CN103152978A - Bonding pad, circuit board and manufacturing method for circuit board - Google Patents
Bonding pad, circuit board and manufacturing method for circuit board Download PDFInfo
- Publication number
- CN103152978A CN103152978A CN2013100465269A CN201310046526A CN103152978A CN 103152978 A CN103152978 A CN 103152978A CN 2013100465269 A CN2013100465269 A CN 2013100465269A CN 201310046526 A CN201310046526 A CN 201310046526A CN 103152978 A CN103152978 A CN 103152978A
- Authority
- CN
- China
- Prior art keywords
- conductor portion
- circuit board
- pad
- conductor
- tin cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a bonding pad, a circuit board and a manufacturing method for the circuit board. The bonding pad comprises a first conductor part and a second conductor part; the first conductor part and the second conductor part are insulated from each other; and a slit is formed between the first conductor part and the second conductor part. By the bonding pad, the circuit board and the manufacturing method for the circuit board, a new circuit jumper mode is provided, device cost and surface mount device cost are saved, the area and space for circuit elements are saved, and problem points are easily founded in the testing and debugging process and are convenient to maintain.
Description
Technical field
The present invention relates to electronic technology field, relate in particular to the manufacture method of pad, circuit board and circuit board.
Background technology
Pad of the prior art (Pad) is for being used for mounting the dew copper zone of electronic devices and components on circuit board.On circuit board of the prior art, as shown in Figure 1, be connected by a circuit direct circuit on circuit board between power supply and device, do not possess like this function of wire jumper between power supply and device, when circuit board goes wrong, be difficult to find fast the problem origination point, detection and maintenance difficulty are larger; A kind of improved mode is arranged in prior art, and as shown in Figure 2, namely the welding Zero-ohm resistor realizes that power supply is connected with circuit between device between power supply and device.Like this, when circuit board goes wrong, can will disconnect between power supply and device by the mode of removing described Zero-ohm resistor, be convenient to circuit board is detected, be convenient to find the problem origination point, brought convenience for detection and maintenance.But the Zero-ohm resistor cost is higher, and the fraction defective large and that mount that takes up room is higher.Especially for jumbo chips such as CPU, the core voltage of its work etc. all needs several amperes even tens amperes, if be used as wire jumper with Zero-ohm resistor, because power ratio is larger, the device that often needs very large encapsulation not only brings cost to raise, and occupies very large circuit board space.
Summary of the invention
The manufacture method that the purpose of this invention is to provide a kind of pad, circuit board and circuit board.
Pad provided by the present invention comprises the first conductor portion and the second conductor portion, is provided with slit between described the first conductor portion and the second conductor portion mutually insulated and described the first conductor portion and the second conductor portion.
Circuit board provided by the present invention is provided with conductor line, and described conductor line comprises the first path, alternate path and pad; Described the first path and alternate path connect respectively the first conductor portion and second conductor portion of described pad.
The manufacture method of circuit board provided by the invention comprises: S1 arranges the pad with the first conductor portion and second conductor portion; Have slit and described the first conductor portion and the second conductor portion mutually insulated between described the first conductor portion and described the second conductor portion, the pad described in embodiment one namely is set; S2 covers the steel mesh through windowing on described circuit board; S3 is the brushing tin cream on described circuit board; S4 removes steel mesh; S5 is placed on circuit board in brazier and heats, and the tin cream that covers on the tin cream that covers on the first conductor portion and the second conductor portion is combined together; The S6 cooling circuit board.
The manufacture method of pad provided by the present invention, circuit board and circuit board, a kind of new circuit jumper is provided, save device cost and paster expense, more save circuit goods of furniture for display rather than for use area and space, be more convenient for finding problem points, convenient for maintaining in test and debug process.
Description of drawings
Fig. 1 is the circuit diagram that does not have the wire jumper setting described in background technology;
Fig. 2 is the circuit diagram that utilizes the Zero-ohm resistor wire jumper described in background technology;
Fig. 3 and Fig. 4 are the structural representation of two embodiment of embodiment one described pad;
Fig. 5 is the electrical block diagram of the conductor line of the embodiment of the present invention two described circuit boards;
Fig. 6 is the change procedure schematic diagram of tin cream on the pad of the in-line slit described in embodiment one;
Fig. 7 is the change procedure schematic diagram of tin cream on the pad of the bending structure slit described in embodiment one;
Fig. 8 is the electrical block diagram that is provided with the Electron Equipment Circuit Board of described pad, and the rectangle shown in circuit represents the pad 100 described in the embodiment of the present invention one, does not carry out the part sign in Fig. 8.
Embodiment
For the purpose, technical scheme and the advantage that make the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Embodiment one
As Fig. 3 or shown in Figure 4, a kind of pad 100 comprises the first conductor portion 1 and the second conductor portion 2, is provided with slit 3 between described the first conductor portion 1 and the second conductor portion 2 mutually insulateds and described the first conductor portion 1 and the second conductor portion 2.It will be appreciated by those skilled in the art that, in the SMT of factory process, can brush respectively tin cream and enter again the brazier processing on described the first conductor and the second conductor, in this process, the tin cream 52 that covers on the tin cream 51 that covers on described the first conductor and the second conductor is fused into an integral body under the effect of stress, described the first conductor and the second conductor are conducted, thereby make described pad 100 be in conducting state.Zero-ohm resistor of the prior art can be replaced with the pad 100 that the present embodiment provides like this, realize that power supply is connected with the circuit of device.When circuit board breaks down, can utilize the mode of flatiron heating to remove the tin cream that covers on described pad 100, described the first conductor disconnects mutually with the second conductor, thereby makes described pad 100 be in off state, is convenient to circuit board is detected and keeps in repair.
As shown in Figure 4, further, described the first conductor portion 1 and the second conductor portion 2 are rectangle.Described like this slit 3 is in-line.The pad 100 of this structure, manufacturing process is simpler, but due to effect of stress, tin cream 52 syncretizing effects that cover on the tin cream 51 that covers on the first conductor and the second conductor are not good.
As shown in Figure 3, preferably, described the first conductor portion 1 and the second conductor portion 2 are mutually inverted L shaped.Described like this slit 3 is bending structure, under the effect of stress, the tin cream 52 that covers on the tin cream 51 that covers on the first conductor and the second conductor has syncretizing effect preferably, makes the conducting effect of described the first conductor portion 1 and the second conductor portion 2 better, guarantees the conducting state of described pad 100.
Further, described the first conductor portion 1 and the second conductor portion 2 can be stairstepping, and described like this slit 3 has many places bendings, and be better with the syncretizing effect of the tin cream 52 that covers on the tin cream 51 that guarantees to cover on the first conductor and the second conductor.
The width of described slit 3 is less than or equal to 0.15 millimeter.Like this, can guarantee that the tin cream 52 that covers on the tin cream 51 that covers on the first conductor and the second conductor merges fully in brazier.
Embodiment two
As Fig. 5 and shown in Figure 8, the present embodiment provides the circuit board of having used the described pad 100 of embodiment, be provided with conductor line on described circuit board, described conductor line comprises the first path 41 and alternate path 42, and described the first path 41 is connected the first conductor portion 1 and the second conductor portion 2 that connects respectively described pad 100 with alternate path.It will be understood by those skilled in the art that described conductor line is used for connecting power supply, chip and device, realize that the circuit between power supply, chip and device connects.After the tin cream on described pad 100 merged, described pad 100 was in conducting state, and power supply, chip or the device at described conductor line two ends are realized conducting; Tin cream on pad 100 is removed, and described pad 100 is in off-state, and described conductor line is for opening circuit, and power supply, chip or the device at described conductor line two ends disconnect mutually, search problem a little when being convenient to detect maintenance.
Embodiment three
As Figure 6 and Figure 7, this enforcement provides a kind of manufacture method of circuit board, comprises the steps:
S1 arranges the pad with the first conductor portion and second conductor portion; Have slit and described the first conductor portion and the second conductor portion mutually insulated between described the first conductor portion and described the second conductor portion, the pad described in embodiment one namely is set.As shown in Figure 4, described the first conductor portion 1 and the second conductor portion 2 are rectangle, and described like this slit 3 is in-line.The pad of this structure, manufacturing process is simpler, but due to effect of stress, tin cream 52 syncretizing effects that cover on the tin cream 51 that covers on the first conductor and the second conductor are not good.As shown in Figure 3, described the first conductor portion 1 and the second conductor portion 2 can also be for mutually inverted L shaped, described like this slit 3 is bending structure, under the effect of stress, the tin cream 52 that covers on the tin cream 51 that covers on the first conductor and the second conductor has syncretizing effect preferably, make the conducting effect of described the first conductor portion 1 and the second conductor portion 2 better, guarantee the conducting state of described pad.Described the first conductor portion 1 and the second conductor portion 2 can also be stairstepping, and described like this slit 3 has many places bendings, and be better with the syncretizing effect of the tin cream 52 that covers on the tin cream 51 that guarantees to cover on the first conductor and the second conductor.The width of described slit 3 is less than or equal to 0.15 millimeter.Like this, can guarantee that the tin cream 52 that covers on the tin cream 51 that covers on the first conductor and the second conductor merges fully in brazier.
S2 covers the steel mesh through windowing on described circuit board; It will be appreciated by those skilled in the art that, described steel mesh through windowing refers to arrange some through holes on steel plate, the position of described through hole, shape and size all with described pad on conductor portion corresponding, because the step that covers steel mesh is in the routine techniques means, therefore no longer to give unnecessary details here.
S3 is the brushing tin cream on described circuit board; All be coated with uniformly one deck tin cream on the conductor portion of described like this steel mesh and described pad.
S4 removes steel mesh, the tin cream that covers on the tin cream that cover on the first conductor portion this moment and the second conductor portion
Be the state that is separated from each other.Described pad is off-state, and the conductor line on described circuit board also is in off-state.
Further, be provided with the first through hole and the second through hole on described steel mesh, the position of described the first through hole, shape are mutually consistent with size and described the first conductor portion; The position of described the second through hole, shape are mutually consistent with size and described the second conductor portion.Like this, on described slit, through hole is not set, tin cream can't cover on described slit, after removing steel mesh, the tin cream that covers on the tin cream that covers on described the first conductor portion and described the second conductor portion is the state that is separated from each other, need to two parts tin cream be merged by heating, therefore also comprise:
S5 is placed on circuit board in brazier and heats, and the tin cream that covers on the tin cream that covers on the first conductor portion and the second conductor portion is combined together.At this moment, described pad is conducting state, and the conductor line on described circuit board also is in conducting state.
The S5 cooling circuit board.At this moment, the manufacture process of completing circuit plate.
Further, on described steel mesh, described the first conductor portion and the second conductor portion and slit integral body are windowed.Like this, tin cream covers integral body on described the first conductor portion and the second conductor portion and slit, and the tin cream of this moment itself is integrality, need not to heat fusion again, therefore can omit the step of above-mentioned heating and cooling in brazier.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment, the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. pad, it is characterized in that: comprise the first conductor portion (1) and the second conductor portion (2), be provided with slit (3) between described the first conductor portion (1) and the second conductor portion (2) mutually insulated and described the first conductor portion (1) and the second conductor portion (2).
2. pad as claimed in claim 1, it is characterized in that: described the first conductor portion (1) and the second conductor portion (2) are rectangle.
3. pad as claimed in claim 1 is characterized in that: described the first conductor portion (1) and the second conductor portion (2) are for mutually inverted L shaped.
4. pad as claimed in claim 1, it is characterized in that: described the first conductor portion (1) and the second conductor portion (2) can be stairstepping.
5. pad as described in claim 1 to 4, it is characterized in that: the width of described slit (3) is less than or equal to 0.15 millimeter.
6. circuit board, described circuit board is provided with conductor line, it is characterized in that: described conductor line comprises the pad described in the first path (41), alternate path (42) and claim 1 to 4; Described the first path (41) is connected 42 with alternate path) connect respectively the first conductor portion (1) and second conductor portion (2) of described pad.
7. the manufacture method of a circuit board, is characterized in that, comprising:
S1 arranges the pad with the first conductor portion and second conductor portion; Have slit and described the first conductor portion and the second conductor portion mutually insulated between described the first conductor portion and described the second conductor portion, the pad described in embodiment one namely is set;
S2 covers the steel mesh through windowing on described circuit board;
S3 is the brushing tin cream on described circuit board;
S4 removes steel mesh;
S5 is placed on circuit board in brazier and heats, and the tin cream that covers on the tin cream that covers on the first conductor portion and the second conductor portion is combined together;
The S6 cooling circuit board.
8. method as claimed in claim 7 is characterized in that: be provided with the first through hole and the second through hole on described steel mesh, the position of described the first through hole, shape are mutually consistent with size and described the first conductor portion; The position of described the second through hole, shape are mutually consistent with size and described the second conductor portion.
9. the manufacture method of a circuit board, is characterized in that, comprising:
S1 arranges the pad with the first conductor portion and second conductor portion; Have slit and described the first conductor portion and the second conductor portion mutually insulated between described the first conductor portion and described the second conductor portion, the pad described in embodiment one namely is set;
S2 covers the steel mesh through windowing on described circuit board;
S3 is the brushing tin cream on described circuit board;
S4 removes steel mesh.
