CN105657981B - A kind of electroless copper plating method and its application device using pre-terminated touch function - Google Patents
A kind of electroless copper plating method and its application device using pre-terminated touch function Download PDFInfo
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- CN105657981B CN105657981B CN201610124956.1A CN201610124956A CN105657981B CN 105657981 B CN105657981 B CN 105657981B CN 201610124956 A CN201610124956 A CN 201610124956A CN 105657981 B CN105657981 B CN 105657981B
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- Prior art keywords
- heavy copper
- copper cylinder
- heavy
- cylinder
- medicinal liquid
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A kind of PCB electroless copper plating device, including heavy copper cylinder, winged bar, positioning seat, metal stud and ballast machine, the positioning seat is set on heavy copper cylinder, the positioning seat being oppositely arranged there are two being set on the heavy copper cylinder, described winged bar is set up on two positioning seats, chemical medicinal liquid is loaded in the heavy copper cylinder, the metal stud is placed in the chemical medicinal liquid, and the ballast machine is electrically connected at by conducting wire, the invention also includes a kind of electroless copper plating methods using pre-terminated touch function, pcb board was put into preceding 30 to the 90 seconds time after the heavy copper cylinder, by to the additional negative contact voltage of chemical medicinal liquid in heavy copper cylinder, to reduce pcb board with the reaction potential between chemical medicinal liquid, chemical reaction is promoted to generate rapidly, improve the stability of deposition rate during electroless copper plating, and the thickness of heavy layers of copper Degree and backlight stay in grade, the broken risk in hole is low, and high production efficiency is practical, has stronger dissemination.
Description
Technical field
The present invention relates to the manufacturing field of PCB more particularly to a kind of electroless copper plating method using pre-terminated touch function and its
Application apparatus.
Background technique
Electroless copper (Eletcroless Plating Copper) is generally also heavy copper or hole (PTH) is one kind itself
Catalysed oxidation reduction reaction is widely used in the production and processing for having the printed wiring board of through-hole, the system of printed wiring board
Make the process including parts such as pad, via hole, solder mask, silk-screen layer, heavy copper.Heavy copper technology is widely used in the print for having through-hole
In the production and processing of wiring board processed, main purpose is to deposit one on non-conductive substrate by a series of chemical treatment methods
Layer copper, then thickeies the specific thicknesses for making up to design by subsequent electro-plating method.
Currently, chemical medicinal liquid system used mainly has ion activation in relatively conventional vertical electroless copper plating technique
Palladium catalytic system, however there are many deficiencies, one sideization in the production technology of existing ion activation catalysis liquid medicine system
Learn heavy copper process starting slowly, and electroless copper plating rate is big with the resin area fluctuation of pcb board, the smaller heavy copper speed of resin area is got over
Slowly；And to sink layers of copper coverage rate poor it will cause pcb board for deposition rate unstable, sinking copper hole, to break risk high；On the other hand, chemical
Cooperation production is carried out using pure resin plate in heavy process for copper, it will cause production efficiency declines.
Summary of the invention
Based on this, it is necessary to aiming at the shortcomings in the prior art, provide a kind of starting that can accelerate electroless copper plating process
Speed, the electroless copper plating method and its application device for improving heavy copper mass and production efficiency.
A kind of electroless copper plating method using pre-terminated touch function, comprising the following steps:
Step (1): the Hanging Basket equipped with PCB is put into PCB electroless copper plating device, and the electroless copper plating device includes heavy copper
Cylinder and ballast machine are loaded with chemical medicinal liquid in the heavy copper cylinder, and the ballast machine is electrically connected at the chemical medicinal liquid；
Step (2): adding a negative contact voltage to the chemical medicinal liquid in heavy copper cylinder, before PCB is put into the heavy copper cylinder
In 30-90 seconds times, the output voltage of the ballast machine is set as -2V, continues the 30-90S time, to reduce pcb board with described
Reaction potential between chemical medicinal liquid promotes the rapid generation of chemical reaction；
Step (3): copper-coating is carried out to pcb board, to form a layers of copper in the hole on pcb board.
Further, the ballast machine sets voltage as 1-5V, and operating voltage is 2.0 ± 0.1V.
Further, the PCB electroless copper plating device further include fly bar, positioning seat and metal stud, the positioning seat are set
Be placed on heavy copper cylinder, set on the heavy copper cylinder there are two the positioning seat that is oppositely arranged, it is described fly bar to be set up in two it is described fixed
On the seat of position, the heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, and first is provided on the first heavy copper cylinder and is flown bar, the
It is provided with second winged bar, described first winged bar and second winged bar on two heavy copper cylinders to connect by conducting wire, the metal stud is vertical
It is placed in the heavy copper cylinder, the 90% of metal stud outer surface part is soaked in the chemical medicinal liquid in the heavy copper cylinder, gold
One end that category stud extends chemical medicinal liquid is electrically connected at the ballast machine by conducting wire.
Further, the V-shaped setting of the positioning seat, the material of the positioning seat are stainless steel material.
Further, the electroless copper plating device further includes a controlling terminal, and a voltage is provided in the controlling terminal
Control module, the ballast machine are electrically connected at the controlling terminal, the output electricity of the voltage control module control ballast machine
Pressure and duration.
A kind of PCB electroless copper plating device, including heavy copper cylinder, winged bar, positioning seat, metal stud and ballast machine, the positioning
Seat is set on heavy copper cylinder, and the heavy copper cylinder is equipped at least two positioning seats being oppositely arranged, and described winged bar is set up in
On two positioning seats, the heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, and the is provided on the first heavy copper cylinder
One winged bar, it is provided with second winged bar, described first winged bar and second winged bar on the second heavy copper cylinder and passes through conducting wire series connection, the heavy copper
Chemical medicinal liquid is loaded in cylinder, the metal stud vertical is placed in the heavy copper cylinder, metal stud outer surface part
90% is soaked in the chemical medicinal liquid in the heavy copper cylinder, and one end that metal stud extends chemical medicinal liquid is electrically connected by conducting wire
It is connected to the ballast machine.
The V-shaped setting of positioning seat, the material of the positioning seat are stainless steel material.
The electroless copper plating device further includes a controlling terminal, and a voltage control module is provided in the controlling terminal,
The ballast machine is electrically connected at the controlling terminal, the output voltage of the voltage control module control ballast machine and it is lasting when
Between.
Compared with prior art, the electroless copper plating method and its application device of the invention using pre-terminated touch function is beneficial
Effect is: reducing pcb board with the reaction potential between chemical medicinal liquid, promotes chemical reaction to generate rapidly, improve chemistry
The stability of deposition rate during heavy copper, and the thickness and backlight stay in grade of heavy layers of copper, the broken risk in hole is low, production efficiency
Height has stronger dissemination.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the PCB electroless copper plating device in the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.
As shown in Figure 1, the present invention provides a kind of PCB electroless copper plating device, it is electroplated in flow process for PCB, the PCB
Electroless copper plating device is set including heavy copper cylinder 10, winged bar 20, positioning seat 30, metal stud 40 and ballast machine 50, the positioning seat 30
It is placed on heavy copper cylinder 10, is set on the heavy copper cylinder 10 there are two the positioning seat 30 being oppositely arranged, described winged bar 20 is set up in
On two positioning seats 30, chemical medicinal liquid is loaded in the heavy copper cylinder 10, the metal stud 40 is placed in the chemical drugs
In water, and the ballast machine 50 is electrically connected at by conducting wire 60.
The PCB electroless copper plating device further includes a controlling terminal, and the ballast machine 50 is electrically connected at the control eventually
It holds, in the present embodiment, the ballast machine 50 sets voltage as 1-5V, and operating voltage is 2.0 ± 0.1V, and the controlling terminal includes
One voltage control module, the voltage control module are used to control operating voltage and the duration of ballast machine 50, to heavy copper cylinder
Chemical medicinal liquid in 10 increases a negative contact voltage, to reduce pcb board 70 with the reaction potential between chemical medicinal liquid, promotees
The rapid generation of theory of evolution reaction.
The heavy copper cylinder 10 includes the first heavy copper cylinder 11 and the second heavy copper cylinder 12, and the is provided on the first heavy copper cylinder 11
One flies bars 21, and second is provided on the second heavy copper cylinder 12 and flies bars 22, and described first, which flies bars 21, flies bars 22 with second and pass through conducting wire 60
Series connection.Specifically, the described first heavy copper cylinder 11 is equipped with two the first positioning seats 31 and the second positioning seat 32 being oppositely arranged, described
It is set up on the first positioning seat 31 and the second positioning seat 32 for first winged bar 21；Two are provided on the second heavy copper cylinder 12 to set relatively
The third positioning seat 33 and the 4th positioning seat 34 set, described second winged bar 22 is set up in third positioning seat 33 and the 4th positioning seat 34
On；First positioning seat 31 is connected to third positioning seat 33 by conducting wire, and second positioning seat 32 is connected to by conducting wire
4th positioning seat 34 connects first winged bar 21 with second winged bar 22.
The V-shaped setting of the positioning seat 30, described winged bar is set up in the V-shaped groove of positioning seat, so that winged bar of placement
It is more firm.The positioning seat 30 is acid and alkali-resistance, corrosion resistant metal material, and in the present embodiment, the positioning seat 30 is stainless steel
Matter.40 vertical of metal stud is placed in the second heavy copper cylinder 22, and the 90% of 40 outer surface part of metal stud impregnates
In the chemical medicinal liquid in the second heavy copper cylinder 22, the upper end that metal stud 40 extends chemical medicinal liquid is connected to institute by conducting wire 60
State ballast machine 50.
The present invention also provides a kind of electroless copper plating methods using pre-terminated touch function, the production process applied to PCB plating
In, comprising the following steps:
Step (1): the Hanging Basket equipped with pcb board 70 is put into PCB electroless copper plating device, 40 vertical of metal stud is put
It is placed in the heavy copper cylinder 10, the 90% of 40 outer surface part of metal stud is soaked in the chemical medicinal liquid in the heavy copper cylinder 10
In, and the ballast machine 50 is electrically connected at by conducting wire 60.
Step (2): adding a negative contact voltage to the chemical medicinal liquid in heavy copper cylinder 10, is put into the heavy copper cylinder 10 in PCB
Preceding 30-90 seconds times in, the output voltage of the ballast machine 50 is set as -2V, continue the 30-90S time, to reduce pcb board
70, with the reaction potential between the chemical medicinal liquid, promote the rapid generation of chemical reaction, and improve during electroless copper plating
The stability of deposition rate avoids the influence of the size and resin area of pcb board 70 to the stability of electroless copper plating rate；This
Outside, the thickness and backlight stay in grade of layers of copper are sunk, hole breaks that risk is low, and no matching is required in production management pure resin plate is with maintenance
Learn the activity of liquid medicine, high production efficiency.
Step (3): copper-coating is carried out to pcb board, to form a layers of copper in the hole on pcb board.
In conclusion the beneficial effect of the electroless copper plating method and its application device of the invention using pre-terminated touch function exists
In: pcb board 70 is reduced with the reaction potential between chemical medicinal liquid, is promoted chemical reaction to generate rapidly, is improved electroless copper plating
The stability of deposition rate in the process, and the thickness and backlight stay in grade of heavy layers of copper, the broken risk in hole is low, high production efficiency, tool
There is stronger dissemination.
One embodiment of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of electroless copper plating method using pre-terminated touch function, it is characterised in that: the following steps are included:
Step (1): will be put into PCB electroless copper plating device equipped with the Hanging Basket of PCB, the electroless copper plating device include heavy copper cylinder and
Ballast machine is loaded with chemical medicinal liquid in the heavy copper cylinder, and the ballast machine is electrically connected at the chemical medicinal liquid；
Step (2): adding a negative contact voltage to the chemical medicinal liquid in heavy copper cylinder, before PCB is put into the heavy copper cylinder, by institute
The output voltage for stating ballast machine is set as -2V, continues 30~90S time；
Step (3): copper-coating is carried out to pcb board, to form a layers of copper on pcb board.
2. using the electroless copper plating method of pre-terminated touch function as described in claim 1, it is characterised in that: the ballast machine setting
Voltage is 1~5V, and operating voltage is 2.0 ± 0.1V.
3. using the electroless copper plating method of pre-terminated touch function as described in claim 1, it is characterised in that: the PCB chemistry is heavy
Copper device further include fly bar, positioning seat and metal stud, the positioning seat are set on heavy copper cylinder, the heavy copper cylinder is equipped with two
A positioning seat being oppositely arranged, described winged bar is set up on two positioning seats, and the heavy copper cylinder includes the first heavy copper cylinder
With the second heavy copper cylinder, it is provided with first on the first heavy copper cylinder and flies bar, second is provided on the second heavy copper cylinder and is flown bar, described the
One winged bar and second winged bar is connected by conducting wire, and the metal stud is vertically placed in the heavy copper cylinder, metal stud appearance
The 90% of face part is soaked in the chemical medicinal liquid in the heavy copper cylinder, and metal stud extends one end of chemical medicinal liquid by leading
Line is electrically connected at the ballast machine.
4. using the electroless copper plating method of pre-terminated touch function as claimed in claim 3, it is characterised in that: the positioning seat is in V
Shape setting, the material of the positioning seat are stainless steel material.
5. using the electroless copper plating method of pre-terminated touch function as described in claim 1, it is characterised in that: the electroless copper plating dress
Setting further includes a controlling terminal, and a voltage control module is provided in the controlling terminal, and the ballast machine is electrically connected at institute
State controlling terminal, the output voltage of the voltage control module control ballast machine and duration.
6. a kind of PCB electroless copper plating device, it is characterised in that: including heavy copper cylinder, fly bar, positioning seat, metal stud and ballast machine,
The positioning seat is set on heavy copper cylinder, and the heavy copper cylinder is equipped at least two positioning seats being oppositely arranged, described to fly
It bar is set up on two positioning seats, the heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, on the first heavy copper cylinder
It is provided with first winged bar, second winged bar, described first winged bar and second winged bar is provided on the second heavy copper cylinder and is connected by conducting wire,
Chemical medicinal liquid is loaded in the heavy copper cylinder, the metal stud is vertically placed in the heavy copper cylinder, metal stud outer surface
Partial 90% is soaked in the chemical medicinal liquid in the heavy copper cylinder, and one end that metal stud extends chemical medicinal liquid passes through conducting wire
It is electrically connected at the ballast machine；The PCB electroless copper plating device further includes a controlling terminal, is provided in the controlling terminal
One voltage control module, the ballast machine are electrically connected at controlling terminal, the output of the voltage control module control ballast machine
Voltage and duration increase by a negative contact voltage to the chemical medicinal liquid in heavy copper cylinder, reduce pcb board between chemical medicinal liquid
Reaction potential.
7. PCB electroless copper plating device as claimed in claim 6, it is characterised in that: the V-shaped setting of positioning seat, it is described fixed
The material of position seat is stainless steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610124956.1A CN105657981B (en) | 2016-03-04 | 2016-03-04 | A kind of electroless copper plating method and its application device using pre-terminated touch function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610124956.1A CN105657981B (en) | 2016-03-04 | 2016-03-04 | A kind of electroless copper plating method and its application device using pre-terminated touch function |
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| Publication Number | Publication Date |
|---|---|
| CN105657981A CN105657981A (en) | 2016-06-08 |
| CN105657981B true CN105657981B (en) | 2018-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610124956.1A Active CN105657981B (en) | 2016-03-04 | 2016-03-04 | A kind of electroless copper plating method and its application device using pre-terminated touch function |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980530B (en) * | 2022-06-21 | 2023-11-24 | 江西鸿宇电路科技有限公司 | Chemical copper deposition device and chemical copper deposition method for printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6179990B1 (en) * | 1999-06-30 | 2001-01-30 | International Business Machines Corporation | Biased acid cleaning of a copper-invar-copper laminate |
| CN204119671U (en) * | 2014-09-22 | 2015-01-21 | 国茂(浙江)科技有限公司 | A kind of pcb board sinks copper cash and flies to cling to fixture |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119676A (en) * | 1987-10-31 | 1989-05-11 | Mitsumi Electric Co Ltd | Electroless and electroplating method |
| KR101565355B1 (en) * | 2014-01-22 | 2015-11-03 | 대덕전자 주식회사 | Electroplating apparatus and processing method thereof |
-
2016
- 2016-03-04 CN CN201610124956.1A patent/CN105657981B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6179990B1 (en) * | 1999-06-30 | 2001-01-30 | International Business Machines Corporation | Biased acid cleaning of a copper-invar-copper laminate |
| CN204119671U (en) * | 2014-09-22 | 2015-01-21 | 国茂(浙江)科技有限公司 | A kind of pcb board sinks copper cash and flies to cling to fixture |
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| CN105657981A (en) | 2016-06-08 |
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