CN111462649A - L ED integrated packaging display module, maintenance method thereof and display device - Google Patents
L ED integrated packaging display module, maintenance method thereof and display device Download PDFInfo
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Abstract
The application relates to a L ED integrated package display module, a maintenance method thereof and a display device, wherein the maintenance method of the L ED integrated package display module comprises the steps of detecting a L ED integrated package display module to determine the position of a first L ED chip which fails, removing a first packaging colloid covered on the first L ED chip to expose the first L ED chip which fails, removing the first L ED chip which fails, installing a normal second L ED chip, and packaging the second L ED chip.
Description
Technical Field
The application relates to the L ED display field, in particular to a L ED integrated packaging display module, a maintenance method thereof and a display device.
Background
L A packaging mode of an integrated packaged display product is to apply COB (Chip On Board) packaging technology, the L ED display product adopting a COB light source has the advantages of space saving and easy realization of small spacing, wherein the main method of the COB packaging technology is that firstly, a L ED Chip and related components are fixed On a circuit Board in a sticking mode through viscose glue, a L ED Chip and related components are electrically connected through metal wire bonding or welding by means of circuit Board wiring, and finally, L ED chips and related components On the circuit Board are integrally packaged and covered by adopting packaging colloid so as to play a role in waterproof and dustproof protection.
Generally, a complete L ED integrated package display module is provided with at least thousands of L ED chips, before packaging, preliminary lighting detection is carried out to ensure that the L ED chips are normally and electrically connected with components, if the L ED chips have abnormal lighting conditions such as non-lighting or abnormal brightness, the L ED chips are judged to be failed, namely, the L ED chips are broken or damaged, operators only need to maintain the broken points in time and then package the broken points after maintenance is finished, and in the packaging and forming process, the L ED chips cannot be completely ensured.
Disclosure of Invention
Accordingly, it is necessary to provide a L ED integrated package display module, a method for repairing the same, and a display device, in order to solve the problem that it is difficult to repair a defective pixel of the L ED integrated package display module after packaging.
A maintenance method of an L ED integrated package display module comprises the following steps:
detecting an L ED integrated package display module, and determining the position of a first L ED chip which fails;
removing the first encapsulant covering the failed first L ED chip to expose the failed first L ED chip;
removing the failed first L ED chip;
mounting a normal second L ED chip;
and packaging the second L ED chip.
Above-mentioned L ED integrated package display module's maintenance method gets rid of the first L ED chip that became invalid through the fixed point, installs normal second L ED chip again, encapsulates again at last, makes L ED integrated package display module resume normal display effect, improves the yields of production, avoids the product to scrap, reduction in production cost.
In one embodiment, the L ED integrated package display module is detected, and the method comprises the steps of placing the L ED integrated package display module on a test fixture, and carrying out a lighting test on the L ED integrated package display module.
In one embodiment, removing the first encapsulant covering the failed first L ED chip includes heating the first encapsulant to soften the first encapsulant, and removing the first encapsulant covering the failed first L ED chip by laser removal, chemical etching removal, or mechanical removal.
In one embodiment, the method further comprises removing the residual first packaging colloid and the first adhesive to expose the bonding pads on the circuit board before mounting the normal second L ED chip, and completely removing the residual first packaging colloid and the first adhesive to expose the bonding pads for mounting the second L ED chip, so that the height of the second L ED chip is consistent with that of the surrounding first L ED chip.
In one embodiment, mounting the second L ED chip includes applying a second adhesive to the pads, adhering the second L ED chip to the second adhesive, and curing the second adhesive by heating.
In one embodiment, encapsulating the second L ED die includes covering the second L ED die with a second encapsulant, and heat curing the second encapsulant.
In one embodiment, the thickness of the second encapsulant is set according to the thickness of the first encapsulant. Through setting up the thickness with the second encapsulation colloid into the same with the thickness of first encapsulation colloid, avoid appearing the encapsulation surface and appear unevenness, avoid influencing the transmission of light and influence the display effect.
In one embodiment, before the second L ED chip is packaged, the method further comprises detecting the L ED integrated package display module again to determine that the second L ED chip is operating normally.
An L ED integrated package display module maintained by the method for maintaining the integrated package display module according to any one of the above embodiments.
A display device comprising at least one L ED integrated packaged display module according to any one of the above embodiments.
Drawings
Fig. 1 is a schematic flow chart illustrating an embodiment of a repair method for an L ED integrated package display module according to the present application.
Fig. 2 is a schematic flow chart illustrating another embodiment of a repair method for an L ED integrated package display module according to the present application.
Fig. 3 is a schematic view illustrating an implementation of another embodiment of a L ED integrated packaged display module repairing method according to the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of the present application, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In an embodiment of the application, as shown in fig. 1, a method for maintaining a L ED integrated package display module includes the steps of detecting a L ED integrated package display module to determine a position of a first L ED chip that fails, removing a first encapsulant covering the first L ED chip to expose the first L ED chip that fails, removing a first L ED chip that fails, mounting a second L ED chip that is normal, and packaging the second L ED chip.
In one embodiment, the L ED chips in the L ED integrated package display module are assembled in a manner that includes front mounted chips, flip chips, or a combination of front mounted chips and flip chips, that is, a L2 ED integrated package display module repair method is applied to the L ED integrated package display module in the above-described various assembly manners, for convenience of understanding, it is noted that in this application, the first L ED 4ED chip refers to each L ED chip on the L ED integrated package display module before repair, that is, the first L ED chip before repair refers to a first L ED chip on the L ED 5ED integrated package display module before repair, that is, the first L ED chip before repair and a second L ED chip before repair, that is, the first 366392 ED chip before repair and a first L ED chip that fails, the second 638 ED chip after repair method is applied to a second adhesive-.
In one embodiment, the L ED integrated package display module is detected to obtain the L ED integrated package display module with the failed first L ED chip, and in another embodiment, the L ED integrated package display module is judged whether the failed first L ED chip exists, and if yes, the subsequent steps are executed.
In one embodiment, the L ED integrated package display module is detected, the L ED integrated package display module is placed on a test fixture, a lighting test is carried out on a L ED integrated package display module, the number and the positions of failed first L ED chips are determined through the lighting test, the states of the failed first L ED chips comprise abnormal states such as dead lamps, abnormal brightness, abnormal voltage, crosstalk, dark brightness, ghost shadow and caterpillar and the like, when the number of the failed first L ED chips is large and reaches a preset abnormal number limit value, the overall quality of the L4 ED integrated package display module is poor, the failure can be abandoned, when the number of the failed first L ED chips is lower than the abnormal number limit value, the maintenance method is carried out, in one embodiment, the test fixture is used for clamping and fixing the L ED integrated package display module to be detected, special detection equipment is adopted for carrying out lighting lamp detection on each first L ED chip in the L ED integrated package display module, and when the number of the failed first L ED chips is lower than the abnormal number limit value, the first L ED chips is consistent with the first 3884, and the failed first ED chips are determined and the coordinates are recorded and the failed first ED chips are judged by the 73742.
After the position of the first L ED chip which fails is determined, in one embodiment, the first encapsulant covered on the first L ED chip which fails is removed, wherein the first encapsulant is heated to soften the first encapsulant, and then the first encapsulant covered on the first L ED chip which fails is removed by laser removal, chemical etching removal or mechanical removal.
In one embodiment, the heating temperature is 100 ℃ to 260 ℃ and the heating time is 1 minute to 15 minutes, in one embodiment, the heating temperature is 100 ℃ to 200 ℃ and the heating time is 1 minute to 10 minutes, in one embodiment, the heating temperature is 200 ℃ and the heating time is 8 minutes, wherein the heating temperature is not too high, the heating time cannot be too long, the too high temperature and the too long time can cause the normal components around the failed first L ED chip to be subjected to heat loss so as to affect the use of the normal components, and simultaneously, the first encapsulating colloid around the failed first L ED chip is prevented from being excessively softened, namely, the first encapsulating colloid around the normal bright lamp area is prevented from softening and deforming, so that the first L ED chip in the normal bright lamp area can emit light normally, the light emitting effect is prevented from being influenced, the first encapsulating colloid is prevented from softening and softening the first encapsulating colloid is heated by a heating gun, and the first encapsulating colloid is heated to soften the light reflecting metal wire, so that the light emitting effect of the first L ED chip is not softened, the light emitting colloid is prevented from being heated, the light reflecting colloid is heated, and the light reflecting colloid is heated to be heated to soften the light reflecting metal, so that the light reflecting colloid is heated to be heated to cause the light reflecting metal of the encapsulating colloid.
After removing the first encapsulant covering the failed first L ED chip to expose the failed first L ED chip, the failed first L ED chip is removed in one embodiment, the failed first L ED chip is removed by clamping with a clamp in one embodiment, and the residual bonding wires of the failed first L ED chip are cut off by a cutter in one embodiment.
In one embodiment, the method further comprises removing the remaining first encapsulant and first adhesive to expose the pads on the circuit board before mounting the second, normal L ED die, in order to avoid damaging the circuit board and surrounding normal components, on one hand, the step of removing the first encapsulant covering the failed first L ED die removes only the first encapsulant over the surface of the failed first L ED die, and the first encapsulant remains around the first L ED die, on the other hand, the first L ED die is a pad adhered to the circuit board by the first adhesive, and after removing the first L ED die, the pad still has the first adhesive remains dry, e.g., if the remaining first adhesive is not completely removed, after subsequently mounting the normal second L ED die, the second L ED die is padded by the remaining first adhesive, i.e., with respect to the circuit board, the second L ED die is higher than the surrounding normal light emitting first L ED die, and when mounting the normal second L ED die, the led die is exposed to a substantially uniform brightness, and the first encapsulant is removed.
In one embodiment, a method for mounting a normal second L ED chip includes applying a second adhesive to a pad, attaching a second L ED chip to the second adhesive, and heating to cure the second adhesive, wherein the second adhesive is cured by heating, and attaching a second L ED chip to the pad, and preventing movement of the second L ED chip, wherein the second adhesive has a heating time less than a heating time of the first adhesive, and wherein the first adhesive is used to attach a first L ED chip to the pad, and wherein the first L ED chip is preferentially mounted on a circuit board over other components, thereby providing sufficient heating time to heat up the normal components, without concern for heat loss, and wherein the heating time of the second adhesive is controlled, wherein the heating time of the second adhesive is inevitably conducted to the normal components, wherein the heating time of the second adhesive is less than a heating time of the second adhesive, and wherein the heating time of the second adhesive is 200 hours, and wherein the heating time of the second adhesive is reduced by heating the second adhesive in an oven, wherein the heating time of the second adhesive is 100-78, and wherein the second adhesive is heated for a heating time of 200 hours.
In one embodiment, the second adhesive is different from the first adhesive in composition and ratio. Specifically, in order to shorten the heating time of the second adhesive, the components in the second adhesive may be adjusted, for example, the content of the water aqua is reduced, and the volatile chemical is added, so as to increase the curing speed of the second adhesive and shorten the heating and curing time. In one embodiment, the second adhesive has the same composition and ratio as the first adhesive. The raw material cost is saved by directly using the same components and proportion as the first viscose.
In one embodiment, the number of failed first L ED chips is multiple, and accordingly, the number of normal second L ED chips to be mounted is multiple, in order to maintain the uniformity of the height of each second L ED chip, the amount of the second adhesive used by each second L ED chip is the same, so that the second L ED chip is prevented from being lifted by the excessive amount of the second adhesive, in one embodiment, an automatic die bonding device is used for fixing the second L ED chips on bonding pads, and in one embodiment, a high-precision wire bonding device is used for wire bonding to electrically connect the second L ED chips with other components.
In one embodiment, before the second L ED chip is packaged, the method further comprises the step of detecting the L ED integrated package display module again to determine that the second L0 ED chip normally operates, in order to avoid abnormal lighting of the second L1 ED chip after packaging, in the embodiment, before the second L ED chip is packaged, the L ED integrated package display module is detected again, the detection method of the second L ED chip is the same as the initial step of detecting the L ED integrated package display module, and the L ED integrated package display module provided with the second L ED chip is placed on a test fixture, and the lighting test is performed on the L ED integrated package display module to determine that the second L ED chip normally operates.
