CN104066280A - Method for manufacturing coreless plate and coreless plate - Google Patents
Method for manufacturing coreless plate and coreless plate Download PDFInfo
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- CN104066280A CN104066280A CN201410316957.7A CN201410316957A CN104066280A CN 104066280 A CN104066280 A CN 104066280A CN 201410316957 A CN201410316957 A CN 201410316957A CN 104066280 A CN104066280 A CN 104066280A
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Abstract
The invention discloses a method for manufacturing a coreless plate and the coreless plate. the method includes the steps that copper foil is laminated on the upper surface and the lower surface of a prepreg at a lower temperature, wherein the prepreg comprises resin and reinforcing materials steeped into the resin; dry film is laminated on the copper foil, and then photoetching is carried out to form mask graphs; the mask graphs are etched to expose parts of the copper foil, and the non-etched parts of the copper foils form copper circuits located on the two sides of the prepreg; the mask graphs on the copper circuits are stripped; the copper circuits are laminated to or laminated into the reinforcing materials at a high temperature to form a copper circuit structure; at least one hole is drilled in the copper circuit structure; the at least one hole is filled with conducting materials to form at least one metal protrusion; solder masks are printed in the areas where electronic elements are not required to be welded, and areas where the electronic elements are required to be welded are exposed out; surface coating is carried out in the exposed areas. The method is simple in manufacturing process, the thickness of the coreless plate can be effectively reduced, and the coreless plate can be prevented from warping.
Description
Technical field
The present invention relates to centreless plate technique field, be specifically related to a kind of without the manufacture method of central layer and without central layer.
Background technology
Along with the development of information technology, mobile phone and various electronic product are more and more to compact future development, integrated requirement to chip and device is also more and more higher, owing to can make package dimension thinner less without central layer, is therefore with a wide range of applications.
In prior art making during without central layer, generally to apply ephemeral key rubber alloy at upper surface and the lower surface of a loading plate, layer-by-layer preparation metallic circuit again, upper surface and lower surface at loading plate are made after multilayer line, two multilayered coreless plates need to be peeled from upper surface and the lower panel of loading plate, thereby obtain multilayered coreless plate, this manufacture method without central layer is the increasing layer processing of carrying out in the both sides of loading plate without central layer.
But adopt while making in this way even level without central layer, symmetrical for loading plate without central layer due to loading plate both sides, and the processing conditions difference of every one deck, even if adopt the same material and thickness when every one deck is made, the pyroprocess of its experience also makes a big difference, cause even level centreless intralamellar part stress distribution variant, and this internal stress is generally difficult to eliminate, therefore the even level that adopts the manufacture method without central layer of prior art to make can produce very large warpage without central layer, in addition, the thickness without central layer that adopts this manufacture method to make is thicker, can not adapt to the requirement of microelectric technique development.
Summary of the invention
In view of this, it is a kind of without the manufacture method of central layer and without central layer that the embodiment of the present invention provides, to solve centreless slab warping and the thicker problem of centreless plate thickness.
First aspect, the embodiment of the present invention provides a kind of manufacture method without central layer, and described method comprises:
S1, at the upper surface of prepreg and lower surface low temperature pressing the first Copper Foil and the second Copper Foil respectively, wherein, described prepreg comprises resin and impregnated in the reinforcing material in resin;
S2, carry out photoetching after pressing dry film respectively form the first mask pattern and the second mask pattern on described the first Copper Foil and the second Copper Foil, described the first mask pattern and the second mask pattern be exposed portions serve the first Copper Foil and the second Copper Foil respectively;
Part the first Copper Foil and the second Copper Foil that described in S3, etching, expose, not etched the first Copper Foil and the second Copper Foil form respectively the first copper wire and the second copper wire;
S4, divest and be positioned at the first mask pattern in the first copper wire and be positioned at the second mask pattern in the second copper wire;
S5, by described the first copper wire with the second copper wire at high temperature presses to or pressing enters described reinforcing material, form copper wire structure;
S6, to described copper wire structure hole form at least one hole;
S7, in described at least one hole, filled conductive material forms at least one metal coupling;
S8, do not needing the region solder-mask printing ink of soldering of electronic components, described anti-solder ink will need the region of soldering of electronic components out exposed;
S9, on the described exposed region that needs soldering of electronic components out, carry out surface-coated.
