CN204251743U - The sub-basket of a kind of thin PCB - Google Patents
The sub-basket of a kind of thin PCB Download PDFInfo
- Publication number
- CN204251743U CN204251743U CN201420731263.5U CN201420731263U CN204251743U CN 204251743 U CN204251743 U CN 204251743U CN 201420731263 U CN201420731263 U CN 201420731263U CN 204251743 U CN204251743 U CN 204251743U
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- framework
- tooth bar
- pcb
- thin pcb
- thin
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Abstract
The utility model discloses the sub-basket of a kind of thin PCB, comprise framework, the bottom of framework is provided with the Card trough be spacedly distributed, the spring jam plate for fastening thin PCB is provided with in each Card trough, the two ends of outermost Card trough are equipped with spring lock switching plate, removable tooth bar is provided with directly over framework, removable tooth bar is fixed on the top of framework by set nut, the height adjustable of removable tooth bar, removable tooth bar is provided with the rectangular indentation be spacedly distributed, each rectangular indentation is corresponding with the Card trough position of below, framework is also provided with two piercing wires along thin PCB orientation, each piercing wire is used for spacing thin PCB.The sub-basket of thin PCB of the present utility model, promotes thin plate process capability, production plate thickness of slab is reduced to 12mil by 28mil, good fixing effect, is suitable for the fixing of the pcb board of different size, reduces the condemnation factor of pcb board, cost-saving, structure is simple, has a good application prospect.
Description
Technical field
The utility model relates to the sub-basket of a kind of thin PCB, belongs to PCB manufacturing technology field.
Background technology
It is requisite operation in PCB manufacturing process that plating PTH makes, the glue slag that after it mainly removes boring, hole wall stays, it is made to metallize at hole wall, plating mode is utilized to thicken face copper thickness to reach the requirement of client and rear processing procedure, use plating positive tin mode to form etching auxiliary agent, make plate face form circuit.As shown in Figure 1, common sub-basket dress plank is used to produce in usual PCB manufacturing inherence plating PTH making processes, but when in production thin plate (being less than 28mil) process, because processing units is upper and lower, rock back and forth concussion, easily cause the pcb board in common sub-basket change plate, curling, to drop etc. abnormal, have a strong impact on the quality of producing thin plate.
Utility model content
The technical problem that the utility model solves is when in production thin plate (being less than 28mil) process, because processing units is upper and lower, rock back and forth concussion, easily cause the pcb board in common sub-basket change plate, curling, to drop etc. abnormal, have a strong impact on the problem of the quality of producing thin plate.The sub-basket of thin PCB of the present utility model, can promote thin plate process capability, and production plate thickness of slab is reduced to 12mil by 28mil, good fixing effect, reduces the condemnation factor of pcb board, cost-saving, and structure is simple, has a good application prospect.
In order to achieve the above object, the technical scheme that the utility model adopts is:
The sub-basket of a kind of thin PCB, it is characterized in that: the framework comprising rectangular shape, the bottom of described framework is provided with the Card trough be spacedly distributed, the spring jam plate for fastening thin PCB is provided with in each Card trough, the two ends of outermost Card trough are equipped with spring lock switching plate, removable tooth bar is provided with directly over described framework, described removable tooth bar is fixed on the top of framework by set nut, the height adjustable of described removable tooth bar, described removable tooth bar is provided with the rectangular indentation be spacedly distributed, and each rectangular indentation is corresponding with the Card trough position of below.
The sub-basket of aforesaid a kind of thin PCB, is characterized in that: described framework is also provided with two piercing wires along thin PCB orientation, and each piercing wire is used for spacing thin PCB.
The beneficial effects of the utility model are: the sub-basket of thin PCB of the present utility model, promote thin plate process capability, production plate thickness of slab is reduced to 12mil by 28mil, good fixing effect, be suitable for the fixing of the pcb board of different size, reduce the condemnation factor of pcb board, cost-saving, structure is simple, has a good application prospect.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional common sub-basket.
Fig. 2 is the structural representation of the sub-basket of thin PCB of the present utility model.
The implication marked in accompanying drawing is as follows:
1: framework 2: Card trough; 3: spring lock switching plate; 4: removable tooth bar; 5: set nut; 6: rectangular indentation; 7: piercing wire.
Embodiment
Below in conjunction with Figure of description, the utility model is further described.
As shown in Figure 2, the sub-basket of thin PCB of the present utility model, comprise the framework 1 of rectangular shape, the bottom of framework 1 is provided with the Card trough 2 be spacedly distributed, the spring jam plate for fastening thin PCB is provided with in each Card trough 2, the two ends of outermost Card trough 2 are equipped with spring lock switching plate 3, when thin PCB is placed in corresponding each Card trough 2, opened by spring lock switching plate 3 control spring jam plate, clamping thin PCB, removable tooth bar 4 is provided with directly over framework 1, removable tooth bar 4 is fixed on the top of framework 1 by set nut 5, removable tooth bar 4 is provided with the rectangular indentation 6 be spacedly distributed, each rectangular indentation 6 is corresponding with Card trough 2 position of below, each rectangular indentation 6 is from the fixing thin PCB of top restriction, the height adjustable of removable tooth bar 4, be suitable for the fixing of the thin PCB of different size, realize secondary location, framework 1 is also provided with two piercing wires 7 along thin PCB orientation, each piercing wire 7 is for spacing thin PCB, realize three location, promote thin plate process capability, production plate thickness of slab is reduced to 12mil by 28mil, reduce the condemnation factor of pcb board, cost-saving, structure is simple, have a good application prospect.
More than show and describe ultimate principle of the present utility model and principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification sheets just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (2)
1. the sub-basket of thin PCB, it is characterized in that: the framework (1) comprising rectangular shape, the bottom of described framework (1) is provided with the Card trough (2) be spacedly distributed, the spring jam plate for fastening thin PCB is provided with in each Card trough (2), the two ends of outermost Card trough (2) are equipped with spring lock switching plate (3), removable tooth bar (4) is provided with directly over described framework (1), described removable tooth bar (4) is fixed on the top of framework (1) by set nut (5), the height adjustable of described removable tooth bar (4), described removable tooth bar (4) is provided with the rectangular indentation (6) be spacedly distributed, each rectangular indentation (6) is corresponding with Card trough (2) position of below.
2. the sub-basket of a kind of thin PCB according to claim 1, is characterized in that: described framework (1) is also provided with two piercing wires (7) along thin PCB orientation, and each piercing wire (7) is for spacing thin PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420731263.5U CN204251743U (en) | 2014-11-26 | 2014-11-26 | The sub-basket of a kind of thin PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420731263.5U CN204251743U (en) | 2014-11-26 | 2014-11-26 | The sub-basket of a kind of thin PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204251743U true CN204251743U (en) | 2015-04-08 |
Family
ID=52956068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420731263.5U Active CN204251743U (en) | 2014-11-26 | 2014-11-26 | The sub-basket of a kind of thin PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204251743U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110042457A (en) * | 2019-04-04 | 2019-07-23 | 伯恩高新科技（惠州）有限公司 | A kind of cleaning hanger |
| CN110284176A (en) * | 2019-07-09 | 2019-09-27 | 广德今腾电子科技有限公司 | A kind of electroplanting device and electroplating technology of pcb board coating |
-
2014
- 2014-11-26 CN CN201420731263.5U patent/CN204251743U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110042457A (en) * | 2019-04-04 | 2019-07-23 | 伯恩高新科技（惠州）有限公司 | A kind of cleaning hanger |
| CN110284176A (en) * | 2019-07-09 | 2019-09-27 | 广德今腾电子科技有限公司 | A kind of electroplanting device and electroplating technology of pcb board coating |
| CN110284176B (en) * | 2019-07-09 | 2020-05-29 | 广德今腾电子科技有限公司 | Electroplating device and electroplating process for PCB coating |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |