CN101841968A - Circuit board with step-shaped blind hole and manufacturing method - Google Patents
Circuit board with step-shaped blind hole and manufacturing method Download PDFInfo
- Publication number
- CN101841968A CN101841968A CN 201010167716 CN201010167716A CN101841968A CN 101841968 A CN101841968 A CN 101841968A CN 201010167716 CN201010167716 CN 201010167716 CN 201010167716 A CN201010167716 A CN 201010167716A CN 101841968 A CN101841968 A CN 101841968A
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- Prior art keywords
- blind hole
- hole
- wiring board
- bellmouth
- blind
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Abstract
The invention relates to a circuit board with a blind hole, which comprises the blind hole, wherein the blind hole is in a step shape, the aperture of one end of the blind hole is large, and the aperture of the other end of the blind hole is small; the upper part of the blind hole is of a cylindrical hole, and the lower part of the blind hole is of a conical hole; and the conical part of the conical hole is the lower end part of the blind hole. In the technical scheme, when electroplating and immersion nickel-gold surface treatment are carried out, the blind hole arranged at one side only originally is changed into a through hole with one large head and one small head by newly adding the conical hole, no residual air is in the hole, and liquid medicine can easily circulate and exchange in the hole, thereby effectively overcoming the defects of open and black blind hole because the liquid medicine can not circulate and exchange.
Description
Technical field
The present invention relates to a kind of wiring board and manufacture method that contains blind hole, relate in particular to a kind of wiring board and manufacture method that contains step-shaped blind hole.
Background technology
Along with the development of wiring board technology, the wiring board that contains blind hole extensively is employed.For the wiring board that contains blind hole, when making contains the wiring board of blind hole, need electroplate and surface treatment wiring board.When carrying out surface treatment, when the degree of depth of blind hole surpassed certain value, liquid medicine exchange in hole difficulty that can become especially more was prone to such problem during greater than 1: 1 when hole depth divided by aperture value, electroplate and during surface treatment, can cause blind hole quality problems to occur and lost efficacy.
Summary of the invention
The technical problem that the present invention solves is: make up a kind of wiring board that contains step-shaped blind hole, overcome the technical problem that prior art causes blind hole open circuit and blind hole blackout.
Technical scheme of the present invention is: make up a kind of wiring board that contains blind hole, comprise blind hole, described blind hole is a shoulder hole, and blind hole top is cylindrical hole, and the blind hole bottom is a bellmouth, and described bellmouth is a back taper, and the tapering of described bellmouth is the blind hole bottom.
Further technical scheme of the present invention is: described blind hole also comprises through hole, and described through hole one end connects the tapering of described bellmouth, and described through hole connects wiring board.
Further technical scheme of the present invention is: the ratio of the degree of depth of described blind hole and radical length is greater than 1.
Further technical scheme of the present invention is: described through hole radical length is less than the radical length on described blind hole top.
Further technical scheme of the present invention is: described through hole radial dimension is 0.2 millimeter to 0.4 millimeter.
Technical scheme of the present invention is: a kind of manufacture method that contains the blind hole wiring board is provided, comprises the steps:
Make blind hole: described blind hole top is cylindrical hole, and the blind hole bottom is a bellmouth;
To wiring board heavy copper, plating and graphic making;
Make solder mask: when PCB surface is made solder mask, blind hole is not covered not consent of oil;
Wiring board is carried out surface treatment;
Block blind hole: adopt welding resistance or lid oil to block blind hole.
Further technical scheme of the present invention is: in the step of making blind hole, described blind hole also comprises through hole, and described through hole connects the bottom of described blind hole.
Further technical scheme of the present invention is: in the step of making blind hole, the size of described through hole is 0.2 millimeter to 0.4 millimeter.
Technique effect of the present invention is: make up a kind of wiring board that contains blind hole, described blind hole is a shoulder hole, and blind hole top is cylindrical hole, and the blind hole bottom is a bellmouth, and described bellmouth is a back taper, and the tapering of described bellmouth is the blind hole bottom.Technical solution of the present invention is when doing the processing of plating and heavy nickel gold surface, initiate bellmouth has become the original blind hole of having only a side into big, a little through hole, can air pocket in the hole, liquid medicine also can circulate in the hole and exchange at an easy rate, so blind hole open circuit and the blind hole blackout problem that can effectively avoid original liquid medicine to circulate and to exchange and to cause.
Description of drawings
Fig. 1 is a structure chart of the present invention.
Fig. 2 is a flow chart of the present invention.
Embodiment
Below in conjunction with specific embodiment, technical solution of the present invention is further specified.
As shown in Figure 1, the specific embodiment of the present invention is: make up a kind of wiring board that contains blind hole, comprise blind hole, described blind hole is a shoulder hole, and blind hole top 1 is cylindrical hole, and blind hole bottom 2 is a bellmouth, described bellmouth is a back taper, and the tapering of described bellmouth is the blind hole bottom.Specific implementation process of the present invention is: when making contains the wiring board of blind hole, blind hole is made into the shoulder hole shape, that is, blind hole top 1 is cylindrical hole, and the aperture is big, and blind hole bottom 2 is a bellmouth, and the aperture is little.Technical solution of the present invention is when doing the processing of plating and heavy nickel gold surface, initiate bellmouth has become the original blind hole of having only a side into big, a little through hole, can air pocket in the hole, liquid medicine also can circulate in the hole and exchange at an easy rate, so blind hole open circuit and the blind hole blackout problem that can effectively avoid original liquid medicine to circulate and to exchange and to cause.In the specific embodiments of the invention, the ratio of the degree of depth of described blind hole and radical length is greater than 1.
As shown in Figure 1, preferred implementation of the present invention is: described blind hole also comprises through hole 3, and described through hole 3 one ends connect the tapering of described bellmouth, and described through hole 3 connects wiring board.In the specific embodiments of the invention, through hole 3 is set is communicated with shoulder hole, that is, described through hole 3 one ends connect the tapering of described bellmouth, and described through hole 3 other ends connect to PCB surface.Like this, when surface treatment, liquid medicine exchanges easily, can not cause the blind hole blackout.In the specific embodiments of the invention, described through hole radial dimension is 0.2 millimeter to 0.4 millimeter.Described through hole 3 radical lengths are less than the radical length on described blind hole top 1.
As shown in Figure 2, the specific embodiment of the present invention is: a kind of manufacture method that contains the blind hole wiring board is provided, comprises the steps:
Step 100: make blind hole, that is, make blind hole in the circuit board, described blind hole top 1 is cylindrical hole, and blind hole bottom 2 is a bellmouth, and described bellmouth is a back taper, and the tapering of described bellmouth is the blind hole bottom.
Step 200:, that is, the wiring board of making step-shaped blind hole is sunk copper, plating and graphic making to wiring board heavy copper, plating and graphic making.
Step 300: make solder mask, that is, when PCB surface is made solder mask, blind hole is not covered not consent of oil.
Step 400: wiring board being carried out surface treatment, normally adopt heavy nickel gold surface to handle, also can be surface treatments such as OSP, spray tin, heavy silver, heavy tin.
Step 500: block blind hole: adopt welding resistance or lid oil to block blind hole.When adopting welding resistance or lid oil to block blind hole, can block whole blind holes, also can only block the part blind hole.
As shown in Figure 2, preferred implementation of the present invention is: in the step of making blind hole, described blind hole also comprises through hole, and described through hole connects the bottom of described blind hole.Described blind hole also comprises through hole 3, and described through hole 3 one ends connect the tapering of described bellmouth, and described through hole 3 connects wiring board.In the specific embodiments of the invention, through hole 3 is set is communicated with shoulder hole, that is, described through hole 3 one ends connect the tapering of described bellmouth, and described through hole 3 other ends connect to PCB surface.Like this, when surface treatment, liquid medicine exchanges easily, can not cause the blind hole blackout.The size of described through hole is 0.2 millimeter to 0.4 millimeter.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. a wiring board that contains step-shaped blind hole comprises blind hole, it is characterized in that, described blind hole is a shoulder hole, and blind hole top is cylindrical hole, and the blind hole bottom is a bellmouth, and described bellmouth is a back taper, and the tapering of described bellmouth is the blind hole bottom.
2. according to the described wiring board that contains step-shaped blind hole of claim 1, it is characterized in that described blind hole also comprises through hole, described through hole one end connects the tapering of described bellmouth, and described through hole connects wiring board.
3. according to the described wiring board that contains step-shaped blind hole of claim 1, it is characterized in that the ratio of the degree of depth of described blind hole and radical length is greater than 1.
4. according to the described wiring board that contains step-shaped blind hole of claim 1, it is characterized in that described through hole radical length is less than the radical length on described blind hole top.
5. according to the described wiring board that contains step-shaped blind hole of claim 4, it is characterized in that described through hole radial dimension is 0.2 millimeter to 0.4 millimeter.
6. a manufacture method that contains the step-shaped blind hole wiring board comprises the steps:
Make blind hole: described blind hole top is cylindrical hole, and the blind hole bottom is a bellmouth;
To wiring board heavy copper, plating and graphic making;
Make solder mask: when PCB surface is made solder mask, blind hole is not covered not consent of oil;
Wiring board is carried out surface treatment;
Block blind hole: adopt welding resistance or lid oil to block blind hole.
7. according to the described manufacture method that contains the step-shaped blind hole wiring board of claim 6, it is characterized in that in the step of making blind hole, described blind hole also comprises through hole, described through hole connects the bottom of described blind hole.
8. according to the described manufacture method that contains the step-shaped blind hole wiring board of claim 7, it is characterized in that in the step of making blind hole, the size of described through hole is 0.2 millimeter to 0.4 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101677162A CN101841968B (en) | 2010-04-30 | 2010-04-30 | Circuit board with step-shaped blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101677162A CN101841968B (en) | 2010-04-30 | 2010-04-30 | Circuit board with step-shaped blind hole |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110285823XA Division CN102348337A (en) | 2010-04-30 | 2010-04-30 | Method for producing circuit board containing stepped blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101841968A true CN101841968A (en) | 2010-09-22 |
| CN101841968B CN101841968B (en) | 2012-06-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101677162A Expired - Fee Related CN101841968B (en) | 2010-04-30 | 2010-04-30 | Circuit board with step-shaped blind hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101841968B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998768A (en) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | Novel manufacturing method for back drilling of PCB (Printed Circuit Board) |
| CN102523699A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Resin plug-hole apparatus of PCB back borehole and method thereof |
| CN103889166A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Mechanical controlled deep blind hole processing technology |
| CN110167286A (en) * | 2019-06-27 | 2019-08-23 | 浪潮商用机器有限公司 | A kind of pcb board hole wall method for processing plating layer |
| CN112996254A (en) * | 2021-03-03 | 2021-06-18 | 苏州维嘉科技股份有限公司 | Circuit board blind hole processing method, circuit board processing gong machine and computer equipment |
| CN113423183A (en) * | 2021-07-01 | 2021-09-21 | 定颖电子（昆山）有限公司 | Manufacturing process of 5G communication high-frequency signal plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070068700A1 (en) * | 2005-09-26 | 2007-03-29 | Ddk Ltd. | Electric contact and method for producing the same and connector using the electric contacts |
| CN1946270A (en) * | 2005-10-03 | 2007-04-11 | 日本Cmk株式会社 | Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor |
| CN101668388A (en) * | 2008-09-05 | 2010-03-10 | 欣兴电子股份有限公司 | Method for manufacturing through-hole circuit board for solving bilateral contraposition precision offset of laser through hole |
-
2010
- 2010-04-30 CN CN2010101677162A patent/CN101841968B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070068700A1 (en) * | 2005-09-26 | 2007-03-29 | Ddk Ltd. | Electric contact and method for producing the same and connector using the electric contacts |
| CN1946270A (en) * | 2005-10-03 | 2007-04-11 | 日本Cmk株式会社 | Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor |
| CN101668388A (en) * | 2008-09-05 | 2010-03-10 | 欣兴电子股份有限公司 | Method for manufacturing through-hole circuit board for solving bilateral contraposition precision offset of laser through hole |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998768A (en) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | Novel manufacturing method for back drilling of PCB (Printed Circuit Board) |
| CN101998768B (en) * | 2010-11-09 | 2012-11-21 | 深圳崇达多层线路板有限公司 | Novel manufacturing method for back drilling of PCB (Printed Circuit Board) |
| CN102523699A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Resin plug-hole apparatus of PCB back borehole and method thereof |
| CN102523699B (en) * | 2011-12-15 | 2014-01-08 | 深圳崇达多层线路板有限公司 | Resin plug-hole apparatus of PCB back borehole and method thereof |
| CN103889166A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Mechanical controlled deep blind hole processing technology |
| CN110167286A (en) * | 2019-06-27 | 2019-08-23 | 浪潮商用机器有限公司 | A kind of pcb board hole wall method for processing plating layer |
| CN112996254A (en) * | 2021-03-03 | 2021-06-18 | 苏州维嘉科技股份有限公司 | Circuit board blind hole processing method, circuit board processing gong machine and computer equipment |
| CN113423183A (en) * | 2021-07-01 | 2021-09-21 | 定颖电子（昆山）有限公司 | Manufacturing process of 5G communication high-frequency signal plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101841968B (en) | 2012-06-06 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Peng Weihong Inventor after: Liu Dong Inventor after: Jiang Xuefei Inventor before: Liu Dong |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LIU DONG TO: PENG WEIHONG LIU DONG JIANG XUEFEI |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120606 Termination date: 20200430 |