CN204681664U - A kind of printed circuit board (PCB) - Google Patents
A kind of printed circuit board (PCB) Download PDFInfo
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- CN204681664U CN204681664U CN201520384082.4U CN201520384082U CN204681664U CN 204681664 U CN204681664 U CN 204681664U CN 201520384082 U CN201520384082 U CN 201520384082U CN 204681664 U CN204681664 U CN 204681664U
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- circuit board
- pcb
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The utility model discloses a kind of printed circuit board (PCB), comprise substrate, the upper surface of described substrate offers the groove according to circuit layout distribution, described groove has coarse bottom, nano-silver layer is provided with in described groove, above described nano-silver layer, be provided with metallic circuit layer, be coated with thermosetting glue-line in the upper end of described substrate.The utility model does not adopt etch process, therefore comparatively saves copper raw material, and also without the need to using etching solution, therefore comparatively environmental protection, meanwhile, throttle circuit plate of the present utility model, technique is simple, and Stability Analysis of Structures, cost is low.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB), belongs to board production manufacturing technology field.
Background technology
The title of circuit board has: wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc.Circuit board makes circuit miniaturization, visualize, for permanent circuit batch production and optimize electrical appliance layout and play an important role.Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is (Printed Circuit Board) PCB.The printed circuit board (PCB) the most often used, needs etch process step in its production process, not only waste copper resource, and etching solution can produce environmental pollution.Given this, Chinese patent literature CN204291617U discloses a kind of printed circuit board (PCB), comprises a substrate, a line map pattern layer, and a metallic circuit layer.Line map pattern layer is with a silver ink after drying, forms line map pattern layer on substrate, then is covered in line map pattern layer by chemical plating formation metallic circuit layer.But, the circuit board of this structure is sprayed on upper surface of base plate owing to adopting the form of ink-jet, and bond strength between the line map pattern layer of ink-jet and substrate is lower, after add the height giving metallic circuit layer in circuit patterned layer, whole pattern part protrudes from substrate, therefore be easy to be subject to extension rub, thus metallic circuit pull-up is fallen, circuit board is scrapped.
Utility model content
Therefore, the technical problems to be solved in the utility model is to overcome defect of the prior art, thus provides a kind of constitutionally stable printed circuit board (PCB).
To achieve these goals, a kind of printed circuit board (PCB) of the present utility model, comprise substrate, the upper surface of described substrate offers the groove according to circuit layout distribution, described groove has coarse bottom, in described groove, be provided with nano-silver layer, above described nano-silver layer, be provided with metallic circuit layer, be coated with thermosetting glue-line in the upper end of described substrate.
Described thermosetting glue-line upper end is coated with reinforcement resin plate.
The upper surface of described metallic circuit layer is lower than the upper surface of described substrate.
Adopt technique scheme, printed circuit board (PCB) of the present utility model, in manufacturing process, first the layout path according to circuit on the substrate of circuit board offers groove, and the bottom of groove is polished into rough surface, by the mode of ink-jet, silver ink is sprayed on bottom portion of groove in a groove, treats that silver ink forms nano-silver layer after drying, then be covered in nano-silver layer by chemical plating formation metallic circuit layer.Then be filled with hot-setting adhesive in substrate upper surface, pass downwardly through from top and strengthen resin plate extruding, treat that hot-setting adhesive is strengthened resin plate and hot-setting adhesive and substrate and formed integrally after solidifying, can processing step be completed.The utility model does not adopt etch process, therefore comparatively saves copper raw material, and also without the need to using etching solution, therefore comparatively environmental protection, meanwhile, throttle circuit plate of the present utility model, technique is simple, and Stability Analysis of Structures, cost is low.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model.
Fig. 2 is stereogram of the present utility model.
Fig. 3 is decomposing schematic representation of the present utility model
Embodiment
Below by way of the drawings and specific embodiments, the utility model is described in further detail.
The present embodiment provides a kind of printed circuit board (PCB), as shown in Figure 1, 2, 3, comprises substrate 1, and the upper surface of described substrate 1 offers the groove 101 according to circuit layout distribution.Owing to being schematic diagram, a part for the only indication circuit topological shape of the groove 101 in figure.
Described groove 101 has coarse bottom, in described groove 101, be provided with nano-silver layer 2, above described nano-silver layer 2, be provided with metallic circuit layer 3, is coated with thermosetting glue-line 4 in the upper end of described substrate 1.
Described thermosetting glue-line 4 upper end is coated with strengthens resin plate 5.
The upper surface of described metallic circuit layer 3 is lower than the upper surface of described substrate 1.
Adopt technique scheme, printed circuit board (PCB) of the present utility model, in manufacturing process, first the layout path according to circuit on the substrate of circuit board offers groove, and the bottom of groove is polished into rough surface, by the mode of ink-jet, silver ink is sprayed on bottom portion of groove in a groove, treats that silver ink forms nano-silver layer after drying, then be covered in nano-silver layer by chemical plating formation metallic circuit layer.Then be filled with hot-setting adhesive in substrate upper surface, pass downwardly through from top and strengthen resin plate extruding, treat that hot-setting adhesive is strengthened resin plate and hot-setting adhesive and substrate and formed integrally after solidifying, can processing step be completed.The utility model does not adopt etch process, therefore comparatively saves copper raw material, and also without the need to using etching solution, therefore comparatively environmental protection, meanwhile, throttle circuit plate of the present utility model, technique is simple, and Stability Analysis of Structures, cost is low.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range that the utility model creates.
Claims (3)
1. a printed circuit board (PCB), it is characterized in that: comprise substrate, the upper surface of described substrate offers the groove according to circuit layout distribution, described groove has coarse bottom, nano-silver layer is provided with in described groove, above described nano-silver layer, be provided with metallic circuit layer, be coated with thermosetting glue-line in the upper end of described substrate.
2. printed circuit board (PCB) according to claim 1, is characterized in that: described thermosetting glue-line upper end is coated with reinforcement resin plate.
3. printed circuit board (PCB) according to claim 2, is characterized in that: the upper surface of described metallic circuit layer is lower than the upper surface of described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520384082.4U CN204681664U (en) | 2015-06-06 | 2015-06-06 | A kind of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520384082.4U CN204681664U (en) | 2015-06-06 | 2015-06-06 | A kind of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204681664U true CN204681664U (en) | 2015-09-30 |
Family
ID=54181328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520384082.4U Active CN204681664U (en) | 2015-06-06 | 2015-06-06 | A kind of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204681664U (en) |
-
2015
- 2015-06-06 CN CN201520384082.4U patent/CN204681664U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |