CN204392682U - Printed circuit board and display device - Google Patents
Printed circuit board and display device Download PDFInfo
- Publication number
- CN204392682U CN204392682U CN201520121969.4U CN201520121969U CN204392682U CN 204392682 U CN204392682 U CN 204392682U CN 201520121969 U CN201520121969 U CN 201520121969U CN 204392682 U CN204392682 U CN 204392682U
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- protective layer
- access
- shielding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000011241 protective layer Substances 0.000 claims abstract description 49
- 239000010410 layer Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000012360 testing method Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 11
- 239000002313 adhesive film Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses an among printed circuit board and display device, include: a substrate; the conductive layer comprises at least one first wire, at least one second wire and an access part, and the access part is electrically connected with the second wire; the protective layer comprises a first opening part and a first tearing part, the first opening part exposes the second routing, and the access part is exposed after the first tearing part is removed; the first shielding film is electrically connected with the second wiring through the first opening portion, and covers the first wiring. The utility model discloses in, first portion of tearing is got rid of when the first line of walking of test, exposes access portion in order to be used for the fixed potential of access portion input for first shielding film actual ground connection, thereby guarantees the measuring accuracy.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a printed circuit board and display device.
Background
Due to the requirements of customers and product performance, more and more printed circuit boards need to be pasted with electromagnetic shielding films or pasted with double-sided conductive adhesive to be contacted with an iron frame in the printed circuit boards, so that the internal circuits of the printed circuit boards are shielded. Thus, the differential impedance on the printed circuit board is greatly affected by the positions and areas of the electromagnetic shield film and the double-sided conductive paste. In the prior art, no signal input point is reserved in the design of the printed circuit board, and the actual grounding of the electromagnetic shielding film or the double-sided conductive adhesive can not be ensured when the printed circuit board is measured, so that the deviation of the measurement result from the actual application is large,
the scheme aims to solve the problem that the measuring result of the printed circuit board is inaccurate, so that the control precision is improved, and the yield of the display device is improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a printed circuit board guarantees electromagnetic shield membrane and two-sided conducting resin actual ground connection for printed circuit board's measuring result is more accurate, thereby improves the management and control precision, improves the display device yield.
In order to solve the above technical problem, an aspect of the present invention provides a printed circuit board, including:
a substrate; the conductive layer comprises at least one first wire, at least one second wire and an access part, and the access part is electrically connected with the second wire; the protective layer comprises a first opening part and a first tearing part, the first opening part exposes the second routing, and the access part is exposed after the first tearing part is removed; the first shielding film is electrically connected with the second wiring through the first opening portion, and covers the first wiring.
Optionally, the access portion and the second trace are disposed on the same layer and connected to each other.
Optionally, the conductive layer includes at least two first traces, and the first traces are differential traces.
Optionally, the first trace, the second trace and the access portion are located on one side of the substrate; the protective layer comprises a first protective layer positioned on one side, away from the substrate, of the first routing, and the first protective layer comprises a first opening part and a first tearing part; the first shielding film is positioned on the side, away from the base material, of the first protection layer, covers part of the first protection layer and exposes the first tearing part.
Optionally, the first tearable portion is removed when testing the first trace, and the access portion is exposed for inputting a fixed potential to the access portion.
Optionally, the first shielding film is an electromagnetic shielding film or a conductive adhesive film.
Optionally, the access portion and the second trace are located on different layers and are electrically connected through the first via hole.
Optionally, the first trace and the second trace are located on one side of the substrate, the access portion is located on the other side of the substrate, and the second trace is electrically connected to the access portion through a first via hole; the protective layer comprises a first protective layer and a second protective layer, the first protective layer is positioned on one side, away from the base material, of the first routing and the second routing, the second protective layer is positioned on one side, away from the base material, of the access portion, the first protective layer comprises a first opening portion, and the second protective layer comprises a first tearable portion; the first shielding film is positioned on one side, away from the base material, of the first protective layer.
Optionally, the first shielding film entirely covers the first protective layer, and the first tearable portion is removed when the first trace is tested, so as to expose the access portion for inputting a fixed potential to the access portion; or, the conductive layer further includes at least one third wire, and the first tearable portion is removed when testing the third wire, and exposes the access portion for inputting a fixed potential to the access portion.
Optionally, the second protective layer further includes a second opening, and the printed circuit board further includes a second shielding film, where the second shielding film is located on a side of the second protective layer away from the substrate and electrically connected to the access portion through the second opening.
Optionally, the second shielding film is an electromagnetic shielding film or a conductive adhesive film.
Correspondingly, another aspect of the present invention further provides a display device, including a display panel and the printed circuit board.