10. method as claimed in claim 9 is characterized in that: on described steel mesh, described the first conductor portion and the second conductor portion and slit integral body are windowed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100465269A CN103152978A (en) | 2013-02-05 | 2013-02-05 | Bonding pad, circuit board and manufacturing method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100465269A CN103152978A (en) | 2013-02-05 | 2013-02-05 | Bonding pad, circuit board and manufacturing method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103152978A true CN103152978A (en) | 2013-06-12 |
Family
ID=48550767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100465269A Pending CN103152978A (en) | 2013-02-05 | 2013-02-05 | Bonding pad, circuit board and manufacturing method for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103152978A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228342A (en) * | 2015-08-31 | 2016-01-06 | 昆山龙腾光电有限公司 | A kind of circuit board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4889961A (en) * | 1988-08-10 | 1989-12-26 | E. F. Johnson Company | Graphite trace electrical interconnect |
| CN1112351A (en) * | 1994-04-22 | 1995-11-22 | 美国电报电话公司 | Printed circuit board circuit control device |
| CN1283954A (en) * | 1999-08-09 | 2001-02-14 | 三星电子株式会社 | Printed circuit board and mask of screen printing such printed circuit bard |
| JP2007194240A (en) * | 2006-01-17 | 2007-08-02 | Toshiba Lighting & Technology Corp | Printed circuit board and electronic apparatus |
| JP2008016582A (en) * | 2006-07-05 | 2008-01-24 | Kokusan Denki Co Ltd | Printed circuit board for electronic device |
| CN201274608Y (en) * | 2008-09-16 | 2009-07-15 | 上海广电住金微电子有限公司 | Novel encapsulation construction substituting zero ohm SMD resistor |
| CN201319701Y (en) * | 2008-11-28 | 2009-09-30 | 深圳市实益达科技股份有限公司 | Tinning steel mesh |
| CN202507663U (en) * | 2012-02-22 | 2012-10-31 | 京信通信系统（中国）有限公司 | Steel mesh of welded printed circuit board (PCB) |
-
2013
- 2013-02-05 CN CN2013100465269A patent/CN103152978A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4889961A (en) * | 1988-08-10 | 1989-12-26 | E. F. Johnson Company | Graphite trace electrical interconnect |
| CN1112351A (en) * | 1994-04-22 | 1995-11-22 | 美国电报电话公司 | Printed circuit board circuit control device |
| CN1283954A (en) * | 1999-08-09 | 2001-02-14 | 三星电子株式会社 | Printed circuit board and mask of screen printing such printed circuit bard |
| JP2007194240A (en) * | 2006-01-17 | 2007-08-02 | Toshiba Lighting & Technology Corp | Printed circuit board and electronic apparatus |
| JP2008016582A (en) * | 2006-07-05 | 2008-01-24 | Kokusan Denki Co Ltd | Printed circuit board for electronic device |
| CN201274608Y (en) * | 2008-09-16 | 2009-07-15 | 上海广电住金微电子有限公司 | Novel encapsulation construction substituting zero ohm SMD resistor |
| CN201319701Y (en) * | 2008-11-28 | 2009-09-30 | 深圳市实益达科技股份有限公司 | Tinning steel mesh |
| CN202507663U (en) * | 2012-02-22 | 2012-10-31 | 京信通信系统（中国）有限公司 | Steel mesh of welded printed circuit board (PCB) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228342A (en) * | 2015-08-31 | 2016-01-06 | 昆山龙腾光电有限公司 | A kind of circuit board |
| CN105228342B (en) * | 2015-08-31 | 2018-06-08 | 昆山龙腾光电有限公司 | A kind of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204129082U (en) | Connector test socket and connector testing device | |
| CN104849880A (en) | Display panel TEG test assembly, forming method and testing method of same | |
| CN202661566U (en) | Detector for pin of electronic element | |
| CN103152978A (en) | Bonding pad, circuit board and manufacturing method for circuit board | |
| CN102316674A (en) | Circuit board and method for detecting pressure drop of electronic component by using same | |
| CN105277863A (en) | Aging device for power amplifier | |
| CN103228111B (en) | The welding method of a kind of filter element and printed circuit board (PCB) and structure thereof | |
| CN103647445B (en) | DC-DC power source equipment and electric current detecting method thereof | |
| KR101663920B1 (en) | Board inspection method and jig for board inspection | |
| US20140354317A1 (en) | Circuit board inspection apparatus, circuit board inspection method and circuit board inspection tool | |
| CN105067982B (en) | The verifying attachment of solder joint between lead and device | |
| JP2014038091A (en) | Production method of jig for electric inspection | |
| CN203659302U (en) | Direct-connection combination experimental board | |
| CN202351345U (en) | Testing device for fine-pitch arranged pins on PCB (Printed Circuit Board) | |
| JP4774091B2 (en) | Multi-layer burn-in board structure with power tower | |
| JP5966688B2 (en) | Wiring structure and board inspection device | |
| JP2008112027A (en) | Inspection tool for liquid crystal display panel | |
| TW201539000A (en) | Detection module and jumper means thereof | |
| CN202603032U (en) | High-conductivity PCB board | |
| JP2014235126A (en) | Substrate inspection device, substrate inspection method, and substrate inspection jig | |
| CN205611042U (en) | Table pastes device and printed circuit board | |
| CN113905503B (en) | Circuit board structure, circuit board test structure and electronic equipment | |
| CN108459236A (en) | A kind of detection of electrical leakage structure for high power device radiator | |
| CN203732574U (en) | PCB test board for SOD882 chip testing | |
| CN203645008U (en) | Wiring terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130612 |