CN209676617U

CN209676617U - A kind of microcellular structure of PCB substrate

Info

Publication number: CN209676617U
Application number: CN201821892386.1U
Authority: CN
Inventors: 戴振军
Original assignee: SHENZHEN HEMEIJINGYI TECHNOLOGY Co Ltd
Current assignee: Shenzhen Hemei Jingyi Semiconductor Technology Co.,Ltd.
Priority date: 2018-11-16
Filing date: 2018-11-16
Publication date: 2019-11-22
Anticipated expiration: 2028-11-16

Abstract

The utility model relates to a kind of microcellular structures of PCB substrate, it includes wiring board, dielectric layer and dielectric material block, wherein, the wiring board includes substrate layer and covers copper wire layer, this covers copper wire layer and is arranged on the substrate layer top surface, it this is covered into copper wire layer is pressed together on the substrate layer top surface and form the wiring board, if it includes main line item that this, which covers copper wire layer, the dielectric layer lid is located at the top of the wiring board, several blind holes are offered on the dielectric layer, each blind hole is all located at right above the route item, it is filled out in each blind hole equipped with the dielectric material block, micropore is offered on the dielectric material block.

Description

A kind of microcellular structure of PCB substrate

Technical field

Utility model is related to a kind of open-celled structure of PCB substrate, particularly relates to a kind of aperture ruler that can reduce PCB substrate Very little structure.

Background technique

It is well known that needing to make in the PCB substrate of same size more intensive with the development of electronic circuit technology Line layer to promote the integrated level of product, while reducing volume, in the field of encapsulation PCB substrate at present, to PCB substrate into Row aperture mainly carries out aperture using laser, and the minimum diameter in general laser open-blind hole is 50um, is less than if you need to make The hole of 50um, such as the hole of 30um are then needed using special equipment, and such equipment development & production cost is high, and mesh Preceding relevant equipment not yet can be purchased.And if cannot be broken through to bore size, produce ultra high density wiring envelope Dress substrate then can not be achieved, and this is the major defect for traditional technology.

Utility model content

Utility model provides a kind of microcellular structure of PCB substrate, can reduce the bore size of PCB substrate, Neng Gouti The current densities for rising whole PCB substrate, promote the circuit level of PCB substrate, and this is the main purpose for utility model.

A kind of technical solution used by utility model are as follows: microcellular structure of PCB substrate comprising wiring board, dielectric layer And dielectric material block, wherein the wiring board includes substrate layer and covers copper wire layer, this covers copper wire layer and is arranged in the substrate It on layer top surface, this is covered into copper wire layer is pressed together on the substrate layer top surface and form the wiring board, it includes several that this, which covers copper wire layer, Route item, the dielectric layer lid are located at the top of the wiring board, offer several blind holes on the dielectric layer, each blind hole is all located at Right above the route item, fills out in each blind hole equipped with the dielectric material block, offer micropore on the dielectric material block.

Utility model has the beneficial effect that it can reduce the bore size of PCB substrate, is able to ascend whole PCB substrate Current densities, be able to ascend the circuit level of PCB substrate.

Detailed description of the invention

Fig. 1 is the production process schematic diagram of utility model.

Fig. 2 is the structural schematic diagram of utility model.

Specific embodiment

As shown in Fig. 1 to 2, a kind of microcellular structure of PCB substrate comprising wiring board 10, dielectric layer 20 and dielectric material Expect block 40, wherein the wiring board 10 is including substrate layer 11 and covers copper wire layer 12.

This covers copper wire layer 12 and is arranged on 11 top surface of substrate layer, this is covered copper wire layer 12 and is pressed together on the substrate layer 11 The wiring board 10 is formed on top surface, if it includes main line item 121 that this, which covers copper wire layer 12, which includes glass layer And epoxy resin layer.

The dielectric layer 20 lid is located at 10 top of wiring board, offers several blind holes 30 on the dielectric layer 20, each should Blind hole 30 is all located at right above the route item 121, and the aperture of the blind hole 30 is between 50 ~ 100um.

It is filled out in each blind hole 30 equipped with the dielectric material block 40, offers micropore 41 on the dielectric material block 40, The aperture of the micropore 41 is less than or equal to 30um.

When specific implementation, which is round hole, which is also round hole, which is It is circular.

Be located in the blind hole 30 can be in the route item 121 by being filled out using the circular dielectric material block 40 by the present invention Surface forms the structure of micropore, to promote the current densities of whole PCB substrate, promotes the circuit level of PCB substrate.

When specific production, dielectric material block 40 can be set first in the blind hole 30, then, in the dielectric material Photoresist layer 50 is covered simultaneously on material block 40 and 20 top surface of dielectric layer, development is exposed to the photoresist layer 50 later, at this Opening 51 is formed in photoresist layer 50, which is located at 40 surface of the dielectric material block, by the opening 51 by portion Divide dielectric material block 40 to be exposed, the part dielectric material block 40 in 51 bottom of opening is etched, in Jie The micropore 41 is formed in electric material block 40, finally removes the photoresist layer on the dielectric material block 40 and 20 top surface of dielectric layer 50, obtain finished product.

Claims

1. a kind of microcellular structure of PCB substrate, it is characterised in that: it includes wiring board, dielectric layer and dielectric material block, In, which includes substrate layer and covers copper wire layer, this covers copper wire layer and is arranged on the substrate layer top surface, this is covered copper Line layer is pressed together on the substrate layer top surface and forms the wiring board, if it includes main line item, the dielectric layer lid that this, which covers copper wire layer, It is located at the top of the wiring board, offers several blind holes on the dielectric layer, each blind hole is all located at right above the route item, often It is all filled out in one blind hole equipped with the dielectric material block, offers micropore on the dielectric material block.

2. a kind of microcellular structure of PCB substrate as described in claim 1, it is characterised in that: the substrate layer includes glass fibre Layer and epoxy resin layer.

3. a kind of microcellular structure of PCB substrate as described in claim 1, it is characterised in that: the aperture of the blind hole 50 ~ Between 100um.

4. a kind of microcellular structure of PCB substrate as claimed in claim 1 or 3, it is characterised in that: the aperture of the micropore be less than etc. In 30um.

5. a kind of microcellular structure of PCB substrate as described in claim 1, it is characterised in that: the blind hole is round hole, the micropore It also is round hole, which is annular shape.