CN202507663U - Steel mesh of welded printed circuit board (PCB) - Google Patents
Steel mesh of welded printed circuit board (PCB) Download PDFInfo
- Publication number
- CN202507663U CN202507663U CN2012200593677U CN201220059367U CN202507663U CN 202507663 U CN202507663 U CN 202507663U CN 2012200593677 U CN2012200593677 U CN 2012200593677U CN 201220059367 U CN201220059367 U CN 201220059367U CN 202507663 U CN202507663 U CN 202507663U
- Authority
- CN
- China
- Prior art keywords
- steel mesh
- scolding tin
- hole
- pcb board
- millimeter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a steel mesh of a welded printed circuit board (PCB). The steel mesh comprises a plurality of soldering holes, wherein an area in which the soldering holes are formed corresponds to an area in which the welded PCB can be welded; the area of each soldering hole is 0.785 to 19.625 square millimeters; and a solid clearance between every two soldering hole in the steel mesh is 0.3 to 1 millimeter. By the steel mesh, air bubbles generated by melting solder paste in the welding process can be effectively discharged, the problems of reduction in the amount of the solder paste on the middle parts of the soldering holes and local absence of soldering tin after a welding process can be solved, and the welding accuracy of the welded PCB can be improved.
Description
Technical field
The utility model relates to the mobile communication terminal device field, is specifically related to the steel mesh of solder type pcb board.
Background technology
Along with improving constantly of PCB solder technology, Type of Welding presents diversified trend, to a kind of novel solder type PCB welding requirements of present appearance, need a PCB be welded on another piece pcb board or other objects.But but existing PCB steel mesh to this novel solder technology is provided with single big scolding tin hole with respect to the welding region of solder type PCB.During welding, steel mesh is fixed on (like another piece PCB or other solderability objects) on the substrate to be welded; Steel mesh to fixing is brushed tin cream, and tin cream will be filled in the steel mesh perforate on the substrate to be welded this moment; Remove steel mesh, the tin cream that only have the steel mesh tapping to stay this moment on substrate to be welded; The solder type pcb board is fixed on the substrate of having brushed tin cream;
The steel mesh weak point in existing single scolding tin hole mainly show following some: 1) the steel mesh scolding tin hole of opening is excessive; But the size in scolding tin hole generally is close with the welding region size, and the part lacks scolding tin after can occurring the middle part tin cream amount minimizing in scolding tin hole like this and welding completion; 2) design in single scolding tin hole on the steel mesh, tin cream melts the bubble that produces in the time of can not effectively discharging welding; 3) single big scolding tin hole makes steel mesh relatively more difficult when the demoulding, particularly when the scolding tin hole is irregular.
The utility model content
The purpose of the utility model is the shortcoming to existing PCB steel mesh, and a kind of steel mesh of solder type pcb board is provided.
The technical scheme of the utility model is:
The steel mesh of solder type pcb board comprises:
A plurality of scolding tin hole, but it is corresponding with the welding region of solder type pcb board to offer the zone in said scolding tin hole;
The area in each scolding tin hole is between 0.785 square millimeter to 19.625 square millimeters;
Entity gap between each scolding tin hole is between 0.3 millimeter to 1 millimeter.
But the utility model is offered a plurality of scolding tin hole according to the welding region area of solder type pcb board on steel mesh, and tin cream melts the bubble that produces in the time of can effectively discharging welding; The size design in the scolding tin hole of offering on the steel mesh is become between 0.785 square millimeter to 19.625 square millimeters; In the entity gap between each scolding tin hole on the steel mesh between 0.3 millimeter to 1 millimeter; When being welded on a pcb board on another piece pcb board or other objects; The part lacks the problem of scolding tin after can effectively preventing the middle part tin cream amount minimizing in steel mesh hole and welding completion, improves the welding precision of solder type pcb board.
Preferably, the shaped design in the scolding tin hole of offering on the steel mesh is become the scolding tin hole of regular shape, as circular, square, the demoulding that can realize brushing the tin cream device effectively.
Preferably, select the steel mesh of thickness between 0.12 millimeter to 0.3 millimeter, can guarantee that the brush tin amount of steel mesh can be too much perhaps not very few.
Preferably, on steel mesh, evenly offer the scolding tin hole, tin cream melts the bubble that produces in the time of can more effectively discharging welding; The part lacks the problem of scolding tin after more effectively preventing the middle part tin cream amount minimizing in steel mesh scolding tin hole and welding completion.
Description of drawings
Fig. 1 is an embodiment sketch map of the utility model;
Fig. 2 is another embodiment sketch map of the utility model;
Fig. 3 is another embodiment sketch map of the utility model;
Fig. 4 is another embodiment sketch map of the utility model;
Fig. 5 is another embodiment sketch map of the utility model;
Fig. 6 is another embodiment sketch map of the utility model.
The specific embodiment
For ease of understanding, will combine accompanying drawing to set forth below.
But steel mesh according to the welding region area design of solder type pcb board;
Steel mesh is fixed on (like another piece PCB or other solderability objects) on the substrate to be welded;
Steel mesh to fixing is brushed tin cream, and tin cream will be filled in the steel mesh perforate corresponding on the substrate to be welded this moment;
Remove steel mesh, the tin cream that only have the steel mesh tapping to stay this moment on substrate to be welded;
The solder type pcb board is fixed on the substrate of having brushed tin cream;
Cross Reflow Soldering;
Accomplish the welding of solder type pcb board.
The utility model proposes the steel mesh of solder type pcb board, as a kind of specific embodiment, please refer to Fig. 1, comprising:
But, on steel mesh, offer a plurality of scolding tin hole 101 according to the welding region area design steel mesh of solder type pcb board; As shown in Figure 1, the scolding tin hole of offering 101 comprises the scolding tin hole of different shape; The area in each scolding tin hole is between 0.785 square millimeter to 19.625 square millimeters; Between 0.3 millimeter to 1 millimeter, promptly the gap a between scolding tin hole and scolding tin hole, b are between 0.3 millimeter to 1 millimeter in the entity gap between each scolding tin hole on the steel mesh.
As a kind of preferred implementation; The area in each scolding tin hole 101 is 0.785 square millimeter; When the entity gap that the scolding tin hole is 101 is 0.3 millimeter; Make that when on the PCB steel mesh, carrying out scolding tin, the soldering tin amount on the pcb board can not design too smallly because of scolding tin hole 101, and the problem of the middle part tin cream amount minimizing in steel mesh hole occurs; The area in each scolding tin hole 101 is 19.625 square millimeters; When the entity gap that the scolding tin hole is 101 is 1 millimeter; Make when on the PCB steel mesh, carrying out scolding tin that the soldering tin amount on the pcb board can be not too much because of scolding tin hole design, and the part lacks the problem of scolding tin after welding occurring and accomplishing.
As a kind of preferred implementation, if the area in the scolding tin hole of offering 101 the not enough problem of soldering tin amount then occurs easily less than 0.785 square millimeter; If the area in scolding tin hole 101 is greater than 19.625 square millimeters, when then occurring the welding completion easily, the part lacks the problem of soldering tin amount.
As a kind of preferred implementation,, can select the laser steel mesh in order to improve the welding precision of pcb board; Preferably, the area in the scolding tin hole that the laser steel mesh is offered is the value between 0.785 square millimeter to 3.14 square millimeters; For the laser steel mesh, when the area in the scolding tin hole of offering was 0.785 square millimeter of value between 3.14 square millimeters, the welding precision of pcb board was best.
As a kind of preferred implementation, in view of the consideration of environment for use or cost aspect, can select the chemical etching steel mesh, the area in the scolding tin hole 101 that the chemical etching steel mesh is offered is the value between 3.14 square millimeters to 19.625 square millimeters; For the chemical etching steel mesh, when the area in the scolding tin hole of offering 101 was 3.14 square millimeters of values between 19.625 square millimeters, the welding precision of pcb board was best.
But the utility model is offered a plurality of scolding tin hole according to the welding region area of solder type pcb board on steel mesh, and tin cream melts the bubble that produces in the time of can effectively discharging welding; The size design in the scolding tin hole of offering on the steel mesh is become the value between 0.785 square millimeter to 19.625 square millimeters; In the entity gap between each scolding tin hole on the steel mesh between 0.3 millimeter to 1 millimeter; When being welded on a pcb board on another piece pcb board or other objects, the part lacks the problem of scolding tin after can effectively preventing the middle part tin cream amount minimizing in steel mesh scolding tin hole and welding completion.
Brush tin cream for ease, but can locating hole 102 be set in the welding region external symmetry of pcb board, as shown in Figure 2.
In addition, tin cream melts the bubble that produces when welding for more effective discharge, and the entity gap in the scolding tin hole of on steel mesh, offering 101 equates.
As preferred embodiment a kind of, please refer to Fig. 3, the scolding tin hole of on the steel mesh of solder type pcb board, evenly offering is circular scolding tin hole 301; The diameter in circular scolding tin hole 301 is d, and wherein the value of d is between 1 millimeter to 5 millimeters; The gap of each circular scolding tin hole 301 horizontal direction is a, and the gap of each circular scolding tin hole 301 vertical direction is b, and equal because of the gap in 301 in each circular scolding tin hole, so a equals b, and the value of a is between 0.3 millimeter to 1 millimeter.
As another kind of optimal way, the diameter d in circular weld hole 301 is got 3mm, the gap a=b=0.7mm that each circular weld hole is 301; Steel mesh by this design welds, and after welding was accomplished, scolding tin was even, no bubble.
As preferred embodiment a kind of; The diameter in each circular scolding tin hole 301 is 1 millimeter; When the entity gap that each circular scolding tin hole is 301 is 0.3 millimeter; Make when on the PCB steel mesh, carrying out scolding tin that the soldering tin amount on the pcb board can not design too smallly because of circular scolding tin hole 301, and the problem of the middle part tin cream amount minimizing in steel mesh hole occurs; The diameter in each scolding tin hole 301 is 5 millimeters; When the entity gap between the scolding tin hole is 1 millimeter; Make when on the PCB steel mesh, carrying out scolding tin that the soldering tin amount on the pcb board can be not too much because of circular scolding tin hole 301 design, and the part lacks the problem of scolding tin after welding occurring and accomplishing.
As preferred embodiment a kind of, brush tin cream for ease, locating hole 102 can be set on the steel mesh device, but locating hole 102 can be symmetricly set on outside the welding region of pcb board, as shown in Figure 4.
As another preferred embodiment, please refer to Fig. 5, the hole of offering at the first-class interval of the steel mesh of solder type pcb board is square scolding tin hole 401; The length of side in square scolding tin hole 401 is L; The gap of each square scolding tin hole 401 horizontal direction is a, and the gap of each square scolding tin hole 401 vertical direction is b, because of the gap in 401 in each square scolding tin hole equates; So a equals b, and the value of a is between 0.3 millimeter to 1 millimeter.
Obviously, but can also on the PCB welding region, offer scolding tin hole circular and the square combination, perhaps the scolding tin hole of other difform combinations.
Brush tin cream for ease, can on the steel mesh device, offer locating hole 102, but locating hole 102 can be symmetricly set on outside the welding region of pcb board, as shown in Figure 6.
In addition, in order to improve the brush tin cream amount on the steel mesh, can select the steel mesh of thickness between 0.12 millimeter to 0.3 millimeter.When the steel mesh thickness of selecting during less than 0.12 millimeter, the part lacks the problem of scolding tin after occurring the problem that the middle part tin cream amount in scolding tin hole reduces easily and occur welding easily accomplishing; When the steel mesh thickness of selecting during greater than 0.3 millimeter, the part lacks the problem of scolding tin after occurring the too much problem of tin cream amount easily and occur welding easily accomplishing.
Above-described the utility model embodiment does not constitute the qualification to the utility model protection domain.The modification of being done within any spirit and principle at the utility model, be equal to replacement and improvement etc., all should be included within the claim protection domain of the utility model.
Claims (10)
1. the steel mesh of solder type pcb board is characterized in that, comprising:
A plurality of scolding tin hole, but it is corresponding with the welding region of solder type pcb board to offer the zone in said scolding tin hole; Wherein, the area in each scolding tin hole is between 0.785 square millimeter to 19.625 square millimeters;
Entity gap between each scolding tin hole is between 0.3 millimeter to 1 millimeter.
2. the steel mesh of solder type pcb board according to claim 1 is characterized in that, the entity gap between the scolding tin hole of offering equates.
3. the steel mesh of solder type pcb board according to claim 2 is characterized in that, said scolding tin hole is circular scolding tin hole.
4. the steel mesh of solder type pcb board according to claim 2 is characterized in that, said scolding tin hole is foursquare scolding tin hole.
5. according to the steel mesh of each described solder type pcb board of claim 1 to 4, it is characterized in that,
Said steel mesh is the laser steel mesh;
At the area in the scolding tin hole that said laser steel mesh is offered between 0.785 square millimeter to 3.14 square millimeters.
6. according to the steel mesh of each described solder type pcb board of claim 1 to 4, it is characterized in that,
Said steel mesh is the chemical etching steel mesh;
At the area in the scolding tin hole that said chemical etching steel mesh is offered between 3.14 square millimeters to 19.625 square millimeters.
7. the steel mesh of solder type pcb board according to claim 5 is characterized in that, the thickness of said steel mesh is between 0.12 millimeter to 0.3 millimeter.
8. the steel mesh of solder type pcb board according to claim 6 is characterized in that, the thickness of said steel mesh is between 0.12 millimeter to 0.3 millimeter.
9. according to the steel mesh of claim 7 or 8 described solder type pcb boards, it is characterized in that, but the welding region on pcb board is outside equipped with locating hole.
10. the steel mesh of solder type pcb board according to claim 9 is characterized in that, but said locating hole is symmetricly set on outside the welding region on the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200593677U CN202507663U (en) | 2012-02-22 | 2012-02-22 | Steel mesh of welded printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200593677U CN202507663U (en) | 2012-02-22 | 2012-02-22 | Steel mesh of welded printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202507663U true CN202507663U (en) | 2012-10-31 |
Family
ID=47060166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200593677U Expired - Fee Related CN202507663U (en) | 2012-02-22 | 2012-02-22 | Steel mesh of welded printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202507663U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103072367A (en) * | 2013-01-06 | 2013-05-01 | 奈电软性科技电子(珠海)有限公司 | Producing method for simple SMT (surface mount technology) otter board |
| CN103152978A (en) * | 2013-02-05 | 2013-06-12 | 上海华勤通讯技术有限公司 | Bonding pad, circuit board and manufacturing method for circuit board |
| CN103331999A (en) * | 2013-06-15 | 2013-10-02 | 成都聚合科技有限公司 | Array high concentrating photovoltaic cell printed steel mesh with positioning function |
| CN103331998A (en) * | 2013-06-15 | 2013-10-02 | 成都聚合科技有限公司 | Enhanced array hole type high-concentration photovoltaic cell bonding printing steel |
| CN103342043A (en) * | 2013-06-15 | 2013-10-09 | 成都聚合科技有限公司 | Irregular array hole type high concentrated photovoltaic steel mesh with positioning function |
| CN103342044A (en) * | 2013-06-15 | 2013-10-09 | 成都聚合科技有限公司 | High concentrated photovoltaic cell bonding and printing steel mesh with positioning function |
| CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
| CN108990265A (en) * | 2018-08-28 | 2018-12-11 | 竞华电子(深圳)有限公司 | A kind of solderability pcb board and its manufacture craft |
| CN109348640A (en) * | 2018-11-05 | 2019-02-15 | 贵州航天电子科技有限公司 | A kind of web plate for aluminum substrate Printing Paste |
-
2012
- 2012-02-22 CN CN2012200593677U patent/CN202507663U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
| CN103072367A (en) * | 2013-01-06 | 2013-05-01 | 奈电软性科技电子(珠海)有限公司 | Producing method for simple SMT (surface mount technology) otter board |
| CN103152978A (en) * | 2013-02-05 | 2013-06-12 | 上海华勤通讯技术有限公司 | Bonding pad, circuit board and manufacturing method for circuit board |
| CN103331999A (en) * | 2013-06-15 | 2013-10-02 | 成都聚合科技有限公司 | Array high concentrating photovoltaic cell printed steel mesh with positioning function |
| CN103331998A (en) * | 2013-06-15 | 2013-10-02 | 成都聚合科技有限公司 | Enhanced array hole type high-concentration photovoltaic cell bonding printing steel |
| CN103342043A (en) * | 2013-06-15 | 2013-10-09 | 成都聚合科技有限公司 | Irregular array hole type high concentrated photovoltaic steel mesh with positioning function |
| CN103342044A (en) * | 2013-06-15 | 2013-10-09 | 成都聚合科技有限公司 | High concentrated photovoltaic cell bonding and printing steel mesh with positioning function |
| CN108990265A (en) * | 2018-08-28 | 2018-12-11 | 竞华电子(深圳)有限公司 | A kind of solderability pcb board and its manufacture craft |
| CN109348640A (en) * | 2018-11-05 | 2019-02-15 | 贵州航天电子科技有限公司 | A kind of web plate for aluminum substrate Printing Paste |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202507663U (en) | Steel mesh of welded printed circuit board (PCB) | |
| CN205213155U (en) | Ladder steel mesh | |
| CN101841968A (en) | Circuit board with step-shaped blind hole and manufacturing method | |
| CN105234516A (en) | Reflow soldering process for electronic component printed circuit board | |
| CN201550359U (en) | Circuit board and steel mesh for manufacturing pad | |
| CN103002668B (en) | Terminal surface mounting method based on circuit board | |
| CN103415162B (en) | The method of steel mesh perforate | |
| CN104125721B (en) | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards | |
| CN201491379U (en) | Printed circuit board comprising LCD bonding pads | |
| CN201960236U (en) | Copper brazing graphite electrode | |
| CN202364474U (en) | PCB structure for handset | |
| CN202014438U (en) | SMT (surface mounted technology) printed template structure | |
| CN203056147U (en) | Welding pin structure of electronic component | |
| CN202475939U (en) | Packaging structure of board-to-board connector | |
| CN204859791U (en) | Circuit board welding jig with shelter from strake | |
| CN203279460U (en) | Shielding structural member and electronic apparatus equipped therewith | |
| CN107039384B (en) | Surface-mounted element | |
| CN204090329U (en) | The SMT printed steel mesh of anti-tin sweat(ing) | |
| CN203228481U (en) | SMT (surface mounted technology) printing stencil structure | |
| CN102655731A (en) | Structure of heat radiation metal substrate for power amplifier | |
| CN203409386U (en) | Turbulent wave nozzle cover plate | |
| CN202005073U (en) | Carrier plate jig capable of reducing tin soldering loss | |
| CN203590586U (en) | Circuit board | |
| CN110958786A (en) | Method for soldering tin on side surface of PCBA (printed Circuit Board Assembly) of on-chip paster | |
| CN202712168U (en) | Metal terminal surface structure for component chip welding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20150222 |
|
| EXPY | Termination of patent right or utility model |