Compared with the prior art, the utility model provides an increase at least one second among the printed circuit board and walk line and access portion, when the first line of walking of test, with the first portion of tearing of can tearing get rid of, expose access portion in order to be used for doing access portion input ground potential for the second walks line ground connection, thereby guarantees the actual ground connection of first barrier film, makes printed circuit board's measuring result more accurate, thereby improves the management and control precision, improves the display device yield. And, the utility model discloses can be according to actual need, the access portion can be arranged in the optional position of being convenient for test in the printed circuit board.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a printed circuit board according to an embodiment of the present invention;
fig. 2A is a top view of a printed circuit board according to an embodiment of the present invention;
FIG. 2B is a cross-sectional view along AA' of FIG. 2A;
FIG. 3 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the present invention
Fig. 4 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the present invention;
fig. 5 is a graph showing the relationship between the differential impedance measured in the present invention.
Fig. 6 is a top view of the display device of the present invention.
Detailed Description
The printed circuit board and the display device of the present invention will be described in more detail with reference to the drawings, in which preferred embodiments of the present invention are shown, it being understood that those skilled in the art can modify the invention described herein while still achieving the advantageous effects of the present invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The core idea of the present invention is to provide a printed circuit board, wherein when the first shielding film partially covers the first protective layer, the first wire, the second wire and the access portion are located on one side of the substrate, the first tearable portion is removed when testing the first wire, and the access portion is exposed for inputting the ground potential for the access portion; when the first shielding film completely covers the first protective layer, the first wiring and the second wiring are located on one side of the base material, the access portion is located on the other side of the base material, the first tearable portion is removed when the first wiring is tested, and the access portion is exposed to be used for inputting a fixed potential for the access portion, so that the second wiring is connected with a ground potential. Thereby the second is walked line ground connection and is made the actual ground connection of first barrier film for printed circuit board's measuring result is more accurate, thereby improves the management and control precision, improves display device yield.
Referring to fig. 1, the present invention provides a printed circuit board, including:
a substrate 1;
a conductive layer (not shown) including at least one first trace 21, at least one second trace 22 and an access 222. The access portion 222 is disposed on the same layer as the second trace 22 and connected thereto, and the access portion 222 is electrically connected to the second trace 22;
a protective layer, including a first protective layer 3 located on a side of the first trace 21 away from the substrate 1, where the first protective layer 3 includes at least one first opening 31 and at least one first tearable portion 32, and the first tearable portion 32 exposes the access portion 222 to overlap after being removed;
the first shielding film 4 is located on one side of the first protection layer 3 far away from the substrate 1, the first shielding film 4 covers a part of the first protection layer 3, and the first shielding film 4 is electrically connected with the second wiring 22 through the first opening 31.
It should be noted that, fig. 1 illustrates the relationship of the layers on the printed circuit board, and the layer thicknesses are exaggerated, and the thicknesses of the actual layers are very thin, for example, the base material 1 is 25 μm, the first protective layer 3 is 12.5 μm, and the first shielding film 4 is 15 μm, and when the first protective layer 3 has the first opening 31, and the first shielding film 4 is attached to the first protective layer 3, the first shielding film 4 can be electrically connected to the second trace 22 through the first opening 31.
In addition, the first trace 21 may also include at least two, and the first trace may be a differential trace. Fig. 2A is a top view and fig. 2B is a cross-sectional view along AA' in fig. 2A, two first traces 21 are shown in fig. 2A and fig. 2B, each first trace 21 has a testing end 211 at a position not covered by the first shielding film 4 for leading out the first trace 21 at the time of testing. Taking the test of the differential impedance between the two first wires 21 in fig. 2A and fig. 2B as an example to test the printed circuit board, during the test, the first tearable portion 32 is removed to expose the access portion 222, and a fixed potential is input to the access portion 222. The utility model discloses in, fixed electric potential is the ground potential to access portion 222 ground connection, consequently, the second is walked line 22 ground connection, makes first barrier film 4 ground connection, adopts the network analyzer at two first line 21 between the input signal of telecommunication, obtains two first impedance of walking between the line 21 and follows the signal at the first relation of walking transmission time between the line 21. Because the first shielding film 4 is actually grounded, the measured differential impedance of the printed circuit board is closer to the differential impedance in practical application, so that the control precision of the differential impedance is improved, and the yield of the display device is improved.
In this embodiment, the first shielding film 4 partially covers the first protection layer 3, the second trace 22 and the connection portion 222 are located on one side of the substrate 1, and the position of the connection portion 222 may be located at any position of a printed circuit board convenient for testing, and meanwhile, a plurality of connection portions 222 may also be disposed at different positions convenient for testing according to needs.
In this embodiment, the first protection layer 3 is a polyimide protection layer, the conductive layer is a copper conductive layer, and the first shielding film 4 is an electromagnetic shielding film or a conductive adhesive film.
Referring to fig. 3, another printed circuit board according to an embodiment of the present invention includes:
a substrate 1;
a conductive layer (not shown in the figure), the conductive layer including the first trace 21, the second trace 22 and the access portion 222, wherein the first trace 21 and the second trace 22 are located on one side of the substrate, the access portion 222 is located on the other side of the substrate 1, and the second trace 22 is electrically connected to the access portion 222 through a first via 6;
the protective layer comprises a first protective layer 3 positioned on one side, away from the substrate 1, of the first routing line 21 and the second routing line 22 and a second protective layer 7 positioned on one side, away from the substrate 1, of the access portion 222, wherein the first protective layer 3 comprises a first opening portion 31, and the second protective layer 7 comprises a first tearable portion 32;
the first shielding film 4 is located on one side of the first protection layer 3 away from the substrate 1, the first shielding film 4 covers a part of the first protection layer 3, and the first shielding film 4 is electrically connected with the second wiring 22 through the first opening 31.
In this embodiment, the connection relationship among the substrate 1, the conductive layer, the first trace 21, the second trace 22, the first protective layer 3, and the first opening 31 is the same as that in the embodiment shown in fig. 1, and is different from that in the embodiment shown in fig. 1, the first shielding film 4 completely covers the first protective layer 3, the access portion 222 and the second trace 22 are located on different layers and are electrically connected through the first via 6, the first tearable portion 32 is located in the second protective layer 7, and the first tearable portion 32 is removed when testing the first trace 21, and exposes the access portion 222 for inputting a fixed potential to the access portion 222. In this embodiment, the fixed potential is a ground potential, and the access portion 222 is grounded, so that the second trace 22 is connected to the ground potential. Therefore, the first shielding film 4 is actually grounded, the characteristic impedance measurement result of the printed circuit board is more accurate, the characteristic impedance control precision is improved, and the yield of the display device is improved.
It will be appreciated by those skilled in the art that any combination of the above embodiments may be used to arrive at further embodiments. Referring to fig. 4, the present invention provides another printed circuit board, which includes a substrate 1, a conductive layer (not shown in the figure), a first wire 21, a second wire 22, a first protection layer 3, a first shielding film 4, an access portion 222, a first via hole 6, a second protection layer 7, and the like, wherein the connection relationship is the same as that in the embodiment shown in fig. 3, and is not repeated herein. In this embodiment, the conductive layer further includes a third trace 52, and the first tearable portion 32 is removed when testing the third trace 52, so as to expose the access portion 222 for inputting a fixed potential to the access portion 222. The second protection layer 7 further includes a second opening portion 72, the printed circuit board further includes a second shielding film 8, the second shielding film 8 is electrically connected to the access portion 222 through the second opening portion 72, the first tearable portion 32 is removed when the third trace 52 is tested, and the access portion 222 is exposed to input a fixed potential for the access portion 222, so that the second shielding film 8 is actually grounded when the third trace 52 is tested. The method for testing the third trace 52 is the same as the method for testing the first trace 21, and is not described herein again.
The utility model discloses in, second protective layer 7 is the polyimide protective layer, the conducting layer is the copper conducting layer, second barrier film 8 is electromagnetic shield membrane or conductive adhesive membrane.
For further explanation, the technical effects of the present invention are explained by taking the test differential impedance as an example, refer to fig. 5, which shows that the prior art is first to measure the differential impedance relation curve a of the wire 21 and the utility model discloses the first measured differential impedance relation curve B of the wire 21. Contrast A and B can see, process the utility model discloses a line 22 is walked to the second makes 4 actual ground connection of first barrier film, has certain difference between curve A and the curve B, and it can be understood that measuring during actual ground connection is closer with the actual value, consequently, the utility model discloses can improve and improve differential impedance management and control precision.
In the foregoing embodiments, the printed Circuit board may be a flexible printed Circuit board (FPC) or a rigid printed Circuit board, and it is within the scope of the invention to achieve the actual grounding of the first shielding film or the second shielding film through the second trace.
Meanwhile, referring to fig. 6, the present invention also provides a display device 100, wherein the display device 100 comprises a display panel 200 and a printed circuit board 300 in any of the above embodiments or a combination thereof, and the printed circuit board 300 is electrically connected to the display panel 200. The utility model discloses an among the display device 100, through above-mentioned printed circuit board 300, can be as required according to the test, with the removal of first portion 32 that can tear, provide the earth potential for access portion 222 to the second is walked line 22 earth potential, makes first barrier film 4 or second barrier film 8 actual ground connection, thereby makes the first measured value of walking line 21 or third line 52 of walking be close the value when actually using. Thereby improving the yield of the module,
to sum up, the utility model provides a printed circuit board and display device for first barrier film or the actual ground connection of second barrier film, thereby improve the management and control precision, improve the display device yield.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (12)
1. A printed circuit board, comprising:
a substrate;
the conductive layer comprises at least one first wire, at least one second wire and an access part, and the access part is electrically connected with the second wire;
the protective layer comprises a first opening part and a first tearing part, the first opening part exposes the second routing, and the access part is exposed after the first tearing part is removed;
the first shielding film is electrically connected with the second wiring through the first opening portion, and covers the first wiring.
2. The printed circuit board of claim 1, wherein the access portion is disposed and connected with the second trace in the same layer.
3. The printed circuit board of claim 1, wherein the conductive layer comprises at least two of the first traces, and the first traces are differential traces.
4. A printed circuit board of claim 1,
the first routing wire, the second routing wire and the access part are positioned on one side of the substrate;
the protective layer comprises a first protective layer positioned on one side, away from the substrate, of the first routing, and the first protective layer comprises a first opening part and a first tearing part;
the first shielding film is positioned on the side, away from the base material, of the first protection layer, covers part of the first protection layer and exposes the first tearing part.
5. The printed circuit board of claim 4, wherein the first tearable portion is removed when testing the first trace, exposing the access for inputting a fixed potential for the access.
6. The printed circuit board of claim 5, wherein the first shielding film is an electromagnetic shielding film or a conductive adhesive film.
7. The printed circuit board of claim 1, wherein the access portion and the second trace are located at different layers and are electrically connected through the first via.
8. The printed circuit board of claim 1, wherein the first trace and the second trace are located on one side of the substrate, the access portion is located on the other side of the substrate, and the second trace is electrically connected to the access portion through a first via;
the protective layer comprises a first protective layer and a second protective layer, the first protective layer is positioned on one side, away from the base material, of the first routing and the second routing, the second protective layer is positioned on one side, away from the base material, of the access portion, the first protective layer comprises a first opening portion, and the second protective layer comprises a first tearable portion;
the first shielding film is positioned on one side, away from the base material, of the first protective layer.
9. The printed circuit board of claim 8, wherein the first shielding film entirely covers the first protective layer, the first tearable portion is removed when testing the first trace, exposing the access portion for inputting a fixed potential for the access portion; or,
the conductive layer further comprises at least one third wire, and the first tearable portion is removed when the third wire is tested, so that the access portion is exposed to be used for inputting a fixed potential for the access portion.
10. The printed circuit board of claim 8, wherein the second protective layer further comprises a second opening, the printed circuit board further comprising a second shielding film located on a side of the second protective layer away from the substrate and electrically connected to the access portion through the second opening.
11. The printed circuit board of claim 10, wherein the second shielding film is an electromagnetic shielding film or a conductive adhesive film.
12. A display device comprising a display panel and a printed circuit board according to any one of claims 1 to 11.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520121969.4U CN204392682U (en) | 2015-03-02 | 2015-03-02 | Printed circuit board and display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520121969.4U CN204392682U (en) | 2015-03-02 | 2015-03-02 | Printed circuit board and display device |
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CN204392682U true CN204392682U (en) | 2015-06-10 |
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Family Applications (1)
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CN201520121969.4U Active CN204392682U (en) | 2015-03-02 | 2015-03-02 | Printed circuit board and display device |
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CN (1) | CN204392682U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105338729A (en) * | 2015-10-28 | 2016-02-17 | 北大方正集团有限公司 | Circuit board, method and apparatus for detecting grounding condition of shielding film of circuit board |
CN105744729A (en) * | 2016-04-22 | 2016-07-06 | 上海天马微电子有限公司 | Flexible circuit board, electronic equipment and electromagnetic interference filtering method thereof |
CN111914776A (en) * | 2020-08-07 | 2020-11-10 | 业泓科技(成都)有限公司 | Display device |
-
2015
- 2015-03-02 CN CN201520121969.4U patent/CN204392682U/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105338729A (en) * | 2015-10-28 | 2016-02-17 | 北大方正集团有限公司 | Circuit board, method and apparatus for detecting grounding condition of shielding film of circuit board |
CN105338729B (en) * | 2015-10-28 | 2018-09-04 | 北大方正集团有限公司 | A kind of circuit board and its screened film Grounding detection method and detection device |
CN105744729A (en) * | 2016-04-22 | 2016-07-06 | 上海天马微电子有限公司 | Flexible circuit board, electronic equipment and electromagnetic interference filtering method thereof |
CN105744729B (en) * | 2016-04-22 | 2019-04-30 | 上海天马微电子有限公司 | Flexible circuit board, electronic equipment and electromagnetic interference filtering method thereof |
CN111914776A (en) * | 2020-08-07 | 2020-11-10 | 业泓科技(成都)有限公司 | Display device |
CN111914776B (en) * | 2020-08-07 | 2023-12-22 | 业泓科技(成都)有限公司 | display device |
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