CN113441362B - Gluing mold and bonding method - Google Patents
Gluing mold and bonding method Download PDFInfo
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- CN113441362B CN113441362B CN202010231756.2A CN202010231756A CN113441362B CN 113441362 B CN113441362 B CN 113441362B CN 202010231756 A CN202010231756 A CN 202010231756A CN 113441362 B CN113441362 B CN 113441362B
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 198
- 238000002347 injection Methods 0.000 claims abstract description 148
- 239000007924 injection Substances 0.000 claims abstract description 148
- 239000000853 adhesive Substances 0.000 claims abstract description 73
- 230000001070 adhesive effect Effects 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 22
- 238000009826 distribution Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 description 19
- 239000002390 adhesive tape Substances 0.000 description 8
- 238000007711 solidification Methods 0.000 description 8
- 230000008023 solidification Effects 0.000 description 8
- 238000010073 coating (rubber) Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
Abstract
The invention discloses a gluing mold and a bonding method, wherein the gluing mold comprises a mold body, a plurality of glue injection cavities are formed in the mold body, each glue injection cavity penetrates through the surfaces of two sides of the thickness of the mold body, and any two glue injection cavities are arranged at intervals. According to the gluing mold, the plurality of glue injection cavities are arranged, so that the injection amount of the adhesive can be effectively controlled, the distribution of the adhesive can meet the requirement, the plurality of glue injection cavities are arranged to be distributed at intervals, the curing efficiency of the adhesive can be improved, the curing strength of the central position of the adhesive is improved, the glue blocks are enabled to overflow from spaces during bonding, the bonding area is improved, the false bonding phenomenon of air holes is improved, and the bonding strength is improved.
Description
Technical Field
The invention relates to the technical field of bonding, in particular to a gluing mold and a bonding method.
Background
With the rapid development of industrial technology, bonding is used as a new process and a new technology, so that the connection of multiple materials becomes possible, the method has the advantages of simple process equipment, convenience in operation, low cost, wide application range, good sealing and corrosion resistance, high fatigue resistance and the like, simultaneously, the damage of a base material caused by drilling is avoided, the stress distribution is uniform, the integrated functions of corrosion resistance, shock absorption, insulation, tolerance compensation and the like can be realized, and the traditional connection modes such as welding, riveting, bolt connection and the like are replaced more and more. For example, in the production and manufacturing process of rail vehicles, bonding is an indispensable connection method, for example, the mounting process of hangers, glass and the like involves bonding operation, however, the bonding quality cannot be effectively guaranteed, and the quality of the whole vehicle is influenced to a certain extent.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a gluing mold which can improve the bonding quality.
The invention also provides a bonding method adopting the bonding die.
A gluing die according to an embodiment of the first aspect of the invention, comprises: the mould comprises a mould body, wherein the mould body is provided with a plurality of glue injection cavities, each glue injection cavity penetrates through the surfaces of two sides of the thickness of the mould body, and any two glue injection cavities are arranged at intervals.
According to the gluing mold disclosed by the embodiment of the first aspect of the invention, the plurality of glue injection cavities are arranged, so that the injection amount of the adhesive can be effectively controlled, the distribution of the adhesive can be ensured to meet the requirement, the glue injection cavities are arranged to be distributed at intervals, the curing efficiency of the adhesive can be improved, the curing strength of the central position of the adhesive can be improved, the glue blocks are enabled to overflow from spaces during bonding, the bonding area is improved, the false bonding phenomenon of air holes is improved, and the bonding strength is improved.
In some embodiments, the spacing between every two adjacent glue injection cavities is equal.
In some embodiments, a plurality of the glue injection cavities are distributed at intervals along the length direction of the mould body in sequence.
In some embodiments, the edges on both sides of the length of the mold body are respectively a first edge and a second edge, a first glue injection cavity is arranged in the plurality of glue injection cavities close to the first edge, a second glue injection cavity is arranged in the plurality of glue injection cavities close to the second edge, the distance between the first glue injection cavity and the first edge is larger than the distance between any two adjacent glue injection cavities, and the distance between the second glue injection cavity and the second edge is larger than the distance between any two adjacent glue injection cavities.
In some embodiments, the glue spreading die further comprises: the positioning structure is arranged on one side of the thickness of the die body and avoids the glue injection cavity, and the positioning structure is used for limiting the relative position of the to-be-glued piece and the die body.
In some embodiments, a plurality of the glue injection cavities are distributed at intervals in sequence along the length direction of the mold body, and the positioning structure includes: the first locating blocks are two and located on two sides of the plurality of glue injection cavities in the length direction of the die body.
In some embodiments, a plurality of the glue injection cavities are distributed at intervals in sequence along the length direction of the mold body, and the positioning structure includes: the number of the second positioning blocks is at least two, and the second positioning blocks are respectively arranged on two sides of the at least one glue injection cavity in the width direction of the die body.
In some embodiments, at least a portion of the mold body is a uniform-thickness flat plate and is configured to provide a plurality of the glue injection cavities so that the depths of the plurality of the glue injection cavities are equal in the thickness direction of the mold body.
In some embodiments, the glue die further comprises: and the pad piece is arranged in at least one glue injection cavity and is not in contact with the side wall of the glue injection cavity where the pad piece is positioned, and the height of the pad piece is smaller than the depth of the glue injection cavity where the pad piece is positioned in the thickness direction of the die body.
According to the bonding method of the embodiment of the second aspect of the present invention, the bonding method of bonding a work to a base material using the paste application mold according to the embodiment of the first aspect of the present invention includes the steps of: arranging the die body on the workpiece; arranging the cushion piece in at least one glue injection cavity and adhering the cushion piece to the workpiece; injecting an adhesive into at least one glue injection cavity, and enabling the adhesive injected into the glue injection cavity provided with the pad to cover the pad; taking the die body off the workpiece, wherein the workpiece is adhered with a glue block formed by the adhesive in the corresponding glue injection cavity; and enabling one side of the workpiece, which is provided with the rubber block, to face the base material, and enabling the workpiece to be close to the base material until the pad piece is contacted with the base material, wherein the part of the rubber block, which is higher than the pad piece, overflows to the periphery of the rubber block.
According to the bonding method of the second aspect of the invention, by adopting the gluing mold of the first aspect of the invention to bond the workpiece to the substrate, the bonding can be simply and effectively realized, the injection amount of the adhesive can be effectively controlled, the curing efficiency of the adhesive is improved, the curing strength of the central position of the adhesive is improved, and the glue block has space to overflow during bonding, so that the bonding area is improved, the false bonding phenomenon of air holes is improved, and the bonding strength is further improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a front view of a gluing die according to one embodiment of the invention;
FIG. 2 is a top plan view of the glue die shown in FIG. 1 mated to a work piece;
FIG. 3 is a schematic view of the work piece shown in FIG. 2 after it has been disengaged from the glue die;
FIG. 4 is a rear view of the glue die shown in FIG. 1;
FIG. 5 isbase:Sub>A cross-sectional view of section A-A shown in FIG. 4;
FIG. 6 is a partial cross-sectional view of the glue die shown in FIG. 1;
FIG. 7 is a state diagram during bonding of a workpiece to a substrate according to one embodiment of the present invention;
FIG. 8 is another state diagram during bonding of the workpiece to the substrate shown in FIG. 7;
FIG. 9 is a diagram of a workpiece after bonding to a substrate has been completed according to one embodiment of the invention;
FIG. 10 is a front view of the workpiece shown in FIG. 9;
FIG. 11 is a schematic view of the clamping of the workpiece and vise shown in FIG. 10;
FIG. 12 is a schematic view of the mating of the work piece shown in FIG. 11 with the glue die;
FIG. 13 is a top plan view of the workpiece shown in FIG. 12 in cooperation with a glue application die;
FIG. 14 is a partial front view of the workpiece shown in FIG. 9 secured with clamps while it is adhered to a substrate;
FIG. 15 is a partial left side view of the workpiece shown in FIG. 14 secured with clamps while it is bonded to a substrate.
Reference numerals:
a gluing mold 1;
a mold body 11; a thickness-side surface 11a; the thickness other side surface 11b;
a first edge 11c; a second edge 11d;
a glue injection cavity 12; a first glue injection cavity 12a; a second glue injection cavity 12b;
a positioning structure 13; a first positioning block 131; a second positioning block 132;
a pad 14;
a workpiece 2; an adhesive 3; a rubber block 31; glue overflow 32;
the gap 41; a slit 42; a base material 5; a bench clamp 6; and a clamp 7.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.
With the rapid development of industrial technology, bonding is used as a new process and a new technology, so that the connection of multiple materials becomes possible, the method has the advantages of simple process equipment, convenience in operation, low cost, wide application range, good sealing and corrosion resistance, high fatigue resistance and the like, simultaneously, the damage of a base material caused by drilling is avoided, the stress distribution is uniform, the integrated functions of corrosion resistance, shock absorption, insulation, tolerance compensation and the like can be realized, and the traditional connection modes such as welding, riveting, bolt connection and the like are replaced more and more. For example, in the production and manufacturing process of rail vehicles, bonding is an indispensable connection method, for example, the installation process of hangers, glass and the like involves bonding operation, and the quality of bonding directly affects the quality of the whole vehicle.
However, the inventor creatively finds that in the general bonding operation, the common industry practice is to make a rope-shaped adhesive tape out of the adhesive and apply the rope-shaped adhesive tape on a workpiece or a base material, when the area of the workpiece is large, a plurality of rope-shaped adhesive tapes are needed to be made back and forth, but the manual extrusion pressure of the adhesive is difficult to control, the thickness of the manually extruded adhesive tape is not uniform, and the lengths of the manually extruded adhesive tapes are different, so that the distribution of the adhesive on the workpiece is not uniform, the adhesive amount of the adhesive cannot be controlled, the bonding reliability cannot be ensured, the bonding strength of each part of the workpiece is also different, the stress is not uniform, and the risk of damage or falling off is easy to occur.
In addition, when large-area bonding is carried out, the adhesive is expected to be paved on the whole surface of a workpiece, but the multiple rope-shaped adhesive tapes are difficult to realize paving, gaps exist between the adhesive tapes inevitably, gaps also exist at the positions where the adhesive tapes are broken by extrusion, a large number of air holes possibly appear at the gaps after a base material is bonded with the workpiece, false bonding phenomena occur, the contact area between the adhesive and the base material is insufficient, the mechanical locking acting force is insufficient, the workpiece is easy to fall off when external force is applied, and the bonding quality is not stable enough. In order to solve at least one of the above technical problems, the present invention provides a glue spreading mold 1 and a glue spreading method using the glue spreading mold 1.
Next, a gluing mold 1 according to an embodiment of the first aspect of the present invention is described with reference to the accompanying drawings.
As shown in fig. 1, the gluing mold 1 according to the embodiment of the invention may include a mold body 11, the mold body 11 having a plurality of glue injection cavities 12 therein, each glue injection cavity 12 penetrating through both thickness side surfaces of the mold body 11, that is, in conjunction with fig. 2 and 3, each glue injection cavity 12 penetrating through from a thickness side surface 11a of the mold body 11 to a thickness side surface 11b of the mold body 11, so that the adhesive 3 may be injected into the glue injection cavity 12 from the thickness side of the mold body 11 and flow from the glue injection cavity 12 to the thickness side of the mold body 11 to contact a member to be glued (e.g., a workpiece 2) located at the thickness side of the mold body 11, so that when the mold body 11 is removed from the member to be glued (e.g., the workpiece 2), the adhesive 3 may be separated from the mold body 11 and adhered to the surface of the member to be glued (e.g., the workpiece 2).
Of course, the present invention is not limited thereto, and in other embodiments of the present invention, the member to be glued may also be the base material 5, and for simplifying the description, the member to be glued is only taken as the workpiece 2 for illustration, and after reading the technical solution of the present application, it is obvious that the member to be glued is an example of the base material 5.
As shown in fig. 1 and 3, after the mold body 11 is removed from the workpiece 2, a plurality of glue blocks 31 corresponding to the glue injection cavities 12 one by one are adhered to the workpiece 2, that is, each glue block 31 is formed by the adhesive 3 in the corresponding glue injection cavity 12, because any two glue injection cavities 12 are arranged at intervals, any two glue blocks 31 adhered to the workpiece 2 are also arranged at intervals, that is, a gap 41 is formed between any two glue blocks 31, and further, the gap 41 can be used for circulating air flow and/or glue overflow, so when the air flow circulates in the gap 41, moisture is facilitated to solidify the adhesive 3, the solidification time of the adhesive 3 is shortened, the solidification efficiency of the adhesive 3 is improved, and the solidification strength of the center position of the adhesive 3 is improved.
Moreover, when the workpiece 2 is bonded to the base material 5 through the plurality of rubber blocks 31, when the distance between the workpiece 2 and the base material 5 is smaller than the height of the rubber blocks 31, the rubber blocks 31 can overflow to the gap 41, so that the bonding area is increased, the air hole false bonding phenomenon is improved, and the bonding strength is improved. Of course, it can be understood that the rubber blocks 31 not only overflow to the gaps 41 between two adjacent rubber blocks 31, but also overflow to the periphery of the rubber blocks 31, and the air holes are extruded in the overflow process, so as to improve the false adhesion phenomenon.
Therefore, according to the gluing mold 1 provided by the embodiment of the invention, the injection amount of the adhesive 3 can be effectively controlled by arranging the plurality of glue injection cavities 12, the distribution of the adhesive 3 can be ensured to meet the bonding requirement, the plurality of glue injection cavities 12 are arranged to be distributed at intervals, the curing efficiency of the adhesive 3 can be improved, the curing strength of the central position of the adhesive 3 is improved, and the glue blocks 31 are enabled to overflow in space during bonding, so that the bonding area is improved, the phenomenon of false bonding of air holes is improved, and the bonding strength is improved.
In addition, it should be noted that, in the process of performing the bonding operation by using the gluing mold 1, the adhesive 3 is not required to be injected into each glue injection cavity 12, the adhesive 3 may be selectively injected into at least one glue injection cavity 12 according to needs, and the amount of the adhesive 3 injected into the glue injection cavity 12 is also not limited, for example, the glue injection cavity 12 may be filled completely, so as to control the injection amount of the adhesive 3, and of course, the glue injection may also be selected not to be filled according to actual situations, which is not described herein again.
In some embodiments of the present invention, the spacing between each two adjacent glue cavities 12 is equal, for example, in the example shown in fig. 1, the spacing between each two adjacent glue cavities 12 is L. From this, can guarantee that two adjacent gluey gaps 41 between the piece 31 equal to can guarantee that gluey piece 31 distributes evenly, bonding strength is good, makes gluey piece 31 take place excessive space substantially the same when bonding moreover, thereby makes every gluey piece 31 excessive area substantially the same, and then can improve the distribution homogeneity of adhesive 3 more effectively, and then improves bonding strength.
In some embodiments of the present invention, as shown in fig. 1, the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, that is, the mold body 11 has an elongated structure (e.g., a rectangle, an oval, etc.), and the plurality of glue injection cavities 12 are spaced apart along the length extension direction of the mold body 11 (e.g., the direction F1 shown in fig. 1). Therefore, the die body 11 is simple in structure, convenient to process and suitable for gluing the strip-shaped workpiece 2.
Of course, the present invention is not limited thereto, and the shape of the mold body 11 and the distribution of the glue injection cavities 12 can be adjusted according to actual conditions, such as the specific shape of the workpiece 2, so as to meet different actual requirements, such as the glue application requirements of workpieces 2 of different shapes. For example, when the surface of the workpiece 2 to be glued is circular, the mold body 11 may also be circular, and the plurality of glue injection cavities 12 may be uniformly distributed in the form of radial dots, and for example, when the surface of the workpiece 2 to be glued is a square with a large size, the mold body 11 may also be square, and the plurality of glue injection cavities 12 may be uniformly distributed in multiple rows and multiple columns, and so on.
In some embodiments of the present invention, as shown in fig. 1, when the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, two side edges of the length of the mold body 11 are respectively a first edge 11c and a second edge 11d, that is, the first edge 11c and the second edge 11d are oppositely disposed along the length direction F1 of the mold, a first glue injection cavity 12a is located in the plurality of glue injection cavities 12 near the first edge 11c, and a second glue injection cavity 12b is located in the plurality of glue injection cavities 12 near the second edge 11 d.
As shown in fig. 1, a distance L1 between the first glue injection cavity 12a and the first edge 11c is greater than a distance (e.g., distance L shown in fig. 1) between any two adjacent glue injection cavities 12, and a distance L2 between the second glue injection cavity 12b and the second edge 11d is greater than a distance (e.g., distance L shown in fig. 1) between any two adjacent glue injection cavities 12. From this, the position that lies in on the mould body 11 between first notes gluey chamber 12a and first edge 11c to and the position that lies in on the mould body 11 between second notes gluey chamber 12b and second edge 11d can regard as the gripping handle of both sides, makes things convenient for the staff to take mould body 11, the operation of being convenient for.
It should be noted that the specific shape of the glue injection cavity 12 is not limited, and may be, for example, a circle, an ellipse, a polygon (such as a rectangle, a hexagon, etc.), and the shape of the first edge 11c and the second edge 11d is also not limited, and may be, for example, a straight edge or a curved edge, where "a distance L1 between the first glue injection cavity 12a and the first edge 11 c" refers to a maximum distance between the first glue injection cavity 12a and the first edge 11c in the length direction F1 of the mold body 11, and "a distance L2 between the second glue injection cavity 12b and the second edge 11 d" refers to a maximum distance between the second glue injection cavity 12b and the second edge 11d in the length direction F1 of the mold body 11.
In some embodiments of the present invention, as shown in fig. 2 and 4, the gluing mold 1 may further include: the positioning structure 13, the positioning structure 13 are disposed on one side of the thickness of the mold body 11, that is, one side of the mold body 11 facing the workpiece 2 (the side where the surface 11b on the other side of the thickness of the mold body 11 is located as shown in fig. 2), and the positioning structure 13 is set up in a manner of avoiding the glue injection cavity 12, that is, the positioning structure 13 does not block the glue injection cavity 12, so that the adhesive 3 injected into the glue injection cavity 12 can pass through the workpiece 2 and contact the workpiece 2, but does not contact the positioning structure 13.
As shown in fig. 2 and 4, the positioning structure 13 is used for limiting the relative position of the member to be glued (e.g. the workpiece 2 or the substrate 5) and the mold body 11, for example, when the member to be glued is the workpiece 2, the positioning structure 13 may be used for at least limiting: the workpiece 2 moves relative to the die body 11 in a plane perpendicular to the thickness direction F3 of the die body 11. From this, can improve stability, reliability and the validity that the rubber coating process goes on, avoid because work piece 2 takes place the dislocation skew with mould body 11, lead to rubber coating error scheduling problem, and saved and adopted and be used for restricting above-mentioned relative motion anchor clamps to simplify going on of injecting glue process, and reduced the input cost of rubber coating process, improved the efficiency of going on of rubber coating process.