In one embodiment, the second L ED chip is packaged by covering a second L ED chip with a second encapsulant, and heating and curing the second encapsulant, for L ED integrated package modules which are not used, in one embodiment, the second encapsulant has the same composition and ratio as the first encapsulant so as to ensure the uniformity of the whole encapsulant and avoid affecting the display effect, and for L ED integrated package modules which are used, the encapsulant may age and change color according to the length of the using time, in one embodiment, the second encapsulant has different composition and ratio from the first encapsulant, in one embodiment, the color of the second encapsulant is adjusted by adding a proper amount of pigment so as to ensure the uniformity of the color of the second encapsulant and the color of the first encapsulant, and finally the uniformity of the display effect.
In one embodiment, the heating time of the second encapsulant is less than the heating time of the first encapsulant, in order to avoid the second encapsulant from heating for too long and too high temperatures to thermally damage other components in the normally lit area, in one embodiment, the heating temperature of the second encapsulant is 100 ℃ to 200 ℃ and the heating time is 0.5 hours to 4 hours, in one embodiment, the first encapsulant in the normally lit area is inevitably heated to soften while the second encapsulant is heated because the first encapsulant is already cured, and in particular, in the step of removing the first encapsulant, the first encapsulant in the normally lit area is inevitably heated to soften, while the second encapsulant is heated to cure, the first encapsulant in the normally lit area is reheated for a second time, in this embodiment, the heating time and temperature of the second encapsulant are controlled so that, otherwise, the first encapsulant is further aged to change color, and the second encapsulant generates color, and in the other embodiment, the first encapsulant is softened again, and the heating time and temperature of the second encapsulant is controlled so that the first encapsulant is heated to prevent the first encapsulant from being heated to soften for a second encapsulant, and the first encapsulant from being heated to heat cured for a second encapsulant, and the second encapsulant is heated to soften for a second encapsulant, wherein the first encapsulant is heated to heat time of 150 hours, thereby avoiding the normal encapsulant from being heated to heat to deform, and the temperature of the second encapsulant to reduce the temperature of the second encapsulant to be heated to be changed to 150 hours, and to reduce the temperature of the first encapsulant.
In one embodiment, the thickness of the second encapsulant is set according to the thickness of the first encapsulant. Through setting up the thickness with the second encapsulation colloid into the same with the thickness of first encapsulation colloid, avoid appearing the encapsulation surface and appear unevenness, avoid influencing the transmission of light and influence the display effect. In one embodiment, when the cured glue surface of the second encapsulant protrudes from the glue surface of the first encapsulant, the second encapsulant is processed by polishing, knife-engraving or CNC milling, so that the glue surface of the second encapsulant is flush with the glue surface of the first encapsulant.
In one embodiment, a L ED integrated package display module repair method is shown in fig. 2, and includes steps of inspecting L ED integrated package display module, determining a location of a failed first L ED chip, heating the first package adhesive to soften the first package adhesive, removing the first package adhesive covering the failed first L ED chip by laser removal, chemical etching removal or mechanical removal to expose the first L ED chip, removing the failed first L ED chip, removing the remaining first package adhesive and the first adhesive to expose pads on a circuit board, applying a second adhesive to the pads to adhere the second L ED 4 chip to the second adhesive, and heat curing the second adhesive, wherein a heating time of the second adhesive is less than a heating time of the first adhesive, inspecting L ED integrated package display module to determine that the second L ED chip is operating normally, covering the second package adhesive with the second package adhesive, heating the second adhesive for a heating time that is less than a heating time of the first adhesive, inspecting L ED integrated package display module to determine that the second L ED chip is operating normally, reducing a heating time of the second package adhesive, reducing a normal manufacturing cost of the package, reducing a cost of the package by reducing a cost of the package, reducing a normal package by reducing a time of the package, reducing a normal package of the package, reducing a normal package of the package, and reducing a time of the package, reducing a defective package of the package, and reducing a defective package of the package.
In one embodiment, a L ED integrated package display module before repair comprises a circuit board, a bonding pad disposed on the circuit board, a first adhesive and a first L ED chip disposed on the bonding pad, a bonding wire for electrical conduction and a first encapsulant, firstly, a L ED 0ED integrated package display module is detected, the position of the first L ED chip which fails is determined, then, the first encapsulant covered on the first L ED chip is removed, the first L ED chip which fails is exposed, then, the first L ED chip which fails is removed, a normal second L ED 5ED chip is mounted, and finally, a second L ED 6ED chip is packaged, in one embodiment, the maintenance method of the L ED integrated package display module is specifically implemented as shown in fig. 3, step S10 is to prepare an L8 ED integrated package display module, step L ED package display module comprises the circuit board 100, the bonding pad 200, the first adhesive 300, the first package L ED chip and the first package 500, the first package colloid comprises the steps of coating the first adhesive and the second package 72 ED chip which fails, exposing the first adhesive and the first package colloid L ED chip which is removed, the normal package glue chip L ED chip 36420, and the package glue is electrically connected to the bonding pad 200, the bonding pad of the first adhesive package glue package 300, the first glue package display module, the first glue package 200, the first glue package 200, the package glue package 200, the first glue package 200, the package.
Above-mentioned L ED integrated package display module's maintenance method gets rid of the first L ED chip that became invalid through the fixed point, installs normal second L ED chip again, encapsulates again at last, makes L ED integrated package display module resume normal display effect, improves the yields of production, avoids the product to scrap, reduction in production cost.
The L ED integrated package display module is maintained by the integrated package display module maintenance method of any one of the embodiments, namely, the L ED integrated package display module is maintained by the L ED integrated package display module maintenance method of any one of the embodiments, so that the integrated package display module solves the problem that a L ED chip which fails is scrapped, meanwhile, the consistency of the display effect of the maintained display module is ensured, the maintained display module can be continuously and normally used, and the production cost is saved.
In one embodiment, the L ED integrated package display device comprises a plurality of regularly arranged L ED integrated package display modules, namely, the L ED integrated package display module obtained by maintenance is adopted in a L ED integrated package display device applied for a period of time, so that on one hand, a failed L ED chip is eliminated, on the other hand, the display consistency after maintenance is ensured, and the problems of non-uniformity and non-uniformity of display are avoided, therefore, the L ED integrated package display module has high practicability.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (10)
1. A maintenance method of an L ED integrated package display module is characterized by comprising the following steps:
detecting an L ED integrated package display module, and determining the position of a first L ED chip which fails;
removing the first encapsulant covering the failed first L ED chip to expose the failed first L ED chip;
removing the failed first L ED chip;
mounting a normal second L ED chip;
and packaging the second L ED chip.
2. The L ED display module repairing method according to claim 1, wherein the inspecting the L ED display module comprises placing the L ED display module on a test fixture, and performing a lighting test on the L ED display module.
3. The L ED integrated package display module repairing method of claim 1, wherein the removing of the first encapsulant covering the failed first L ED chip comprises heating the first encapsulant to soften the first encapsulant, and removing the first encapsulant covering the failed first L ED chip by laser, chemical etching or mechanical removal.
4. The L ED integrated package display module repairing method according to claim 1, further comprising removing the residual first encapsulant and the first adhesive to expose the bonding pads on the circuit board before mounting the second L ED chip.
5. The L ED integrated package display module repairing method of claim 4, wherein the step of mounting the second L ED chip includes applying a second adhesive to the pads, adhering the second L ED chip to the second adhesive, and curing the second adhesive by heating.
6. The L ED integrated package display module maintenance method of claim 4, wherein encapsulating the second L ED chip includes covering the second L ED chip with a second encapsulant, and curing the second encapsulant by heating.
7. The L ED integrated package display module maintenance method of claim 6, wherein the thickness of the second encapsulant is set according to the thickness of the first encapsulant.
8. The L ED integrated package display module maintenance method of claim 6, wherein before encapsulating the second L ED chip, further comprising re-testing the L ED integrated package display module to determine that the second L ED chip is functioning properly.
9. An L ED display module assembly, wherein the module assembly is maintained by the method of any one of claims 1 to 8.
10. A display device comprising at least one L ED ic packaged display module according to claim 9.
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