CN205566779U - PCB (Printed circuit board) structure - Google Patents
PCB (Printed circuit board) structure Download PDFInfo
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- CN205566779U CN205566779U CN201520935353.0U CN201520935353U CN205566779U CN 205566779 U CN205566779 U CN 205566779U CN 201520935353 U CN201520935353 U CN 201520935353U CN 205566779 U CN205566779 U CN 205566779U
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- electrolytic copper
- rob
- copper point
- independent
- circuit board
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Abstract
The utility model discloses a PCB (Printed circuit board) structure, including setting up a plurality of electrolytic copper points of robbing on the circuit board, rob the interval that has predetermined length between electrolytic copper point and independent line or the independent hole. PCB (Printed circuit board) structure, through set up on the circuit board with independent line or independent hole apart from the predetermined length of more than or equal to rob electrolytic copper point, and the electroplating current is invariable basically, messenger's electroplating current dispersion makes independent hole or independent line electroplate and goes up the copper that is similar with other position thickness to doing benefit to subsequent etching treatment quality, avoiding the customer end plug -in components on the independent hole bad, avoiding line face local etching, clean or the etching is excessive, avoids independent line impedence undersize.
Description
Technical field
The utility model relates to pcb board design field, particularly relates to a kind of pcb board structure.
Background technology
Pcb board is provided with the independent lines for the separate wells or turning circuit installing electronic devices and components, the separate wells 1 as described in Fig. 1 or independent lines 2.But causing because the distribution of circuit is the most uneven separate wells to be less than customer Canonical mix in process of production and require 0.05mm, independent lines copper thickness occurs beyond the situation of other lines 50um, to such an extent as to it is bad to occur that when SMT components and parts bond angle cannot insert in separate wells etc..This is because when producing, electroplating current substantially constant, when line pattern distribution serious uneven time, relatively independent hole, line, thicker copper can be electroplated because of electric current concentrations, cause subsequent etch difficulty to increase, etch the problems such as the cleanest.
Utility model content
The purpose of this utility model is to provide a kind of pcb board structure, it is to avoid the client plug-in in separate wells is bad, it is to avoid line plate face local etching is clean or etching is excessive, it is to avoid independent lines impedance is too small.
For solving above-mentioned technical problem, the utility model embodiment provides a kind of pcb board structure, multiple robs electrolytic copper point including arrange on circuit boards, described in rob the spacing between electrolytic copper point and independent lines or separate wells with predetermined length.
Wherein, robbing electrolytic copper point described in is rectangle or circle.
Wherein, the spacing robbing electrolytic copper point described in adjacent is equal.
Wherein, rob described in adjacent the spacing of electrolytic copper point be equal to described in rob electrolytic copper point length or described in rob the diameter of electrolytic copper point.
Wherein, the blank space of described circuit board be provided with described in rob electrolytic copper point.
Wherein, robbing electrolytic copper point described in multiple is square lattice or hexagonal lattice.
The pcb board structure that the utility model embodiment is provided, compared with prior art, has the advantage that
The pcb board structure that the utility model embodiment provides, multiple robs electrolytic copper point including arrange on circuit boards, described in rob the spacing between electrolytic copper point and independent lines or separate wells with predetermined length.
Described pcb board structure, electrolytic copper point is robbed by arrange the spacing between independent lines or separate wells with predetermined length on circuit boards, and electroplating current substantially constant, the electroplating current dispersion made, make separate wells or the upper copper close with other position thickness of independent lines plating, be beneficial to follow-up etch processes quality, it is to avoid the client plug-in in separate wells is bad, avoid line plate face local etching clean or etching is excessive, it is to avoid independent lines impedance is too small.
In sum, the described pcb board structure that the utility model embodiment provides, rob electrolytic copper point by setting, make separate wells or the upper copper close with other position thickness of independent lines plating, it is to avoid line plate face local etching is clean or etches excessively.
Accompanying drawing explanation
In order to be illustrated more clearly that the utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is embodiments more of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of pcb board of the prior art；
A kind of structural representation of the detailed description of the invention of the pcb board structure that Fig. 2 is provided by the utility model embodiment.
Detailed description of the invention
The most as described in the background section, the most in the art, pcb board is provided with the independent lines for the separate wells or turning circuit installing electronic devices and components, cause because the distribution of circuit is the most uneven separate wells to be less than customer Canonical mix in process of production and require 0.05mm, independent lines copper thickness occurs beyond the situation of other lines 50um, to such an extent as to it is bad to occur that when SMT components and parts bond angle cannot insert in separate wells etc..
Based on this, the utility model embodiment provides a kind of pcb board structure, multiple robs electrolytic copper point including arrange on circuit boards, described in rob the spacing between electrolytic copper point and independent lines or separate wells with predetermined length.
In sum, the described pcb board structure that the utility model embodiment is provided, electrolytic copper point is robbed by arrange the spacing between independent lines or separate wells with predetermined length on circuit boards, and electroplating current substantially constant, the electroplating current dispersion made, make separate wells or the upper copper close with other position thickness of independent lines plating, it is beneficial to follow-up etch processes quality, avoid the client plug-in in separate wells bad, avoid line plate face local etching clean or etching is excessive, it is to avoid independent lines impedance is too small.
Understandable for enabling above-mentioned purpose of the present utility model, feature and advantage to become apparent from, below in conjunction with the accompanying drawings detailed description of the invention of the present utility model is described in detail.
Elaborate detail in the following description so that fully understanding the utility model.But the utility model can be different from alternate manner described here implement with multiple, those skilled in the art can do similar popularization in the case of the utility model intension.Therefore the utility model is not limited by following public being embodied as.
Refer to the structural representation of a kind of detailed description of the invention of the pcb board structure that Fig. 2, Fig. 2 are provided by the utility model embodiment.
In the concrete mode of one, described pcb board structure, multiple rob electrolytic copper point 30 including arrange on circuit boards, described in rob the spacing between electrolytic copper point 30 and independent lines 10 or separate wells 20 with predetermined length.
It should be noted that, described rob the spacing between electrolytic copper point 30 and described independent lines 10 or separate wells 20 with predetermined length, it is to overlap with independent lines 10 or separate wells 20 in order to avoid robbing electrolytic copper point 30, rob electrolytic copper point 30 described in but and be close to described independent lines 10 or described separate wells 20 is arranged as far as possible, electroplating current so can be avoided excessive, otherwise, described independent lines 10 or described separate wells 20 still will not avoid independence.
Electrolytic copper point 30 of robbing in this use new embodiment may also be by electroplating or being arranged on around independent lines 10 or separate wells 20 by the way of other between electroplating independent lines 10 or separate wells 20, and the mode arranged on circuit board robbing electrolytic copper point 30 is not especially limited by the utility model.
Described pcb board structure, electrolytic copper point 30 is robbed more than or equal to predetermined length by arranging the distance with independent lines 10 or separate wells 20 on circuit boards, and electroplating current substantially constant, the electroplating current dispersion made, make separate wells 20 or the upper copper close with other position thickness of independent lines 10 plating, be beneficial to follow-up etch processes quality, it is to avoid the client plug-in in separate wells 20 is bad, avoid line plate face local etching clean or etching is excessive, it is to avoid independent lines 10 impedance is too small.
Owing to the shape of electroplating hole is generally regular figure, the figure so electroplated out could thickness uniform, the damage to electroplating machine is minimum, described in rob electrolytic copper point 30 for rectangle or circle.Certainly, rob electrolytic copper point 30 described in and can also is that other shape, such as rectangle, ellipse, equilateral triangle etc..
Electric current for making plating everywhere is uniform, and the thickness difference of the figure after plating is less, adjacent described in rob the spacing of electrolytic copper point 30 equal.
For making the manufacturing process robbing electrolytic copper point 30 simple, also make components and parts on circuit board be evenly distributed simultaneously, make circuit board attractive in appearance, rob electrolytic copper point 30 electric current of passing through when plating excessive or too small, adjacent described in rob the spacing of electrolytic copper point 30 be equal to described in rob electrolytic copper point 30 length or described in rob the diameter of electrolytic copper point 30.
