CN204859775U - Tool is electroplated to figure - Google Patents
Tool is electroplated to figure Download PDFInfo
- Publication number
- CN204859775U CN204859775U CN201520662082.6U CN201520662082U CN204859775U CN 204859775 U CN204859775 U CN 204859775U CN 201520662082 U CN201520662082 U CN 201520662082U CN 204859775 U CN204859775 U CN 204859775U
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- board
- production
- tool
- plate
- conducting surface
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Abstract
The utility model provides a tool is electroplated to figure, its includes an instrument board, the size of a dimension is unanimous with printed circuit board's production board, and the instrument board simultaneously is the conducting surface, and the another side is non - conducting surface, the instrument board corresponds production board figure and electroplates the regional fretwork that the figure distributes, counterpointing non - conducting surface of instrument board after the fretwork and production board to overlap and placing together, instrument board conducting surface is connected in the negative pole of electroplating device through a wire and the parallelly connected electricity of production board. The utility model discloses a can improve the electroplating area, dispersing action puts the unnecessary electric current on the board into production, improves local current distribution to reaching and improving the thick homogeneity purpose of production board electro -coppering, the problem of area low excessively (mismatching with figure electricity plate wire rectifier electric current regulating power) is electroplated to solution production board, or the parcel plating area seriously unbalance inhomogeneous thick widely different problem of copper that results in that distributes.
Description
Technical field
The utility model relates to electroplating device, particularly graphic plating tool in printed circuit board or semiconductor integrated circuit package substrate process.
Background technology
Flourish along with electronic industry, electronic product is entered function, intelligentized development, for meeting electronic product high integration, miniaturization, microminiaturized development need, more and more higher to the graphic plating technological requirement of printed circuit board or semiconductor integrated circuit package substrate, sometimes even occur that plating area is on the low side, exceed the regulating power scope of graphic plating line rectifier, thus cause electro-coppering thickness ununiformity even, even occur the defects such as plating knurl.
Summary of the invention
The purpose of this utility model is to design a kind of graphic plating tool, plating area can be improved, peptizaiton is producing the unwanted currents on plate, improve localised current distribution, thus it is all thick to reach the electro-coppering of improvement production plate, solve the problem of producing plate plating area too low (not mating with graphic plating line rectifier current regulating power), or parcel plating area distributions serious unbalance is uneven causes the problem that the thick difference of copper is large.Even property object.
For achieving the above object, the technical solution of the utility model is:
A kind of graphic plating tool, it comprises, a tool palette, and size is consistent with the production plate of printed circuit board, and tool palette one side is conducting surface, and another side is nonconductive surface; Tool palette correspondence produces the region hollow out of plate graphic plating graphical distribution; Put together overlapping with the contraposition of production plate for the tool palette nonconductive surface after hollow out, tool palette conducting surface is by a wire and the production plate negative electrode being electrically connected on electroplating device in parallel.
Further, described tool palette is copper-clad plate, and its one side is posted dry film and formed nonconductive surface, or formation nonconductive surface is removed in copper-clad plate Copper Foil etching.
Again, described tool palette is copper coin or steel plate, and its one side is posted dry film and formed nonconductive surface.
The utility model adopts hollow out tool palette to add a plating " face shield " for producing plate, both the plating area of copper-clad plate (face shield) itself had been utilized to make up the problem of the plating area deficiency of producing plate, its hollow out feature in turn ensure that the liquid medicine switching requirement of producing plate plating area, play adjustment, improve and produce plate localised current distribution, and then reach the thick uniformity object of improvement production plate electro-coppering.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model graphic plating controls tool palette in embodiment.
Fig. 2 is the structural representation that the utility model graphic plating controls embodiment.
Fig. 3 is the profile that the utility model graphic plating controls embodiment.
Embodiment
See Fig. 1 ~ Fig. 3, a kind of graphic plating tool of the present utility model, it comprises, a tool palette 1, and size is consistent with the production plate 2 of printed circuit board, and tool palette 1 one side is conducting surface 11, and another side is nonconductive surface 12; Tool palette 1 correspondence produces region 13 hollow out of plate 2 plating patterns 21; Put together overlapping with the contraposition of production plate 2 for the tool palette nonconductive surface after hollow out, tool palette 1 conducting surface is by a wire 3 and production plate 1 negative electrode being electrically connected on electroplating device in parallel.
Further, described tool palette 1 is copper-clad plate, and its one side is posted dry film and formed nonconductive surface, or copper-clad plate Copper Foil etching removing is formed nonconductive surface.
Again, described tool palette 1 is copper coin or steel plate, and its one side is posted dry film and formed nonconductive surface.
Be positioned over overlapping with the contraposition of production plate 2 for tool palette 1 on graphic plating framework, and fix, ensure that producing plate 2 needs the figure 21 of plating to be in completely in region 13 scope of tool palette 1 hollow out, then puts into electro-coppering cylinder and carries out graphic plating.
Claims (3)
1. a graphic plating tool, is characterized in that, comprises, a tool palette, and size is consistent with the production plate of printed circuit board, and tool palette one side is conducting surface, and another side is nonconductive surface; Tool palette correspondence produces the region hollow out of plate graphic plating graphical distribution; Put together overlapping with the contraposition of production plate for the tool palette nonconductive surface after hollow out, tool palette conducting surface is by a wire and the production plate negative electrode being electrically connected on electroplating device in parallel.
2. graphic plating tool as claimed in claim 1, it is characterized in that, described tool palette is copper-clad plate, and its one side is posted dry film and formed nonconductive surface, or copper-clad plate Copper Foil etching removing is formed nonconductive surface.
3. graphic plating tool as claimed in claim 1, it is characterized in that, described tool palette is copper coin or steel plate, and its one side is posted dry film and formed nonconductive surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520662082.6U CN204859775U (en) | 2015-08-28 | 2015-08-28 | Tool is electroplated to figure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520662082.6U CN204859775U (en) | 2015-08-28 | 2015-08-28 | Tool is electroplated to figure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204859775U true CN204859775U (en) | 2015-12-09 |
Family
ID=54750282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520662082.6U Active CN204859775U (en) | 2015-08-28 | 2015-08-28 | Tool is electroplated to figure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204859775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110914482A (en) * | 2017-07-11 | 2020-03-24 | 株式会社荏原制作所 | Adjustment plate, anode holder, and substrate holder |
-
2015
- 2015-08-28 CN CN201520662082.6U patent/CN204859775U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110914482A (en) * | 2017-07-11 | 2020-03-24 | 株式会社荏原制作所 | Adjustment plate, anode holder, and substrate holder |
| CN110914482B (en) * | 2017-07-11 | 2022-02-22 | 株式会社荏原制作所 | Adjustment plate, anode holder, and substrate holder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |