CN204681665U - A kind of throttle circuit plate - Google Patents
A kind of throttle circuit plate Download PDFInfo
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- CN204681665U CN204681665U CN201520384090.9U CN201520384090U CN204681665U CN 204681665 U CN204681665 U CN 204681665U CN 201520384090 U CN201520384090 U CN 201520384090U CN 204681665 U CN204681665 U CN 204681665U
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Abstract
The utility model discloses a kind of throttle circuit plate, comprise substrate, the upper surface of described substrate offers the groove according to circuit layout distribution, and described groove has coarse bottom, in described groove, be filled with copper powder layer, be coated with thermosetting glue-line in the upper end of described substrate.The utility model does not adopt etch process, therefore comparatively saves copper raw material, and also without the need to using etching solution, therefore comparatively environmental protection, meanwhile, throttle circuit plate of the present utility model, technique is simple, and Stability Analysis of Structures, cost is low.
Description
Technical field
The utility model relates to a kind of throttle circuit plate, belongs to board production manufacturing technology field.
Background technology
The title of circuit board has: wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc.Circuit board makes circuit miniaturization, visualize, for permanent circuit batch production and optimize electrical appliance layout and play an important role.Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is (Printed Circuit Board) PCB.The printed circuit board (PCB) the most often used, needs etch process step in its production process, not only waste copper resource, and etching solution can produce environmental pollution.
Utility model content
Therefore, the technical problems to be solved in the utility model is to overcome defect of the prior art, thus provides a kind of without the need to etching, thus can not waste copper resource and eco-friendly throttle circuit plate.
To achieve these goals, a kind of throttle circuit plate of the present utility model, comprises substrate, the upper surface of described substrate offers the groove according to circuit layout distribution, described groove has coarse bottom, is filled with copper powder layer in described groove, is coated with thermosetting glue-line in the upper end of described substrate.
Described thermosetting glue-line upper end is coated with reinforcement resin plate.
The thickness of described copper powder layer is less than described depth of groove.
Adopt technique scheme, throttle circuit plate of the present utility model, in manufacturing process, first the layout path according to circuit on the substrate of circuit board offers groove, and the bottom of groove is polished into rough surface, fills copper powder in a groove, then hot-setting adhesive is filled with in substrate upper surface, pass downwardly through from top and strengthen resin plate extruding, treat that hot-setting adhesive is strengthened resin plate and hot-setting adhesive and substrate and formed integrally after solidifying, can processing step be completed.The utility model does not adopt etch process, therefore comparatively saves copper raw material, and also without the need to using etching solution, therefore comparatively environmental protection, meanwhile, throttle circuit plate of the present utility model, technique is simple, and Stability Analysis of Structures, cost is low.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Embodiment
Below by way of the drawings and specific embodiments, the utility model is described in further detail.
The present embodiment provides a kind of throttle circuit plate, comprise substrate 1, the upper surface of described substrate 1 offers the groove 101 according to circuit layout distribution, and described groove 101 has coarse bottom 101a, in described groove 101, be filled with copper powder layer 2, be coated with thermosetting glue-line 3 in the upper end of described substrate 1.
Described thermosetting glue-line 3 upper end is coated with strengthens resin plate 4.
The thickness of described copper powder layer 2 is less than described groove 101 degree of depth.
Adopt technique scheme, throttle circuit plate of the present utility model, in manufacturing process, first the layout path according to circuit on the substrate of circuit board offers groove, and the bottom of groove is polished into rough surface, fill copper powder in a groove, be then filled with hot-setting adhesive in substrate upper surface, pass downwardly through from top and strengthen resin plate extruding, treat that hot-setting adhesive can complete processing step after solidifying.The utility model does not adopt etch process, therefore comparatively saves copper raw material, and also without the need to using etching solution, therefore comparatively environmental protection, meanwhile, throttle circuit plate of the present utility model, technique is simple, and Stability Analysis of Structures, cost is low.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range that the utility model creates.
Claims (3)
1. a throttle circuit plate, it is characterized in that: comprise substrate, the upper surface of described substrate offers the groove according to circuit layout distribution, and described groove has coarse bottom, in described groove, be filled with copper powder layer, be coated with thermosetting glue-line in the upper end of described substrate.
2. throttle circuit plate according to claim 1, is characterized in that: described thermosetting glue-line upper end is coated with reinforcement resin plate.
3. throttle circuit plate according to claim 2, is characterized in that: the thickness of described copper powder layer is less than described depth of groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520384090.9U CN204681665U (en) | 2015-06-06 | 2015-06-06 | A kind of throttle circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520384090.9U CN204681665U (en) | 2015-06-06 | 2015-06-06 | A kind of throttle circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204681665U true CN204681665U (en) | 2015-09-30 |
Family
ID=54181329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520384090.9U Active CN204681665U (en) | 2015-06-06 | 2015-06-06 | A kind of throttle circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204681665U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107404802A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board, the preparation method of printed circuit board and electronic equipment |
-
2015
- 2015-06-06 CN CN201520384090.9U patent/CN204681665U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107404802A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board, the preparation method of printed circuit board and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |