CN205611042U - Table pastes device and printed circuit board - Google Patents
Table pastes device and printed circuit board Download PDFInfo
- Publication number
- CN205611042U CN205611042U CN201620227093.6U CN201620227093U CN205611042U CN 205611042 U CN205611042 U CN 205611042U CN 201620227093 U CN201620227093 U CN 201620227093U CN 205611042 U CN205611042 U CN 205611042U
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- conductive region
- test point
- pad
- mounting component
- surface mounting
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- 238000012360 testing method Methods 0.000 claims abstract description 121
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 230000005611 electricity Effects 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012812 general test Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a table of placing on the test point pastes the device, the table pastes the device and includes that the table pastes pad and first insulation part, wherein, the table pastes a pad and includes first conductive region and second conductive region, the second conductive region and test point pad electricity on the test point is connected, and is located in the orthographic projection of test point pad. The utility model provides a printed circuit board utilizes second conductive region and test point pad electricity to be connected, also be insulating material around should the table pasting the second conductive region of device, and adjacent circuit can be pressed to the insulating part of this table device, just can not influence the signal, can reduce the interval between the adjacent circuit of PCB board, more is favorable to the narrow typeization of PCB board, simultaneously the size of first conductive region can the arbitrary selection, satisfies the demands of different tests.
Description
Technical field
This utility model belongs to display apparatus test field, more particularly, to a kind of surface mounting component and
Printed circuit board (PCB).
Background technology
Along with the narrow frame demand of LCD screen, the width requirement of printed circuit board (PCB) (PCB) is also got over
Come the narrowest, walk line density more and more higher.But, owing to test needs, at PCB width
The network of upward wiring has to increase test point.
The general test point diameter not affecting test is at least 0.6mm, live width minimum on pcb board
/ line-spacing is 0.1mm.For single-spot testing point, with the network line of same level direction cabling
10 measure, as it is shown in figure 1, in order to increase single test point 20, adjacent two lines on Net1
Between space length at least need 0.8mm.And for differential testing point, live width in differential pair
/ line-spacing is 0.1mm, and between differential pair, spacing is 0.2mm, and the Pitch between two test points is 1.0mm,
Measure with the network line of same level direction cabling, as in figure 2 it is shown, differential pair Net+,
Net-adds test point, and the space length of the most adjacent line-to-line at least needs 2mm.
Therefore, increasing test point needs more spaces, and this defines asking of contradiction with PCB narrow
Topic.
Utility model content
The purpose of this utility model is to provide a kind of surface mounting component and printed circuit board (PCB).
According to one side of the present utility model, it is provided that a kind of Surface Mount device for being placed in test point
Part, described surface mounting component includes Surface Mount pad and the first insulating element, wherein, described Surface Mount pad
Including the first conductive region and the second conductive region, the second conductive region and the survey in described test point
Pilot pad electrically connects, and is positioned at the orthographic projection of described test point pad.
Preferably, described first insulating element is arranged on around described second conductive region.
Preferably, the first conductive region arranges the second insulating element, and extends to the second conduction
Region, makes the first conductive region form the 3rd conductive region and the 4th conductive region of insulation setting,
The second conductive region is made to form the 5th conductive region and the 6th conductive region of insulation setting.
Preferably, described 5th conductive region and the 6th conductive region respectively with in adjacent test point
Test point pad electrically connects.
According to another aspect of the present utility model, it is provided that a kind of printed circuit board (PCB), including: test point
Pad, surface mounting component electrically connects with described test point pad；Wherein, described surface mounting component includes table
Patch pad and the first insulating element, described Surface Mount pad includes the first conductive region and the second conduction region
Territory, the second conductive region electrically connects with the test point pad in described test point, and is positioned at described survey
In the orthographic projection of pilot pad.
Preferably, described printed circuit board (PCB) also includes: soldering-tin layer, described surface mounting component and described survey
Pilot pad electrically connects.
Preferably, described first insulating element is arranged on around described second conductive region.
Preferably, the first conductive region arranges the second insulating element, and extends to the second conduction
Region, makes the first conductive region form the 3rd conductive region and the 4th conductive region of insulation setting,
The second conductive region is made to form the 5th conductive region and the 6th conductive region of insulation setting.
Preferably, described 5th conductive region and the 6th conductive region respectively with in adjacent test point
Test point pad electrically connects.
Surface mounting component and printed circuit board (PCB) that this utility model provides utilize the second conductive region and test
Point pad electrical connection, is also insulant around the second conductive region of this surface mounting component, this Surface Mount
The insulating element of device can be pressed onto adjacent lines, and does not interferes with signal, it is possible to reduce pcb board
Adjacent lines between spacing, be more beneficial for pcb board narrow；First conductive region simultaneously
Size can arbitrarily select, and meets the demand of difference test.
Accompanying drawing explanation
By description to this utility model embodiment referring to the drawings, of the present utility model above-mentioned
And other objects, features and advantages will be apparent from, in the accompanying drawings:
Fig. 1 shows in prior art the schematic wiring diagram of single test point in printed circuit board (PCB)；
Fig. 2 shows in prior art the schematic wiring diagram of differential testing point in printed circuit board (PCB)；
Fig. 3 a-Fig. 3 b respectively illustrates the structure of the surface mounting component that this utility model embodiment provides and shows
It is intended to and side view；
Fig. 4 a-Fig. 4 b shows that the structure of the surface mounting component that another embodiment of this utility model provides is shown
It is intended to and side view；
Fig. 5 a-Fig. 5 b show the printed circuit board (PCB) of this utility model embodiment structural representation and
Side view；
Fig. 6 a-Fig. 6 b shows the structural representation of the printed circuit board (PCB) of another embodiment of this utility model
Figure and side view；
Fig. 7 shows the schematic wiring diagram of the printed circuit board (PCB) of this utility model embodiment；
Fig. 8 shows the schematic wiring diagram of the printed circuit board (PCB) of another embodiment of this utility model.
Detailed description of the invention
It is more fully described various embodiment of the present utility model hereinafter with reference to accompanying drawing.Attached at each
In figure, identical element uses same or similar reference to represent.For the sake of clarity,
Various piece in accompanying drawing is not necessarily to scale.
This utility model can present in a variety of manners, some of them example explained below.
Fig. 3 a to Fig. 3 b shows the structural representation of the surface mounting component that this utility model embodiment provides
Figure and side view.As shown in Fig. 3 a-Fig. 3 b, for the surface mounting component 30 being placed in test point
Including Surface Mount pad 31 and insulating element 32.
In the present embodiment, Surface Mount pad specifically for plate-making time window dew copper in test point.Described
Surface Mount pad 31 includes the first conductive region 311 and the second conductive region 312.
The shape of described first conductive region 311 and size can need to appoint according to reality test
Meaning selects, generally circular in cross section.
Described second conductive region 312 electrically connects with test point pad 20, and is positioned at test point pad
In the orthographic projection of 20.The size of described second conductive region is consistent with test point pad 20,
Owing to its shape and size are consistent with test point pad 20, additional space will not be taken, no
Live width can be changed, affect signal quality.
Can add insulating element 32 around second conductive region 312, its effect is to place test point
Time, can maintain a certain distance with other devices or other testing weld pad, take during to facilitate test
Point, the most also reduces short circuit chance, increases reliability.
Described surface mounting component 30 may be used for having selection in the PCB fabric swatch stage, on purpose add
Test point: first determine the position of test point in printed circuit board (PCB), and place one side in test point
The surface mounting component windowed；Finally carry out, in test point, process of windowing during plate-making.
During as it is shown in fig. 7, be used for being placed on pcb board by this surface mounting component 30, because PCB walks
There is green oil on line, for insulant, be also insulation material around the second conductive region of this surface mounting component
Material, the insulating element of this surface mounting component can be pressed onto adjacent lines, and not interfere with signal, permissible
Reduce the spacing between the adjacent lines of pcb board.
The surface mounting component that this utility model provides utilizes the second conductive region to electrically connect with test point pad,
Also it is insulant around second conductive region of this surface mounting component, the insulating element of this surface mounting component
Adjacent lines can be pressed onto, and do not interfere with signal, it is possible to reduce between the adjacent lines of pcb board
Spacing, be more beneficial for pcb board narrow；The size of the first conductive region can arbitrarily be selected simultaneously
Select, meet the demand of difference test.
Fig. 4 a-Fig. 4 b shows the structural representation of the surface mounting component of another embodiment of this utility model
And side view.As shown in Fig. 4 a-4b, include table for the surface mounting component 40 being placed in test point
Patch pad the 41, first insulating element 42 and the second insulating element 43.
In the present embodiment, Surface Mount pad specifically for plate-making time window dew copper in test point.Described
Surface Mount pad 41 includes the 3rd conductive region the 411, the 4th conductive region the 412, the 5th conductive region
413 and the 6th conductive region 414.
In the present embodiment, the 3rd conductive region 411 is by the 5th conductive region 413 and test point
Pad 20a electrically connects, and the 4th conductive region 412 is by the 6th conductive region 414 and adjacent survey
Pilot pad 20b electrically connects.
Described 3rd conductive region 411 and the shape of the 4th conductive region 412 and size are permissible
Need arbitrarily to select according to reality test, generally circular arc.
Described 5th conductive region 413 electrically connects with test point pad 20a, and is positioned at described test
In the orthographic projection of some pad 20a.Described 6th conductive region 414 is electrically connected with test point pad 20b
Connect, and be positioned at the orthographic projection of described test point pad 20b.Described 5th conductive region 413
Size and test point pad 20a, and the size of described 6th conductive region 414 with
Test point pad 20b is consistent, due to its shape and size and test point pad 20a or 20b
Unanimously, additional space will not be taken, live width will not be changed, affect signal quality.
First insulating element 42 is positioned at around the 5th conductive region 413 and the 6th conductive region 414,
Second insulating element 43 is between the 3rd conductive region 411 and the 4th conductive region 412 and
Between five conductive regions 413 and the 6th conductive region 414, when its effect is to place test point, can
To maintain a certain distance with other devices or other testing weld pad, take during to facilitate test a little, with
Time also reduce short circuit chance, increase reliability.
Described surface mounting component 40 may be used for having selection in the PCB fabric swatch stage, on purpose add
Test point: first determine the position of test point in printed circuit board (PCB), and place one side in test point
The surface mounting component windowed；Finally carry out, in test point, process of windowing during plate-making.
As shown in Figure 8, when being used for being placed on pcb board by this surface mounting component 40, because PCB walks
Green oil is had, for insulant, the 5th conductive region of this surface mounting component and the 6th conduction region on line
Also being insulant around territory, the insulating element of this surface mounting component can be pressed onto adjacent lines, and not
Signal can be affected, it is possible to reduce the spacing between the adjacent lines of pcb board.
The surface mounting component that this utility model provides utilizes the 5th conductive region, the 6th conductive region respectively
Electrically connect with test point pad, around the 5th conductive region of this surface mounting component, the 6th conductive region
Also being insulant, the insulating element of this surface mounting component can be pressed onto adjacent lines, and not interfere with
Signal, it is possible to reduce the spacing between the adjacent lines of pcb board, is more beneficial for pcb board narrow
Change；3rd conductive region, the size of the 4th conductive region can arbitrarily select simultaneously, meet difference
The demand of test.
Fig. 5 a to Fig. 5 b shows the structural representation of the printed circuit board (PCB) of this utility model embodiment
And side view.As shown in Fig. 5 a-Fig. 5 b, described printed circuit board (PCB) includes test point pad 20 and table
Patch device 30, surface mounting component 30 electrically connects with described test point pad 20.
Wherein, surface mounting component 30 includes Surface Mount pad 31 and insulating element 32.
In the present embodiment, Surface Mount pad specifically for plate-making time window dew copper in test point.Described
Surface Mount pad 31 includes the first conductive region 311 and the second conductive region 312.
The shape of described first conductive region 311 and size can need to appoint according to reality test
Meaning selects, generally circular in cross section.
Described second conductive region 312 electrically connects with test point pad 20, and is positioned at test point pad
In the orthographic projection of 20.The size of described second conductive region is consistent with test point pad 20,
Owing to its shape and size are consistent with test point pad 20, additional space will not be taken, no
Live width can be changed, affect signal quality.
Can add insulating element 32 around second conductive region 312, its effect is to place test point
Time, can maintain a certain distance with other devices or other testing weld pad, take during to facilitate test
Point, the most also reduces short circuit chance, increases reliability.
Described surface mounting component 30 may be used for having selection in the PCB fabric swatch stage, on purpose add
Test point: first determine the position of test point in printed circuit board (PCB), and place one side in test point
The surface mounting component windowed；Finally carry out, in test point, process of windowing during plate-making.
During as it is shown in fig. 7, be used for being placed on pcb board by this surface mounting component 30, because PCB walks
There is green oil on line, for insulant, be also insulation material around the second conductive region of this surface mounting component
Material, the insulating element of this surface mounting component can be pressed onto adjacent lines, and not interfere with signal, permissible
Reduce the spacing between the adjacent lines of pcb board.
In a preferred embodiment, described printed circuit board (PCB) also includes soldering-tin layer 50, described
Two conductive regions 312 are electrically connected by soldering-tin layer 50 with described test point pad 20.
The printed circuit board (PCB) that this utility model provides utilizes the second conductive region to be electrically connected with test point pad
Connect, be also insulant around the second conductive region of this surface mounting component, the insulation of this surface mounting component
Parts can be pressed onto adjacent lines, and does not interferes with signal, it is possible to reduce the adjacent lines of pcb board
Between spacing, be more beneficial for pcb board narrow；The size of the first conductive region can be appointed simultaneously
Meaning selects, and meets the demand of difference test.
Fig. 6 a to Fig. 6 b shows that the structure of the printed circuit board (PCB) of another embodiment of this utility model is shown
It is intended to and side view.As shown in Fig. 6 a-6b, described printed circuit board (PCB) include test point pad 20a,
20b and surface mounting component 40, surface mounting component 40 respectively with described test point pad 20a and 20b
Electrical connection.
Wherein, described surface mounting component 40 includes Surface Mount pad the 41, first insulating element 42 and second
Insulating element 43.
In the present embodiment, Surface Mount pad specifically for plate-making time window dew copper in test point.Described
Surface Mount pad 41 includes the 3rd conductive region the 411, the 4th conductive region the 412, the 5th conductive region
413 and the 6th conductive region 414.
In the present embodiment, the 3rd conductive region 411 is by the 5th conductive region 413 and test point
Pad 20a electrically connects, and the 4th conductive region 412 is by the 6th conductive region 414 and adjacent survey
Pilot pad 20b electrically connects.
Described 3rd conductive region 411 and the shape of the 4th conductive region 412 and size are permissible
Need arbitrarily to select according to reality test, generally circular arc.
Described 5th conductive region 413 electrically connects with test point pad 20a, and is positioned at described test
In the orthographic projection of some pad 20a.Described 6th conductive region 414 is electrically connected with test point pad 20b
Connect, and be positioned at the orthographic projection of described test point pad 20b.Described 5th conductive region 413
Size and test point pad 20a, and the size of described 6th conductive region 414 with
Test point pad 20b is consistent, due to its shape and size and test point pad 20a or 20b
Unanimously, additional space will not be taken, live width will not be changed, affect signal quality.
First insulating element 42 is positioned at around the 5th conductive region 413 and the 6th conductive region 414,
Second insulating element 43 is between the 3rd conductive region 411 and the 4th conductive region 412 and
Between five conductive regions 413 and the 6th conductive region 414, when its effect is to place test point, can
To maintain a certain distance with other devices or other testing weld pad, take during to facilitate test a little, with
Time also reduce short circuit chance, increase reliability.
Described surface mounting component 40 may be used for having selection in the PCB fabric swatch stage, on purpose add
Test point: first determine the position of test point in printed circuit board (PCB), and place one side in test point
The surface mounting component windowed；Finally carry out, in test point, process of windowing during plate-making.
As shown in Figure 8, when being used for being placed on pcb board by this surface mounting component 40, because PCB walks
Green oil is had, for insulant, the 5th conductive region of this surface mounting component and the 6th conduction region on line
Also being insulant around territory, the insulating element of this surface mounting component can be pressed onto adjacent lines, and not
Signal can be affected, it is possible to reduce the spacing between the adjacent lines of pcb board.
