CN210706125U

CN210706125U - FRP board-base member bonding test piece making devices

Info

Publication number: CN210706125U
Application number: CN201920203703.2U
Authority: CN
Inventors: 王海涛
Original assignee: Hohai University HHU
Current assignee: Hohai University HHU
Priority date: 2019-02-15
Filing date: 2019-02-15
Publication date: 2020-06-09
Anticipated expiration: 2029-02-15

Abstract

The utility model discloses a FRP board-base member bonding test piece making devices, the device include that the subassembly is applyed to bottom plate, centering control subassembly, binder layer thickness control subassembly, apron and extrusion force, and the bottom plate both ends are provided with the recess, and the recess bottom is equipped with the bolt hole that runs through the bottom plate, are equipped with the sliding tray in the middle of the bottom plate, and the centering control subassembly comprises baffle, support and bolt, and binder layer thickness control subassembly comprises baffle and bolt, and the subassembly is applyed to the extrusion force comprises baffle and bolt. The utility model discloses can realize the accurate control of FRP board-base member bonding test piece binder layer thickness to guarantee the FRP board centering of bonding test piece, do not harm the FRP board simultaneously.

Description

FRP board-base member bonding test piece making devices

Technical Field

The utility model relates to a bonding test piece making devices, more specifically relates to a FRP board-base member bonding test piece making devices.

Background

Fiber Reinforced Polymer (FRP) has the advantages of high strength, light weight, good durability, convenient construction and the like, and the external FRP plate technology is widely applied to the field of structural reinforcement, and related theoretical research is also a research hotspot in the field of structural engineering. Research shows that the stress performance of the structure can be effectively improved by the externally-adhered FRP plate, but the bonding performance of the FRP plate and the matrix interface plays a crucial role in reinforcing effect, so that the bonding performance of the FRP plate-matrix interface needs to be fully researched, a large number of FRP plate-matrix bonding test pieces with different parameters need to be manufactured, and the centering of the FRP plate and the accurate control of the thickness of a bonding agent layer in the manufacturing process of the test piece are the key for ensuring the manufacturing quality of the test piece. The existing method for manufacturing the FRP plate-matrix bonding test piece is mainly a mode of pressing by hands or a C-shaped clamp, and the modes have poor centering effect and easily cause local damage to the FRP plate. The thickness of the existing adhesive layer is controlled mainly by searching steel balls, fine iron wires and the like with the same size as the thickness of the adhesive layer, mixing the steel balls, the fine iron wires and the like into the adhesive layer and extruding the steel balls and the fine iron wires to obtain the required thickness of the adhesive layer. In addition, the efficiency of the traditional FRP plate-matrix bonding test piece manufacturing process is low.

Disclosure of Invention

Utility model purpose: the utility model provides a FRP board-base member bonding test piece making devices, the device can the accurate control binder layer thickness and guarantee the centering of FRP board, improves the preparation efficiency of FRP board-base member bonding test piece simultaneously.

The technical scheme is as follows: a FRP board-base member bonding test piece making devices, apply the subassembly including bottom plate, centering control subassembly, binder layer thickness control subassembly, apron and extrusion force, wherein the centering control subassembly is located the centering of bottom plate both sides in order to realize the FRP board, and binder layer thickness control subassembly is located the bottom plate both ends, and the apron is kept flat on the binder layer thickness control subassembly at bottom plate both ends, and the subassembly is applied to bottom plate and apron passing the extrusion force, and subassembly upper portion and apron contact, lower part and bottom plate contact are applied to the extrusion force.

The two ends of the bottom plate are provided with grooves, bolt holes penetrating through the bottom plate are formed in the bottoms of the grooves, the positions of the binder layer thickness control assemblies can be fixed, the thickness of the binder layer can be controlled more accurately, the sliding grooves are formed in the middle of the bottom plate, so that the centering control assemblies can flexibly slide, centering of the FRP plate can be controlled conveniently, and meanwhile, the centering effect is not influenced by the width of the FRP plate-substrate bonding test piece.

Wherein, centering control assembly comprises first bolt, first baffle and backup pad, and first bolt passes the screw and the first baffle contact of backup pad, and the backup pad supports the bottom plate, and first baffle is promoted by first bolt, and the baffle of both sides promotes FRP board and base member, makes the FRP board centering.

The adhesive layer thickness control assembly is composed of a second baffle and a second bolt, the second bolt is rotated to push the second baffle to ascend or descend, and the adhesive layer thickness can be flexibly and accurately controlled.

The extrusion force applying assembly comprises a third baffle and a bolt, the bolt penetrates through the third baffle to push the cover plate, the cover plate can uniformly apply extrusion force on the FRP plate, and the bonding effect and the thickness control effect of the adhesive layer are enhanced.

