CN206350242U - Circuit board resin consent structure - Google Patents
Circuit board resin consent structure Download PDFInfo
- Publication number
- CN206350242U CN206350242U CN201621354909.8U CN201621354909U CN206350242U CN 206350242 U CN206350242 U CN 206350242U CN 201621354909 U CN201621354909 U CN 201621354909U CN 206350242 U CN206350242 U CN 206350242U
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- CN
- China
- Prior art keywords
- aluminium flake
- consent
- hole
- circuit board
- resin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of circuit board resin consent structure, including the upper strata aluminium flake being cascading, circuit board and lower floor's aluminium flake, wherein, aluminium flake consent and upper aluminium flake fixing hole are formed with the aluminium flake of upper strata, lower aluminium flake consent and lower aluminium flake fixing hole are formed with lower floor's aluminium flake, circuit board fixing hole is formed with circuit board, need to clog the first through hole of resin and the second through hole of resin need not be clogged, upper aluminium flake consent, first through hole and lower aluminium flake consent are coaxially disposed, and the radius of first through hole is less than the radius of upper aluminium flake consent and lower aluminium flake consent, closed by upper strata aluminium flake the upper end of second through hole, closed by lower floor's aluminium flake the lower end of second through hole.Pass through the technical scheme in the utility model so that consent operation only can be carried out to the position for needing filling holes with resin using filling holes with resin machine, so as to improve consent efficiency.
Description
Technical field
The utility model is related to circuit board manufacture field, more particularly to a kind of circuit board resin consent structure.
Background technology
In assist side production process, increasing client selects using filling holes with resin to adapt to when manufacturing HDI plates
The development trend of dense wire.General filling holes with resin method has in the industry at present：Aluminium flake consent, silk-screen consent and filling holes with resin machine
Consent.Wherein aluminium flake consent and silk-screen consent be less efficient lower but the property of can be chosen consent, filling holes with resin engine efficiency it is higher but
Selective consent can not be carried out.Therefore, a kind of consent structure of efficiency high is badly in need of in this area.
Utility model content
The utility model provide a kind of circuit board resin consent structure, with solve prior art filling holes with resin engine efficiency compared with
It is high but selective consent can not be carried out, the problem of consent efficiency is low.
To solve the above problems, as one side of the present utility model there is provided a kind of circuit board resin consent structure,
Including the upper strata aluminium flake, circuit board and lower floor's aluminium flake being cascading, wherein, be formed with the aluminium flake of upper strata aluminium flake consent and
Be formed with upper aluminium flake fixing hole, lower floor's aluminium flake on lower aluminium flake consent and lower aluminium flake fixing hole, circuit board be formed with circuit board consolidate
Determine hole, need clog resin first through hole and the second through hole of resin need not be clogged, upper aluminium flake consent, first through hole and under
Aluminium flake consent is coaxially disposed, and the radius of first through hole is less than the radius of upper aluminium flake consent and lower aluminium flake consent, the second through hole
Upper end closed by upper strata aluminium flake, the lower end of the second through hole is closed by lower floor's aluminium flake.
Preferably, the thickness of upper strata aluminium flake and lower floor's aluminium flake is 0.1 millimeter.
Preferably, the difference of the radius of first through hole and upper aluminium flake consent or the radius of lower aluminium flake consent is 2mil.
Pass through the technical scheme in the utility model so that can be using filling holes with resin machine only to needing the position of filling holes with resin
Progress consent operation is put, so as to improve consent efficiency.
Brief description of the drawings
Fig. 1 schematically shows layer structure schematic diagram of the present utility model；
Fig. 2 schematically shows the structural representation of upper strata aluminium flake.
Reference in figure：1st, upper strata aluminium flake；2nd, circuit board；3rd, lower floor's aluminium flake；4th, upper aluminium flake consent；5th, upper aluminium flake is fixed
Hole；6th, lower aluminium flake consent；7th, the second through hole；8th, first through hole；9th, substrate；10th, layers of copper.
Embodiment
Embodiment of the present utility model is described in detail below in conjunction with accompanying drawing, but the utility model can be by right
It is required that the multitude of different ways for limiting and covering is implemented.
It refer to Fig. 1 and Fig. 2, the utility model provides a kind of circuit board resin consent structure, including stack gradually and set
Upper strata aluminium flake 1, circuit board 2 and the lower floor's aluminium flake 3 put, wherein, aluminium flake consent 4 is formed with upper strata aluminium flake 1 and upper aluminium flake is solid
Determine to be formed with hole 5, lower floor's aluminium flake 3 be formed with lower aluminium flake consent 6 and lower aluminium flake fixing hole, circuit board 2 circuit board fixing hole,
Need to clog the first through hole 8 of resin and need not clog the second through hole 7 of resin, upper aluminium flake consent 4, first through hole 8 and under
Aluminium flake consent 6 is coaxially disposed, and the radius of first through hole 8 is less than the radius of upper aluminium flake consent 4 and lower aluminium flake consent 6, second
The upper end of through hole 7 is closed by upper strata aluminium flake 1, and the lower end of the second through hole 7 is closed by lower floor's aluminium flake 3.Preferably, circuit board 2 includes
Substrate 9 and the layers of copper 10 being connected with substrate 9.
The utility model opens up the first through hole phase of a set of resin to be stuffed with circuit board on upper and lower layer aluminium flake
The upper and lower aluminium flake consent matched somebody with somebody, so, when carrying out filling holes with resin machine consent, can be respectively placed in circuit board by upper and lower layer aluminium flake
In upper and lower surface, thus only at full speed I need to fill in resin first through hole exposure outside, so as to be carried out using filling holes with resin machine
Consent operation, is not required to fill in the second through hole of resin because levels aluminium flake does not drill in corresponding position, therefore resin cannot be introduced into
Wherein.
It can be seen that, pass through the technical scheme in the utility model so that can be using filling holes with resin machine only to needing resin plug
The position in hole carries out consent operation, so as to improve consent efficiency.
Preferably, the thickness of upper strata aluminium flake 1 and lower floor's aluminium flake 3 is 0.1 millimeter.
Preferably, the difference of the radius of first through hole 8 and upper aluminium flake consent 4 or the radius of lower aluminium flake consent 6 is 2mil.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements made etc. should be included within protection domain of the present utility model.
Claims (3)
1. a kind of circuit board resin consent structure, it is characterised in that including upper strata aluminium flake (1), the circuit board being cascading
(2) and lower floor's aluminium flake (3), wherein, be formed with aluminium flake consent (4) and upper aluminium flake fixing hole (5) on the upper strata aluminium flake (1),
It is formed with lower floor's aluminium flake (3) on lower aluminium flake consent (6) and lower aluminium flake fixing hole, the circuit board (2) and is formed with circuit
Plate fixing hole, need clog resin first through hole (8) and the second through hole (7) of resin need not be clogged, the upper aluminium flake plug
Hole (4), the first through hole (8) and the lower aluminium flake consent (6) are coaxially disposed, and the radius of the first through hole (8) is small
In the radius of the upper aluminium flake consent (4) and the lower aluminium flake consent (6), the upper end of second through hole (7) is by the upper strata
Aluminium flake (1) is closed, and the lower end of second through hole (7) is closed by lower floor's aluminium flake (3).
2. circuit board resin consent structure according to claim 1, it is characterised in that the upper strata aluminium flake (1) and described
The thickness of lower floor's aluminium flake (3) is 0.1 millimeter.
3. circuit board resin consent structure according to claim 1, it is characterised in that the radius of the first through hole (8)
Difference with the upper aluminium flake consent (4) or the radius of the lower aluminium flake consent (6) is 2mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621354909.8U CN206350242U (en) | 2016-12-12 | 2016-12-12 | Circuit board resin consent structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621354909.8U CN206350242U (en) | 2016-12-12 | 2016-12-12 | Circuit board resin consent structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206350242U true CN206350242U (en) | 2017-07-21 |
Family
ID=59322670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621354909.8U Active CN206350242U (en) | 2016-12-12 | 2016-12-12 | Circuit board resin consent structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206350242U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
-
2016
- 2016-12-12 CN CN201621354909.8U patent/CN206350242U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
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|---|---|---|---|
| GR01 | Patent grant |