CN105657981A - Electroless plating copper adopting pre-contact function and application device thereof - Google Patents
Electroless plating copper adopting pre-contact function and application device thereof Download PDFInfo
- Publication number
- CN105657981A CN105657981A CN201610124956.1A CN201610124956A CN105657981A CN 105657981 A CN105657981 A CN 105657981A CN 201610124956 A CN201610124956 A CN 201610124956A CN 105657981 A CN105657981 A CN 105657981A
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- China
- Prior art keywords
- heavy copper
- copper cylinder
- positioning seat
- cylinder
- plating copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
A PCB electroless plating copper device comprises electroless plating copper vats, conductive bars, locating seats, a metallic titanium bar and a ballast machine; the locating seats are arranged on the electroless plating copper vats, each electroless plating copper vat is provided with two oppositely arranged locating seats, each conductive bar is erected on the two corresponding locating seats, chemical liquid is contained in the electroless plating copper vats, and the metallic titanium bar is placed in the chemical liquid and electrically connected to the ballast machine through a wire. The invention further provides an electroless plating copper adopting a pre-contact function. During the time 30-90 seconds before PCBs are put into the electroless plating copper vats, a negative contact voltage is additionally added to the chemical liquid in the electroless plating copper vats, reaction potentials between the PCBs and the chemical liquid are reduced, rapid conducting of a chemical reaction is facilitated, the stability of plating copper rate in the electroless plating copper process is improved, the thickness and backlight quality of plating copper layers are stable, the hole breakage risk is low, the production efficiency is high, the practicability is high, and strong promotion significance is achieved.
Description
Technical field
The present invention relates to the manufacture field of PCB, particularly relate to a kind of electroless copper plating method adopting pre-contact function and application apparatus thereof.
Background technology
Electroless copper (EletcrolessPlatingCopper) generally also makes heavy copper or hole (PTH) be a kind of their catalytic redox reaction, being widely used in having in the production and processing of the printed wiring board of through hole, the making of printed substrate includes the operation of the parts such as pad, via, solder mask, silk-screen layer, heavy copper. Heavy copper technology is widely used in having in the production and processing of the printed wiring board of through hole, its main purpose is in that to deposit one layer of copper on non-conductive substrate by a series of chemical treatment methods, is then thickeied the specific thicknesses making up to design by follow-up electro-plating method.
At present, in relatively conventional vertical electroless copper plating technique, chemical medicinal liquid system used mainly has ion activation palladium catalytic system, but there is many deficiencies in the production technology of existing ion activation catalysis liquid medicine system, electroless copper plating process starts slow on the one hand, and electroless copper plating speed fluctuates big with the resin area of pcb board, the more little heavy copper speed of resin area is more slow; And the unstable rule of deposition rate can cause the heavy layers of copper of pcb board to cover rate variance, the broken risk in heavy copper hole is high; On the other hand, electroless copper plating technique uses virgin resin plate carry out coordinating production, then production efficiency can be caused to decline.
Summary of the invention
Based on this, it is necessary to for deficiency of the prior art, it is provided that a kind of electroless copper plating method that can accelerate the toggle speed of electroless copper plating process, the heavy copper mass of raising and production efficiency and application apparatus thereof.
A kind of electroless copper plating method adopting pre-contact function, comprises the following steps:
Step (1): will be equipped with the Hanging Basket of PCB and put into PCB electroless copper plating device, described electroless copper plating device includes heavy copper cylinder and ballast machine, is loaded with chemical medicinal liquid in described heavy copper cylinder, and described ballast machine is electrically connected at described chemical medicinal liquid;
Step (2): give the negative contact voltage that adds of the chemical medicinal liquid in heavy copper cylinder, front 30-90 time second of described heavy copper cylinder is put at PCB, the output voltage of described ballast machine is set to-2V, continue the 30-90S time, to reduce pcb board with the reaction electromotive force between described chemical medicinal liquid, promote the rapid generation of chemical reaction;
Step (3): pcb board is carried out heavy Copper treatment, to form a layers of copper in the hole on pcb board.
Further, described ballast machine setting voltage is 1-5V, and running voltage is 2.0 �� 0.1V.
Further, described PCB electroless copper plating device also includes flying bar, positioning seat and Titanium rod, described positioning seat is arranged on heavy copper cylinder, described heavy copper cylinder is provided with two described positioning seats being oppositely arranged, the described bar that flies is set up on positioning seat described in two, described heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, described first heavy copper cylinder is provided with first and flies bar, second heavy copper cylinder is provided with second and flies bar, described first flies bar and second flies bar and passes through wired in series, described Titanium rod is vertically positioned in described heavy copper cylinder, the 90% of Titanium rod outer surface part is soaked in the chemical medicinal liquid in described heavy copper cylinder, Titanium rod extends one end of chemical medicinal liquid and is electrically connected at described ballast machine by wire.
Further, the V-shaped setting of described positioning seat, the material of described positioning seat is stainless steel material.
Further, described electroless copper plating device also includes a control terminal, and described control terminal is provided with a voltage control module, and described ballast machine is electrically connected at described control terminal, and described voltage control module controls output voltage and the persistent period of ballast machine.
A kind of PCB electroless copper plating device, including heavy copper cylinder, fly bar, positioning seat, Titanium rod and ballast machine, described positioning seat is arranged on heavy copper cylinder, described heavy copper cylinder is provided with the described positioning seat that at least two is oppositely arranged, the described bar that flies is set up on positioning seat described in two, described heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, described first heavy copper cylinder is provided with first and flies bar, second heavy copper cylinder is provided with second and flies bar, described first flies bar and second flies bar and passes through wired in series, it is loaded with chemical medicinal liquid in described heavy copper cylinder, described Titanium rod vertical is positioned in described heavy copper cylinder, the 90% of Titanium rod outer surface part is soaked in the chemical medicinal liquid in described heavy copper cylinder, Titanium rod extends one end of chemical medicinal liquid and is electrically connected at described ballast machine by wire.
The V-shaped setting of described positioning seat, the material of described positioning seat is stainless steel material.
Described electroless copper plating device also includes a control terminal, and described control terminal is provided with a voltage control module, and described ballast machine is electrically connected at described control terminal, and described voltage control module controls output voltage and the persistent period of ballast machine.
Compared with prior art, the electroless copper plating method of employing pre-contact function of the present invention and having the beneficial effects that of application apparatus thereof: reduce pcb board with the reaction electromotive force between chemical medicinal liquid, promote that chemical reaction produces rapidly, improve the stability of deposition rate in electroless copper plating process, and the thickness of heavy layers of copper and backlight stay in grade, the broken risk in hole is low, and production efficiency is high, has stronger dissemination.
Accompanying drawing explanation
Fig. 1 is the structural representation of the PCB electroless copper plating device in the present invention.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.
As shown in Figure 1, the present invention provides a kind of PCB electroless copper plating device, electroplate in flow process for PCB, described PCB electroless copper plating device includes heavy copper cylinder 10, fly bar 20, positioning seat 30, Titanium rod 40 and ballast machine 50, described positioning seat 30 is arranged on heavy copper cylinder 10, described heavy copper cylinder 10 is provided with two described positioning seats 30 being oppositely arranged, the described bar 20 that flies is set up on positioning seat 30 described in two, it is loaded with chemical medicinal liquid in described heavy copper cylinder 10, described Titanium rod 40 is positioned in described chemical medicinal liquid, and it is electrically connected at described ballast machine 50 by wire 60.
Described PCB electroless copper plating device also includes a control terminal, described ballast machine 50 is electrically connected at described control terminal, in the present embodiment, described ballast machine 50 setting voltage is 1-5V, running voltage is 2.0 �� 0.1V, described control terminal includes a voltage control module, described voltage control module is for controlling running voltage and the persistent period of ballast machine 50, add a negative contact voltage to the chemical medicinal liquid in heavy copper cylinder 10, to reduce pcb board 70 with the reaction electromotive force between chemical medicinal liquid, promote the rapid generation of chemical reaction.
Described heavy copper cylinder 10 includes the first heavy copper cylinder 11 and the second heavy copper cylinder 12, the described first heavy copper cylinder 11 is provided with first and flies bar 21, the second heavy copper cylinder 12 is provided with second and flies bar 22, and described first flies bar 21 flies bar 22 and pass through wire 60 and connect with second. Specifically, the described first heavy copper cylinder 11 is provided with two the first positioning seat 31 and the second positioning seats 32 being oppositely arranged, and described first flies bar 21 is set up on the first positioning seat 31 and the second positioning seat 32; Being provided with two the 3rd positioning seat 33 and the 4th positioning seats 34 being oppositely arranged on described second heavy copper cylinder 12, described second flies bar 22 is set up on the 3rd positioning seat 33 and the 4th positioning seat 34; Described first positioning seat 31 is connected to the 3rd positioning seat 33 by wire, and described second positioning seat 32 is connected to the 4th positioning seat 34 by wire, flies bar 22 with second and connects flying bar 21 by first.
The described V-shaped setting of positioning seat 30, described in fly bar and be set up in the V-shaped groove of positioning seat so that the placement flying bar is more firm. This positioning seat 30 is acid and alkali-resistance, corrosion resistant metal material, and in the present embodiment, described positioning seat 30 is stainless steel. Described Titanium rod 40 verticals are positioned in the second heavy copper cylinder 22, the 90% of described Titanium rod 40 outer surface part is soaked in the chemical medicinal liquid in the second heavy copper cylinder 22, and Titanium rod 40 extends the upper end of chemical medicinal liquid and is connected to described ballast machine 50 by wire 60.
The present invention also provides for a kind of electroless copper plating method adopting pre-contact function, is applied in the production process of PCB plating, comprises the following steps:
Step (1): will be equipped with the Hanging Basket of pcb board 70 and put into PCB electroless copper plating device, described Titanium rod 40 verticals are positioned in described heavy copper cylinder 10, the 90% of Titanium rod 40 outer surface part is soaked in the chemical medicinal liquid in described heavy copper cylinder 10, and is electrically connected at described ballast machine 50 by wire 60.
Step (2): give the negative contact voltage that adds of the chemical medicinal liquid in heavy copper cylinder 10, front 30-90 time second of described heavy copper cylinder 10 is put at PCB, the output voltage of described ballast machine 50 is set to-2V, continue the 30-90S time, to reduce pcb board 70 with the reaction electromotive force between described chemical medicinal liquid, promote the rapid generation of chemical reaction, and improve the stability of deposition rate in electroless copper plating process, it is to avoid the size of pcb board 70 and the resin area impact on the stability of electroless copper plating speed; Additionally, the thickness of heavy layers of copper and backlight stay in grade, the broken risk in hole is low, and without virgin resin plate of arranging in pairs or groups to maintain the activity of chemical medicinal liquid in production management, production efficiency is high.
Step (3): pcb board is carried out heavy Copper treatment, to form a layers of copper in the hole on pcb board.
In sum, the electroless copper plating method of employing pre-contact function of the present invention and having the beneficial effects that of application apparatus thereof: reduce pcb board 70 with the reaction electromotive force between chemical medicinal liquid, promote that chemical reaction produces rapidly, improve the stability of deposition rate in electroless copper plating process, and the thickness of heavy layers of copper and backlight stay in grade, the broken risk in hole is low, and production efficiency is high, has stronger dissemination.
Embodiment described above only have expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention. It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention. Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. the electroless copper plating method adopting pre-contact function, it is characterised in that: comprise the following steps:
Step (1): will be equipped with the Hanging Basket of PCB and put into PCB electroless copper plating device, described electroless copper plating device includes heavy copper cylinder and ballast machine, is loaded with chemical medicinal liquid in described heavy copper cylinder, and described ballast machine is electrically connected at described chemical medicinal liquid;
Step (2): give the negative contact voltage that adds of the chemical medicinal liquid in heavy copper cylinder, in PCB front 30-90 time second putting into described heavy copper cylinder, the output voltage of described ballast machine is set to-2V, continues the 30-90S time;
Step (3): pcb board is carried out heavy Copper treatment, to form a layers of copper on pcb board.
2. the electroless copper plating method adopting pre-contact function as claimed in claim 1, it is characterised in that: described ballast machine setting voltage is 1-5V, and running voltage is 2.0 �� 0.1V.
3. the electroless copper plating method adopting pre-contact function as claimed in claim 1, it is characterized in that: described PCB electroless copper plating device also includes flying bar, positioning seat and Titanium rod, described positioning seat is arranged on heavy copper cylinder, described heavy copper cylinder is provided with two described positioning seats being oppositely arranged, the described bar that flies is set up on positioning seat described in two, described heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, described first heavy copper cylinder is provided with first and flies bar, second heavy copper cylinder is provided with second and flies bar, described first flies bar and second flies bar and passes through wired in series, described Titanium rod is vertically positioned in described heavy copper cylinder, the 90% of Titanium rod outer surface part is soaked in the chemical medicinal liquid in described heavy copper cylinder, Titanium rod extends one end of chemical medicinal liquid and is electrically connected at described ballast machine by wire.
4. the electroless copper plating method adopting pre-contact function as claimed in claim 3, it is characterised in that: the V-shaped setting of described positioning seat, the material of described positioning seat is stainless steel material.
5. the electroless copper plating method adopting pre-contact function as claimed in claim 1, it is characterized in that: described electroless copper plating device also includes a control terminal, described control terminal is provided with a voltage control module, described ballast machine is electrically connected at described control terminal, and described voltage control module controls output voltage and the persistent period of ballast machine.
6. a PCB electroless copper plating device, it is characterized in that: include heavy copper cylinder, fly bar, positioning seat, Titanium rod and ballast machine, described positioning seat is arranged on heavy copper cylinder, described heavy copper cylinder is provided with the described positioning seat that at least two is oppositely arranged, the described bar that flies is set up on positioning seat described in two, described heavy copper cylinder includes the first heavy copper cylinder and the second heavy copper cylinder, described first heavy copper cylinder is provided with first and flies bar, second heavy copper cylinder is provided with second and flies bar, described first flies bar and second flies bar and passes through wired in series, it is loaded with chemical medicinal liquid in described heavy copper cylinder, described Titanium rod is vertically positioned in described heavy copper cylinder, the 90% of Titanium rod outer surface part is soaked in the chemical medicinal liquid in described heavy copper cylinder, Titanium rod extends one end of chemical medicinal liquid and is electrically connected at described ballast machine by wire.
7. PCB electroless copper plating device as claimed in claim 6, it is characterised in that: the V-shaped setting of described positioning seat, the material of described positioning seat is stainless steel material.
8. PCB electroless copper plating device as claimed in claim 6, it is characterized in that: described electroless copper plating device also includes a control terminal, described control terminal is provided with a voltage control module, described ballast machine is electrically connected at described control terminal, and described voltage control module controls output voltage and the persistent period of ballast machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610124956.1A CN105657981B (en) | 2016-03-04 | 2016-03-04 | A kind of electroless copper plating method and its application device using pre-terminated touch function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610124956.1A CN105657981B (en) | 2016-03-04 | 2016-03-04 | A kind of electroless copper plating method and its application device using pre-terminated touch function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105657981A true CN105657981A (en) | 2016-06-08 |
| CN105657981B CN105657981B (en) | 2018-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610124956.1A Active CN105657981B (en) | 2016-03-04 | 2016-03-04 | A kind of electroless copper plating method and its application device using pre-terminated touch function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980530A (en) * | 2022-06-21 | 2022-08-30 | 江西鸿宇电路科技有限公司 | Chemical copper deposition method for printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119676A (en) * | 1987-10-31 | 1989-05-11 | Mitsumi Electric Co Ltd | Electroless and electroplating method |
| US6179990B1 (en) * | 1999-06-30 | 2001-01-30 | International Business Machines Corporation | Biased acid cleaning of a copper-invar-copper laminate |
| CN204119671U (en) * | 2014-09-22 | 2015-01-21 | 国茂(浙江)科技有限公司 | A kind of pcb board sinks copper cash and flies to cling to fixture |
| KR20150087502A (en) * | 2014-01-22 | 2015-07-30 | 대덕전자 주식회사 | Electroplating apparatus and processing method thereof |
-
2016
- 2016-03-04 CN CN201610124956.1A patent/CN105657981B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119676A (en) * | 1987-10-31 | 1989-05-11 | Mitsumi Electric Co Ltd | Electroless and electroplating method |
| US6179990B1 (en) * | 1999-06-30 | 2001-01-30 | International Business Machines Corporation | Biased acid cleaning of a copper-invar-copper laminate |
| KR20150087502A (en) * | 2014-01-22 | 2015-07-30 | 대덕전자 주식회사 | Electroplating apparatus and processing method thereof |
| CN204119671U (en) * | 2014-09-22 | 2015-01-21 | 国茂(浙江)科技有限公司 | A kind of pcb board sinks copper cash and flies to cling to fixture |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980530A (en) * | 2022-06-21 | 2022-08-30 | 江西鸿宇电路科技有限公司 | Chemical copper deposition method for printed circuit board |
| CN114980530B (en) * | 2022-06-21 | 2023-11-24 | 江西鸿宇电路科技有限公司 | Chemical copper deposition device and chemical copper deposition method for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105657981B (en) | 2018-12-04 |
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