Further, described reinforcing material is glass-fiber-fabric.
Further, in step, described copper wire structure is holed after at least one hole of formation, before in step, in described at least one hole, filled conductive material forms at least one metal coupling, described method also comprises:
To described at least one hole de-smear.
Further, in described at least one hole, filled conductive material forms at least one metal coupling and comprises:
On the inwall of described at least one hole and the surface of prepreg, carry out electroless copper, form chemical plating copper layer;
On described chemical plating copper layer, after pressing dry film, carry out photoetching and form the 3rd masking film figure, described the 3rd masking film figure is by out exposed to part chemical plating copper layer and described at least one hole.
On the described part chemical plating copper layer exposing, electroplate electric conducting material, and described at least one hole is filled up with described electric conducting material, to form at least one metal coupling;
Divest described the 3rd masking film figure, expose beyond described at least one hole and the chemical plating copper layer not covered by described at least one metal coupling;
Dodge beyond the described at least one hole exposing described in losing, and the chemical plating copper layer not covered by described at least one metal coupling.
Further, the temperature range of described low temperature pressing is 90 DEG C-120 DEG C.
Further, the temperature range of described high-temperature laminating is 190 DEG C-220 DEG C.
Further, the roughness of described the first Copper Foil and described the second Copper Foil is all less than 3 μ m.
Further, make described the first copper wire and the insulation of the second copper wire by the resin flooding in described reinforcing material and reinforcing material.
Further, in step by described the first copper wire with the second copper wire at high temperature presses to or pressing enters described reinforcing material, after forming copper wire structure, in step, described copper wire structure is holed before at least one hole of formation, described method also comprises:
Step S6a, at the upper surface of described copper wire structure and lower surface low temperature pressing M prepreg and N Copper Foil respectively, described M is not less than 1 integer, described N is not less than 3 integer;
Step S6b, repeating step S2, to step S5, form multiple layer of copper line construction.
Second aspect, it is a kind of without central layer that the embodiment of the present invention provides, and describedly made by the manufacture method without central layer described in above-mentioned first aspect without central layer.
The embodiment of the present invention provide without the manufacture method of central layer with without central layer, after the upper surface at prepreg and lower surface low temperature pressing the first Copper Foil and the second Copper Foil, on the first Copper Foil and the second Copper Foil, carry out photoetching after pressing dry film respectively and form the first mask pattern and the second mask pattern, described the first mask pattern and the second mask pattern be exposed portions serve the first Copper Foil and the second Copper Foil respectively, after part the first Copper Foil exposing described in etching and the second Copper Foil, form the first copper wire and the second copper wire, divest after the first mask pattern and the second mask pattern, by the first copper wire and the second copper wire high-temperature laminating to or pressing enter in the reinforcing material in prepreg, form copper wire structure, after being holed, copper wire structure forms at least one hole that runs through prepreg, finally described at least one hole is filled and formed conductive through hole, this copper wire by prepreg both sides presses to the method in prepreg glass-fiber-fabric, manufacture craft is simple, can effectively reduce the thickness without central layer, and can avoid centreless slab warping.
Brief description of the drawings
To, by describe exemplary embodiment of the present invention in detail with reference to accompanying drawing, the person of ordinary skill in the art is more clear that above-mentioned and other feature and advantage of the present invention below, in accompanying drawing:
Fig. 1 is the flow chart of a kind of ultra-thin manufacture method without central layer that provides of the embodiment of the present invention;
Fig. 2 A-Fig. 2 I is the structural profile schematic diagram corresponding to each stage of a kind of ultra-thin manufacture method without central layer that provides of the embodiment of the present invention;
Fig. 2 Ga-Fig. 2 Ge is structural profile schematic diagram corresponding to step that filled conductive material at least one hole that the embodiment of the present invention provides forms at least one metal coupling;
Fig. 2 J-Fig. 2 R is the structural profile schematic diagram corresponding to each stage of the ultra-thin manufacture method without central layer of another kind that provides of the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, in accompanying drawing, only show part related to the present invention but not full content.
Fig. 1 is the flow chart of a kind of ultra-thin manufacture method without central layer that provides of the embodiment of the present invention, as shown in Figure 1, the method comprising the steps of S101 is to step S109, it should be noted that, it is for the each step of convenient differentiation that the present embodiment is named each step with step S101 to step S109, and be not the sequencing that limits each step, in different embodiments of the invention, each step can be adjusted sequencing according to the adjusting of technique.
Step S101, at the upper surface of prepreg and lower surface low temperature pressing the first Copper Foil and the second Copper Foil respectively, wherein, described prepreg comprises resin and impregnated in the reinforcing material in resin.
Described reinforcing material comprises the several types such as glass-fiber-fabric, paper substrate, composite material, in the present embodiment, described reinforcing material is preferably glass-fiber-fabric, by treated glass-fiber-fabric, resin adhesive liquid on dipping, make resin enter the B stage and the sheeting made is called prepreg through heat treatment (preliminary drying) again, described prepreg is one of main material during multi-layer sheet is produced.
In the present embodiment, referring to Fig. 2 A, the first Copper Foil 11 of low roughness and the second Copper Foil 12 are pressed on respectively at low temperatures to upper surface and the lower surface of described prepreg, wherein, described prepreg comprises resin 131 and impregnated in the middle glass-fiber-fabric 132 of resin, can be in resin 131 viscosity at the temperature when lower, and under certain pressure with the pressing of vacuum film pressing machine.
The scope of described low temperature pressing is preferably 90 DEG C-120 DEG C, in this temperature range, the viscosity of the resin 131 in prepreg is lower, make resin 131 and the first Copper Foil 11 and the second Copper Foil 12 reach best wettability, thereby the first Copper Foil 11 and the second Copper Foil 12 are pressed to respectively to upper surface and the lower surface of prepreg.
In the present embodiment, the first Copper Foil 11 of described low roughness and the roughness of the second Copper Foil 12 are preferably and are less than 3 μ m, the benefit of processing is like this, prevent at subsequent step the first copper wire and when the second copper wire presses to or pressing enters described glass-fiber-fabric 132, in order to avoid copper tooth is excessive, form short circuit through glass-fiber-fabric 132.
Step S102, carry out photoetching after pressing dry film respectively form the first mask pattern and the second mask pattern on described the first Copper Foil and the second Copper Foil, described the first mask pattern and the second mask pattern be exposed portions serve the first Copper Foil and the second Copper Foil respectively.
Referring to Fig. 2 B, can on the first Copper Foil and the second Copper Foil, distinguish pressing one deck dry film, form the first mask pattern 14 and the second mask pattern 15 by photoetching again, described first mask pattern 14 exposed portions serve the first Copper Foils 11, described second mask pattern 15 exposed portions serve the second Copper Foils 12.
Part the first Copper Foil and the second Copper Foil that described in step S103, etching, expose, not etched the first Copper Foil and the second Copper Foil form respectively the first copper wire and the second copper wire.
Referring to Fig. 2 C, part the first Copper Foil 11 and the second Copper Foil 12 that in etch figures(s) 2B, expose, not etched the first Copper Foil 11 that is positioned at the first mask pattern 14 belows forms the first copper wire 111, and not etched the second Copper Foil 12 that is positioned at the second mask pattern 15 belows forms the second copper wire 121.
Step S104, divest and be positioned at the first mask pattern in the first copper wire and be positioned at the second mask pattern in the second copper wire.
Referring to Fig. 2 D, with stripper solution, the first mask pattern 14 that is positioned at the first copper wire 111 tops in Fig. 2 C is got rid of with the second mask pattern that is positioned at the second copper wire 121 tops, expose the first copper wire 111 and the second copper wire 121.
Step S105, by described the first copper wire with the second copper wire at high temperature presses to or pressing enters described reinforcing material, form copper wire structure.
Referring to Fig. 2 E, in high temperature press by the first copper wire 111 with the second copper wire 121 presses to or pressing enters in described glass-fiber-fabric 132, the temperature range of described high-temperature laminating is preferably 190 DEG C-220 DEG C, along with the rising of temperature, the starting of resin 131 in prepreg solidified, the viscosity rise of resin 131, finally becomes solid-state.
In the present embodiment, due to the first copper wire 111 with the second copper wire 121 presses to or pressing enters in the glass-fiber-fabric 132 of prepreg, reduce the thickness without central layer, the described thickness without central layer is controlled by the thickness of the glass-fiber-fabric 132 in prepreg, and described the first copper wire 111 and the second copper wire 121 realize insulation by the resin comprising in the glass-fiber-fabric 132 in prepreg 13 and glass-fiber-fabric 132.The roughness of described the first Copper Foil 11 and the second Copper Foil 12 is preferably and is all less than 3 μ m, in order to avoid copper tooth is excessive, forms short circuit through glass-fiber-fabric 132.
Step S106, to described copper wire structure hole form at least one hole.
Referring to Fig. 2 F, described copper wire structure is holed, form at least one hole 16 that runs through prepreg upper surface and lower surface, described boring can comprise machine drilling and laser drill.
Step S107, in described at least one hole, filled conductive material forms at least one metal coupling.
Particularly, described in described at least one hole filled conductive material form at least one metal coupling and preferably can realize by following step:
Step S1071, on the inwall of described at least one hole and the surface of prepreg, carry out electroless copper, form chemical plating copper layer.
Referring to Fig. 2 Ga, on the inwall of described at least one hole 16 and the surface of prepreg, carry out electroless copper, form chemical plating copper layer 171, the thickness of chemical plating copper layer 171 generally only has 1 μ m left and right, be used as the Seed Layer of filled conductive material in subsequent step, form a conductive plane.
Step S1072, on described chemical plating copper layer, after pressing dry film, carry out photoetching form the 3rd masking film figure, described the 3rd masking film figure is by out exposed to part chemical plating copper layer and described at least one hole.
Referring to Fig. 2 Gb, carry out again exposure imaging after can pressing dry film on chemical plating copper layer 171, form the 3rd masking film figure 172, described the 3rd masking film figure 172 is by out exposed to part chemical plating copper layer and described at least one hole 16.
Step S1073, at the described part chemical plating copper layer plated conductive material exposing, and described at least one hole is filled up with described electric conducting material, to form at least one metal coupling.
Referring to Fig. 2 Gc, substrate is put into electroplating bath, by the part chemical plating copper layer plated conductive material exposing, this electric conducting material is preferably copper, can certainly be other electric conducting materials, at least one hole 16, fill up electric conducting material, form at least one metal coupling 17 simultaneously.
Step S1074, divest described the 3rd masking film figure, expose beyond described at least one hole and the chemical plating copper layer not covered by described at least one metal coupling.
Referring to Fig. 2 Gd, the 3rd masking film figure 172 in Fig. 2 Gc is removed with stripper solution, expose beyond at least one hole 16 and the chemical plating copper layer not covered by least one metal coupling 17.
Beyond the described at least one hole exposing described in step S1075, sudden strain of a muscle erosion and by the chemical plating copper layer of described at least one metal coupling covering.
Referring to Fig. 2 Ge, by fast speed flash erosion method, by beyond at least one hole 16 exposing and the chemical plating copper layer not covered by least one metal coupling 17.In this process, described at least one metal coupling also can by partially-etched fall, because at least one metal coupling 17 is finer and close than the structure of chemical plating copper layer, crystal grain is thicker, and the thickness of at least one metal coupling 17 is much larger than the thickness of chemical plating copper layer, therefore, beyond the described at least one hole 16 exposing and the chemical plating copper layer not covered by described at least one metal coupling 17 etched complete after, 17 etched little parts of at least one metal coupling.
Described at least one metal coupling 17 gets up the upper surface of prepreg and lower-surface interconnection by the electric conducting material at least one hole 16.
Step S108, do not needing the region solder-mask printing ink of soldering of electronic components, described anti-solder ink will need the region of soldering of electronic components out exposed.
Referring to Fig. 2 H; described anti-solder ink 18 is again green oil; line construction on can permanent protection printed substrate; to prevent copper wire structure oxidation and to cause the problems such as open circuit or short circuit because wiping because of carelessness flower; do not needing the region solder-mask printing ink 18 of soldering of electronic components; by needing, the region of soldering of electronic components is out exposed, can adopt the method for silk screen process while making anti-solder ink 18, does not repeat them here.
Step S109, on the described exposed region that needs soldering of electronic components out, carry out surface-coated.
Referring to Fig. 2 I; on the exposed region that needs soldering of electronic components out, carry out surface-coated 19; because copper wire structure is easy to oxidation in general environment; soldering of electronic components is obstructed; therefore need the region of soldering of electronic components to protect, the mode of protection has spray tin (HASL), changes gold (ENIG), changes silver (Immersion Silver), changes the methods such as tin (Immersion Tin) and organic solderability preservative (OSP).
The ultra-thin manufacture method without central layer that the embodiment of the present invention provides, by double-side copper circuit being arranged on to the both sides of glass-fiber-fabric in prepreg, can effectively reduce the thickness without central layer, in addition, processing conditions when double-side copper circuit is made is identical, therefore, there will not be the phenomenon of centreless slab warping.
In a preferred embodiment of the present embodiment, described prepreg is holed form run through described prepreg at least one hole (step S106) afterwards, in described at least one hole, filled conductive material forms at least one metal coupling (step S107) before, and described method also comprises: to described at least one hole de-smear.
After prepreg is holed, more residual gum residues of meeting at least one hole 16, method by de-smear is removed residual gum residue at least one hole 16, and the benefit of processing is like this to improve in subsequent step S107 the adhesion of at least one hole 16 and electric conducting material.The method of described de-smear includes, but are not limited to: chemical method for etching and plasma cleaning method.
The preferred embodiment of the present embodiment, by least one hole after boring is carried out to de-smear processing, makes at least one hole and electric conducting material have better adhesion, has improved the performance without central layer.
In another preferred embodiment of the present embodiment, in step by described the first copper wire with the second copper wire at high temperature presses to or pressing enters described reinforcing material, form copper wire structure (step S105) afterwards, step to described copper wire structure hole form run through described prepreg at least one hole (step S106) before, described method also comprises:
Step S106a, at the upper surface of described copper wire structure and lower surface low temperature pressing M prepreg and N Copper Foil respectively, described M is not less than 1 integer, described N is not less than 3 integer.
For example: when making 4 layers during without central layer, referring to Fig. 2 J, at step S105 (referring to Fig. 2 E) afterwards, at step S106 (referring to Fig. 2 F) before, at upper surface low temperature pressing the second prepreg 20 and the 3rd Copper Foil 21 of described copper wire structure, at lower surface low temperature pressing the 3rd prepreg 22 and the 4th Copper Foil 23 of described copper wire structure, the roughness of described the 3rd Copper Foil 21 and the 4th Copper Foil 23 is less than 3 μ m, in order to avoid the excessive reinforcing material through prepreg of copper tooth forms short circuit.Described M and N only represent up-to-date prepreg and the Copper Foil being pressed together in copper wire structure, and in subsequent step, prepreg used and Copper Foil are all at the prepreg of up-to-date pressing and the enterprising line operate of Copper Foil.
Step S106b, repeating step S102, to step S105, forms multiple layer of copper line construction.
Referring to Fig. 2 K, on the 3rd Copper Foil 21 and the 4th Copper Foil 23, carry out respectively photoetching and form the 3rd masking film figure 24 and the 4th masking film figure 25, described the 3rd masking film figure 24 and the 4th masking film figure 25 exposed portions serve the 3rd Copper Foil and part the 4th Copper Foil respectively.
Referring to Fig. 2 L, the part that etching is exposed the 3rd Copper Foil and part the 4th Copper Foil, not etched the 3rd Copper Foil and the 4th Copper Foil form respectively the 3rd copper wire 211 and the 4th copper wire 231.
Referring to Fig. 2 M, divest and be positioned at the 3rd mask pattern 24 in the 3rd copper wire 211 and be positioned at the 4th mask pattern 25 in the 4th copper wire 231, expose the 3rd copper wire 211 and the 4th copper wire 231.
Referring to Fig. 2 N, by described the 3rd copper wire 211 with the 4th copper wire 231 at high temperature presses to respectively or pressing enters in the reinforcing material of the second prepreg 20 and the 3rd prepreg 22, form copper wire structure.Described reinforcing material is preferably glass-fiber-fabric.The resin flooding in the glass-fiber-fabric of copper wire structure by each prepreg and glass-fiber-fabric makes to insulate between the first copper wire, the second copper wire, the 3rd copper wire and the 4th copper wire.
Repeating step S102 is to step S105 again, execution step S106, holes and forms at least one hole 16 described copper wire structure, referring to Fig. 2 O, preferably, described at least one hole 16 can run through prepreg, the first prepreg 20 and the second prepreg 22.Certainly, described at least one hole 16 can be also blind hole or buried via hole.
After execution of step S106, execution step S107, in described at least one hole, filled conductive material forms at least one metal coupling.Referring to Fig. 2 P, the step that filled conductive material forms at least one metal coupling at least one hole, with to form the two-layer method that forms at least one metal coupling during without central layer identical, does not repeat them here.
Finally perform step S108 (referring to Fig. 2 Q) and step S109 (referring to Fig. 2 R), do not needing the region solder-mask printing ink of soldering of electronic components, described anti-solder ink will need the region of soldering of electronic components out exposed, on the described exposed region that needs soldering of electronic components out, carry out surface-coated, the two-layer method during without central layer of the method for execution step S108 during with step S109 and making is identical, is not described in detail at this.
It should be noted that, the present embodiment four layers of manufacture method without central layer that have been exemplary explanation, the method that adopts the embodiment of the present invention to provide, can also manufacture more multi-layered without central layer.
The centreless board manufacturing method that the another kind of preferred embodiment of the embodiment of the present invention provides, can produce multilayered coreless plate, by multiple layer of copper circuit being arranged on to the both sides of glass-fiber-fabric in prepreg, can effectively reduce the thickness of multilayered coreless plate, in addition, processing conditions when multiple layer of copper circuit is made is identical, therefore, there will not be the phenomenon of centreless slab warping, because glass thickness in prepreg is no more than 20um conventionally, copper thickness is generally 9um, the 8 laminate thickness that the centreless board manufacturing method that the employing embodiment of the present invention provides is made, after adding anti-solder ink, these 8 layers of thickness without central layer can not exceed 300um, therefore, the manufacture method without central layer that the embodiment of the present invention provides can reduce the thickness without central layer greatly.
It is a kind of without central layer that the embodiment of the present invention also provides, describedly can make by the manufacture method without central layer providing described in above-mentioned any one embodiment without central layer, this can be printed circuit board (PCB) without central layer, also can be other coreless substrates, described printed circuit board (PCB) can be printed circuit board (Printed Circuit Board, be called for short PCB) can be also flexible PCB (Flexible Printed Circuit is called for short FPC).
The embodiment of the present invention provide without the manufacture method of central layer with without central layer, Copper Foil is processed to form copper wire on the surface of prepreg, afterwards by copper wire high-temperature laminating to or pressing enter the reinforcing material in prepreg, therefore there is high adhesion, and can effectively reduce substrate thickness, in addition, the pressing term harmonization of interlayer prepreg in multilayered coreless plate, can effectively avoid the inconsistent gravitation causing of pressing condition of interlayer prepreg and substrate warp phenomenon therefore.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, to those skilled in the art, the present invention can have various changes and variation.All any amendments of doing, be equal to replacement, improvement etc., within protection scope of the present invention all should be included within spirit of the present invention and principle.
Claims (10)
1. without a manufacture method for central layer, it is characterized in that, described method comprises:
S1, at the upper surface of prepreg and lower surface low temperature pressing the first Copper Foil and the second Copper Foil respectively, wherein, described prepreg comprises resin and impregnated in the reinforcing material in resin;
S2, carry out photoetching after pressing dry film respectively form the first mask pattern and the second mask pattern on described the first Copper Foil and the second Copper Foil, described the first mask pattern and the second mask pattern be exposed portions serve the first Copper Foil and the second Copper Foil respectively;
Part the first Copper Foil and the second Copper Foil that described in S3, etching, expose, not etched the first Copper Foil and the second Copper Foil form respectively the first copper wire and the second copper wire;
S4, divest and be positioned at the first mask pattern in the first copper wire and be positioned at the second mask pattern in the second copper wire;
S5, by described the first copper wire with the second copper wire at high temperature presses to or pressing enters described reinforcing material, form copper wire structure;
S6, to described copper wire structure hole form at least one hole;
S7, in described at least one hole, filled conductive material forms at least one metal coupling;
S8, do not needing the region solder-mask printing ink of soldering of electronic components, described anti-solder ink will need the region of soldering of electronic components out exposed;
S9, on the described exposed region that needs soldering of electronic components out, carry out surface-coated.