For reducing independent lines 10 or the circuital current of separate wells 20 as far as possible, reduce the thickness of the copper of plating in independent lines 10 or separate wells 20, the blank space of described circuit board be provided with described in rob electrolytic copper point 30.
Rob the technological design of electrolytic copper point 30 for simplifying as far as possible, multiple described in rob electrolytic copper point be square lattice or hexagonal lattice.It should be noted that rob electrolytic copper point 30 described in multiple can also form the dot matrix of other kind, this is not especially limited by the utility model.
In sum, the described pcb board structure that the utility model embodiment is provided, electrolytic copper point is robbed by arrange the spacing between independent lines or separate wells with predetermined length on circuit boards, and electroplating current substantially constant, the electroplating current dispersion made, make separate wells or the upper copper close with other position thickness of independent lines plating, it is beneficial to follow-up etch processes quality, avoid the client plug-in in separate wells bad, avoid line plate face local etching clean or etching is excessive, it is to avoid independent lines impedance is too small.
Above pcb board structure provided by the utility model is described in detail.Principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; on the premise of without departing from the utility model principle, it is also possible to the utility model is carried out some improvement and modification, these improve and modification also falls in the utility model scope of the claims.
Claims (6)
1. a pcb board structure, it is characterised in that include arranging on circuit boards multiple robs electrolytic copper point, described in rob the spacing between electrolytic copper point and independent lines or separate wells with predetermined length.
2. pcb board structure as claimed in claim 1, it is characterised in that described in rob electrolytic copper point be rectangle or circle.
3. pcb board structure as claimed in claim 2, it is characterised in that the spacing robbing electrolytic copper point described in adjacent is equal.
4. pcb board structure as claimed in claim 3, it is characterised in that rob described in adjacent the spacing of electrolytic copper point be equal to described in rob electrolytic copper point length or described in rob the diameter of electrolytic copper point.
5. pcb board structure as claimed in claim 4, it is characterised in that the blank space of described circuit board be provided with described in rob electrolytic copper point.
6. pcb board structure as claimed in claim 5, it is characterised in that robbing electrolytic copper point described in multiple is square lattice or hexagonal lattice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520935353.0U CN205566779U (en) | 2015-11-20 | 2015-11-20 | PCB (Printed circuit board) structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520935353.0U CN205566779U (en) | 2015-11-20 | 2015-11-20 | PCB (Printed circuit board) structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205566779U true CN205566779U (en) | 2016-09-07 |
Family
ID=56822354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520935353.0U Active CN205566779U (en) | 2015-11-20 | 2015-11-20 | PCB (Printed circuit board) structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205566779U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567198A (en) * | 2017-08-31 | 2018-01-09 | 惠州市永隆电路有限公司 | A kind of pcb board separate lines copper facing uniformity ameliorative way |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
| CN115802633A (en) * | 2022-11-28 | 2023-03-14 | 福莱盈电子股份有限公司 | Electroplating uniformity method of circuit board |
-
2015
- 2015-11-20 CN CN201520935353.0U patent/CN205566779U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567198A (en) * | 2017-08-31 | 2018-01-09 | 惠州市永隆电路有限公司 | A kind of pcb board separate lines copper facing uniformity ameliorative way |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
| CN115802633A (en) * | 2022-11-28 | 2023-03-14 | 福莱盈电子股份有限公司 | Electroplating uniformity method of circuit board |
| CN115802633B (en) * | 2022-11-28 | 2023-12-26 | 福莱盈电子股份有限公司 | Electroplating uniformity method of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: PCB structure Effective date of registration: 20190712 Granted publication date: 20160907 Pledgee: Bank of Changsha Limited by Share Ltd Liuyang branch Pledgor: Hunan Li'er Circuit Board Co., Ltd.|Hunan Lier Electronic Materials Co., Ltd. Registration number: 2019430000064 |