected inside the gear, and the sliding block is slidably connected inside the groove.
The utility model discloses a semiconductor optical chip encapsulates uses point gum machine, its beneficial effect who possesses as follows:
1. this point gum machine for semiconductor optical chip encapsulation loads mechanism and adjustment mechanism through setting up, when the position that the chip was placed needs to be adjusted, at first rotates the button piece, makes the button piece drive gear revolve, drives the stopper simultaneously and slides, and the stopper drives the fixed plate and slides, and the upper surface at the fixed plate is just placed to the chip, so when rotating the button piece, can drive the fixed plate and slide, just can drive the chip removal when the fixed plate slides, and the device is convenient for adjust the position that the chip was placed.
2. This point gum machine is used in semiconductor optical chip encapsulation, when the position of chip is fixed to needs, at first, to one side pulling slider, make the slider drive the cardboard slide to the one side of keeping away from the gear, the spring is in compression state this moment, then rotate the button piece, when sliding the fixed plate to suitable position, stall, can loosen the slider, the spring of slider one side removes the compression, the spring drives the slider and slides to one side of gear, the slider drives the cardboard card simultaneously in the inside of gear, the device is convenient for fixed chip's position.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the supporting body of the present invention;
FIG. 3 is a schematic view of the loading mechanism of the present invention;
fig. 4 is a schematic structural diagram of the adjusting mechanism of the present invention.
In the figure: 1. a support body; 101. a groove; 102. a hole groove; 2. a vertical plate; 201. dispensing a glue head; 3. a loading mechanism; 301. a chute; 302. a fixing plate; 303. a clamping block; 304. a limiting block; 305. a toothed plate; 4. an adjustment mechanism; 401. a gear; 402. a button block; 403. clamping a plate; 404. a slider; 405. a spring.
Detailed Description
The embodiment of the utility model discloses semiconductor optical chip encapsulates uses point gum machine, as shown in fig. 1-4, include:
the device comprises a support body 1, wherein the upper surface of the support body 1 is fixedly connected with a vertical plate 2, and the upper surface of the support body 1 is provided with an adjusting mechanism 4;
the loading mechanism 3, the loading mechanism 3 includes the chute 301, the chute 301 opens on the upper surface of the supporting body 1.
One side of the support body 1 is provided with a groove 101, one side of the support body 1 is provided with a hole groove 102, and one side of the vertical plate 2 is provided with a dispensing head 201 in a sliding manner.
When a semiconductor optical chip packaging dispenser is used, in an initial state, firstly, one side of a support body 1 is provided with a groove 101, a sliding block 404 is arranged inside the groove 101, one side of the support body 1 is provided with a hole 102, a button block 402 is rotated inside the hole 102, the top of the support body 1 is provided with a loading mechanism 3, the top of the support body 1 is provided with a vertical plate 2, one side of the vertical plate 2 is provided with a dispensing head 201, a chip can be placed at the top of the loading mechanism 3, and the dispensing head 201 dispenses the chip at the top of the loading mechanism 3.
The loading mechanism 3 further comprises a fixing plate 302, a clamping block 303, a limiting block 304 and a toothed plate 305, the fixing plate 302 is slidably connected to the upper surface of the support body 1, the fixing block 303 is fixedly connected to the upper surface of the fixing plate 302, the limiting block 304 is fixedly connected to the lower surface of the fixing plate 302, and the toothed plate 305 is fixedly connected to the lower surface of the limiting block 304.
The fixing plate 302 is slidably connected to the upper surface of the supporting body 1, the limiting block 304 is slidably connected to the inside of the sliding slot 301, and the toothed plate 305 is slidably connected to the inside of the sliding slot 301.
When the position that the chip was placed needs to be adjusted, at first, rotate the inside button 402 of hole groove 102, make button 402 drive gear 401 rotate, toothed plate 305 rotates thereupon rather than the meshing when gear 401 rotates, when toothed plate 305 rotates, drive stopper 304 and slide in the inside of spout 301, when stopper 304 slides in the inside of spout 301, stopper 304 drives fixed plate 302 and slides at the upper surface of supporter 1, the top of fixed plate 302 is fixed with fixture block 303, the chip is just placed at the upper surface of fixed plate 302, so when rotating button 402, can drive fixed plate 302 and slide, just can drive the chip removal when fixed plate 302 slides, the device is convenient for adjust the position that the chip was placed.
The knob 402 is rotatably coupled inside the hole 102, the catch plate 403 is slidably coupled inside the gear 401, and the slider 404 is slidably coupled inside the groove 101.
When the position of the chip needs to be fixed, firstly, the sliding block 404 is pulled to one side, the sliding block 404 drives the clamping plate 403 to slide to one side far away from the gear 401, the spring 405 is in a compression state at the moment, then the button block 402 is rotated, when the fixing plate 302 slides to a proper position, the rotation is stopped, the sliding block 404 can be loosened, the spring 405 on one side of the sliding block 404 is decompressed, the spring 405 drives the sliding block 404 to slide to one side of the gear 401, meanwhile, the sliding block 404 drives the clamping plate 403 to be clamped inside the gear 401, and the device is convenient for fixing the position of the chip.
The working principle is as follows: when a semiconductor optical chip packaging dispenser is used, in an initial state, firstly, one side of a support body 1 is provided with a groove 101, a sliding block 404 is arranged inside the groove 101, one side of the support body 1 is provided with a hole 102, a button block 402 is rotated inside the hole 102, the top of the support body 1 is provided with a loading mechanism 3, the top of the support body 1 is provided with a vertical plate 2, one side of the vertical plate 2 is provided with a dispensing head 201, a chip can be placed at the top of the loading mechanism 3, and the dispensing head 201 dispenses the chip at the top of the loading mechanism 3.
When the position that the chip was placed needs to be adjusted, at first, rotate the inside button 402 of hole groove 102, make button 402 drive gear 401 rotate, toothed plate 305 rotates thereupon rather than the meshing when gear 401 rotates, when toothed plate 305 rotates, drive stopper 304 and slide in the inside of spout 301, when stopper 304 slides in the inside of spout 301, stopper 304 drives fixed plate 302 and slides at the upper surface of supporter 1, the top of fixed plate 302 is fixed with fixture block 303, the chip is just placed at the upper surface of fixed plate 302, so when rotating button 402, can drive fixed plate 302 and slide, just can drive the chip removal when fixed plate 302 slides, the device is convenient for adjust the position that the chip was placed.
When the position of the chip needs to be fixed, firstly, the sliding block 404 is pulled to one side, the sliding block 404 drives the clamping plate 403 to slide to one side far away from the gear 401, the spring 405 is in a compression state at the moment, then the button block 402 is rotated, when the fixing plate 302 slides to a proper position, the rotation is stopped, the sliding block 404 can be loosened, the spring 405 on one side of the sliding block 404 is decompressed, the spring 405 drives the sliding block 404 to slide to one side of the gear 401, meanwhile, the sliding block 404 drives the clamping plate 403 to be clamped inside the gear 401, and the device is convenient for fixing the position of the chip.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A dispenser for packaging a semiconductor optical chip, comprising:
the device comprises a support body (1), wherein a vertical plate (2) is fixedly connected to the upper surface of the support body (1), and an adjusting mechanism (4) is arranged on the upper surface of the support body (1);
the loading mechanism (3) comprises a sliding groove (301), and the sliding groove (301) is formed in the upper surface of the support body (1).
2. The dispenser of claim 1, wherein: one side of the support body (1) is provided with a groove (101), one side of the support body (1) is provided with a hole groove (102), and one side of the vertical plate (2) slides to form a spot gluing head (201).
3. The dispenser of claim 1, wherein: the loading mechanism (3) further comprises a fixing plate (302), a clamping block (303), a limiting block (304) and a toothed plate (305), the fixing plate (302) is connected to the upper surface of the supporting body (1) in a sliding mode, the clamping block (303) is fixedly connected to the upper surface of the fixing plate (302), the limiting block (304) is fixedly connected to the lower surface of the fixing plate (302), and the toothed plate (305) is fixedly connected to the lower surface of the limiting block (304).
4. The dispenser according to claim 3, wherein: the fixed plate (302) is connected to the upper surface of the support body (1) in a sliding mode, the limiting block (304) is connected to the inside of the sliding groove (301) in a sliding mode, and the toothed plate (305) is connected to the inside of the sliding groove (301) in a sliding mode.
5. The dispenser of claim 1, wherein: adjustment mechanism (4) include gear (401), button piece (402), cardboard (403), slider (404) and spring (405), gear (401) rotate to be connected in the inside of supporter (1), one side fixedly connected with button piece (402) of gear (401), one side slip joint of gear (401) has cardboard (403), one side fixedly connected with slider (404) of cardboard (403), one side activity joint of slider (404) has spring (405).
6. The dispenser according to claim 5, wherein: the button block (402) is rotatably connected inside the hole groove (102), the clamping plate (403) is slidably connected inside the gear (401), and the sliding block (404) is slidably connected inside the groove (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121223148.3U CN214917660U (en) | 2021-06-02 | 2021-06-02 | Glue dispenser for packaging semiconductor optical chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121223148.3U CN214917660U (en) | 2021-06-02 | 2021-06-02 | Glue dispenser for packaging semiconductor optical chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214917660U true CN214917660U (en) | 2021-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121223148.3U Active CN214917660U (en) | 2021-06-02 | 2021-06-02 | Glue dispenser for packaging semiconductor optical chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214917660U (en) |
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2021
- 2021-06-02 CN CN202121223148.3U patent/CN214917660U/en active Active
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