In a preferred embodiment, described printed circuit board (PCB) also includes: soldering-tin layer 50, described
5th conductive region 413 of surface mounting component 40 passes through soldering-tin layer 50 with described test point pad 20a
Electrical connection, the 6th conductive region 414 is electrically connected by soldering-tin layer 50 with described test point pad 20b.
The printed circuit board (PCB) that this utility model provides utilizes the 5th conductive region, the 6th conductive region to divide
Do not electrically connect with test point pad, the 5th conductive region of this surface mounting component, the 6th conductive region week
Enclosing is also insulant, and the insulating element of this surface mounting component can be pressed onto adjacent lines, and will not shadow
Ring signal, it is possible to reduce the spacing between the adjacent lines of pcb board, be more beneficial for pcb board narrow
Type；3rd conductive region, the size of the 4th conductive region can arbitrarily select simultaneously, meet not
Demand with test.
According to embodiment of the present utility model as described above, these embodiments do not have detailed descriptionthe
All of details, is also not intended to the specific embodiment that this utility model is only described.Obviously, according to
Above description, can make many modifications and variations.This specification is chosen and is specifically described these and implements
Example, is to preferably explain principle of the present utility model and actual application, so that affiliated technology
Skilled person can utilize this utility model and the amendment on the basis of this utility model well
Use.The scope that protection domain of the present utility model should be defined with this utility model claim
It is as the criterion.
Claims (9)
1. one kind is used for the surface mounting component being placed in test point, it is characterised in that described Surface Mount device
Part includes Surface Mount pad and the first insulating element,
Wherein, described Surface Mount pad includes the first conductive region and the second conductive region, the second conduction
Region electrically connects with the test point pad in described test point, and is just positioned at described test point pad
In projection.
Surface mounting component the most according to claim 1, it is characterised in that described first insulation division
Part is arranged on around described second conductive region.
Surface mounting component the most according to claim 1, it is characterised in that at the first conductive region
In the second insulating element is set, and extend to the second conductive region, make the first conductive region be formed absolutely
3rd conductive region of edge setting and the 4th conductive region, make the second conductive region form insulation and arrange
The 5th conductive region and the 6th conductive region.
Surface mounting component the most according to claim 3, it is characterised in that described 5th conduction region
Territory and the 6th conductive region electrically connect with the test point pad in adjacent test point respectively.
5. a printed circuit board (PCB), it is characterised in that including:
Test point pad,
Surface mounting component electrically connects with described test point pad；
Wherein, described surface mounting component includes Surface Mount pad and the first insulating element, described Surface Mount pad
Including the first conductive region and the second conductive region, the second conductive region and the survey in described test point
Pilot pad electrically connects, and is positioned at the orthographic projection of described test point pad.
Printed circuit board (PCB) the most according to claim 5, it is characterised in that also include:
Soldering-tin layer, described surface mounting component electrically connects with described test point pad.
Printed circuit board (PCB) the most according to claim 5, it is characterised in that described first insulation
Parts are arranged on around described second conductive region.
Printed circuit board (PCB) the most according to claim 5, it is characterised in that in the first conduction region
Territory arranges the second insulating element, and extends to the second conductive region, make the first conductive region be formed
3rd conductive region of insulation setting and the 4th conductive region, make the second conductive region form insulation and set
The 5th conductive region put and the 6th conductive region.
Printed circuit board (PCB) the most according to claim 8, it is characterised in that described 5th conduction
Region and the 6th conductive region electrically connect with the test point pad in adjacent test point respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620227093.6U CN205611042U (en) | 2016-03-23 | 2016-03-23 | Table pastes device and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620227093.6U CN205611042U (en) | 2016-03-23 | 2016-03-23 | Table pastes device and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611042U true CN205611042U (en) | 2016-09-28 |
Family
ID=56963615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620227093.6U Active CN205611042U (en) | 2016-03-23 | 2016-03-23 | Table pastes device and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611042U (en) |
-
2016
- 2016-03-23 CN CN201620227093.6U patent/CN205611042U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee after: InfoVision Optoelectronics(Kunshan)Co.,Ltd. Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd. |