CN201550359U - Circuit board and steel mesh for manufacturing pad - Google Patents

Circuit board and steel mesh for manufacturing pad Download PDF

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Publication number
CN201550359U
CN201550359U CN2009201710657U CN200920171065U CN201550359U CN 201550359 U CN201550359 U CN 201550359U CN 2009201710657 U CN2009201710657 U CN 2009201710657U CN 200920171065 U CN200920171065 U CN 200920171065U CN 201550359 U CN201550359 U CN 201550359U
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CN
China
Prior art keywords
pad
usb
auxiliary
hole
circuit board
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Expired - Lifetime
Application number
CN2009201710657U
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Chinese (zh)
Inventor
谢宗良
乔斌
彭德刚
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Huawei Device Co Ltd
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Priority to CN2009201710657U priority Critical patent/CN201550359U/en
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Abstract

The utility model discloses a circuit board and a steel mesh for manufacturing a pad, which relates to a surface bonding technology and solves the problem that an SMT process is unable to be applied to the product with a Mini USB device by adopting a book matching method. The circuit board comprises a first pad which is arranged correspondingly to a leg on the USB device and is used for welding the leg; and an auxiliary pad which is arranged correspondingly to a metal housing of the USB device and is used for welding the metal housing of the USB device. The steel mesh for manufacturing the pad comprises a first through hole which is arranged correspondingly to the leg on the USB device and is used for manufacturing the first pad; and an auxiliary through hole which is arranged correspondingly to a metal housing of the USB device and is used for manufacturing the auxiliary pad. The utility model is mainly used in the SMT process for products having the Mini USB device.

Description

Circuit board and the steel mesh that is used for the pad making
Technical field
The utility model relates to surface mounting technology, relates in particular to the circuit board in the surface mounting technology and is used for the steel mesh that pad is made.
Background technology
In making the end product process, need to adopt surface mounting technology (SMT, Surface MountTechnology) that various components and parts are welded on the printed circuit board (PCB) (PCB, Print Circuit Board).Comparatively Chang Yong surface mount process flow process as shown in Figure 1, at first need on the one side of PCB, be coated with tin cream (Paste deposition), and then the components and parts that will need to weld mount on the correspondence position of PCB (Component Placement), carry out reflow soldering (Dry andReflow) after finishing the mounting of components and parts, so just finished PCB wherein one side go up mounting of components and parts; Afterwards, with PCB turnover panel (Invert) and according to above-mentioned coating tin cream, components and parts mount and the process of reflow soldering is carried out surface mount process on the another side of PCB.
As shown in Figure 2, in above-mentioned surface mount process flow process, because need be with the PCB turnover panel, cause the components and parts that welded down, and when carrying out surface mount process on to another side at PCB, its solder reflow process can cause the tin cream of components and parts side correspondence down also can melt, in order to guarantee that components and parts down can not come off, this two-sided arts demand that carries out SMT satisfies following condition: the absorption affinity of the weight of the components and parts that mount earlier after less than the fusing of device pin and tin cream own.
As shown in Figure 3, when adopting positive jigsaw mode to carry out the SMT technological process since before the PCB turnover panel and behind the turnover panel to mount figure different, two SMT production lines of needs cause the production line cost higher.In order to reduce cost, adopt the mode of positive and negative jigsaw to carry out the SMT technological process usually.Specifically as shown in Figure 4, when adopting positive and negative jigsaw mode to carry out the SMT technological process, needs being carried out the pcb board of SMT technology arranges according to the mode that obverse and reverse replaces, like this, before the PCB turnover panel and turnover panel after the figure that mounts be duplicate, the SMT technology on two sides can be finished on same production line, reduced the cost of production line.Simultaneously, owing to do not need to shift production line, can improve the production efficiency of SMT.When adopting positive and negative jigsaw mode, the components and parts on the last two sides of PCB all can be behind turnover panel down, so, can not come off in order to guarantee components and parts down, need satisfy following condition: the absorption affinity of the weight of last all components and parts of PCB after own less than the fusing of device pin and tin cream.
State in realization in the process of SMT technology, the inventor finds that there are the following problems at least in the prior art: if need to mount heavier components and parts such as Mini USB device on this PCB, then can cause Mini USB device to come off.Present solution is to adopt positive jigsaw mode to carry out SMT technology when needs mount Mini USB device, and with Mini USB designs after carry out the side of attachment process, so just can prevent Mini
The USB device comes off, and still, the production efficiency that has produced SMT technology simultaneously is lower, and the production line cost is than problems such as height.
Summary of the invention
Embodiment of the present utility model provides a kind of circuit board and is used for the steel mesh that pad is made, and improves the production efficiency that mounts this USB device.
For achieving the above object, embodiment of the present utility model adopts following technical scheme:
A kind of circuit board, first pad that comprises corresponding setting with leg on the USB device, described first pad is used to weld described leg, comprises also and the auxiliary pad of the corresponding setting of metal shell of USB device that described auxiliary pad is used to weld the metal shell of described USB device.
A kind of steel mesh that is used for the pad making, first through hole that comprises corresponding setting with leg on the USB device, described first through hole is used to make first pad, comprises also and the auxiliary through hole of the corresponding setting of metal shell of USB device that described auxiliary through hole is used to make auxiliary pad.
Circuit board that the utility model embodiment provides and the steel mesh that is used for the pad making, wherein the pad pad on the circuit board can utilize steel mesh to form on pcb board, because steel mesh is provided with auxiliary through hole, the last naturally pad that forms also can comprise auxiliary pad.Because comprise auxiliary pad in the pad of above-mentioned USB device, after welding, this auxiliary pad can be welded together with the metal shell on the USB device, makes that the pad between USB device and the PCB has further increased.So, after the tin cream fusing of USB device, the absorption affinity after USB device pin and the tin cream fusing also can increase along with the increase of pad, thereby the weight that guarantees the USB device can be less than the absorption affinity after USB device pin and the tin cream fusing.
So, after the utility model embodiment circuit board that provides and the steel mesh that is used for the pad making are provided, when carrying out the mounting of USB device, the USB device can be placed down, so, when needs mount Mini USB device, can adopt the mode of positive and negative jigsaw to carry out SMT technology, make before the PCB turnover panel and turnover panel after the figure that mounts be duplicate, the SMT technology on two sides can be finished on same production line, reduced the cost of production line.Simultaneously, owing to do not need to shift production line, can improve the production efficiency of SMT.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the surface mount process schematic flow sheet;
Fig. 2 carries out schematic diagram behind the turnover panel for PCB in the surface mount process process;
Fig. 3 is the jigsaw structure chart of positive jigsaw in the surface mount process;
Fig. 4 is the jigsaw structure chart of positive and negative jigsaw in the surface mount process;
The one side shape schematic diagram of Fig. 5 for fitting with PCB on the Mini USB device;
Fig. 6 is the schematic diagram of pad on the circuit board of the utility model embodiment;
Fig. 7 is first kind of distortion of pad schematic diagram on the circuit board of the utility model embodiment;
Fig. 8 is second kind of distortion of pad schematic diagram on the circuit board of the utility model embodiment;
Fig. 9 is the third distortion schematic diagram of pad on the circuit board of the utility model embodiment;
Figure 10 is the structure chart of the steel mesh that is used for the pad making of the utility model embodiment.
Embodiment
The one side that fits with PCB on the Mini USB device as shown in Figure 5, two pins of 1 liang of middle side part of Mini USB device for the perforation leg 2, this perforation leg 2 need penetrate in the hole of pcb board; MiniUSB device 1 among the figure also comprises a metal shell 3, and Mini USB device 1 can be realized welding by this metal shell 3; The top of Mini USB device 1 also comprises leg 4.
Because Mini USB device leg 4, perforation leg 2 and PCB go up corresponding bonding pad and concentrate on top shown in Figure 5, after welding is finished as Mini USB device, Mini USB device is carried out the reflow soldering second time down, after the tin cream fusing, because the leg of Mini USB device and the absorption affinity that the pad tin cream can provide are very little, cause the weight of the absorption affinity sum of leg and pad tin cream, cause Mini USB device to come off less than Mini USB device.So, by existing pad design, when production has the product of Mini USB device, can not place Mini USB down, cause using positive and negative jigsaw mode to mount.Make that the production efficiency of SMT is lower, cost is just than higher.
The utility model embodiment provides the circuit board of the USB device that can enhance productivity and is used for the steel mesh that pad is made, to overcome defective of the prior art, below in conjunction with the accompanying drawing among the utility model embodiment, technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Pad on the circuit board of the utility model embodiment as shown in Figure 6, it comprise with Mini USB device on the pad 5 of leg 4 corresponding settings, in order to improve the absorption affinity after leg and tin cream melt, the utility model Mini USB device bonding pad embodiment also comprises the auxiliary pad 6 of the metal shell 3 corresponding settings bottom Mini USB device, being somebody's turn to do auxiliary pad 6 can be welded together with the metal shell 3 of Mini USB device bottom, makes that the pad between Mini USB device and the PCB has further increased.Original pad among the utility model embodiment except auxiliary pad 6 all can be described as first pad.
So, after the tin cream fusing of Mini USB device, absorption affinity after Mini USB device pin and the tin cream fusing also can increase along with the increase of pad, thereby the weight that guarantees Mini USB device can be less than the absorption affinity after Mini USB device pin and the tin cream fusing.
So, when needs mount Mini USB device, can adopt positive and negative jigsaw mode to carry out SMT technology, make before the PCB turnover panel and turnover panel after the figure that mounts be duplicate, the SMT technology on two sides can be finished on same production line, reduced the cost of production line.Simultaneously, owing to do not need to shift production line, can improve the production efficiency of SMT.
Before using the utility model, all use the veneer of Mini USB device, all adopt positive jigsaw mode in the SMT technology, and the production efficiency that SMT produces line is low.After adopting the utility model, do not need to revise Mini USB device, do not increase PCB design and cost of manufacture, can in SMT technology, adopt positive and negative jigsaw mode, same product, the efficient of SMT production line can promote about 5%, thereby reduces the production cost of SMT.
As shown in Figure 5, comprise two perforation legs 2 that are separately positioned on USB device both sides in the leg of Mini USB device, among Fig. 6 corresponding with perforation leg 2 be provided be the pad 7 of boring a hole; In order to make the absorption affinity proportionality action that increases newly on Mini USB device, auxiliary pad 6 described in the utility model embodiment is arranged between described two perforation pads 7, and the lower limb of described auxiliary pad 6 is concordant with the lower limb of described two perforation pads 7.After factors such as comprehensive absorption affinity requirement and pad cost of manufacture, can will assist pad 6 to be set to the rectangle of 2.0mm*1.5mm.
When practice, the structure of auxiliary pad 6 can be carried out certain accommodation, only need and to realize welding with the MiniUSB device, thereby increase absorption affinity, general implementation mainly comprises: zone corresponding with metal shell 3 parts of MiniUSB device bottom on PCB increases auxiliary pad 6, and the number of auxiliary pad 6 can be one, also can be a plurality of; Even auxiliary pad 6 can adopt random geometry, for example: the pad of different shapes such as rectangle, circle, ellipse or other arbitrary polygons.
As shown in Figure 7, auxiliary pad 8 can be the rectangular pads of two parallel arranged, is used for metal shell 3 welding with Mini USB device bottom; As shown in Figure 8, auxiliary pad 9 can be an oval-shaped pad, is used for metal shell 3 welding with Mini USB device bottom; As shown in Figure 9, auxiliary pad 10 can be 3 rectangular pads that are the arrangement of " product " font, is used for metal shell 3 welding with Mini USB device bottom.
Pad shown in the above embodiment, is arranged on the pcb board to Fig. 9 with reference to figure 6, and these pads are used for welding mutually with leg 4, perforation leg 2 or the metal shell 3 of Mini USB device respectively, so that the MiniUSB device is welded on the PCB.
When on circuit board, making pad, steel mesh and circuit board need be secured together, because steel mesh is provided with the through hole corresponding with pad, so can directly be printed on tin cream on the steel mesh, will form the tin cream corresponding with through hole on the steel mesh on the pad of PCB after steel mesh taken away, the tin cream of pad can be welded to device on the PCB.
As shown in figure 10, the utility model embodiment also provides a kind of steel mesh 11 that pad is made that is used for, and the pad that utilizes this steel mesh 11 to produce can adsorb Mini USB device more firmly.As shown in figure 10, this steel mesh 11 comprise with Mini USB device on the through hole 12 of leg 4 corresponding settings, in order to increase the absorption affinity of pad, the utility model steel mesh also comprises the auxiliary through hole 13 with the metal shell 3 corresponding settings of USB device bottom.Original pad among the utility model embodiment except auxiliary pad all can be described as first pad, except that assisting the original through hole by 13 all to can be described as first through hole.
Be provided with auxiliary through hole 13 owing to be used for the steel mesh of pad making, the last naturally pad that forms also can comprise auxiliary pad.Description by the pad embodiment of top Mini USB device can be learnt: can guarantee that the weight of Mini USB device can be less than the absorption affinity after Mini USB device pin and the tin cream fusing after forming auxiliary pad.So, when needs mount Mini USB device, can adopt positive and negative jigsaw mode to carry out SMT technology, make before the PCB turnover panel and turnover panel after the figure that mounts be duplicate, the SMT technology on two sides can be finished on same production line, reduced the cost of production line.Simultaneously, owing to do not need to shift production line, can improve the production efficiency of SMT.
Comprise two perforation legs 2 that are separately positioned on USB device both sides among Fig. 5 in the leg of Mini USB device, among Figure 10 with the corresponding settings of perforation leg 2 be side through hole 14; In order to make the absorption affinity proportionality action that increases newly on Mini USB device, auxiliary through hole 13 described in the utility model embodiment is arranged between described two side through holes 14, and the lower limb of described auxiliary through hole 13 is concordant with the lower limb of described two side through holes 14.After comprehensive and factors such as absorption affinity requirement and pad cost of manufacture, can be the rectangle of 2.0mm*1.5mm with auxiliary through hole 13.
When practice, the structure of auxiliary through hole 13 can be carried out certain accommodation, as long as can realize welding with Mini USB device with auxiliary through hole 13 corresponding bonding pad, thereby increase absorption affinity, general implementation mainly comprises: zone corresponding with metal shell 3 parts of Mini USB device bottom on steel mesh increases auxiliary through hole, and auxiliary through hole 13 numbers can be one, also can be a plurality of; Even auxiliary through hole 13 can adopt any specific geometry, for example: the through hole of different shapes such as rectangle, circle, ellipse or arbitrary polygon.Specifically can be according to the shape of the auxiliary pad 10 of the auxiliary pad 9 of the auxiliary pad 8 of Fig. 7, Fig. 8, Fig. 9, correspondence is provided with the structure of auxiliary through hole 13.
The pad of the utility model USB device and steel mesh mainly are used in the SMT technology with Mini USB device products.
The above; it only is embodiment of the present utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion by described protection range with claim.

Claims (10)

1. circuit board, comprise first pad of corresponding setting with leg on the USB device, described first pad is used to weld described leg, it is characterized in that, comprise also and the auxiliary pad of the corresponding setting of metal shell of USB device that described auxiliary pad is used to weld the metal shell of described USB device.
2. circuit board according to claim 1 is characterized in that, described first pad comprises corresponding two perforation pads that are provided with the perforation leg that is arranged on USB device both sides; Described auxiliary pad is arranged between described two perforation pads, and the lower limb of described auxiliary pad is concordant with the lower limb of described two perforation pads.
3. the circuit board of USB device according to claim 2 is characterized in that, described auxiliary pad is the rectangle of 2.0mm*1.5mm.
4. the circuit board of USB device according to claim 1 is characterized in that, in the corresponding zone, described auxiliary pad comprises that at least one has the pad of geometry to the metal shell that described auxiliary pad is arranged on described USB device on described circuit board.
5. the circuit board of USB device according to claim 4 is characterized in that, described geometry is: rectangle, circle, ellipse or arbitrary polygon.
6. according to each described circuit board of claim 1 to 5, it is characterized in that described circuit board also comprises the USB device, the leg of described USB device welds mutually with described first pad, and the metal shell of described USB device welds mutually with described auxiliary pad.
7. one kind is used for the steel mesh that pad is made, comprise first through hole of corresponding setting with leg on the USB device, described first through hole is used to make first pad, it is characterized in that, comprise also and the auxiliary through hole of the corresponding setting of metal shell of USB device that described auxiliary through hole is used to make auxiliary pad.
8. the steel mesh that is used for the pad making according to claim 7 is characterized in that described first through hole comprises two side through holes of corresponding setting with the perforation leg that is arranged on USB device both sides; Described auxiliary through hole is arranged between described two side through holes, and the lower limb of described auxiliary through hole is concordant with the lower limb of described two side through holes.
9. the steel mesh that is used for the pad making according to claim 8 is characterized in that described auxiliary through hole is the rectangle of 2.0mm*1.5mm.
10. the steel mesh that is used for the pad making according to claim 7, it is characterized in that, described auxiliary through hole is arranged on the metal shell of described USB device and states in the zone corresponding on the circuit board described, and described auxiliary through hole comprises that at least one has the through hole of geometry;
Described geometry is: rectangle, circle, ellipse or arbitrary polygon.
CN2009201710657U 2009-08-17 2009-08-17 Circuit board and steel mesh for manufacturing pad Expired - Lifetime CN201550359U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028678A (en) * 2016-07-22 2016-10-12 深圳天珑无线科技有限公司 Steel mesh
CN107171158A (en) * 2017-04-18 2017-09-15 深圳市宇隆宏天科技有限公司 A kind of production method of USB TYPE C modules
CN108040436A (en) * 2017-12-08 2018-05-15 郑州云海信息技术有限公司 A kind of asymmetric IC pads steel mesh of PCBA and its design method
CN109041426A (en) * 2018-08-02 2018-12-18 苏州彤帆智能科技有限公司 A kind of yin-yang plate manufacture craft
CN110958768A (en) * 2019-12-25 2020-04-03 浪潮商用机器有限公司 PCB (printed circuit board) bonding pad and manufacturing method thereof
CN111836479A (en) * 2020-07-08 2020-10-27 苏州浪潮智能科技有限公司 Pad processing device and pad maintenance method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028678A (en) * 2016-07-22 2016-10-12 深圳天珑无线科技有限公司 Steel mesh
CN107171158A (en) * 2017-04-18 2017-09-15 深圳市宇隆宏天科技有限公司 A kind of production method of USB TYPE C modules
CN107171158B (en) * 2017-04-18 2019-06-07 深圳市宇隆宏天科技有限公司 A kind of production method of USB TYPE-C mould group
CN108040436A (en) * 2017-12-08 2018-05-15 郑州云海信息技术有限公司 A kind of asymmetric IC pads steel mesh of PCBA and its design method
CN109041426A (en) * 2018-08-02 2018-12-18 苏州彤帆智能科技有限公司 A kind of yin-yang plate manufacture craft
CN110958768A (en) * 2019-12-25 2020-04-03 浪潮商用机器有限公司 PCB (printed circuit board) bonding pad and manufacturing method thereof
CN111836479A (en) * 2020-07-08 2020-10-27 苏州浪潮智能科技有限公司 Pad processing device and pad maintenance method

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Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
TR01 Transfer of patent right

Effective date of registration: 20181220

Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province

Patentee after: Huawei Device Co., Ltd.

Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong.

Patentee before: Huawei Terminal (Shenzhen) Co., Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong.

Patentee after: Huawei Terminal (Shenzhen) Co., Ltd.

Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong.

Patentee before: Huawei Device Co., Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20100811

CX01 Expiry of patent term