In some embodiments of the present invention, as shown in fig. 2 and 4, when the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, the positioning structure 13 may include two first positioning blocks 131, and the two first positioning blocks 131 are located on two sides of the plurality of glue injection cavities 12 in the length direction F1 of the mold body 11, for example, in the example shown in fig. 4, when two of the plurality of glue injection cavities 12 close to two ends of the length of the mold body 11 are the first glue injection cavity 12a and the second glue injection cavity 12b, respectively, a side of the first glue injection cavity 12a far from the second glue injection cavity 12b, and a side of the second glue injection cavity 12b far from the second glue injection cavity 12b are respectively provided with the first positioning blocks 131. From this, first locating block 131 can simply and restrict work piece 2 effectively and move along the length direction F1 of mould body 11 relative to mould body 11, and first locating block 131 can not influence the arranging of a plurality of injecting glue chambeies 12, can guarantee that the interval between every two adjacent injecting glue chambeies 12 is equal for example.
In some embodiments of the present invention, as shown in fig. 2 and 4, when the plurality of glue injection cavities 12 are sequentially spaced apart along the length direction F1 of the mold body 11, the positioning structure 13 may include at least two second positioning blocks 132, and the second positioning blocks 132 are respectively disposed on two sides of at least one glue injection cavity 12 in the width direction F2 of the mold body 11. Therefore, the second positioning block 132 can simply and effectively limit the workpiece 2 to move along the width direction F2 of the mold body 11 relative to the mold body 11, and the second positioning block 132 does not affect the arrangement of the plurality of glue injection cavities 12, for example, it can be ensured that the distance between every two adjacent glue injection cavities 12 is equal.
It should be noted that the number and size of the second positioning blocks 132 are not limited, for example, in the example shown in fig. 4, each second positioning block 132 may be disposed corresponding to at least two glue injection cavities 12, so as to reduce the number of the second positioning blocks 132, reduce the processing difficulty, and reduce the assembly difficulty of the mold body 11 and the workpiece 2. In addition, in the width direction F2 of the mold body 11, a plurality of second positioning blocks 132 may be disposed on the same side of the plurality of glue injection cavities 12, and the plurality of second positioning blocks 132 are distributed at intervals along the length direction F1 of the mold body 11, so that the positioning reliability may be improved.
In some embodiments of the present invention, as shown in fig. 5, at least a portion of the mold body 11 is an equal-thickness flat plate, and is configured to provide a plurality of glue injection cavities 12, so that the depths of the plurality of glue injection cavities 12 in the thickness direction F3 of the mold body 11 may be equal, for example, in the example shown in fig. 5, the depth of each glue injection cavity 12 is H, so that when each glue injection cavity 12 is filled with the adhesive 3, it may be ensured that the glue injection amount of each glue injection cavity 12 is equal, so that the glue is uniformly applied, and the structure of the mold body 11 may be simplified, so as to facilitate the processing. Of course, the die body 11 of the embodiment of the present invention may also be a flat plate with the same thickness as the whole, so as to facilitate the processing.
As shown in fig. 1, in some embodiments of the present invention, the glue coating mold 1 may further include a pad 14, the pad 14 is disposed in at least one glue injection cavity 12, and the pad 14 is not in contact with a sidewall of the glue injection cavity 12 where the pad 14 is located, and with reference to fig. 6, in a thickness direction F3 of the mold body 11, a height H of the pad 14 is smaller than a depth H of the glue injection cavity 12 where the pad is located. Referring to fig. 7 and 8, in the process of clamping and pressing the workpiece 2 and the substrate 5 when bonding the workpiece 2 to the substrate 5, for example, when pushing the workpiece 2 toward the substrate 5 from the top to the bottom direction shown in fig. 7 until the pad 14 contacts the substrate 5 (for example, the state shown in fig. 8), the clamping is in place, and in this process, a portion of the rubber block 31 higher than the pad 14 in the thickness direction F3 of the mold body 11 (e.g., the portion in the shaded area B shown in fig. 7) overflows around under pressure, and a portion of the rubber block overflows into the gap 41, so that the glue overflow 32 is obtained.
Therefore, the pad 14 with the height smaller than the depth of the glue injection cavity 12 can be used for realizing glue overflow 32, so that the bonding area can be increased, the phenomenon of false bonding of air holes can be improved, and the bonding strength can be improved. Moreover, the amount of the overflow glue 32 in the gap 41 can be adjusted by designing the relationship between the difference between the depth of the glue injection cavity 12 and the height of the cushion member 14 and the volume of the gap 41 and other parameters, so that the overflow glue 32 of two adjacent glue blocks 31 in the gap 41 is not contacted, and a certain gap 42 (as shown in fig. 8) still remains, thereby facilitating the circulation of air flow in the gap 42, facilitating the moisture to cure the adhesive 3, shortening the curing time of the adhesive 3, improving the curing efficiency of the adhesive 3, and improving the curing strength of the center position of the adhesive 3.