When manufacturing an FRP plate-substrate bonding test piece, firstly adjusting the height of a binder layer thickness control assembly to enable the height of a second baffle plate to be equal to the sum of the thicknesses of a substrate, the binder layer and the FRP plate, then adjusting the position of a first baffle plate of a centering control assembly on one side, fixing a first bolt, placing a cleaned substrate on a bottom plate to enable the substrate to be in contact with the first baffle plate of the fixed centering control assembly, coating the binder on the surfaces of the substrate and the FRP plate, placing the surface of the FRP plate coated with the binder on the substrate, simultaneously contacting with the first baffle plate of the fixed centering control assembly, adjusting the position of the first baffle plate of the centering control assembly on the other side, pushing the FRP plate and the substrate to center the FRP plate, placing a cover plate on the FRP plate, applying an extrusion force to the cover plate by using an extrusion force application assembly to enable the cover plate to be in close contact with the second baffle plate of the, and (3) taking down the test piece after the initial setting of the binding agent for bonding the FRP plate-matrix test piece, and cleaning the redundant binding agent overflowing on the test piece.

Has the advantages that: 1. the thickness of the binding agent layer of the FRP plate-matrix bonding test piece can be accurately controlled; 2. the FRP plate of the manufactured bonding test piece can be ensured to be aligned; 3. the FRP plate is not damaged; 4. the manufacturing process is simple, and the efficiency of manufacturing the FRP plate-matrix bonding test piece is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a base plate;

FIG. 3 is a schematic view of a centering control assembly;

FIG. 4 is a schematic view of an adhesive layer thickness control assembly;

fig. 5 is a schematic view of the pressing force applying assembly.

Detailed Description

As shown in figure 1, the device for manufacturing FRP plate-substrate bonding test piece of the utility model comprises a bottom plate 1, a centering control component 2, a bonding agent layer thickness control component 3, a cover plate 4 and an extrusion force applying component 5. As shown in fig. 2, grooves 11 are provided at both ends of the bottom plate 1, bolt holes 13 penetrating the bottom plate 1 are provided at the bottom of the grooves 11, and a sliding groove 12 is provided in the middle of the bottom plate 1. As shown in fig. 3, the centering control assembly 2 is composed of a first baffle 21, a support plate 22 and a first bolt 23. As shown in fig. 4, the adhesive layer thickness control member 3 is composed of a second shutter 31 and a second bolt 32. As shown in fig. 5, the pressing force applying assembly 5 is composed of a bolt 51 and a third shutter 52.

When manufacturing an FRP plate-substrate bonding test piece, firstly adjusting the height of the adhesive layer thickness control component 3, rotating the second bolt 32 to enable the height of the second baffle 31 to be equal to the thickness of the FRP plate-substrate bonding test piece, namely the sum of the thicknesses of the substrate and the FRP plate of the adhesive layer, then rotating the first bolt 23 of the centering control component 2 at one side to enable the first bolt 23 to push the first baffle 21, adjusting the position of the first baffle 21, fixing the first bolt 23, cleaning the surface of the substrate, flatly placing the substrate on the bottom plate 1 to enable the substrate to be in contact with the first baffle 21 of the fixed centering control component 2, coating the adhesive on the surfaces of the substrate and the FRP plate, placing the surface of the FRP plate coated with the adhesive on the substrate and simultaneously in contact with the first baffle 21 of the fixed centering control component 2, then rotating the first bolt 23 of the centering control component 2 at the other side to enable the first bolt 23 to push the first baffle 21, and then promote FRP board and base member, make FRP board and base member centering, place apron 4 on the FRP board to rotatory bolt 51 makes bolt 51 exert the extrusion force to apron 4, makes apron 4 and the second baffle 31 in close contact with of binder layer thickness control assembly 3, takes off the test piece after the binder of FRP board-base member bonding test piece sets for the first time, and the clearance overflows the unnecessary binder on the test piece.

Claims

1. The utility model provides a FRP board-base member bonding test piece making devices, its characterized in that, the device includes that bottom plate (1), centering control assembly (2), binder layer thickness control assembly (3), apron (4) and extrusion force apply subassembly (5), centering control assembly (2) are located bottom plate (1) both sides in order to realize the centering of FRP board, binder layer thickness control assembly (3) are located bottom plate (1) both ends, apron (4) are kept flat on binder layer thickness control assembly (3) at bottom plate (1) both ends, subassembly (5) are applied to bottom plate (1) and apron (4) passing the extrusion force, and assembly (5) upper portion and apron (4) contact are applied to the extrusion force, and the lower part contacts with bottom plate (1).

2. The FRP plate-substrate bonding test piece manufacturing device according to claim 1, wherein grooves (11) are formed at two ends of the bottom plate (1), bolt holes (13) penetrating through the bottom plate (1) are formed at the bottoms of the grooves (11), and a sliding groove (12) is formed in the middle of the bottom plate (1).

3. The FRP plate-substrate bonded test piece manufacturing device according to claim 1, wherein the centering control assembly (2) is composed of a first bolt (23), a first baffle plate (21) and a support plate (22), and the first bolt (23) is in contact with the baffle plate (21) through a screw hole of the support plate (22).

4. The FRP plate-substrate bonded test piece manufacturing apparatus according to claim 1, wherein the adhesive layer thickness control member (3) is composed of a second baffle plate (31) and a second bolt (32).

5. The FRP plate-substrate bonded specimen manufacturing device according to claim 1, wherein the pressing force applying member (5) is composed of a bolt (51) and a third baffle plate (52).

6. The FRP plate-substrate bonded test piece manufacturing device according to claim 1, wherein the surface of the cover plate (4) is flat.