2. the manufacture method without central layer according to claim 1, is characterized in that, described reinforcing material is glass-fiber-fabric.
3. the manufacture method without central layer according to claim 1, is characterized in that, after step S6, before step S7, described method also comprises:
To described at least one hole de-smear.
4. the manufacture method without central layer according to claim 1, is characterized in that, in described at least one hole, filled conductive material forms at least one metal coupling and comprises:
On the inwall of described at least one hole and the surface of prepreg, carry out electroless copper, form chemical plating copper layer;
On described chemical plating copper layer, after pressing dry film, carry out photoetching and form the 3rd masking film figure, described the 3rd masking film figure is by out exposed to part chemical plating copper layer and described at least one hole.
On the described part chemical plating copper layer exposing, electroplate electric conducting material, and described at least one hole is filled up with described electric conducting material, to form at least one metal coupling;
Divest described the 3rd masking film figure, expose beyond described at least one hole and the chemical plating copper layer not covered by described at least one metal coupling;
Dodge beyond the described at least one hole exposing described in losing, and the chemical plating copper layer not covered by described at least one metal coupling.
5. the manufacture method without central layer according to claim 1, is characterized in that, the temperature range of described low temperature pressing is 90 DEG C-120 DEG C.
6. the manufacture method without central layer according to claim 1, is characterized in that, the temperature range of described high-temperature laminating is 190 DEG C-220 DEG C.
7. the manufacture method without central layer according to claim 1, is characterized in that, the roughness of described the first Copper Foil and described the second Copper Foil is all less than 3 μ m.
8. the manufacture method without central layer according to claim 1, is characterized in that, makes described the first copper wire and the insulation of the second copper wire by the resin flooding in described reinforcing material and reinforcing material.
9. the manufacture method without central layer according to claim 1, is characterized in that, after step S5, before step S6, described method also comprises:
Step S6a, at the upper surface of described copper wire structure and lower surface low temperature pressing M prepreg and N Copper Foil respectively, described M is not less than 1 integer, described N is not less than 3 integer;
Step S6b, repeating step S2, to step S5, form multiple layer of copper line construction.
10. without a central layer, it is characterized in that, describedly made by the manufacture method without central layer described in any one in the claims 1-9 without central layer.
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| CN201410316957.7A CN104066280B (en) | 2014-07-04 | 2014-07-04 | Preparation method without core plate and without core plate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538320A (en) * | 2014-12-31 | 2015-04-22 | 广州兴森快捷电路科技有限公司 | Core-less board manufacturing method |
| WO2016107061A1 (en) * | 2014-12-31 | 2016-07-07 | 广州兴森快捷电路科技有限公司 | Coreless board fabrication component and coreless board production method |
| CN108172542A (en) * | 2017-12-28 | 2018-06-15 | 广州兴森快捷电路科技有限公司 | Centreless board manufacturing method and its manufacture component, support carrier and preparation method thereof |
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| WO2016107061A1 (en) * | 2014-12-31 | 2016-07-07 | 广州兴森快捷电路科技有限公司 | Coreless board fabrication component and coreless board production method |
| CN104538320B (en) * | 2014-12-31 | 2018-07-20 | 广州兴森快捷电路科技有限公司 | Centreless board fabrication method |
| CN108172542A (en) * | 2017-12-28 | 2018-06-15 | 广州兴森快捷电路科技有限公司 | Centreless board manufacturing method and its manufacture component, support carrier and preparation method thereof |
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| CN108172542B (en) * | 2017-12-28 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | Centreless board manufacturing method and its manufacture component, support carrier and preparation method thereof |
| CN110769665A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769665B (en) * | 2018-07-27 | 2023-12-05 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
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