For example, in one embodiment of the present invention, as shown in fig. 6, the depth H of the glue injection cavity 12 is 0.5mm-1mm higher than the height H (i.e., H-H) of the pad 14, and in conjunction with fig. 8, after the glue overflow 32 is obtained in the gap 41, a gap 42 (shown as W in fig. 8) of 1mm-3mm is remained in the gap 41 2 ) Thereby being beneficial to the circulation of air current in the gap 42 and being beneficial to moisture to solidify the adhesive 3, shortening the solidification time of the adhesive 3, improving the solidification efficiency of the adhesive 3 and improving the solidification strength of the central position of the adhesive 3.
It should be noted that the structural shape of the pad 14 is not limited, and for example, the pad 14 may be a solid cylinder, a prism (as shown in fig. 6), or the like, or the pad 14 may also be a hollow cylinder, a prism (as shown in fig. 7), or the like, and when the hollow hole penetrates through the pad 14 in the thickness direction of the mold body 11, the glue filling amount of the glue injection cavity 12 may be increased to some extent, so as to improve the reliability of the bonding. In addition, it should be noted that, during the design, an excessive space is reserved around the workpiece 2 as much as possible, so as to prevent the adhesive 3 from overflowing to the outside of the workpiece 2 and even being adhered to other components.
In a specific example of the present invention, as shown in fig. 1 to 3, the mold body 11 is a rectangular uniform-thickness flat plate, the mold body 11 has a plurality of glue injection cavities 12 with the same shape and size, the plurality of glue injection cavities 12 are uniformly spaced apart along a length direction F1 of the mold body 11, each glue injection cavity 12 is a rounded rectangle to facilitate demolding of the glue block 31, and a spacing L between two adjacent glue injection cavities 12 is about 6 mm. Therefore, by adopting the die body 11, a corresponding number of round-corner rectangular rubber blocks 31 can be obtained on the workpiece 2, and the gap 41 between two adjacent rubber blocks 31 is about 6 mm. The at least two glue cavities 12 are provided with padding elements 14, so that after demoulding, the at least two glue blocks 31 have padding elements 14 therein.
Suppose that: a is the length of the glue injection cavity 12; b is the width of the glue injection cavity 12; s is the bottom area of the glue injection cavity 12, s = ab; h is the height of the glue injection cavity 12; h is the height of the pad 14; h 'is the height of the overflow glue 32 layer, H' = H-H; c is the perimeter of the glue injection cavity 12, c =2 (a + b); the gap 41 between two adjacent rubber blocks 31 is W 1 . Then: the volume of the overflow glue 32 is: v = sh', the single-side width of the flash 32 is: w 3 = V/c/h; the width of the gap 42 in the gap 41 after the glue overflow 32 is: w 2 ＝W 1 -2W 3 . Example (c): a =30mm, b =20mm, h =4mm, h =3mm 1 And 6mm is as follows: v =600mm 3 ；W 3 ＝2mm；W 2 ＝2mm。
Next, a bonding method according to an embodiment of the second aspect of the present invention is described with reference to the drawings.
According to the bonding method of the embodiment of the present invention, the work 2 is bonded to the base material 5 using the paste die 1 of the embodiment of the first aspect of the present invention (as shown in fig. 9). It should be noted that the application of the bonding method of the embodiment of the present invention is not limited, for example, in a specific example of the present invention, in conjunction with fig. 9-10, the workpiece 2 may be a rail vehicle side roof suspension.
The bonding method may include the steps of: arranging a mould body 11 on a workpiece 2, arranging a pad 14 in at least one glue injection cavity 12, bonding the pad 14 to the workpiece 2, injecting a glue 3 into at least one glue injection cavity 12, enabling the glue 3 injected into the glue injection cavity 12 provided with the pad 14 to cover the pad 14, taking the mould body 11 off the workpiece 2, adhering glue blocks 31 formed by the glue 3 in the corresponding glue injection cavity 12 on the workpiece 2, namely injecting the glue 3 into a plurality of glue injection cavities 12, obtaining a plurality of glue blocks 31 on the workpiece 2, arranging a gap 41 between any two glue blocks 31, enabling the side provided with the glue blocks 31 of the workpiece 2 to face a substrate 5, enabling the workpiece 2 to be close to the substrate 5 until the pad 14 is contacted with the substrate 5, and enabling the part of the glue blocks 31 higher than the pad 14 to overflow to the periphery of the glue blocks 31.
From this, can realize simply and effectively bonding, and can be to the injection volume effective control of adhesive 3, can guarantee in addition that 3 distributions of adhesive meet the requirements, and through setting up a plurality of glue injection chamber 12 to spaced apart distribution to can improve the solidification efficiency of adhesive 3, improve the solidification intensity that 3 central points of adhesive put, make gluey piece 31 have the space to take place the overflow when bonding in addition, thereby improve the bonding area, and improve the pseudo-bonding phenomenon of gas pocket, and then improve bonding intensity.
Of course, the present invention is not limited to this, and in the embodiment of the present invention, the above bonding method may be further refined as follows.
Firstly, polishing the workpiece 2 and the base material 5, removing oxide layers on the surfaces of the base material 5 and the workpiece 2, making the surfaces rough, and enhancing the adhesion with the adhesive 3. And then the workpiece 2 and the substrate 5 can be cleaned, and impurities such as grinding residual dust, iron powder and the like can be removed cleanly.
Secondly, as shown in fig. 11, the cleaned workpiece 2 is fixed by using the vise 6 or a jig, with reference to fig. 12 and 13, and then the die body 11 is sleeved on the workpiece 2, for example, the die body 11 and the workpiece 2 are relatively limited by using the positioning structure 13, so as to implement the installation of the die body 11 on the workpiece 2.
Thirdly, as shown in fig. 12, a pad 14 is disposed in at least one glue injection cavity 12, for example, the pad 14 may be disposed in each of two glue injection cavities 12 that are disposed at a distance, the pad 14 is disposed at a central position of the corresponding glue injection cavity 12, a small amount of flash drying glue is dropped into the glue injection cavity 12 in which the pad 14 is disposed, so as to bond the pad 14 to the bonding surface of the workpiece 2, and the pad 14 is dried for about 5 minutes, thereby achieving bonding of the pad 14 to the workpiece 2.
And fourthly, extruding the adhesive 3 by using a glue gun, enabling the adhesive 3 to flow out of a glue gun nozzle, injecting the adhesive into the adhesive injection cavity 12, filling the adhesive injection cavity 12, leveling the surface of the mold body 11, which is far away from the workpiece 2, by using a scraper, scraping redundant adhesive 3, so that the adhesive 3 is only filled in the adhesive injection cavity 12 and does not remain on the surface of the mold body 11, thereby ensuring that the adhesive 3 fully fills the adhesive injection cavity 12, and after leveling, the surface of the adhesive 3 has no air holes, and the amount of the adhesive 3 is effectively controlled.
And fifthly, holding the two ends of the length of the die body 11 by two hands, and lifting the die body 11 vertically upwards slightly to realize demoulding, namely taking down the die body 11, leaving the molding glue with the same shape and size as the glue injection cavity 12 on the die body 11 on the workpiece 2 after demoulding, namely, glue blocks 31 formed by the adhesive 3 in the corresponding glue injection cavity 12 are adhered on the workpiece 2, and a gap 41 is reserved between any two glue blocks 31. For facilitating the demolding, the material of the mold body 11 may be selected from a material having a low tension or a material having a surface treated to have a low tension, such as: the low tension is achieved by the polytetrafluoroethylene, polyethylene, polypropylene and other materials or metal material spraying polytetrafluoroethylene and other processes, so that the mold body 11 can be smoothly demoulded without auxiliary silicon, oil, grease, agent and the like, and the operation is convenient.
Sixthly, the side, provided with the rubber block 31, of the workpiece 2 faces the cleaned substrate 5, the workpiece 2 is made to approach the substrate 5, so that the rubber block 31 is in contact with the substrate 5, then the workpiece 2 and the substrate 5 are lightly clamped at a position opposite to or approximately opposite to the pad 14 by using a plurality of clamps 7 (such as C-shaped clamps), the relative position of the workpiece 2 and the substrate 5 in the direction perpendicular to the pressing direction is properly adjusted, so that the bonding position of the workpiece 2 meets the requirement, then the clamping is continued until the pad 14 is in contact with the substrate 5, in the process, under the action of clamping pressure, the part, higher than the pad 14, of the rubber block 31 overflows to the periphery of the rubber block 31 to form an overflow rubber 32, and in the process of pressing, the air holes in the rubber block 31 are filled, and the false bonding phenomenon is avoided.
In addition, the adhesive 3 can be cured for more than seven days in a temperature-controlled and wet environment to ensure that the inside of the adhesive 3 is changed from colloidal liquid into solid, so that the workpiece 2 and the base material 5 are mechanically locked and reliably connected after the adhesive 3 is cured. The time for removing the clamp 7 may be determined according to actual conditions, and for example, the clamp may be removed after the periphery of the rubber block 31 is cured, for example, about three days, or may be removed after the rubber block 31 is completely cured, which is not limited herein.
In the description of the specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A gluing mold, characterized in that, includes:
the mould comprises a mould body, wherein the mould body is provided with a plurality of glue injection cavities, each glue injection cavity penetrates through the surfaces of two sides of the thickness of the mould body, and any two glue injection cavities are arranged at intervals;
the cushion piece is arranged in at least one glue injection cavity and does not contact with the side wall of the glue injection cavity where the cushion piece is located, and the height of the cushion piece is smaller than the depth of the glue injection cavity where the cushion piece is located in the thickness direction of the die body.
2. The gluing die of claim 1, wherein the spacing between each two adjacent glue injection cavities is equal.
3. Gluing die according to claim 1, characterised in that a plurality of the gluing cavities are distributed at intervals in sequence along the length of the die body.
4. A gluing mold as claimed in claim 3, wherein the two side edges of the length of the mold body are respectively a first edge and a second edge, a first gluing cavity is provided in the plurality of gluing cavities close to the first edge, a second gluing cavity is provided in the plurality of gluing cavities close to the second edge, the distance between the first gluing cavity and the first edge is greater than the distance between any two adjacent gluing cavities, and the distance between the second gluing cavity and the second edge is greater than the distance between any two adjacent gluing cavities.
5. The gluing die of claim 1, further comprising:
the positioning structure is arranged on one side of the thickness of the die body and avoids the glue injection cavity, and the positioning structure is used for limiting the relative position of the to-be-glued piece and the die body.
6. The gluing die of claim 5, wherein a plurality of the gluing cavities are distributed at intervals along the length direction of the die body in sequence, and the positioning structure comprises:
the first locating blocks are two and located on two sides of the plurality of glue injection cavities in the length direction of the die body.
7. The gluing die of claim 5, wherein a plurality of the gluing cavities are distributed at intervals along the length direction of the die body in sequence, and the positioning structure comprises:
the number of the second positioning blocks is at least two, and the second positioning blocks are respectively arranged on two sides of at least one glue injection cavity in the width direction of the die body.
8. The gluing die according to claim 1, wherein at least part of the die body is a flat plate of uniform thickness and is provided with a plurality of the glue injection cavities so as to be equal in depth in the thickness direction of the die body.
9. A bonding method for bonding a work to a substrate using the paste application mold according to any one of claims 1 to 8, comprising the steps of:
arranging the die body on the workpiece;
arranging the cushion piece in at least one glue injection cavity and adhering the cushion piece to the workpiece;
injecting an adhesive into at least one glue injection cavity, and enabling the adhesive injected into the glue injection cavity with the cushion piece to cover the cushion piece;
taking the die body off the workpiece, wherein the workpiece is adhered with a glue block formed by the adhesive in the corresponding glue injection cavity;
and enabling one side of the workpiece, which is provided with the rubber block, to face the base material, and enabling the workpiece to be close to the base material until the pad is contacted with the base material, wherein the part of the rubber block, which is higher than the pad, overflows around the rubber block.
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| CN100447971C (en) * | 2004-09-15 | 2008-12-31 | 精工爱普生株式会社 | Method for mounting semiconductor device, semiconductor device and its mounting structure |
| TW200812705A (en) * | 2006-09-13 | 2008-03-16 | Lingsen Precision Ind Ltd | Method of thickness control for gluing |
| CN101823039A (en) * | 2009-03-06 | 2010-09-08 | 鸿骐新技股份有限公司 | Gluing device, use method and products thereof |
| TWM363338U (en) * | 2009-04-29 | 2009-08-21 | Pin-Yu Liao | Heat-melting glue film with gas exhausting structure |
| JP5156701B2 (en) * | 2009-07-13 | 2013-03-06 | 日本碍子株式会社 | Method for manufacturing ceramic honeycomb structure |
| CN101670331A (en) * | 2009-09-17 | 2010-03-17 | 深圳市瑞丰光电子有限公司 | Liquid glue encapsulation device and encapsulation method using same |
| CN201930901U (en) * | 2010-12-28 | 2011-08-17 | 广州市鸿利光电股份有限公司 | Die used for flat bracket adhesive dispensing |
| CN202006158U (en) * | 2011-03-04 | 2011-10-12 | 常州市欧密格电子科技有限公司 | Batch quantity spot gluer |
| CN103515080A (en) * | 2012-06-20 | 2014-01-15 | 苏州工业园区赫光科技有限公司 | Screen type glue fitting device |
| CN103433171A (en) * | 2013-08-30 | 2013-12-11 | 深圳创维－Rgb电子有限公司 | Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source |
| CN103551291B (en) * | 2013-10-29 | 2015-08-12 | 深圳市联得自动化装备股份有限公司 | Glue spreading method and glue make-up machine |
| CN204249365U (en) * | 2014-11-27 | 2015-04-08 | 荆门市幸科电子有限公司 | LED lamp bead pastes gluing particular manufacturing craft |
| CN204703444U (en) * | 2015-05-26 | 2015-10-14 | 陈燕 | A kind of composite floor board |
| CN106000815B (en) * | 2016-05-27 | 2019-01-25 | 青岛理工大学 | The preparation method and preparation system of damping layer in embedded co-curing composite material |
| CN208062141U (en) * | 2018-05-08 | 2018-11-06 | 宁德时代新能源科技股份有限公司 | Battery modules |
| CN108638678A (en) * | 2018-05-31 | 2018-10-12 | 苏州天立达胶粘制品有限公司 | A kind of printing process of abnormal shape glue |
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