CN106132117A - PTH sinks the PCB technology of directly figure transfer after copper - Google Patents
PTH sinks the PCB technology of directly figure transfer after copper Download PDFInfo
- Publication number
- CN106132117A CN106132117A CN201610543220.8A CN201610543220A CN106132117A CN 106132117 A CN106132117 A CN 106132117A CN 201610543220 A CN201610543220 A CN 201610543220A CN 106132117 A CN106132117 A CN 106132117A
- Authority
- CN
- China
- Prior art keywords
- copper
- pth
- pcb board
- sinks
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
Abstract
PTH sinks the PCB technology of directly figure transfer after copper, holes pcb board；Pcb board being delivered to after boring PTH and sinks copper, PTH sinks the hole copper copper thickness of copper and controls at 60 ± 20u "；Pcb board being fed directly to after heavy copper outer graphics transfer, first carries out pre-treatment, pre-treatment uses nylon bruss nog plate, then press mold, exposed and developed；Pcb board is delivered to graphic plating, and before graphic plating, microetch amount controls at 20 ± 10u ", it is ensured that without disconnected copper phenomenon in hole, through electro-coppering and stannum；Afterwards, pcb board is carried out alkali etching.The present invention reduces the costs such as corresponding equipment, manpower；Improve production efficiency, substantially reduce the overall friendship phase of product；It is substantially reduced the wiping flower rate of product, it is ensured that the product of finished product, improves product entirety yield.
Description
Technical field
The invention belongs to plating, line area that pcb board manufactures, be specifically related to PTH and sink the PCB of directly figure transfer after copper
Technique.
Background technology
Pcb board, also known as printed circuit board (PCB), printed substrate, is called for short printed board, with insulation board as base material, is cut into a scale
Very little, at least with a conductive pattern on it, and cloth porose (such as component hole, fastener hole, plated through-hole etc.), and realize electronics unit
Being connected with each other between device.Owing to this plate is to use electron printing to make, therefore it is referred to as " printing " circuit board.This
Circuit board ectonexine to be realized turns on, and needs to turn on inside and outside layer, i.e. electroplating technology by metallized hole.
At present, for yield and cost consideration, major part multilamellar ventilating hole plate uses positive flow process to make, graphic plating flow process
For: boring → PTH → electric plating of whole board → outer graphics transfer → graphic plating → alkali etching (such as Fig. 1), this Making programme exists
Needing upper hanger, lower hanger, omnidistance manual operation during electric plating of whole board, labor intensity is big, easily occurs that flower, quality are wiped in artificial plate face
Management and control difficulty is big.
Summary of the invention
The technical problem to be solved is, overcomes the drawbacks described above that prior art exists, it is provided that a kind of PTH sinks copper
The PCB technology of rear directly figure transfer, then graphic plating, alkali etching, cut electric plating of whole board flow process；Realize the fall of human cost
Low, material consumption cost reduces, product hands over the phase to shorten, the PTH of product quality improvement sinks the technique that the direct figure of copper shifts.
The technical solution adopted for the present invention to solve the technical problems is, PTH sinks the PCB work of directly figure transfer after copper
Skill, holes to pcb board；Pcb board being delivered to after boring PTH and sinks copper, PTH sinks the hole copper copper thickness of copper and controls at 60 ± 20u "；
Pcb board being fed directly to after heavy copper outer graphics transfer, first carries out pre-treatment, pre-treatment uses nylon bruss nog plate, then press mold,
Exposed and developed；Pcb board is delivered to graphic plating, and before graphic plating, microetch amount controls at 20 ± 10u ", it is ensured that without disconnected copper in hole
Phenomenon, electro-coppering and stannum；Afterwards, pcb board is carried out alkali etching.
Further, described pre-treatment uses 800 mesh nylon bruss nog plates.
Further, to sink the copper thickness of copper suitable for the thickness of the dry film press mold of described press mold and PTH.
Compared with prior art, the method have the advantages that
(1) save electric plating of whole board operation, decrease the costs such as corresponding equipment, manpower；
(2) technique using the transfer of PTH rich copper direct figure can save a turnover operation, improves production effect
Rate, substantially reduces the overall friendship phase of product；
(3) save upper hanger and lower hanger operation, be substantially reduced the wiping flower rate of product, it is ensured that the product of finished product, improve and produce
Product entirety yield.
Accompanying drawing explanation
Fig. 1 is the process chart of former technology；
Fig. 2 is the process chart of one embodiment of the invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment
Referring to Fig. 1, the PTH of the present embodiment sinks the PCB technology of directly figure transfer after copper, holes pcb board；Bore
Pcb board being delivered to behind hole PTH and sinks copper, PTH sinks the hole copper copper thickness of copper and controls at 60 ± 20u "；After heavy copper, pcb board is fed directly to
Outer graphics shifts, and first carries out pre-treatment, and pre-treatment uses nylon bruss nog plate, then press mold, exposed and developed；Pcb board is sent
To graphic plating, before graphic plating, microetch amount controls at 20 ± 10u ", it is ensured that without disconnected copper phenomenon, electro-coppering and stannum in hole；It
After, pcb board is carried out alkali etching.
In the present embodiment, described pre-treatment uses 800 mesh nylon bruss nog plates, effectively prevents from damaging hole copper and aperture copper.
In the present embodiment, it is suitable that the thickness of the dry film press mold of described press mold and PTH sink the copper thickness of copper.
Achieving the reduction of human cost, the reduction of material consumption cost, product hands over the phase to shorten, and product quality improves.
Claims (3)
1.PTH sinks the PCB technology of directly figure transfer after copper, it is characterised in that hole pcb board；By pcb board after boring
Delivering to PTH and sink copper, PTH sinks the hole copper copper thickness of copper and controls at 60 ± 20u "；After heavy copper, pcb board is fed directly to outer graphics turn
Moving, first carry out pre-treatment, pre-treatment uses nylon bruss nog plate, then press mold, exposed and developed；Pcb board is delivered to graphic plating,
Before graphic plating, microetch amount controls at 20 ± 10u ", it is ensured that without disconnected copper phenomenon, electro-coppering and stannum in hole；Afterwards, pcb board is entered
Row alkali etching.
PTH the most according to claim 2 sinks the PCB technology of directly figure transfer after copper, it is characterised in that described pre-treatment
Use 800 mesh nylon bruss nog plates.
3. want the PTH described in 1 or 2 to sink the PCB technology of directly figure transfer after copper according to right, it is characterised in that described press mold
Thickness and the PTH of dry film press mold to sink the copper thickness of copper suitable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610543220.8A CN106132117A (en) | 2016-07-12 | 2016-07-12 | PTH sinks the PCB technology of directly figure transfer after copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610543220.8A CN106132117A (en) | 2016-07-12 | 2016-07-12 | PTH sinks the PCB technology of directly figure transfer after copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106132117A true CN106132117A (en) | 2016-11-16 |
Family
ID=57282823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610543220.8A Pending CN106132117A (en) | 2016-07-12 | 2016-07-12 | PTH sinks the PCB technology of directly figure transfer after copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132117A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062537A (en) * | 2018-12-29 | 2019-07-26 | 博罗康佳精密科技有限公司 | A kind of preparation process of multiple layer metal substrate |
| CN116153791A (en) * | 2023-04-18 | 2023-05-23 | 圆周率半导体(南通)有限公司 | Copper column expanding process for IC carrier plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281500A (en) * | 2003-03-13 | 2004-10-07 | Sumitomo Metal Mining Co Ltd | Method of manufacturing multilayer printed wiring board |
| CN101854779A (en) * | 2010-06-04 | 2010-10-06 | 惠州中京电子科技股份有限公司 | Production process of metallized semi-pore |
| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
-
2016
- 2016-07-12 CN CN201610543220.8A patent/CN106132117A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281500A (en) * | 2003-03-13 | 2004-10-07 | Sumitomo Metal Mining Co Ltd | Method of manufacturing multilayer printed wiring board |
| CN101854779A (en) * | 2010-06-04 | 2010-10-06 | 惠州中京电子科技股份有限公司 | Production process of metallized semi-pore |
| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062537A (en) * | 2018-12-29 | 2019-07-26 | 博罗康佳精密科技有限公司 | A kind of preparation process of multiple layer metal substrate |
| CN116153791A (en) * | 2023-04-18 | 2023-05-23 | 圆周率半导体(南通)有限公司 | Copper column expanding process for IC carrier plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |
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| RJ01 | Rejection of invention patent application after publication |